PF PRESSURE SENSOR 04.11.10 11:32 AM Page 38 PF (ADP1) PF PRESSURE SENSOR PRECISION SEMICONDUCTOR PRESSURE SENSOR <Cross-section of Sensor Chip> Silicon Piezo resistance strain gauge Anode junction Pressure Glass base Highly reliable wire bonding technology Pressure Example of pressure characteristics (when the rated pressure is between 98.1 kPa {1.0 kgf/cm2} * A wide range of rated pressure, including a minute pressure There are 10 types of sensors covering a wide range of rated pressure from a minute pressure between 4.9 kPa {0.05 kgf/cm2}, to a maximum pressure of 980.7 kPa {10 kgf/cm2}. * Realization of highly accurate, linear characteristics This sensor employs a semiconductor strain gauge method, ensuring accurate and linear detection characteristics. It also has excellent repeatability of pressure characteristics. * Impressive line-up of models * Taking their place alongside the standard 5k bridge resistance models are those with a 3.3k resistance which is optimally suited to 5V drive circuits. * Economy model (no glass base) gives outstanding value for consumer appliances 40 kPa (0.4 kgf/cm2) and 49 kPa (0.5 kgf/cm2) units are also available. High reliability die bonding technology Very strong, heat resistant body Drive current: 1.5 mA rated current; ambient temperature: 25C 77F Output voltage, mV 100 50 0 0 {0} 49 {0.5} 98.1 {1} Pressure (gauge pressure), (kPa {kgf/cm2}) TYPICAL APPLICATIONS * Medical equipment: Electronic hemodynamometer * Home appliance: Vacuum cleaner * Gas equipment: Microprocessor gas meter, gas leakage detector * Industrial equipment: Absorption device, etc. ORDERING INFORMATION Ex. ADP Part No. Terminal profile and direction 1: DIP terminal: Dirtection opposite the pressure inlet direction ADP1: PF pressure sensor 2: DIP terminal: Pressure inlet direction Rated pressure 0: 1: 2: 3: 4: 5: 6: 7: 8: 9: A: 4.9 kPa 14.7 kPa 34.3 kPa 49.0 kPa 98.1 kPa 196.1 kPa 343.2 kPa 490.3 kPa 833.6 kPa 980.7 kPa 40.0 kPa {approx. 0.05 kgf/cm2} {approx. 0.15 kgf/cm2} {approx. 0.35 kgf/cm2} {approx. 0.5 kgf/cm2} {approx. 1.0 kgf/cm2} {approx. 2.0 kgf/cm2} {approx. 3.5 kgf/cm2} {approx. 5.0 kgf/cm2} {approx. 8.5 kgf/cm2} {approx. 10.0 kgf/cm2} {approx. 0.4 kgf/cm2} Type 1 : Standard type (With glass base) 2: Economy type (Without glass base) 5.0k Bridge resistance DIP terminal: Direction opposite the pressure inlet direction Terminal Pressure DIP terminal: Pressure inlet direction Packing quantity DIP terminal: Pressure inlet direction 4.9kPa approx. 0.05kgf/cm2 ADP1101 ADP1201 ---- ---- ADP1111 ADP1211 ---- ---- 34.3kPa approx. 0.35kgf/cm ADP1121 ADP1221 ---- ---- ADP1131 ADP1231 ---- ---- ADP1141 ADP1241 ---- ---- ADP1151 ADP1251 ---- ---- ADP1161 ADP1261 ---- ---- 490.3kPa approx. 5.0kgf/cm2 ADP1171 ADP1271 ---- ---- 833.6kPa approx. 8.5kgf/cm2 ADP1181 ADP1281 ---- ---- 980.7kPa approx. 10.0kgf/cm2 ADP1191 ADP1291 ---- ---- 2 Standard 98.1kPa approx. 1.0kgf/cm2 type (With glass 196.1kPa approx. 2.0kgf/cm2 base) 343.2kPa approx. 3.5kgf/cm2 Bridge resistance Nil : 5.0k 3 : 3.3k 3.3k DIP terminal: Direction opposite the pressure inlet direction 14.7kPa approx. 0.15kgf/cm2 49.0kPa approx. 0.5kgf/cm2 Economy type (Without glass base) 1 40.0kPa approx. 0.4kgf/cm ---- ---- ADP11A23 ADP12A23 49.0kPa approx. 