Kyocera's series of Multilayer Ceramic Chip Capacitors
are designed to meet a wide variety of needs. We offer
a complete range of products for both general and
specialized applications, including CM series for general-
purpose, CT series for low profile, CA series for arrays,
CL series for ICs, CF series for high-voltage, and DM
series for automotive.
Features
•
We have factories worldwide in order to supply our global customer
bases quickly and efficiently and to maintain our reputation as one
of the highest−volume producers in the industry.
• All our products are highly reliable due to their monolithic structure
of high−purity and superfine uniform ceramics and their integral
internal electrodes.
• By combining superior manufacturing technology and materials
with high dielectric constants, we produce extremely compact
components with exceptional specifications.
• Our stringent quality control in every phase of production from
material procurement to shipping ensures consistent manufacturing
and super quality.
• Kyocera components are available in a wide choice of dimensions,
temperature characteristics, rated voltages, and terminations to
meet specific configurational requirements.
CM
series
General
CA
series
Arrays
DM
series
Automotive
CL
series
ICs
CT
series
Low Profile
CF
series
High-Voltage
Multilayer
Ceramic Chip
Capacitors
RoHS Compliant
Tape and Reel Bulk Case
Please contact your local AVX, Kyocera sales office or distributor for
specifications not covered in this catalog.
Our products are continually being improved. As a result, the
capacitance range of each series is subject to change without notice.
Please contact an sales representative to confirm compatibility with
your application.
External Termination
Electrodes
Internal Electrodes
(Pd, Pd/ Ag or Ni)
Dielectric Ceramic Layer
Temperature compensation: Titanate family
Zirconate family
High dielectric constant:
Barium Titanate family
Nickel Barrier Termination Products
Ag or Cu or
CuNi
Ni Plating
Sn or Au Plating
Structure
Multilayer Ceramic Chip Capacitors
Kyocera Ceramic Chip Capacitors are available for different applications as classified below:
Series Dielectric Options Typical Applications Features Terminations Available Size
CM
C0G (NP0)
X5R
X7R
∗X6S
∗X7S
Y5V
General purpose Wide cap range Nickel barrier
01005, 0201, 0402
0603, 0805, 1206
1210, 1812
CT
X5R
X7R
Y5V
IC card
(Decoupling) Low profile Nickel barrier 0201, 0402, 0603
0805, 1206, 1210
CA C0G (NP0)
X5R, X7R
Digital signal
Pass line
Reduction in
placing cost Nickel barrier 0405, 0508
CL X7S ICs
(Decoupling) Low inductance Nickel barrier 0204, 0306
CF C0G (NP0)
X7R
High voltage
&
Power circuits
High voltage
250VDC, 630VDC
1000VDC, 2000VDC
3000VDC, 4000VDC
Nickel barrier
0805, 1206, 1210
1812, 2208, 1808
2220
DM X7R Automotive
Thermal shock
Resistivity
High reliability
Nickel barrier 0603,0805,1206
∗ Option
∗ Negative temperature coefficient dielectric types are available on request.
Multilayer Ceramic Chip Capacitors
Multilayer Ceramic Chip Capacitors
Dimensions
7
4
,
0〜0
00
Dimensions and Packaging Quantities
Size Code Dimension
Code
Dimensions (mm) Maximum quantity per reel
JIS EIA L W T P min. P max.
P to P min.
φ180 Reel φ330 Reel
02 0402 01005 A0.4±0.02 0.2±0.02 0.2±0.02 0.07 0.14 0.13 40kp (P8/1) −
20kp (P8/2) 50kp (P8/2)
03 0603 0201
A
0.6±0.03 0.3±0.03
0.22 max.
0.10 0.20 0.20
35kp (P8/1) −
15kp (P8/2) 50kp (P8/2)
B0.3±0.03 35kp (P8/1) −
15kp (P8/2) 50kp (P8/2)
C0.6±0.05 0.3±0.05 0.3±0.05 0.13 0.23 0.19 35kp (P8/1) −
15kp (P8/2) 50kp (P8/2)
05 1005 0402
A
1.0±0.05 0.5±0.05
0.25 max.
0.15 0.35 0.30
30kp (P8/1) −
10kp (P8/2) 50kp (P8/2)
B0.35 max. 30kp (P8/1) −
10kp (P8/2) 50kp (P8/2)
C0.5±0.05 30kp (P8/1) −
10kp (P8/2) 50kp (P8/2)
D
1.0±0.10 0.5±0.10
0.35 max. 30kp (P8/1) −
10kp (P8/2) 50kp (P8/2)
E0.5±0.10 30kp (P8/1) −
10kp (P8/2) 50kp (P8/2)
F1.0±0.15 0.5±0.15 0.5±0.15 30kp (P8/1) −
10kp (P8/2) 50kp (P8/2)
105 1608 0603
A
1.6±0.10 0.8±0.10
0.55 max.
0.20 0.60 0.50
4kp (P8/4) 10kp (P8/4)
B0.8±0.10 8kp (P8/2) 20kp (P8/2)
4kp (P8/4) 10kp (P8/4)
C
1.6±0.15 0.8±0.15
0.55 max. 8kp (P8/2) 20kp (P8/2)
4kp (P8/4) 10kp (P8/4)
D0.8±0.15 8kp (P8/2) 20kp (P8/2)
4kp (P8/4) 10kp (P8/4)
E1.6±0.2 0.8±0.2 0.55 max. 8kp (P8/2) 20kp (P8/2)
4kp (P8/4) 10kp (P8/4)
21 2012 0805
A
2.0±0.10 1.25±0.10
0.55 max.
0.20 0.75 0.70
4kp (P8/4) 10kp (P8/4)
B0.95 max. 4kp (P8/4) 10kp (P8/4)
C1.00 max. 4kp (E8/4) 10kp (E8/4)
D0.6±0.10 4kp (P8/4) 10kp (P8/4)
E0.85±0.10 4kp (P8/4) 10kp (P8/4)
F1.05±0.10 3kp (E8/4) 10kp (E8/4)
G1.25±0.10 3kp (E8/4) 10kp (E8/4)
H
2.0±0.15 1.25±0.15
0.55 max. 4kp (P8/4) 10kp (P8/4)
J0.95 max. 4kp (P8/4) 10kp (P8/4)
K1.25±0.15 3kp (E8/4) 10kp (E8/4)
L2.0±0.20 1.25±0.20 0.95 max. 4kp (P8/4) 10kp (P8/4)
M1.25±0.20 3kp (E8/4) 10kp (E8/4)
316 3216 1206
A
3.2±0.20 1.6±0.15
0.85±0.10
0.30 0.85 1.40
4kp (P8/4) 10kp (P8/4)
B0.95 max. 4kp (P8/4) 10kp (P8/4)
C1.00 max. 4kp (E8/4) 10kp (E8/4)
D1.15±0.10 3kp (E8/4) 10kp (E8/4)
E1.25±0.10 3kp (E8/4) 10kp (E8/4)
F1.6±0.15 2.5kp (E8/4) 5kp (E8/4)
G
3.2±0.20 1.6±0.20
0.95 max. 4kp (P8/4) 10kp (P8/4)
H1.00 max. 4kp (E8/4) 10kp (E8/4)
J1.6±0.20 2.5kp (E8/4) 5kp (E8/4)
32 3225 1210
A
3.2±0.20 2.5±0.20
1.00 max.
