DAC8043
Parameter Symbol Conditions Min Typ Max Units
TIMING CHARACTERISTICS (NOTES 5, 14)
Data Setup Time t
DS
T
A
= Full Temperature Range 40 ns
Data Hold Time t
DH
T
A
= Full Temperature Range 80 ns
Clock Pulse Width High t
CH
T
A
= Full Temperature Range 90 ns
Clock Pulse Width Low t
CL
T
A
= Full Temperature Range 120 ns
Load Pulse Width t
LD
T
A
= Full Temperature Range 120 ns
LSB Clock Into Input Register
to Load DAC Register Time t
ASB
T
A
= Full Temperature Range 0 ns
POWER SUPPLY
Supply Voltage V
DD
4.75 5 5.25 V
Supply Current I
DD
Digital Inputs = V
IH
or V
IL
500 µA max
Digital Inputs = 0 V or V
DD
100 µA max
–3–
REV. C
NOTES
11
±1/2 LSB = ±0.012% of full scale.
12
All grades are monotonic to 12-bits over temperature.
13
Using internal feedback resistor.
14
Applies to I
OUT
; All digital inputs = 0 V.
15
Guaranteed by design and not tested.
16
I
OUT
Load = 100 Ω, C
EXT
= 13 pF, digital input = 0 V to V
DD
or V
DD
to 0 V. Extrapolated to 1/2 LSB; t
S
= propagation delay (t
PD
) + 9τ where τ = measured time
constant of the final RC decay.
17
V
REF
= +10 V, all digital inputs = 0 V.
18
Absolute temperature coefficient is less than +300 ppm/°C.
19
Digital inputs are CMOS gates; I
IN
is typically 1 nA at +25 °C.
10
V
REF
= 0 V, all digital inputs = 0 V to V
DD
or V
DD
to 0 V.
11
All digit inputs = 0 V.
12
Calculated from worst case R
REF
: I
ZSE
(in LSBs) = (R
REF
× I
LKG
× 4096)/V
REF
.
13
Calculations from en = √4K TRB where: K = Boltzmann constant, J/°K, R = resistance, Ω, T = resistor temperature, °K, B = bandwidth, Hz.
14
Tested at V
IN
= 0 V or V
DD
.
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS
(T
A
= +25°C unless otherwise noted)
V
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+17 V
V
REF
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±25 V
V
RFB
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±25 V
Digital Input Voltage Range . . . . . . . . . . . . . . . –0.3 V to V
DD
Output Voltage (Pin 3) . . . . . . . . . . . . . . . . . . . –0.3 V to V
DD
Operating Temperature Range
AZ Versions . . . . . . . . . . . . . . . . . . . . . . . .–55°C to +125°C
EZ/FZ/FP Versions . . . . . . . . . . . . . . . . . . .–40°C to +85°C
GP Version . . . . . . . . . . . . . . . . . . . . . . . . . . . .0°C to +70°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Storage Temperature . . . . . . . . . . . . . . . . . . .–65°C to +150°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . . +300°C
Package Type u
JA
*u
JC
Units
8-Pin Hermetic DIP (Z) 134 12 °C/W
8-Pin Plastic DIP (P) 96 37 °C/W
*u
JA
is specified for worst case mounting conditions, i. e., u
JA
is specified for device
in socket for cerdip and P-DIP packages.
CAUTION
1. Do not apply voltages higher than V
DD
or less than GND po-
tential on any terminal except V
REF
(Pin 1) and R
FB
(Pin 2).
2. The digital control inputs are Zener-protected; however, per-
manent damage may occur on unprotected units from high
energy electrostatic fields. Keep units in conductive foam at
all times until ready to use.
3. Use proper antistatic handling procedures.
4. Absolute Maximum Ratings apply to both packaged devices
and DICE. Stresses above those listed under Absolute Maxi-
mum Ratings may cause permanent damage to the device.
ORDERING GUIDE
1
Relative Temperature Package
Model Accuracy Range Option
DAC8043AZ
2
±1/2 LSB –55°C to +125°C 8-Pin Cerdip
DAC8043AZ/883
2
±1/2 LSB –55°C to +125°C 8-Pin Cerdip
DAC8043EZ ±1/2 LSB –40°C to +125°C 8-Pin Cerdip
DAC8043FS ±1 LSB –40°C to +85°C 16-Lead (Wide) SOL
DAC8043FZ ±1 LSB –40°C to +85°C 8-Pin Cerdip
DAC8043FP ±1 LSB –40°C to +85°C 8-Pin Epoxy DIP
DAC8043GP ±1/2 LSB 0°C to +70°C 8-Pin Epoxy DIP
DAC8043HP ±1 LSB 0°C to +70°C 8-Pin Epoxy DIP
NOTES
1
All commercial and industrial temperature range parts are available with burn-in.
2
For devices processed in total compliance to MIL-STD-883, add/883 after part
number. Consult factory for 883 data sheet.
DAC8043