0.5kgf/cm2 ADP1132 ADP1232 ---- ---- 2 Inner Outer 100 pcs. 1,000 pcs. PF PRESSURE SENSOR 2004.11.1 7:04 PM Page 39 PF (ADP1) SPECIFICATIONS Type Type of pressure Pressure medium Unit: kPa Rated pressure Unit: kgf/cm2 (approx.) Max. applied pressure Bridge resistance Economy type 4.9 0.05 Standard type (With glass base) (Without glass base) Gauge pressure Air (For other medium, please consult us.) 34.3 49.0 98.1 196.1 343.2 490.3 833.6 980.7 40.0 49.0 0.35 0.5 1.0 2.0 3.5 5.0 8.5 10.0 0.4 0.5 Twice the rated pressure 1.5 times the rated pressure Twice the rated pressure 50001000 3300600 50001000 -5 to 50C -20 to 100C -20 to 100C -4 to 212F (no freezing or condensation) -7 to 122F -4 to 212F -20 to 70C -40 to 120C -40 to 120C -40 to 248F (no freezing or condensation) -4 to 158F -70 to 248F 5 to 45C 0 to 50C 0 to 50C 32 to 122F 41 to 113F 32 to 122F 1.5 mA DC 10040 mV 43.522.5 mV 8545 mV 20 mV 15 mV 25 mV 0.3%FS 0.5%FS 0.6%FS 0.3%FS 0.2%FS 0.4%FS 0.7%FS 14.7 0.15 Ambient temperature Storage temperature Temperature compensation range Drive current (constant current) Output span voltage Offset voltage Linearity Pressure hysteresis Offset voltage-temperature characteristics (0 to 50C 32 to 122F) Sensitivity-temperature characteristics (0 to 50C 32 to 122F) 4020 mV 0.7%FS 0.5%FS 0.6%FS 0.4%FS 15%FS 5.0%FS 10%FS 8%FS 10%FS 2.5%FS 1.3%FS 2.5%FS Notes) 1. Unless otherwise specified, measurements were taken with a drive current of1.5 mA 0.01 mA at a temperature of 25C 77F and humidity ranging from 25% to 85%. 2. Please consult us if a pressure medium other than air is to be used. 3. This is the regulation which applies within the compensation temperature range. 4. Please consult us if the intended use involves a negative pressure. DATA ADP1141 Drive current: 1.5 mA; temperature: 25C 77F Output voltage (mV) 80 60 40 20 0 -20 -40 1-<3> Sensitivity - temperature characteristics (%FS) ADP1141 Drive current: 1.5 mA; rating 5%FS ADP1141 Drive current: 1.5 mA; rating 2.5%FS Offset voltage - temperature characteristics (%FS) 100 1-<2> Offset voltage - temperature characteristics 0 49 {0.5} kpa {kgf/cm2} 98.1 {1} Rated pressure 4 4 Sensitivity - temperature characteristics (%FS) 1. Characteristics data 1-<1> Output characteristics 3 2 1 0 -1 -2 0 32 25 47 50 122 Temperature (C F) 3 2 1 0 -1 -2 0 32 25 47 50 122 Temperature (C F) 2. Pressure cycle range (0 to rated pressure) Tested sample: ADP1131, temperature: 25C 77F 2-<1> Offset voltage range 2-<2> Output span voltage range 2 Output span voltage range (%FS) Offset voltage range (%FS) 2 1 0 -1 -2 0 1x105 5x105 1x106 Pressure cycle (cycle) Even after testing for 1 million times, the variations in the offset voltage and output span voltage are minimal. 1 0 -1 -2 0 1x105 5x105 1x106 Pressure cycle (cycle) PF PRESSURE SENSOR 2004.11.1 7:04 PM Page 40 PF (ADP1) 3. Evaluation test Tested item Storage at high temperature Storage at low temperature Environmental characteristics Tested condition Temperature: Left in a 120C 248F constant temperature bath Time: 1,000 hrs. Temperature: Left in a -40C -40F constant temperature bath Time: 1,000 hrs. Temperature/humidity: Left at 40C 104F, 90% RH Time: 1,000 hrs. Temperature: -40C to 120C -40F to 248F 1 cycle: 30 min. Times of cycle: 100 Temperature/humidity: 40C 104F, 90% RH Operation times: 106, rated voltage applied Double amplitude: 1.5 