0.30 1.00 1.40
4kp (E8/4) 10kp (E8/4)
B1.40 max. 3kp (E8/4) 10kp (E8/4)
C1.60 max. 2.5kp (E8/4) 5kp (E8/4)
D1.6±0.15 2.5kp (E8/4) 5kp (E8/4)
E2.20 max. 2kp (E8/4) 5kp (E8/4)
F2.0±0.2 2kp (E8/4) 5kp (E8/4)
G2.5±0.2 1kp (E8/4) 4kp (E8/4)
42 4520 1808 A4.5±0.20 2.0±0.20 1.6 max. 0.15 0.85 2.60 2kp (E12/4) −
B2.2 max. 2kp (E12/4) −
43 4532 1812
A
4.5±0.30 3.2±0.20
2.0 max.
0.30 1.10 2.00
1kp (E12/4) −
B2.0±0.2 1kp (E12/4) −
C2.5 max. 0.5kp (E12/4) −
D2.5±0.2 0.5kp (E12/4) −
E2.8 max. 0.5kp (E12/4) −
F2.8±0.2 0.5kp (E12/4) −
52 5720 2208 A5.7±0.40 2.0±0.20 2.2 max. 0.15 0.85 4.20 2kp (12/4) −
55 5750 2220
A
5.7±0.40 5.0±0.40
2.0 max.
0.30 1.40 2.50
1kp (E12/4) −
B2.5 max. 0.5kp (E12/4) −
C2.8 max. 0.5kp (E12/4) −
Note: Taping denotes the quantity packaged per reel (kp means 1000 pieces).
Multilayer Ceramic Chip Capacitors
Ordering Information
KYOCERA PART NUMBER CM 21 X7R 104 K 50 A T □□□
SERIES CODE
CM = General Purpose
CT = Low Profile
CA = Arrays
CL = ICs
CF = High Voltage
DM = Automotive
SIZE CODE
SIZE EIA (JIS)
02 = 01005 (0402)
03 = 0201 (0603)
05 = 0402 (1005)
105 = 0603 (1608)
21 = 0805 (2012)
316 = 1206 (3216)
SIZE EIA (JIS)
32 = 1210 (3225)
42 = 1808 (4520)
43 = 1812 (4532)
52 = 2208 (5720)
55 = 2220 (5750)
SIZE EIA (JIS)
D11 = 0405 (1014)/ 2 cap
F12 = 0508 (1220)/ 4 cap
DIELECTRIC CODE
CODE EIA CODE
CG = C0G (NPO)
X5R = X5R
X7R = X7R
X7S = X7S (Option)
X6S = X6S (Option)
Y5V = Y5V
Negative temperature coefficient dielectric types are available on request.
CAPACITANCE CODE
Capacitance expressed in pF.
Two significant digits plus number of zeros.
For Values < 10pF, Letter R denotes decimal point,
eg.
100000pF = 104
0.1μF = 104
4700pF = 472
1.5pF = 1R5
0.5pF = R50
100μF = 107
TOLERANCE CODE
A = ±0.05pF (option)
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
F = ±1pF
G = ±2% (option)
J = ±5%
K = ±10%
M
= ±20%
Z = −20 to +80%
VOLTAGE CODE
04 = 4VDC
06 = 6.3VDC
10 = 10VDC
16 = 16VDC
25 = 25VDC
35 = 35VDC
50 = 50VDC
100 = 100VDC
250 = 250VDC
400 = 400VDC
630 = 630VDC
1000 = 1000VDC
2000 = 2000VDC
3000 = 3000VDC
4000 = 4000VDC
TERMINATION CODE
A = Nickel Barrier/ Tin K = Nickel Barrier/ Au
PACKAGING CODE
B = Bulk
C = Bulk Cassette (option)
T = 7" Reel Taping & 4mm Cavity pitch
Q = 7" Reel Taping & 1mm Cavity pitch
L = 13" Reel Taping & 4mm Cavity pitch
H = 7" Reel Taping & 2mm Cavity pitch
N = 13" Reel Taping & 2mm Cavity pitch
OPTION
Thickness max. value is indicated in CT series
EX. 125 → 1.25mm max.
095 → 0.95mm max.
Multilayer Ceramic Chip Capacitors
Temperature Characteristics and Tolerance
Temperature Compensation Type
Dielectric C0G (NPO)
0 ppm/ °C
UΔ (N750)
−750 ppm/ °C
SL
+350 to −1000ppm/ °C
Value (pF)
0.5 to 2.7 CK UK SL
3.0 to 3.9 CJ UJ SL
4.0 to 9.0 CH UJ SL
≥10 CG UJ SL
K = ±250ppm/ °C, J = ±120ppm/ °C, H = ±60ppm/ °C, G = ±30ppm/ °C
e.g. CG = 0±30ppm/ °C
Note: All parts of C0G will be marked as “CG” but will conform to the above table.
High Dielectric Constant Type
EIA Dielectric Temperature Range ΔC max.
X5R −55 to 85°C±15%
X7R −55 to 125°C
∗X7S −55 to 125°C±22%
∗X6S −55 to 105°C
Y5V −30 to 85°C−82 to +22%
∗ option
Available Tolerances
Dielectric materials, capacitance values and tolerances are
available in the following combinations only:
EIA Dielectric Tolerance Capacitance
C0G
C=±0.25pF
D=±0.50pF
F=±1pF
∗1 <10pF
∗3 A=±0.05pF
B=±0.1pF
<0.5pF
≤5pF
∗3 G=±2%
J=±5%
K=±10%
≥10pF
E12 Series
∗2 K=±10%
M=±20%
∗4 E3 Series
∗3 X6S
∗3 X7S
X5R
X7R
Y5V Z=−20% to +80% E3 Series
Note:
∗1 Nominal values below 10pF are available in the standard values of 0.5pF, 1.0pF, 1.5pF,
2.0pF, 3.0pF, 4.0pF, 5.0pF, 6.0pF, 7.0pF, 8.0pF, 9.0pF
∗2 J = ±5% for X7R (X5R) is available on request.
