SFH4645 - OSRAM Opto Semiconductors

SFH 4640

SFH 4645

Engwinklig e LED im MIDL ED- Ge h äus e

Narrow beam LED in MIDLED package

Lead (Pb) Free Product - RoHS Compliant

2010-08-03 1

SFH 4640 SFH 4645

Wesentliche Merkmale

• Infrarot LED mit hoher Ausgangsleistung

(45 mW)

• Emissionswellenlänge typ. 950 nm

• Enger Abstrahlwinkel (± 15°)

• Geringe Bauhöhe

• Als Toplooker und Sidelooker einsetzbar

•SFH 4640: Gurtung als Toplooker

SFH 4645: Gurtung als Sidelooker

Anwendungen

• Infrarotbeleuchtung für Kameras

• IR-Datenübertragung

• Sensorik in der Automobiltechnik

• Fernsteuerung

Sicherheitshinweise

Je nach Betriebsart emittieren diese Bauteile

hochkonzentrierte, nicht sichtbare Infrarot-

Strahlung, die gefährlich für das menschliche

Auge sein kann. Produkte, die diese Bauteile

enthalten, müssen gemäß den Sicherheits-

richtlinien der IEC-Normen 60825-1 und 62471

behandelt werden.

Typ

Type Bestellnummer

Ordering Code Strahlstärkegruppierung1) (IF = 100 mA, tp = 20 ms)

Radiant Intensity Grouping1)

Ie (mW/sr)

SFH 4640

SFH 4645 Q65110A9369

Q65110A9367 ≥ 25 (typ. 50)

≥ 25 (typ. 50)

1) gemessen bei einem Raumwinkel Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr

Features

• High Power (45 mW) Infrared LED

• Peak wavelength typ. 950 nm

• Narrow halfangle (± 15°)

• Low profile component

• Usable as top-looking and side-looking device

•SFH 4640: Taping as Toplooker

SFH 4645: Taping as Sidelooker

Applications

• Infrared Illumination for cameras

• IR Data Transmission

• Automotive sensors

• Remote controls

Safety Advices

Depending on the mode of operation, these

devices emit highly concentrated non visible

infrared light which can be hazardous to the

human eye. Products which incorporate these

devices have to follow the safety precautions

given in IEC 60825-1 and IEC 62471.

2010-08-03 2

SFH 4640, SFH 4645

Grenzwerte (TA = 25 °C)

Maximum Ratings

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

Betriebs- und Lagertemperatur

Operating and storage temperature range Top , Tstg – 40 … + 100 °C

Sperrspannung

Reverse voltage VR5 V

Vorwärtsgleichstrom

Forward current IF100 mA

Stoßstrom, tp = 300 μs, D = 0

Surge current IFSM 1 A

Verlustleistung

Power dissipation Ptot 180 mW

Wärmewiderstand Sperrschicht - Umgebung bei

Montage auf FR4 Platine, Padgröße je 16 mm2

Thermal resistance junction - ambient mounted

on PC-board (FR4), padsize 16 mm2 each

Wärmewiderstand Sperrschicht - Lötstelle bei

Montage auf Metall-Block

Thermal resistance junction - soldering point,

mounted on metal block

RthJA

RthJS

340

180

K/W

Kennwerte (TA = 25 °C)

Characteristics

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

Wellenlänge der Strahlung

Wavelength at peak emission

IF = 100 mA

λpeak 950 nm

Centroid-Wellenlänge der Strahlung

Centroid wavelength

IF = 100 mA

λcentroid 940 nm

Spektrale Bandbreite bei 50% von Imax

Spectral bandwidth at 50% of Imax

IF = 100 mA

Δλ 42 nm

Abstrahlwinkel

Half angle ϕ ± 15 Grad

deg.

