1
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notice_e-01
Notice for TAIYO YUDEN products　
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product information in this catalog is as of October 2011. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-
fore practical application or usage of the Products.
Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo-
rating such products, which are caused under the conditions other than those specified in this catalog or individual
specification.
■ Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is
available.
■ Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
■ All electronic components or functional modules listed in this catalog are developed, designed and intended for
use in general electronics equipment.(for AV, office automation, household, office supply, information service,
telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any
equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal,
disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have
direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma-
rine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic equipment,
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil-
ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to
install a protective circuit is strongly recommended at customer's design stage.
■ The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-
tors (so called “TAIYO YUDEN’s official sales channel”).
It is only applicable to the products purchased from any of TAIYO YUDEN’ s official sales channel.
■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc-
cur in connection with a third party's intellectual property rights and other related rights arising from your usage of
products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.
■ Caution for export
Certain items in this catalog may require specific procedures for export according to “Foreign Exchange and For-
eign Trade Control Law” of Japan, “U.S. Export Administration Regulations”, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
184
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■ FEATURES
■ ORDERING CODE
■ EXTERNAL DIMENSIONS/STANDARD QUANTITY
■ APPLICATIONS
2.5±0.1
index
2.0±0.1
0.6max
C0.15
4-0.9625
8-0.425
4-0.7375
8-0.375
2.5×2.0×0.6（8pin）2.5×2.0×0.65 2.0×1.6×0.52.5×2.0×0.6（9pin）
2.5±0.1
index
2.0±0.1
0.65max
C0.15
4-0.9625 2-0.3
8-0.425
4-0.7375
8-0.375
0.9×0.375
2.5±0.1
index
2.0±0.1
0.6max
C0.15
4-0.9625 2-0.3
8-0.425
4-0.7375
8-0.375
0.9×0.375
2.0±0.1
index
1.6±0.1
0.5max
C0.15
4-0.775 2-0.325
8-0.30
4-0.575
8-0.30
0.60×0.30
Unit：mm Unit：mm
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
sawfilter01_e-01
◦Low Insertion Loss
◦High Attenuation
◦Small Size Package
◦High Reliability with Hermetic Sealing（MSL1）
◦Environmentally Conscions
◦UMTS（W-CDMA）
◦GSM
◦CDMA
◦LTE
◦GPS
◦Other
SAW/FBAR DEVICES (FILTER / DUPLEXERS)
REFLOW
＊For further details, please contact to TAIYO YUDEN Co.,Ltd.
Unit：mm Unit：mm
（B）New Rule (applied to products registered on April 1, 2010 or later.)
D 6 N F 1 G 9 6 0 P 1 B Z －Z _ S
❶ ❷ ❸ ❹ ❺ ❻ ❼ ❽ ❾ ❿
❶Series
Product Frequency Range
D5 Duplexer 700-1000MHz
D6 Duplexer 1000-5000MHz
J5 Dual Duplexer 700-1000MHz
F5 Filter 700-1000MHz
F6 Filter 1000-5000MHz
G5 Dual Filter 700-1000MHz
G6 Dual Filter 1000-5000MHz
❷Package type
❸Product type
❹Frequency ❺Design ❻Serial Number
❾Custom, Status
❽Packing
❼Custom
❿Status, JIG
Nothing
MP
S ES
（A）Previous Rule (applied to products registered on March 31, 2010 or before.)