∗3 option
∗4 E6 series is available on request.
E Standard Number
E3 E6 E12 E24 (Option)
1.0
1.0
1.0 1.0 1.1
1.2 1.2 1.3
1.5
1.5 1.5 1.6
1.8 1.8 2.0
2.2
2.2
2.2 2.2 2.4
2.7 2.7 3.0
3.3
3.3 3.3 3.6
3.9 3.9 4.3
4.7
4.7
4.7 4.7 5.1
5.6 5.6 6.2
6.8
6.8 6.8 7.5
8.2 8.2 9.1
CL Series
Low Inductance Capacitors for Decoupling
Features
• The length to width ratio is reversed from
the normal type and lower inductance is
realized by making the path of a current
loop small.
• The noise removal nature in high
frequency is superior, so that it fits
power-supply decoupling of IC.
Applications
• MPU, GPU, ASIC, FPGA, High speed
memory, etc.
L
T
P
W
Dimensions
Code JIS CODE EIA CODE Dimensions (mm)
LWT P
CL05 0510 0204 0.5±0.05 1.0±0.05 0.3±0.05 0.18±0.08
CL105 0816 0306 0.8±0.15 1.6±0.15 0.5±0.1 0.25±0.15
X7S Dielectric
Size
(EIA Code)
CL05
(0204)
CL105
(0306)
Rated Voltage (VDC)
44
Capacitance (pF)
102 1000
2200
4700
103 10000
22000
47000
104 100000 A8
220000
470000
105 1000000 B8
2200000
4700000
106 10000000
Capacitances other than indicated in the above chart are optional.
Optional Spec.
Thickness and standard package quantity
Size
(EIA Code)
CL05
(0204)
CL105
(0306)
Thickness
(mm)
AB
0.3±0.05 0.5±0.1
Taping (180 dia reel) 10kp (P8/2) 4kp (P8/4)
Taping (330 dia reel) 50kp (P8/2) 10kp (P8/4)
Note: Taping denotes the quantity packaged per reel (kp means 1000 pcs.). P8 in
parenthesis denotes 8mm width paper tape; E8 denotes 8mm width plastic tape;
E12 denotes 12mm width plastic tape. "/1" after slash in parenthesis denotes
1mm pitch; "/2" does 2mm pitch; "/4" does 4mm pitch.
Tan δ
Code Tan δ
8
12.5% max.
Two digits alphanumerics in capacitance chart denote dimensions and tan δ.
Please refer to the below table for detail.
Multilayer Ceramic Chip Capacitors
Test Conditions and Standards
Test Conditions and Specifications for Temperature Compensation Type (CΔ to UΔ
•
SL Characteristics)
CM/ CT/ CF/ CA Series
Test Items Specifications Test Conditions
Capacitance Value (C) Within tolerance
Capacitance
Frequency Volt
C≤1000pF 1MHz±10% 0.5 to 5Vrms
C>1000pF 1kHz±10%
QC≥30pF : Q≥1000
C<30pF : Q≥400+20C
Insulation Resistance (IR) Over 10000MΩ or 500MΩ • μF, whichever is less
Measured after the rated voltage is applied for 1
minute at room ambient.
For the rated voltage of over 630V, apply 500V
for 1 minute at room ambient.
The charge and discharge current of the capacitor
must not exceed 50mA.
Dielectric Resistance No problem observed
Apply 3 times of the rated voltage for 1 to 5 seconds.
Apply 1.5 times when the rated voltage is 250V or over.
Apply 1.2 times when the rated voltage is 630V or over.
The charge and discharge current of the capacitor
must not exceed 50mA.
Appearance No problem observed Microscope (10× magnification)
Termination Strength No problem observed
Apply a sideward force of 500g (5N) to a PCB-
mounted sample. Apply 2N for 0201, and 1N for
01005 size.
Bending Strength No significant damage at 1mm bent
Glass epoxy PCB: Fulcrum spacing: 90mm, duration
time 10 seconds.
Vibration
Test
Appearance No problem observed Vibration frequency: 10 to 55 (Hz)
Amplitude: 1.5mm
Sweeping condition: 10→55→10Hz/ 1 minute in X,
Y and Z
Directions: 2 hours each, 6 hours total.
ΔCWithin Tolerance
QC≥30pF : Q≥1000
C<30pF : Q≥400+20C
Soldering
Heat
Resistance
Appearance No problem observed Soak the sample in 260°C±5°C solder for 10±0.5
seconds and place in room ambient, and measure
after 24±2 hours.
(Pre-heating conditions)
Order Temperature Time
180 to 100°C 2 minutes
2150 to 200°C 2 minutes
The charge and discharge current of the capacitor
must not exceed 50mA for IR and withstanding
voltage measurement.
ΔCWithin ±2.5% or ±0.25pF, whichever is larger
QC≥30pF : Q≥1000
C<30pF : Q≥400+20C
IR Over 10000MΩ or 500MΩ • μF whichever is less
Withstanding
Voltage Resist without problem
Solderablity Solder coverage : 90% min.
Soaking condition
Sn63 Solder
235±5°C2
±0.5 sec.
Sn-3Ag-0.5Cu
245±5°C3
±0.5 sec.
Temperature
Cycle
Appearance No problem observed (Cycle)
Room temperature (3min.)→
Lowest operation temperature (30min.)→
Room temperature (3min.)→
Highest operation temperature(30min.)
After 5 cycles, measure after 24±2 hours.
The charge and discharge current of the capacitor
must not exceed 50mA for IR and withstanding
voltage measurement.
ΔCWithin ±2.5% or ±0.25pF, whichever is larger
QC≥30pF : Q≥1000
C<30pF : Q≥400+20C
IR Over 10000MΩ or 500MΩ • μF, whichever is less
Withstanding
Voltage Resist without problem
Load
Humidity
Test
(Except CF
Series)
Appearance No problem observed After applying rated voltage for 500+12/ −0 hours
in pre-condition at 40°C±2°C, humidity 90 to
95%RH, allow parts to stabilize for 24±2 hours, at
room temperature before measurement.
The charge and discharge current of the capacitor
must not exceed 50mA for IR measurement.
ΔCWithin ±7.5% or ±0.75pF, whichever is larger
QC≥30pF : Q≥200
C<30pF : Q≥100+10C/ 3
IR Over 500MΩ or 25MΩ • μF, whichever is less
High-
Temperature
with Loading
Appearance No problem observed. After applying twice the rated voltage at the
temperature of 125±3°C for 1000+12/ −0 hours,
measure the sample after 24±2 hours.