SFH 4640, SFH 4645

2010-08-03 3

Aktive Chipfläche

Active chip area A0.09 mm2

Abmessungen der aktiven Chipfläche

Dimension of the active chip area L × B

L × W0.3 × 0.3 mm²

Schaltzeiten, Ie von 10% auf 90% und von 90%

auf 10%, bei IF = 100 mA, RL = 50 Ω

Switching times, Ιe from 10% to 90% and from

90% to 10%, IF = 100 mA, RL = 50 Ω

tr, tf11 ns

Durchlassspannung

Forward voltage

IF = 100 mA, tp = 20 ms

IF = 1 A, tp = 100 µs

1.5 (< 1.8)

2.3 (< 3.0)

Sperrstrom

Reverse current

IRnot designed for

reverse

operation

μA

Gesamtstrahlungsfluss

Total radiant flux

IF = 100 mA, tp = 20 ms

Φe typ 45 mW

Temperaturkoeffizient von Ie bzw. Φe,

IF = 100 mA

Temperature coefficient of Ie or Φe,

IF = 100 mA

TCI– 0.5 %/K

Temperaturkoeffizient von VF, IF = 100 mA

Temperature coefficient of VF, IF = 100 mA TCV– 3 mV/K

Temperaturkoeffizient von λ, IF = 100 mA

Temperature coefficient of λ, IF = 100 mA TCλ+ 0.3 nm/K

Kennwerte (TA = 25 °C)

Characteristics (cont’d)

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

2010-08-03 4

SFH 4640, SFH 4645

Strahlstärke Ie in Achsrichtung1)

gemessen bei einem Raumwinkel Ω = 0.01 sr

Radiant Intensity Ie in Axial Direction

at a solid angle of Ω = 0.01 sr

Bezeichnung

Parameter Symbol Werte

Values Einheit

Unit

-T -U -V

Strahlstärke

Radiant intensity

IF = 100 mA, tp = 20 ms

Ie min

Ie max

50 40

80 63

125 mW/sr

mW/sr

Strahlstärke

Radiant intensity

IF = 1 A, tp = 25 μs

Ie typ 260 420 660 mW/sr

1) Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) /

Only one bin in one packing unit (variation lower 2:1)

Abstrahlcharakteristik

Radiation Characteristics Irel = f (ϕ)

OHF03823

0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚0.40.60.81.0

100˚

90˚

80˚

70˚

60˚

50˚

0˚10˚20˚30˚40˚

0.2

0.4

0.6

0.8

1.0

SFH 4640, SFH 4645

2010-08-03 5

Relative Spectral Emission

Irel = f (λ)

Forward Current IF = f (VF)

Single pulse, tp = 100 μs

800

0nm

OHF04134

100

rel

850 900 950 1025

OHF03822

10-4 V

100

-1

10-2

-3

0.5 1 1.5 2 2.5

Radiant Intensity

Single pulse, tp = 25 μs

Permissible Pulse Handling

Capability IF = f (τ), TA = 25 °C,

duty cycle D = parameter

Ie 100 mA = f (IF)

OHF03821

10-3 mA

101

10-1

-2

10 1

10 2

10 3

1055

(100 mA)

0.05

210-1-2-3-4-5

1010 1010 10

10 10s10

0.1

0.005

0.02

0.01

OHF02532

0.2

0.5

0.2

0.4

0.6

0.8

1.0

1.2

Max. Permissible Forward Current

IF = f (TA), RthJA = 340 K/W

40200

01008060 ˚C

OHF02533

110

2010-08-03 6

SFH 4640, SFH 4645

Maßzeichnung

Package Outlines

Maße in mm / Dimensions in mm.

Gehäuse / Package MID mit klarem Silikonverguss / MID casted with clear Silicone

Anschlussbelegung

Pin configuration Pad 1 = Anode / anode

Pad 2 = Kathode / cathode

OHF02956

(1.2)

2.35

2.15

Isolating area

metallisation

Pad 2

Pad 1

metallisation (0.8)

1.7

1.5

0.75

0.55

3.3

2.9

metallisation

Backside

Silicone area1)

Device casted with silicone.

1) Avoid mechanical stress on silicone surface.

0.75

0.55

0.420.42

0.53

0.83

0.53

SFH 4640, SFH 4645

2010-08-03 7

Gurtung / Polarität und Lage Verpackungseinheit 2000/Rolle, ø180 mm

oder 9000/Rolle, ø330 mm

Method of Taping / Polarity and Orientation Packing unit 2000/reel, ø180 mm

or 9000/reel, ø330 mm

Maße in mm (inch) / Dimensions in mm (inch).

