REJ03G0070-0400 Rev.4.00 Jan 09, 200 9
Page 1 of 5
HRD0103C
Silicon Schottky Barrier Diode for Rectifying REJ03G0070-0400
Rev.4.00
Jan 09, 2009
Features
• Low reverse voltage drop and suitable for high efficiency reverse current.
• Lineup of environmental friendly Halogen free type (HRD0103C-N)
• Super small Flat Lead Package (SFP) is suitable for compact and high-density surface mount design.
Ordering Information
Part No. Laser Mark Package Name Package Code Taping Abbreviation
(Quantity)
HRD0103CKRF
HRD0103C-NKRF
(Halogen-free type)
S6 SFP PUSF0002ZB-A KRF (8,000 pcs / reel)
Pin Arrangement
Cathode mark
Mark
1. Cathode
2. Anode
12
S6
HRD0103C
REJ03G0070-0400 Rev.4.00 Jan 09, 200 9
Page 2 of 5
Absolute Maximum Ratings
(Ta = 25°C)
Item Symbol Value Unit
Peak reverse voltage VRM *1 30 V
Reverse voltage VR 30 V
Average rectified current IO *1 100 mA
Peak forward surge current IFM 300 mA
Non-Repetitive peak forward surge curr ent IFSM *2 1 A
Junction temperature Tj 125 °C
Storage temperature Tstg –55 to +125 °C
Notes: 1. See from Fig.3 to Fig.5.
2. 10 ms sine wave 1 pulse.
Electrical Characteristics
(Ta = 25°C)
Item Symbol Min Typ Max Unit Test Condition
VF1 — — 0.40 V IF = 10 mA Forward voltage VF2 — — 0.60 V IF = 100 mA
IR1 — — 0.1 VR = 5 V Reverse current IR2 — — 0.2
μA VR = 10 V
Capacitance C — — 8.0 pF VR = 0.5 V, f = 1 MHz
Thermal resistance Rth(j-a) — 600 — °C/W Polyimide board *1
Notes: 1. Polyimide board
Unit: mm
3.0
0.8
1.5
20h×15w×0.8t
1.5
2. In the SFP package, some lead is exposed because the tip of the llead is used as the cutting plane.
Therefore, the solderability of the lead tip has been ignored. Please test and confirm before use.
HRD0103C
REJ03G0070-0400 Rev.4.00 Jan 09, 200 9
Page 3 of 5
Main Characteristics
0 0.2 0.4 0.6 0.8 1.0
0
0.005
0.020
0.015
0.01
03020 40
0.025
Pulse test
Forward voltage V
F
(V)
Fig.1 Forward current vs. Forward voltage
10
–3
10
–2
10
–5
10
–4
1.0
10
–6
10
–1
10
–3
10
–8
10
–5
10
–4
10
–7
10
–6
Reverse voltage V
R
(V)
Fig.2 Reverse current vs. Reverse voltage
Reverse current I
R
(A)
Forward current I
F
(A)
Ta = 75°C
Ta = 25°C
Pulse test
10
0.03
0.150.10
0
Reverse power dissipation Pd (W)
Fig4.
Reverse
power dissipation vs. Reverse voltage
Reverse voltage V
R
(V)
Fig3. Forward power dissipation vs.
Forward current
Forward current I
F
(A)
Forward power dissipation Pd (W)
0.050
0.02
0.08
0.12
0.04
0.06
0.1
0 5 15 25 3010 20
Ta = 25°C
Ta = 50°C
Ta = 75°C
t
T
0V
Tj = 125°C
sin
D = —
T
t
D = 2/3
D = 5/6
D = 1/2
DC
sin
D = 1/6
D = 1/3
D = 1/2
t
T
0A
Ta = 25°C
D = —
T
t
HRD0103C
REJ03G0070-0400 Rev.4.00 Jan 09, 200 9
Page 4 of 5
05010025 75 125
0
Average rectified current I
O
(A)
Ambient temperature Ta (
°C
)
Fig.5 Average rectified current vs. Ambient temperature
−25
0.12
0.1
0.08
0.06
0.04
0.02
D = 1/6
DC
D = 1/2
D = 1/3
sin(θ = 180°)
V
R
= V
RM
/2
Tj =125°C
Rth(j-a) = 600°C/W
HRD0103C
REJ03G0070-0400 Rev.4.00 Jan 09, 200 9
Page 5 of 5
Package Dimensions
⎯0.0010g
MASS[Typ.]
SFP / SFPVPUSF0002ZB-A
RENESAS CodeJEITA Package Code Previous Code
A
c
EHE
D
b
e1
b
Pattern of terminal position areas
φ
A
b
c
D
E
HE
e1
0.25
0.50
0.08
0.55
0.90
1.30
0.30
0.13
0.60
0.50
1.40
1.00
1.40
0.55
0.35
0.18
0.65
1.10
1.50
Dimension in Millimeters
Reference
Symbol Min Nom Max
b
φ
Package Name
SFP
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