Apply 1.5 times when the rated voltage is 250V or over.
Apply 1.2 times when the rated voltage is 630V or over.
The charge and discharge current of the capacitor
must not exceed 50mA for IR measurement.
ΔCWithin ±3% or ±0.3pF, whichever is larger
Q
C≥30pF : Q≥350
10pF<C<30pF : Q≥275+5C/ 2
C<10pF : Q≥200+10C
IR Over 1000MΩ or 50MΩ • μF, whichever is less
Multilayer Ceramic Chip Capacitors
Test Conditions and Standards
Test Conditions and Specifications for High Dielectric Type (X5R, X7R)
CM/ CT/ CA Series
Test Items Specifications Test Conditions
Capacitance Value (C) Within tolerance Measure after heat treatment
Capacitance
Frequency Volt
C≤10μF 1kHz±10% 1.0±0.2Vrms
C>10μF 120Hz±10% 0.5±0.2Vrms
Tanδ (%) Refer to capacitance chart
Insulation Resistance (IR) Over 10000MΩ or 500MΩ • μF, whichever is less
Measured after the rated voltage is applied for 1
minute at room ambient.
The charge and discharge current of the capacitor
must not exceed 50mA.
Dielectric Resistance No problem observed
Apply 2.5 times of the rated voltage for 1 to 5 seconds.
The charge and discharge current of the capacitor
must not exceed 50mA.
Appearance No problem observed Microscope (10× magnification)
Termination Strength No problem observed
Apply a sideward force of 500g (5N) to a PCB-mounted sample.
note : 2N for 0201 size in for 01005 size.
Exclude CT series with thickness of less than 0.66mm.
Bending Strength No significant damage at 1mm bent
Glass epoxy PCB: Fulcrum spacing: 90mm, duration
time 10 seconds.
Exclude CT series with thickness of less than 0.66mm.
Vibration
Test
Appearance No problem observed Take the initial value after heat treatment.
Vibration frequency: 10 to 55 (Hz)
Amplitude: 1.5mm
Sweeping condition: 10→55→10Hz/ 1 minute in X, Y and Z
Directions: 2 hours each, 6 hours total.
ΔCWithin tolerance
Tanδ (%) Within tolerance
Soldering
Heat
Resistance
Appearance No problem observed Take the initial value after heat treatment.
Soak the sample in 260°C±5°C solder for 10±0.5
seconds and place in room ambient, and measure
after 24±2 hours.
(Pre-heating conditions)
Order Temperature Time
180 to 100°C 2 minutes
2150 to 200°C 2 minutes
The charge and discharge current of the capacitor must not
exceed 50mA for IR and withstanding voltage measurement.
ΔCWithin ±7.5%
Tanδ (%) Within tolerance
IR Over 10000MΩor 500MΩ • μF, whichever is less
Withstanding
Voltage Resist without problem
Solderablity Solder coverage : 90% min.
Soaking condition
Sn63 Solder 235±5°C2
±0.5 sec.
Sn-3Ag-0.5Cu 245±5°C3
±0.5 sec.
Temperature
Cycle
Appearance No problem observed Take the initial value after heat treatment.
(Cycle)
Room temperature (3min.)→
Lowest operation temperature (30min.)→
Room temperature (3min.)→
Highest operation temperature(30min.)
After 5 cycles, measure after 24±2 hours.
The charge and discharge current of the capacitor must not
exceed 50mA for IR and withstanding voltage measurement.
ΔCWithin ±7.5%
Tanδ (%) Within tolerance
IR Over 10000MΩor 500MΩ • μF, whichever is less
Withstanding
Voltage Resist without problem
Load
Humidity
Test
Appearance No problem observed Take the initial value after voltage treatment.
After applying rated voltage for 500+12/ −0 hours
in pre-condition at 40°C±2°C, humidity 90 to
95%RH, allow parts to stabilize for 24±2 hours, at
room temperature before measurement.
The charge and discharge current of the capacitor
must not exceed 50mA for IR measurement.
ΔCWithin ±12.5%
Tanδ (%) 200% max. of initial value
IR Over 500MΩor 25MΩ • μF, whichever is less
High-
Temperature
with
Loading
Appearance No problem observed Take the initial value after voltage treatment.
After applying twice the rated voltage at the highest
operation temperature for 1000+12/ −0 hours,
measure the sample after 24±2 hours.
The charge and discharge current of the capacitor
must not exceed 50mA for IR measurement.
Apply 1.5 times when the rated voltage is 10V or less. Applied
voltages for respective products are indicated in the below chart.
ΔCWithin ±12.5%
Tanδ (%) 200% max. of initial value
IR Over 1000MΩor 50MΩ • μF, whichever is less
Pre-
treatment
Heat Keepspecimenat150+0/−10℃for1hour,leavespecimenatroomambientfor24±2hours.
Voltage Applythesametestconditionfor1hour,thenleavethespecimenatroomambientfor24±2hours.
High-temperature with Loading Applied Voltage (Rated Voltage × □)
AppliedVoltage
RatedVoltage
Products
×1.3 6.3V CM105X5R475, CM316X5R476
CT05X5R104,CT21X5R106
×1.5
16V
CM105X7R474-105,CM21X7R105-475,CM316X7R475-106,CM32X7R106-226,CM05X5R224,CM105X5R225,CM21X5R475-106,CM316X5R226
CT105X5R105,CT21X5R225-475,CT316X5R106
25V
CM105X7R474,CM21X7R105-225,CM316X7R475,CM32X7R106,CM105X5R474-105,CM21X5R225-106,CM316X5R106,CM32X5R106-226
CT316X5R225-106
50V CM21X5R105
CT21X5R225,CT316X5R225-475
Test Conditions and Specifications for High Dielectric Type (Y5V)
CM/ CT/ CA Series
Test Items Specifications Test Conditions
Capacitance Value (C) Within tolerance Measure after heat treatment
Frequency Volt
1kHz±10% 1.0±0.2Vrms
Tanδ (%) Refer to capacitance chart
Insulation Resistance (IR) Over 10000MΩ or 500MΩ • μF, whichever is less
Measured after the rated voltage is applied for 1
minute at room ambient.
Dielectric Resistance No problem observed
Apply 2.5 times of the rated voltage for 1 to 5 seconds.
The charge and discharge current of the capacitor
must not exceed 50mA.