❿Serial Number❽Common sign
－Fixation
❷Common sign
－Fixation
❶Family
F A R －D 6 N F －1 G 9 6 0 0 －P 1 B Z －Z
❶ ❷ ❸ ❹ ❺ ❻ ❼ ❽ ❾ ❿ ⓫ ⓬
❸Series
Product Frequency Range
D5 Duplexer 700-1000MHz
D6 Duplexer 1000-5000MHz
J5 Dual Duplexer 700-1000MHz
F5 Filter 700-1000MHz
F6 Filter 1000-5000MHz
G5 Dual Filter 700-1000MHz
G6 Dual Filter 1000-5000MHz
❼Frequency
❾Design ⓫Custom, Status
⓬Packing
❻Common sign
－Fixation
❹Package type
❺Product type
❼Frequency
HIGH FREQUENCY PRODUCTS
185
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2
1.40±0.1
index
1.00±0.1
0.325
0.325
0.5max
0.50 0.50
0.25
0.575
0.25
0.25
1.4×1.0×0.5 1.8×1.4×0.5 1.5×1.1×0.51.1×0.9×0.5
1.10±0.1
index
0.90±0.1
0.25
0.5max
0.40 0.40
0.2
0.5
0.25
0.20
0.25
1.80±0.1
index
1.40±0.1
0.5max
1.41
0.47
0.600.60
0.24 0.23
1.00
0.25
0.25
0.25
1.50±0.1
index
1.10±0.1
0.5max
1.17
0.39
0.490.39
0.18 0.21
0.78
0.18
0.21
0.18
Unit：mm Unit：mm
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
sawfilter01_e-01
Unit：mm Unit：mm
●2G Frequency Allocation
●3G Frequency Allocation
GSM
3GPP/FDD（W-CDMA/LTE）
GSM Band 3GPP Band Name Region Use Tx（MHz）Rx（MHz）
850 V GSM850 US GPRS, EDGE 824-849 869-894
900 VIII EGSM CN/EU GPRS, EDGE 880-915 925-960
1800 III DCS CN/EU GPRS, EDGE 1710-1785 1805-1880
1900 II GSM1900 US GPRS, EDGE 1850-1910 1930-1990
3GPP Band
3GPP2 Band Class
Name （Block）Region Use （Status）Tx（MHz）Rx（MHz）
I 6 2G EU, JP, CN W-CDMA 1920-1980 2110-2170
II 1,（14）1.9G US W-CDMA 1850-1910 1930-1990
III 8 1800 EU LTE 1710-1785 1805-1880
IV 15 －US W-CDMA 1710-1755 2110-2155
V 0 850 US W-CDMA 824-849 869-894
VI －800 JP W-CDMA 830-840 875-885
VII 13 2.5G EU LTE 2500-2570 2620-2690
VIII 9 900 EU W-CDMA 880-915 925-960
IX －1.7G JP W-CDMA 1750-1785 1845-1880
X－ － US W-CDMA 1710-1770 2110-2170
XI －1.5G JP W-CDMA/LTE 1427.9-1452.9（1427.9-1447.9）1475.9-1500.9 （1475.9-1495.9）
XII －Lower 700 （A,B,C）US LTE 698-716 728-746
XIII －Upper 700 （C）US LTE 777-787 746-756
XIV －Upper 700 （D）US LTE 788-798 758-768
XV － － － － 1900-1920 2600-2620
XVI － － － － 2010-2025 2585-2600
XVII －Lower 700 （B,C）US LTE 704-716 734-746
XVIII 0-3 New 800 JP CDMA2000 or LTE 815-830 860-875
XIX －Extended 800 JP W-CDMA or LTE 830-845 875-890
XX － － EU LTE 832-862 791-821
XXI －Extended 1.5G JP LTE 1447.9-1462.9 1495.9-1510.9
3GPP/TDD
3GPP Band
3GPP2 Band Class
Name Region Use （Status）Tx（MHz）Rx（MHz）
33 － － － － 1900-1920 1900-1920
34 － － － － 2010-2025 2010-2025
35 － － － － 1850-1910 1850-1910
36 － － － － 1930-1990 1930-1990
37 － － － － 1910-1930 1910-1930
38 － － － － 2570-2620 2570-2620
39 － － － － 1880-1920 1880-1920
40 － － － － 2300-2400 2300-2400
186
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■ PART NUMBERS
System Part number Package Size
（mm）
Insertion Loss
（dB）Isolation （dB）Remarks
W-CDMA I （2G）
FAR-D6JG-2G1400-D3FZ 2.5×2.0×0.65 1.4/1.7 54/47 9 Pin, B Type
FAR-D6JH-2G1400-B1BT 2.5×2.0×0.65 1.4/1.7 58/48 9 Pin, B Type Rx : Bal.100ohm STD
D6PE2G140P3AW 2.0×1.6×0.5 1.5/1.6 59/47 9 Pin, B Type Rx : Bal.100ohm
CDMA/W-CDMA V （850）
FAR-D5NG-881M50-M11Z 2.5×2.0×0.6 1.45/1.8 66/52 9 Pin, B Type New
FAR-D5PF-881M50-M3E7 2.0×1.6×0.5 1.5/1.8 58/51 9 Pin, A Type
FAR-D5NE-881M50-P1A9 2.5×2.0×0.6 1.6/1.8 57/51 9 Pin, B Type Rx : Bal.100ohm
FAR-D5NE-881M50-P1A6Q 2.5×2.0×0.6 1.6/1.7 60/53 9 Pin, B Type 100ohm, New
FAR-D5PE-881M50-P3EZ 2.0×1.6×0.5 1.4/1.7 59/52 9 Pin, B Type Rx : Bal.100ohm
FAR-D5PE-881M50-P3EY 2.0×1.6×0.5 1.4/1.7 59/52 9 Pin, A Type Rx : Bal.100ohm
J-CDMA （BW:27MHz）FAR-D5PF-911M50-M3J7 2.0×1.6×0.5 1.5/1.8 61/44 9 Pin, A Type
W-CDMA VIII （900）
FAR-D5NH-942M50-M1Y9 2.5×2.0×0.65 1.8/2.3 58/50 9 Pin, B Type
FAR-D5NF-942M50-P1GZ 2.5×2.0×0.65 1.9/2.3 58/50 9 Pin, B Type 100ohm, STD
FAR-D5NF-942M50-P1GWQ 2.5×2.0×0.65 1.9/2.3 59/54 9 Pin, B Type 100ohm, GPS High Att.