mm .059 inch Vibration: 10 to 55 Hz Applied vibration direction: X, Y, Z 3 directions Times: 2 hrs each Dropping height: 75 cm 29.528 inch Times: 2 times Pulling strength: 9.8 N {1 kgf}, 10 sec. Bending strength: 4.9 N {0.5 kgf}, left and right 90 1 time Temperature: 230C 446F Time: 5 sec. Temperature: 260C 500F Time: 10 sec. Humidity Temperature cycle Endurance characteristics High temperature/high humidity operation Vibration resistance Mechanical characteristics Dropping resistance Terminal strength Soldered in DIP soldering bath Soldering Resistance Temperature Result Passed Passed Passed Passed Passed Passed Passed Passed Passed Passed Note: For details other than listed above, please consult us. General tolerance: 0.3 .012 mm inch DIMENTIONS 1. Terminal direction: Direction opposite the pressure inlet derection ADP11 () 2. Terminal direction: Pressure inlet direction ADP12 () 10.0 .394 Atmospheric pressure inlet hole Atmospheric pressure inlet hole 10.0 .394 0.5 dia. .020 dia. 0.5 dia. .020 dia. 8.6 .339 8.6 .339 3.0 +0 -0.1 dia. .118 +0 -.004 dia. 10.16 0.25 .400 .010 C0.5 .020 Pressure inlet hole 0.8 dia. .031 dia. 2.54 0.25 2.54 0.25 .100 .010 .100 .010 Pressure inlet hole 0.8 dia. .031 dia. 1.2 0.1 .047 .004 6.0 .236 0.6 .024 3.3 .130 1.1 .043 4.9 0.6 .024 .193 0.1 .004 0.5 .020 1.2 0.1 .047 .004 0 to 15 0.5 0.1 .020 .004 R0.5 .020 0.25 .010 0.25 +0.1 -0.05 .010 +.004 -.002 3.0 +0 -0.1 dia. .118 +0 -.004 dia. C0.5 .020 0.25 +0.1 -0.05 .010 +.004 -.002 6.0 4.0 .236 .157 R0.5 .020 3.3 .130 10.16 0.25 .400 .010 0 to 15 2.54 0.25 2.54 0.25 .100 .010 .100 .010 Recommended PC board pattern (BOTTOM VIEW) Recommended PC board pattern (BOTTOM VIEW) 6-0.9 dia. 6-.035 dia. 6-0.9 dia. 6-.035 dia. 10.16 .400 2.54 .100 5.08 .200 6 dia. .236 dia. 2.54 .100 2.54 .100 5.08 .200 Tolerance: 0.1 .004 R2 R1 +Output -Output R3 R4 -Input 2.54 .100 Tolerance: 0.1 .004 3. Terminal connection diagram +Input 10.16 .400 Terminal No. Name 1 Output (-) 2 Power supply (+) 3 Output (+) 4 No connection 5 Power supply (-) 6 Output (-) Note: Leave terminal 4 unconnected. PF PRESSURE SENSOR 2004.11.1 7:04 PM Page 41 PF (ADP1) NOTES 1. Mounting Use lands on the printed-circuit boards to which the sensor can be securely fixed. 2. Soldering 1) Due to its small size, the thermal capacity of the pressure sensor DIP type is low. Therefore, take steps to minimize the effects of external heat. Dip soldering bath: Max. 260C 500F, 5 sec. Soldering iron: 260 to 300C 500 to 572F (30W) within 5 sec. 2) Use a non-corrosive resin type of flux. Since the pressure sensor DIP type is exposed to the atmosphere, do not allow flux to enter inside. 3. Cleaning 1) Since the pressure sensor chip is exposed to the atmosphere, do not allow cleaning fluid to enter inside. 2) Avoid ultrasonic cleaning since this may cause breaks or disconnections in the wiring. 4. Environment Consult with us before using or storing the pressure sensor chip in a place exposed to corrosive gases (such as the gases given off by organic solvents, sulfites, hydrogen sulfides, etc.) which will adversely affect the performance of the pressure sensor chip. 5. Quality check under actual loading conditions 1) To assure reliability, check the sensor under actual loading conditions. Avoid any situation that may adversely affect its performance. 