Appearance No problem observed Microscope (10× magnification)
Termination Strength No problem observed
Apply a sideward force of 500g (5N) to a PCB-
mounted sample.
note : 2N for 0201 size in for 01005 size.
Exclude CT series with thickness of less than 0.66mm.
Bending Strength No significant damage at 1mm bent
Glass epoxy PCB: Fulcrum spacing: 90mm, duration
time 10 seconds.
Exclude CT series with thickness of less than 0.66mm.
Vibration
Test
Appearance No problem observed Take the initial value after heat treatment.
Vibration frequency: 10 to 55 (Hz)
Amplitude: 1.5mm
Sweeping condition: 10→55→10Hz/ 1 minute in X,
Y and Z
Directions: 2 hours each, 6 hours total.
ΔCWithin tolerance
Tanδ (%) Within tolerance
Soldering
Heat
Resistance
Appearance No problem observed Take the initial value after heat treatment.
Soak the sample in 260°C±5°C solder for 10±0.5
seconds and place in room ambient, and measure
after 24±2 hours.
(Pre-heating conditions)
Order Temperature Time
180 to 100°C 2 minutes
2150 to 200°C 2 minutes
The charge and discharge current of the capacitor
must not exceed 50mA for IR and withstanding
voltage measurement.
ΔCWithin ±20%
Tanδ (%) Within tolerance
IR Over 10000MΩ or 500MΩ • μF, whichever is less
Withstanding
Voltage Resist without problem
Solderablity Solder coverage : 90% min.
Soaking condition
Sn63 Solder
235±5°C2
±0.5 sec.
Sn-3Ag-0.5Cu
245±5°C3
±0.5 sec.
Temperature
Cycle
Appearance No problem observed Take the initial value after heat treatment.
(Cycle)
Room temperature (3min.)→
Lowest operation temperature (30min.)→
Room temperature (3min.)→
Highest operation temperature(30min.)
After 5 cycles, measure after 24±2 hours.
The charge and discharge current of the capacitor
must not exceed 50mA for IR and withstanding
voltage measurement.
ΔCWithin ±20%
Tanδ (%) Within tolerance
IR Over 10000MΩ or 500MΩ • μF, whichever is less
Withstanding
Voltage Resist without problem
Load
Humidity
Test
Appearance No problem observed Take the initial value after voltage treatment.
After applying rated voltage for 500+12/ −0 hours
in pre-condition at 40°C±2°C, humidity 90 to
95%RH, allow parts to stabilize for 24±2 hours, at
room temperature before measurement.
The charge and discharge current of the capacitor
must not exceed 50mA for IR measurement.
ΔCWithin ±30%
Tanδ (%) 150% max. of initial value
IR Over 500MΩ or 25MΩ • μF, whichever is less
High-
Temperature
with
Loading
Appearance No problem observed Take the initial value after voltage treatment.
After applying twice the rated voltage at the highest
operation temperature for 1000+12/ −0 hours,
measure the sample after 24±2 hours.
The charge and discharge current of the capacitor
must not exceed 50mA for IR measurement.
ΔCWithin ±30%
Tanδ (%) 150% max. of initial value
IR Over 1000MΩ or 50MΩ • μF, whichever is less
Pre-
treatment
Heat Keepspecimenat150+0/−10℃for1hour,leavespecimenatroomambientfor24±2hours.
Voltage Applythesametestconditionfor1hour,thenleavethespecimenatroomambientfor24±2hours.
Multilayer Ceramic Chip Capacitors
Test Conditions and Standards
Test Conditions and Specifications for High Dielectric Type (X7R)
CF Series
Test Items Specifications Test Conditions
Capacitance Value (C) Within tolerance Measure after heat treatment
Capacitance
Frequency Volt
C≤10μF 1kHz±10% 1.0±0.2Vrms
Tanδ (%) Within ±2.5%
Insulation Resistance (IR)
Over 10000MΩ or 500MΩ • μF, whichever is less
Over
100MΩ
•
μF for CF316X7R104/ 250V and CF43X7R474/ 250V
CF55X7R105/ 250V and CF55X7R224/ 630V
Measured after the rated voltage is applied
for 1 minute at room ambient.
Measured after the 500V is applied for 1
minute at room ambient for the rated voltage
over 630V.
The charge and discharge current of the
capacitor must not exceed 50mA.
Dielectric Resistance No problem observed
Apply 1.5 times when the rated voltage is
250V or over, apply 1.2 times when the rated
voltage is 630V or over for 1 to 5 seconds.
The charge and discharge current of the
capacitor must not exceed 50mA.
Appearance No problem observed Microscope (10× magnification)
Termination Strength No problem observed Apply a sideward force of 500g (5N) to a
PCB-mounted sample.
Bending Strength No significant damage at 1mm bent Glass epoxy PCB: Fulcrum spacing: 90mm,
duration time 10 seconds.
Vibration
Test
Appearance No problem observed Take the initial value after heat treatment.
Vibration frequency: 10 to 55 (Hz)
Amplitude: 1.5mm
Sweeping condition: 10→55→10Hz/ 1 minute
in X, Y and Z
Directions: 2 hours each, 6 hours total.
ΔCWithin tolerance
Tanδ (%) Within tolerance
Soldering
Heat
Resistance
Appearance No problem observed Take the initial value after heat treatment.
Soak the sample in 260°C±5°C solder for
10±0.5 seconds and place in room ambient,
and measure after 24±2 hours.
(Pre-heating conditions)
Order Temperature Time
180 to 100°C 2 minutes
2150 to 200°C 2 minutes
The charge and discharge current of the
capacitor must not exceed 50mA for IR and
withstanding voltage measurement.
ΔCWithin ±7.5%
Tanδ (%) Within tolerance
IR
Over 10000MΩ or 500MΩ • μF, whichever is less
Over
100MΩ
•
μF for CF316X7R104/ 250V and CF43X7R474/ 250V
CF55X7R105/ 250V and CF55X7R224/ 630V
Withstanding
Voltage Resist without problem
Solderablity Solder coverage : 90% min.
Soaking condition
Sn63 Solder
235±5°C2
±0.5 sec.
Sn-3Ag-0.5Cu
245±5°C3
±0.5 sec.
Temperature
Cycle
Appearance No problem observed Take the initial value after heat treatment.
(Cycle)
Room temperature (3min.)→
Lowest operation temperature (30min.)→
Room temperature (3min.)→
Highest operation temperature(30min.)
After 5 cycles, measure after 24±2 hours.
The charge and discharge current of the
capacitor must not exceed 50mA for IR and
withstanding voltage measurement.