D5NE942M5P1G9 2.5×2.0×0.6 1.7/2.0 60/53 9 Pin, B Type 100ohm
D5PE942M5P3GT 2.0×1.6×0.5 1.7/2.2 58/54 9 Pin, B Type 100ohm
PCS/W-CDMA II （1.9G）
FAR-D6NH-1G9600-M1Z9 2.5×2.0×0.65 2.2/3.1 55/50 9 Pin, B Type
FAR-D6NH-1G9600-M1Z6 2.5×2.0×0.65 2.3/2.7 55/53 9 Pin, B Type Low Rx IL
D6HK1G960DK12 2.5×2.0×0.65 2.0/2.3 58/52 9 Pin, B Type
FAR-D6NF-1G9600-P1BT 2.5×2.0×0.65 2.5/2.8 54/55 9 Pin, B Type 100ohm, Low Rx IL
D6NF1G960P1BR 2.5×2.0×0.65 2.5/3.4 56/53
9 Pin, B Type 100ohm High GPS Att. & Rx Isol.
D6HH1G960BH95 2.5×2.0×0.65 2.3/2.5 56/53 9 Pin, B Type 100ohm, STD
D6HH1G960BH97 2.5×2.0×0.65 2.6/2.5 59/59
9 Pin, B Type 100ohm High GPS Att. & Rx Isol.
W-CDMA IV （DCS/2G）
FAR-D6JH-2G1325-B1YZ 2.5×2.0×0.65 1.5/1.7 57/51 9 Pin, B Type Rx : Bal.100ohm
D6JG2G132D3GZ 2.5×2.0×0.65 1.6/1.9 53/52 9 Pin, B Type
D6PE2G132P3DW 2.0×1.6×0.5 1.9/1.8 55/47 9 Pin, B Type Rx : Bal.100ohm
LTE XIII （Upper C）D5NE782M0P1D6 2.5×2.0×0.6 2.2/2.2 60/55 9 Pin, B Type Rx : Bal.100ohm
D5NG782M0M15Z 2.5×2.0×0.6 2.1/2.7 62/57 9 Pin, B Type
LTE XVII （Lower B,C）FAR-D5NE-740M00-P1C9 2.5×2.0×0.6 1.7/2.0 61/58 9 Pin, B Type Rx : Bal.100ohm
D5NG740M0M14Z 2.5×2.0×0.6 1.6/1.7 62/56 9 Pin, B Type
CDMA BC0+BC10 D5NF878M0P1ET 2.5×2.0×0.65 1.9/2.5 58/50 9 Pin B Type Rx : Bal.100ohm
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
sawfilter01_e-01
●3G Frequency Allocation
●OTHERS
3GPP2（CDMA2000）
Wireless LAN, Bluetooth, GPS
TD-SCDMA, PHS
3GPP2 Band Class
3GPP Band Name Region Use Tx（MHz）Rx（MHz）
0 V CDMA US, CN, KR CDMA2000 824-849 869-894
0-2 （V）J-CDMA （6MHz）JP CDMA2000 824-830 869-875
0-3 －J-CDMA （Plan）JP CDMA2000 or LTE 815-824 860-869
1 II PCS US CDMA2000 1850-1910 1930-1990
2－ － － － 872-909, 880-915 917-954, 925-960
3－J-CDMA （27MHz）JP CDMA2000 887-925 832-870
4－K-PCS KR CDMA2000 1750-1780 1840-1870
5－CDMA450 EU CDMA2000 452-484 462-494
6 I J-CDMA （IMT）JP CDMA2000 1920-1980 2110-2170
7－ － － 776-794 746-764
8 III － － － 1710-1785 1805-1880