2) As for test data, please contact us. 6. Other handling precautions 1) That using the wrong pressure range or mounting method may result in accidents. 2) Air can be used directly as a pressure medium. Consult with us before using a corrosive gas (such as a gas given off by an organic solvent, sulfite or hydrogen sulfide) as the pressure medium. 3) The pressure sensor chip is positioned inside the pressure inlet. Never poke wires or other foreign matter through the pressure inlet since they may damage the chip or block the inlet. Avoid use when the atmospheric pressure inlet is blocked. 4) Leave pin No. 4 unconnected since the pressure sensor chip may be damaged if a voltage is applied to this pin. 5) Use an operating pressure which is within the rated pressure range. Using a pressure beyond this range may cause damage. 6) Since this pressure sensor chip does not have a water-proof construction, consult with us if it is to be used in a location where it may be sprayed with water, etc. 7) Avoid using the pressure sensor chip in an environment where condensation may form. Furthermore, its output may fluctuate if any moisture adhering to it freezes. APPLICATION CIRCUIT DIAGRAM (EXAMPLE) MOUNTING METHOD The pressure sensor is designed to convert a voltage by means of constant current drive and then, if necessary, it amplifies the voltage for use. The circuit shown below is a typical example of a circuit in which the pressure sensor is used. Amplifier circuit unit Constant current circuit unit Pressure sensor OP AMP OP AMP OP AMP The general method for transmitting air pressures differs depending on whether the pressure is low or high. * Checkpoints for use <1> Select a pressure inlet pipe which is sturdy enough to prevent pressure leaks. <2> Fix the pressure inlet pipe securely so as to prevent pressure leaks. <3> Do not block the pressure inlet pipe. 8) The pressure sensor chip is constructed in such a way that its output will fluctuate when it is exposed to light. Especially when pressure is to be applied by means of a transparent tube, take steps to prevent the pressure sensor chip from being exposed to light. 9) Avoid using the pressure sensor chip where it will be susceptible to ultrasonic or other high-frequency vibration. 10) Since static charge can damage the pressure sensor chip, bear in mind the following handling precautions. * When storing the pressure sensor chips, use a conductive material to short the pins or wrap the entire chip in aluminum foil. Plastic containers should not be used to store or transport the chips since they readily become charged. * When using the pressure sensor chips, all the charged articles on the bench surface and the work personnel should be grounded so that any ambient static will be safely discharged. 11) Due to the pressures involved, give due consideration to the securing of the pressure sensor DIP type and to the securing and selection of the inlet tube. Consult us if you have any queries. Methods of transmitting air pressures When the pressure is low (4.9 to 98.1 kPa) Printedcircuit board When the pressure is high (196.1 to 980.7 kPa) Printedcircuit board O-ring Tube Pressure inlet pipe If a tube is used as the pressure inlet pipe, it may become disengaged. Therefore, use a sturdy tube and secure it using O-rings.