ΔCWithin ±7.5%
Tanδ (%) Within tolerance
IR
Over 10000MΩ or 500MΩ • μF, whichever is less
Over
100MΩ
•
μF for CF316X7R104/ 250V and CF43X7R474/ 250V
CF55X7R105/ 250V and CF55X7R224/ 630V
Withstanding
Voltage Resist without problem
High-
Temperature
with
Loading
Appearance No problem observed
Take the initial value after voltage treatment.
After applying specified voltage at the highest
operation temperature for 1000
+12/ −0
hours,
then measure the sample after 24±2 hours.
The applied voltage shall be;
1.5 times the rated voltage when the rated
voltage is 250V or over.
1.2 times when the rated voltage is 630V or over.
The charge and discharge current of the capacitor
must not exceed 50mA for IR measurement.
ΔCWithin ±12.5%
Tanδ (%) 200% max. of initial value
IR Over 1000MΩ or 50MΩ • μF, whichever is less
Pre-
treatment
Heat Keepspecimenat150+0/−10℃for1hour,leavespecimenatroomambientfor24±2hours.
Voltage Applythesametestconditionfor1hour,thenleavethespecimenatroomambientfor24±2hours.
Multilayer Ceramic Chip Capacitors
Test Conditions and Standards
Substrate for Electrical Tests (Unit: mm)
C
A
B
Size
(EIA Code) abc
02 (01005) 0.15 0.50 0.20
03 (0201) 0.26 0.92 0.32
05 (0402) 0.4 1.4 0.5
105 (0603) 1.0 3.0 1.2
21 (0805) 1.2 4.0 1.65
316 (1206) 2.2 5.0 2.0
32 (1210) 2.2 5.0 2.9
42 (1808) 3.5 7.0 3.7
43 (1812) 3.5 7.0 3.7
52 (2208) 4.5 8.0 5.6
55 (2220) 4.5 8.0 5.6
E
±
D
F
PP
5
6ROGHULQJ
/RDG
6XSSRUWφPP
7HVWLQJ%RDUG
7HVWLQJ7DEOH
7HVWLQJ%RDUG *ODVV(SR[\%RDUG&(RU)5
7HVWLQJ%RDUG7KLFNQHVV±PP∗
&LUFXLW7KLFNQHVV ±PP
3UHVVXUH
AB
C
Substrate for Bending Test (Unit: mm) Substrate for Adhesion Strength Test
∗ 02, 03, 05 and array: 0.8±0.1mm
Multilayer Ceramic Chip Capacitors
Test Conditions and Standards
Multilayer Ceramic Chip Capacitors
Packaging Options
Carrier Tape (Unit: mm)
Size
(EIA Code) A B F
02 (01005) 0.25±0.03 0.45±0.03 2.0±0.05
03 (0201)∗0.37±0.03 0.67±0.03 2.0±0.05
05 (0402) 0.65±0.1 1.15±0.1 2.0±0.05
105 (0603) 1.0±0.2 1.8±0.2 4.0±0.1
21 (0805) 1.5±0.2 2.3±0.2 4.0±0.1
316 (1206) 2.0±0.2 3.6±0.2 4.0±0.1
32 (1210) 2.9±0.2 3.6±0.2 4.0±0.1
42 (1808) 2.4±0.2 4.9±0.2 4.0±0.1
43 (1812) 3.6±0.2 4.9±0.2 8.0±0.1
52 (2208) 2.4±0.2 6.0±0.2 4.0±0.1
55 (2220) 5.3±0.2 6.0±0.2 8.0±0.1
D11 (0405) 1.15±0.2 1.55±0.2 4.0±0.1
F12 (0508) 1.5±0.2 2.3±0.2 4.0±0.1
∗ Option : A : 0.39±0.03, B : 0.69±0.03
(Unit: mm)
F Carrier Tape C D E G H J
1.0
±0.05
1mm
Paper
8.0
+0.3/ −0.1
3.5
±0.05
1.75
±0.1
2.0
±0.05
4.0
±0.05
1.5
+0.1/ −0
2.0
±0.05 8mm
Paper 8.0
±0.3
4.0
±0.1
4.0
±0.1
8mm
Plastic
12mm
Plastic
12.0
±0.3
5.5
±0.05
8.0
±0.1
0.6 max.
GHF
(Plastic)
3.0 max.
A
BC
E
D
Feed Hole Punched rectangular hole to hold capacitor
J
Holes only for plastic carrier tape. F0.3 min.
F=8mm (43, 55 Type)
(Paper) (Plastic)
0.6 max. 1.1 max.
H G F
A
B
2.8 max.
C
E
D
Feed Hole Punched rectangular hole to hold capacitor
Holes only for plastic carrier tape. F0.3 min.
J
F=4mm (105, D11, F12, 21, 316, 32, 42, 52 Type)
Feed Hole Punched rectangular hole to hold capacitor
J
FH 03 Type: 0.5 max.
05 Type: 0.75 max.
105 Type: 1.1 max.
(Paper)
F
A
BC
E
D
F=2mm (03, 05, 105 Type)
(Paper)
H
FF
A
B
C
E
D
Feed Hole Parts insertion cavity
J
02 Type: 0.4 max.
03 Type: 0.5 max.
05 Type: 0.75 max.
F=1mm (02, 03, 05 Type)
A
R
E
C
D
W1
W2
B
Tape and Reel
• Reel
Reel (Unit: mm)
Code ABCD
Reel
7−inch Reel
(CODE: T, H, Q) 180 +0
−2.0 φ60 min.
13±0.5 21±0.8
13−inch Reel
(CODE: L, N) 330±2.0 φ100±1.0
Code EW
1W2R
Reel
7−inch Reel
(CODE: T, H, Q) 2.0±0.5
10.0±1.5
16.5 max. 1.0
13−inch Reel
(CODE: L, N) 9.5±1.0
∗ Carrier tape width 8mm.
For size 42 (1808) or over, Tape width 12mm and W1: 14±1.5, W2: 18.4mm max.
Carrier Tape
Peeling Direction
Unrolling Direction
165nto180n
Top Tape
Exfoliating angle: 165 to 180 degrees to the carrier tape.
Exfoliating speed: 300 mm/min.
Adhesive tape
1) The exfoliative strength when peeling off the top tape from the
carrier tape by the method of the following figure shall be 0.1-0.7N.
2)
When the top tape is peeled off, the adhesive stays on the top tape.
3) Chip capacitors will be in a state free without being stuck on the
thermal adhesive tape.
Slider
Shutter
Connection Area
110
36
12
Bulk Case (Unit: mm) Package quantity
Size
Code Thickness (mm) Package quantity
(pcs.)