9 VIII － － － 880-915 925-960
10 －Secondary US CDMA2000 817-824 862-869
11 － － － － 452-484 462-494
12 － － － － 870-876 915-921
13 VII － － － 2500-2570 2620-2690
14 （II）PCS （G-Band）US CDMA2000 1850-1915 1930-1995
15 IV AWS US CDMA2000 1710-1755 2110-2155
System Name（Block）Frequency（MHz）
Wireless LAN IEEE 802.11 2400-2483.5
Wireless LAN IEEE 802.11a 5150-5350
Bluetooth IEEE 802.15.1 2400-2483.5
GPS －1574.42-1576.42
3GPP Band
3GPP2 Band Class
Name Region Use Tx（MHz）Rx（MHz）
－ － 2G CN TD-SCDMA 2010-2025 2010-2025
－ － 1.9G CN TD-SCDMA 1880-1920 1880-1920
－ － CORE XGP JP PHS 2545-2575 2545-2575
●Duplexers
HIGH FREQUENCY PRODUCTS
187
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■ PART NUMBERS
System Part number Package Size
（mm）
Insertion Loss
（dB）
Attenuation
（dB）Remarks
CDMA Tx
FAR-F5KB-836M50-B4ER 1.4×1.0×0.5 1.7 44 100ohm input
FAR-F5KB-836M50-B4EG 1.4×1.0×0.5 1.6 42 200ohm input
F5QA836M5M2AB 1.1×0.9×0.5 1.6 34 －
CDMA/GSM850 Tx FAR-F5KA-836M50-D4DF 1.4×1.0×0.5 1.9 44 High Att. type
CDMA Rx
FAR-F5KB-881M50-B4ED 1.4×1.0×0.5 1.5 61 100ohm output
FAR-F5KY-881M50-B4UZ 1.4×1.0×0.5 1.5 61 100ohm, High Att.
FAR-F5KB-881M50-B4EJ 1.4×1.0×0.5 1.4 64 200ohm output
F5QG881M5P2KG 1.1×0.9×0.5 1.5 56 100ohm, High Att.,Low Loss type
GSM850/CDMA Rx FAR-F5KA-881M50-D4DB 1.4×1.0×0.5 1.7 56 High Att. type
FAR-F5QA-881M50-M2AF 1.1×0.9×0.5 1.6 46 －
GSM850 Rx FAR-F5KB-881M50-B4EA 1.4×1.0×0.5 1.7 53 150ohm output
FAR-F5QB-881M50-P2BA 1.1×0.9×0.5 1.3 63 150ohm output
System Part number Package Size
（mm）
Insertion Loss
（dB）
Attenuation
（dB）Remarks
US-PCS Tx
FAR-F6KA-1G8800-L4AF 1.4×1.0×0.5 2.4 35 Full band, High Att.
FAR-F6KB-1G8800-B4GS 1.4×1.0×0.5 2.3 28 100ohm input
F6KB1G880B4GH 1.4×1.0×0.5 2.4 42 200ohm input
US-PCS Rx
FAR-F6KA-1G9600-D4DQ 1.4×1.0×0.5 3.4 44 High Att.
FAR-F6KA-1G9600-D4MT 1.4×1.0×0.5 3.4 43 High Att./New
FAR-F6KB-1G9600-B4GP 1.4×1.0×0.5 2.1 23 100ohm output
FAR-F6KY-1G9600-B4UU 1.4×1.0×0.5 2.6 50 100ohm, High Att.