OHAY2431

8 (0.315)

1.75 (0.069)

4 (0.157)

2.55 (0.100) ±0.05 (0.002)

0.3 (0.012) ±0.02 (0.001)

±0.05 (0.002)

1.75 (0.069)

3.4 (0.134) ±0.05 (0.002)

2˚

1.5 (0.059) +0.1 (0.004)

3.5 (0.138) ±0.05 (0.002)

2 (0.079) ±0.05 (0.002)

Pad 1 Orientation

SFH 4640

OHAY2430

2.3 (0.091)

8 (0.315)

4 (0.157)

3.3 (0.130)

±0.15 (0.006)

0.3 (0.012)

±0.02 (0.001)

±0.05 (0.002)

2.45 (0.096)

3.25 (0.128)

±0.05 (0.002)

2˚

±0.05 (0.002)

2 (0.079)

1.7 (0.067)

±0.05 (0.002)

3.5 (0.138)

±0.05 (0.002)

1.75 (0.069)

1.5 (0.059)

+0.1 (0.004)

Pad 1 Orientation

Optical axis/viewing direction

SFH 4645

2010-08-03 8

SFH 4640, SFH 4645

Empfohlenes Lötpaddesign

Recommended Solder Pad Design

Maße in mm / Dimensions in mm.

Verarbeitungshinweis: Das Gehäuse ist mit Silikon vergossen. Mechanischer Stress auf der

Bauteiloberfläche sollte so gering wie möglich gehalten werden.

Handling indication: The package is casted with silicone. Mechanical stress at the surface of

the unit should be as low as possible.

OHF02422

4.0

2.4

1.35

Padgeometrie für

heat dissipation

Lötstopplack

Solder resist

verbesserte Wärmeableitung

Paddesign for improved

Cu-Fläche > 16 mm

Cu-area 2

SFH 4640

4.5

1.7

1.25

verbesserte Wärmeableitung

OHF02421

Solder resist

Cu-Fläche > 16 mm

Paddesign for improved

Lötstopplack

heat dissipation

Padgeometrie für

Cu-area

SFH 4645

SFH 4640, SFH 4645

2010-08-03 9

Lötbedingungen Vorbehandlung nach JEDEC Level 2

Soldering Conditions Preconditioning acc. to JEDEC Level 2

Reflow Lötprofil für bleifreies Löten (nach J-STD-020C)

Reflow Soldering Profile for lead free soldering (acc. to J-STD-020C)

Published by

OSRAM Opto Semiconductors GmbH

Leibnizstrasse 4, D-93055 Regensburg

www.osram-os.com

The information describes the type of component and shall not be considered as assure d characteristics.

Terms of delivery and rights to change design reserved. Due to technical requirements components may contain

dangerous substances. For information on the types in question please contact our Sales Organizati on.

Packing

Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.

By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing

material that is retu rned to us unsorted or which we are not obliged to accep t, we shall have to invoice you for any cost s

incurred.

Components used in life-support devices or systems must be expressly authorized for such purpose! Critical

components 1 , may only be used in life -suppor t devices or syst ems 2 with th e express written approval of OSRAM OS.

1 A critical component is a component usedin a life-sup port device or system whose failure can reasonably be expected

to cause the failure of tha t life-support device or system, o r to affect its safety o r effectiveness of that device or system.

2 Life support d evices or systems are intend ed (a) to be implanted in the human b ody, or (b ) to suppo rt an d/or maint ain

and sustain human life. If they f ail, it is reasonable to assume that the health of the user may be endangered.

OHLA0687

˚C

120 s max

100

150

200

250

300

Ramp Up

100 s max

50 100 150 200 250 300

Ramp Down

6 K/s (max)

3 K/s (max)

25 ˚C

30 s max

260 ˚C

+0 ˚C

-5 ˚C

245 ˚C

±5 ˚C

240 ˚C

255 ˚C

217 ˚C

Maximum Solder Profile

Recommended Solder Profile

235 ˚C

-0 ˚C

+5 ˚C

Minimum Solder Profile

10 s min