05 0.5 50,000
105 0.8 15,000
21 1.25 5,000
Note: Please check us for bulk case applicable products.
Bulk Case
Size
Code
EIA
CODE
JIS
CODE
Dimensions (mm)
L W T P min. P max.
P to P min.
05 0402 1005 1.0±0.05 0.5±0.05 0.5±0.05 0.15 0.35 0.30
105 0603 1608 1.6±0.07 0.8±0.07 0.8±0.07 0.20 0.60 0.50
21 0805 2012 2.0±0.1 1.25±0.1 1.25±0.1 0.20 0.75 0.70
Note: Regarding support for Bulk cases, please contact us for further information.
Multilayer Ceramic Chip Capacitors
Packaging Options
Detail of leader and trailer
160mm min. 100mm min.
400mm min.
Empty Pockets Components
StartEnd
Leader
External
Electrode
Dimensions
P
P
T
W
L
P to P
Dimensions
Multilayer Ceramic Chip Capacitors
Surface Mounting Information
Dimensions for recommended typical land
Since the amount of solder (size of fillet) to be used has direct
influence on the capacitor after mounting, the sufficient consideration
is necessary.
When the amounts of solder is too much, the stress that a capacitor
receives becomes larger. It may become the cause of a crack in
the capacitor. When the land design of printed wiring board is
considered, it is necessary to set up the form and size of land pattern
so that the amount of solder is suitable.
Chip Capacitor
PCB
Solder
T/ 3 to T/ 2
T
Design of printed circuit and Soldering
The recommended fillet height shall be 1/2 to 1/3 of the thickness of
capacitors. When mounting two or more capacitors in the common
land, it is necessary to separate the land with the solder resist strike
so that it may become the exclusive land of each capacitor.
General, High-Voltage (Unit: mm)
Size
(EIA Code) L×Wabc
02 (01005) 0.4×0.2 0.13 to 0.20 0.12 to 0.18 0.20 to 0.23
03 (0201) 0.6×0.3 0.20 to 0.30 0.25 to 0.35 0.30 to 0.40
05 (0402) 1.0×0.5 0.30 to 0.50 0.35 to 0.45 0.40 to 0.60
105 (0603) 1.6×0.8 0.70 to 1.00 0.80 to 1.00 0.60 to 0.80
21 (0805) 2.0×1.25 1.00 to 1.30 1.00 to 1.20 0.80 to 1.10
316 (1206) 3.2×1.6 2.10 to 2.50 1.10 to 1.30 1.00 to 1.30
32 (1210) 3.2×2.5 2.10 to 2.50 1.10 to 1.30 1.90 to 2.30
42 (1808) 4.5×2.0 2.50 to 3.20 1.80 to 2.30 1.50 to 1.80
43 (1812) 4.5×3.2 2.50 to 3.20 1.80 to 2.30 2.60 to 3.00
52 (2208) 5.7×2.0 4.20 to 4.70 2.00 to 2.50 1.50 to 1.80
55 (2220) 5.7×5.0 4.20 to 4.70 2.00 to 2.50 4.20 to 4.70
Automotive (Unit: mm)
Size
(EIA Code) L×Wabc
105 (0603) 1.6×0.8 0.60 to 0.90 0.80 to 1.00 0.70 to 1.00
21 (0805) 2.0×1.25 0.90 to 1.20 0.80 to 1.20 0.90 to 1.40
316 (1206) 3.2×1.6 1.40 to 1.90 1.00 to 1.30 1.30 to 1.80
Arrays (Unit: mm)
abcd
F12 (0508) 0.5 0.5 0.3 0.5
D11 (0405) 0.69 0.28 0.3 0.64
Ideal Solder Height
Chip Capacitor
PCB
Solder
T/ 3 to T/ 2
T
Item Not recommended example Recommended example/ Separated by solder
Multiple parts mount
Solder resist
Mount with
leaded parts
Leaded parts Leaded parts
Solder resist
Wire soldering
after mounting
Soldering iron
Wire
Solder resist
Overview
Solder resist Solder resist
(General, High-Voltage, Automotive)
Land Pattern
Sample capacitor
Soldering resist
ba
c
(Arrays)
F12 D11
c c c c
d
a
b
a
c c
d
a
b
a
Multilayer Ceramic Chip Capacitors
Surface Mounting Information
Mounting Design
The chip could crack if the PCB warps during processing after the chip has been soldered.
(Not recommended) (Ideal)
Crack
Support pin
(Not recommended) (Ideal)
Recommended chip position on PCB to minimize stress from PCB warpage
Actual Mounting
1) If the position of the vacuum nozzle is too low, a large force may be applied to the chip capacitor during mounting, resulting in cracking.
2) During mounting, set the nozzle pressure to a static load of 100 to 300 gf.
3) To minimize the shock of the vaccum nozzle, provide a support pin on the back of the PCB to minimize PCB flexture.
4) Bottom position of pick up nozzle should be adjusted to the top surface of a substrate which camber is corrected.
5) To reduce the possibility of chipping and cracks, minimize vibration to chips stored in a bulk case.
6)
The discharge pressure must be adjusted to the part size. Verify the pressure during setup to avoid fracturing or cracking the chips capacitors.
Resin Mold
1) If a large amount of resin is used for molding the chip, cracks may occur due to contraction stress during curing. To avoid such cracks, use
a low shrinkage resin.
2) The insulation resistance of the chip will degrade due to moisture absorption. Use a low moisture absorption resin.
3) Check carefully that the resin does not generate a decomposition gas or reaction gas during the curing process or during normal storage.
Such gases may crack the chip capacitor or damage the device itself.
Multilayer Ceramic Chip Capacitors
Surface Mounting Information
Soldering Method
1) Ceramic is easily damaged by rapid heating or cooling. If some heat shock is unavoidable, preheat enough to limit the temperature
difference (Delta T) to within 130 degree Celsius.
2) The product size 1.0×0.5mm to 3.2×1.6mm can be used in reflow and wave soldering, and the product size of bigger than 3.2×1.6mm, or
smaller than 1.0×0.5mm, and capacitor arrays can be used in reflow.
Circuit shortage and smoking can be created by using capacitors which are used neglecting the above caution.
3) Please see our recommended soldering conditions.
4) In case of using Sn-Zn Solder, please contact us in advance.
5) The following condition is recommended for spot heater application.
Sodering iron
1) Temperature of iron chip
2) Wattage
3) Tip shape of soldering iron
4) Soldering Time
1206 and smaller 350°C max.
1210 and larger 280°C max.
80W max.
φ3.0mm max.
3 sec. max.
5) Cautions
a) Pre−heating is necessary rapid heating must be avoided.
Delta T≤150°C
b) Avoid direct touching to capacitors.
c) Avoid rapid cooling after soldering. Natural cooling is recommended.
∗
Consult as if it is difficult to keep the temperature 280°C max. for 1210 and larger MLCC’S.
•Recommendedspotheatercondition
Item Condition
Distance 5mm min.
Angle 45°
Projection Temp. 400°C max.
Flow rate Set at the minimum
Nozzle diameter 2φ to 4φ (Single hole type)
Application time 10 sec. max. (1206 and smaller)
30 sec.max. (1210 and larger)
How to point spot heater
Single hole nozzle
Angle 45°
Recommended Temperature Profile (62Sn Solder) Recommended Temperature Profile (Sn−3Ag−0.5Cu)
Reflow Reflow
ΔT
300
250
200
150
100
50
0
Preheat
60 seconds
Temperature
Peak temperature
230°C±5°C
15 seconds maximum
60 seconds
More than180°C,
40 seconds maximum
Cool at normal room
temperature after
removing from
furnace.
① Minimize soldering time.
② Ensure that the temperature difference (ΔT) does not exceed 150°C.
③ Ensure that the temperature difference (ΔT) does not exceed 130°C for 3.2×2.5mm size or larger.
④ MLCC can withstand the above reflow conditions up to 3 times.
300
250
200
150
100
50
0
Preheat
Temperature
250°C±5°C
5 to 10 sec. max.
90±30 sec.
220°C max.
90 sec. max.
170 to 180°C1 to 3°C/ sec.
① Minimize soldering time.
② Ensure that allowable temperature difference does not exceed 150°C.
③ Ensure that allowable temperature difference does not exceed 130°C for 3.2×2.5mm size or larger.
Wave Wave
① Ensure that the chip capacitor is preheated adequately.
② Ensure that the temperature difference (ΔT) does not exceed 150°C.
③ Cool naturally after soldering.
④ Wave soldering is not applicable for chips with size of 3.2x2.5mm or larger of 0.6x0.3mm or smaller.
300
250
200
150
100
50
0
Preheat
Temperature (°C)
60 to 120 sec.
5 sec. max.
Cool at normal
room temperature
Peak Temperature
230°C to 260°C
ΔT
① Ensure that the chip capacitor is preheated adequately.
② Ensure that the temperature difference (ΔT) does not exceed 150°C.
③ Cool naturally after soldering.
④ Wave soldering is not applicabel for chips with size of 3.2×2.5mm or larger of 0.6x0.3mm or smaller.
Preheat
300
250
200
150
100
50
Temperature (°C)
0
Cool at normal
room temperature
Peak Temperature
245°C to 260°C
ΔT
60 to 120 sec.
5 sec. max.
Circuit Design
1. Once application and assembly environments have been checked, the capacitor may be used in conformance with the rating and
performance which are provided in both the catalog and the specifications. Use exceeding that which is specified may result in inferior
performance or cause a short, open, smoking, or flaming to occur, etc.
2. Please consult the manufacturer in advance when the capacitor is used in devices such as: devices which deal with human life, i.e. medical
devices; devices which are highly public orientated; and devices which demand a high standard of liability.
Accident or malfunction of devices such as medical devices, space equipment and devices having to do with atomic power could generate
grave consequence with respect to human lives or, possibly, a portion of the public. Capacitors used in these devices may require high
reliability design different from that of general purpose capacitors.
3.
Please use the capacitors in conformance with the operating temperature provided in both the catalog and the specifications.
Be especially cautious not to exceed the maximum temperature. In the situation the maximum temperature set forth in both the catalog and
specifications is exceeded, the capacitor’s insulation resistance may deteriorate, power may suddenly surge and short−circuit may occur.
The capacitor has a loss, and may self−heat due to equivalent series resistance when alternating electric current is passed therethrough. As this
effect becomes especially pronounced in high frequency circuits, please exercise caution.
When using the capacitor in a (self−heating) circuit, please make sure the surface of the capacitor remains under the maximum temperature for
usage. Also, please make certain temperature rises remain below 20°C.
4. Please keep voltage under the rated voltage which is applied to the capacitor. Also, please make certain the peak voltage remains below the
rated voltage when AC voltage is super−imposed to the DC voltage.
In the situation where AC or pulse voltage is employed, ensure average peak voltage does not exceed the rated voltage.
Exceeding the rated voltage provided in both catalog and specifications may lead to defective withstanding voltage or, in worst case
situations, may cause the capacitor to smoke or flame.
5. When the capacitor is to be employed in a circuit in which there is continuous application of a high frequency voltage or a steep pulse
voltage, even though it is within the rated voltage, please inquire to the manufacturer.
In the situation the capacitor is to be employed using a high frequency AC voltage or a extremely fast rising pulse voltage, even though it is
within the rated voltage, it is possible capacitor reliability will deteriorate.
6.
It is a common phenomenon of high−dielectric products to have a deteriorated amount of static electricity due to the application of DC voltage.
Due caution is necessary as the degree of deterioration varies depending on the quality of capacitor materials, capacity, as well as the load voltage
at the time of operation.
7. Do not use the capacitor in an environment where it might easily exceed the respective provisions concerning shock and vibration specified
in the catalog and specifications.
In addition, it is a common piezo phenomenon of high dielectric products to have some voltage due to vibration or to have noise due to
voltage change. Please contact sales in such case.
8. If the electrostatic capacity value of the delivered capacitor is within the specified tolerance, please consider this when designing the
respective product in order that the assembled product function appropriately.
9. Please contact us upon using conductive adhesives.
Storage
1. If the component is stored in minimal packaging (a heat−sealed or chuck−type plastic bag), the bag should be kept closed. Once the bag
has been opened, reseal it or store it in a desiccator.
2. Keep storage place temperature +5 to +35 degree C, humidity 45 to 70% RH.
3. The storage atmosphere must be free of gas containing sulfur and chlorine. Also, avoid exposing the product to saline moisture. If the
product is exposed to such atmospheres, the terminals will oxidize and solderability will be effected.
4. Precautions 1) to 3) apply to chip capacitors packaged in carrier tapes and bulk cases.
5. The solderability is assured for 12 months from our shipping date (six months for silver palladium) if the above storage precautions are
followed.
6. Chip capacitors may crack if exposed to hydrogen (H2) gas while sealed or if coated with silicon, which generates hydrogen gas.
Safety application guideline and detailed information of electrical properties are also provided in Kyocera home page;
URL: http://www.kyocera.co.jp/electronic/
Multilayer Ceramic Chip Capacitors
Precautions