F6KY1G960B4NF 1.4×1.0×0.5 2.8 50 100ohm output
GSM1900/US-PCS Rx FAR-F6KA-1G9600-D4CR 1.4×1.0×0.5 2.0 18
F6KA1G960D4CZ 1.4×1.0×0.5 1.8 18 Low loss type
GSM1900 Rx FAR-F6KB-1G9600-B4GB 1.4×1.0×0.5 1.6 18 150ohm output
F6QB1G960P2BK 1.1×0.9×0.5 1.5 15 150ohm output
System Part number Package Size
（mm）
Insertion Loss
（dB）
Attenuation
（dB）Remarks
EGSM＋DCS Rx FAR-G6KZ-1G8425-Y4WZ 1.8×1.4×0.5 1.8/1.6 31/16
EGSM 150ohm output DCS 150ohm output
G6QF1G842N2HA 1.5×1.1×0.5 1.6/1.6 31/17
EGSM 150ohm output DCS 150ohm output
DCS＋EGSM Rx FAR-G6KZ-1G8425-Y4WY 1.8×1.4×0.5 1.6/1.8 16/31
DCS 150ohm output EGSM 150ohm output
G6QF1G842N2GC 1.5×1.1×0.5 1.6/1.6 17/31
DCS 150ohm output EGSM 150ohm output
GSM850＋EGSM Rx FAR-G5QC-942M50-N2FB 1.5×1.1×0.5 1.5/1.8 50/29
GSM850 150ohm output EGSM 150ohm output
GSM850＋EGSM Rx
（Common Input）
FAR-G5KT-942M50-Y4RW 1.8×1.4×0.5 1.9/2.2 50/25
GSM850 150ohm output EGSM 150ohm output
FAR-G5QD-942M50-N2DZ 1.5×1.1×0.5 1.9/2.2 48/26
GSM850 150ohm output EGSM 150ohm output
EGSM＋GSM850 Rx
FAR-G5KC-942M50-Y4YW 1.8×1.4×0.5 1.8/1.4 31/54
EGSM 150ohm output GSM850 150ohm output
FAR-G5QC-942M50-N2CD 1.5×1.1×0.5 1.7/1.4 29/51
EGSM 150ohm output GSM850 150ohm output
G5QJ942M5M2MA 1.5×1.1×0.5 1.7/2.3 52/37
EGSM 50ohm output GSM850 50ohm output
EGSM＋GSM850 Rx
（Common Input）
FAR-G5KT-942M50-Y4RZ 1.8×1.4×0.5 2.2/1.9 25/52
EGSM 150ohm output GSM850 150ohm output
FAR-G5QD-942M50-N2DB 1.5×1.1×0.5 2.5/2.0 25/55
EGSM 150ohm output GSM850 150ohm output
EGSM＋GSM850 Rx
（Common Output）
G5KW942M5Y4YF 1.8×1.4×0.5 2.3/1.8 35/40
EGSM 150ohm output GSM850 150ohm output
G5QE942M5N2ED 1.5×1.1×0.5 2.4/1.9 32/37
EGSM 150ohm output GSM850 150ohm output
DCS＋GSM1900 Rx FAR-G6QC-1G9600-N2FA 1.5×1.1×0.5 1.9/1.7 17/13
DCS 150ohm output GSM1900 150ohm output
GSM1900＋DCS Rx
FAR-G6KC-1G9600-Y4YY 1.8×1.4×0.5 1.9/1.6 14/16
GSM1900 150ohm output DCS 150ohm output
FAR-G6QC-1G9600-N2CB 1.5×1.1×0.5 1.7/1.7 15/16
GSM1900 150ohm output DCS 150ohm output
G6QC1G960N2CH 1.5×1.1×0.5 1.6/1.2 13/15
GSM1900 150ohm output DCS 150ohm output
GSM1900＋DCS Rx
（Common Input）
FAR-G6KT-1G9600-Y4RY 1.8×1.4×0.5 1.9/1.8 13/18
GSM1900 150ohm output DCS 150ohm output
G6QD1G960N2DA 1.5×1.1×0.5 1.9/1.8 15/18
GSM1900 150ohm output DCS 150ohm output
DCS+ GSM1900 Rx
(Common Input)
G6KT1G960Y4RU 1.8×1.4×0.5 1.9/1.8 13/18
GSM1900 150ohm output DCS 150ohm output
G6QD1G960N2DY 1.5×1.1×0.5 1.9/1.8 15/18
DCS 150ohm output GSM1900 150ohm output
GSM1900＋DCS Rx
（Common Output）
G6KW1G960Y4YE 1.8×1.4×0.5 2.5/2.5 20/12
GSM1900 150ohm output DCS 150ohm output
G6QE1G960N2EC 1.5×1.1×0.5 2.5/2.5 18/13
GSM1900 150ohm output DCS 150ohm output
GSM1900＋850 Rx FAR-G6KG-1G9600-Y4ZF 1.8×1.4×0.5 1.6/1.5 15/58
GSM1900 150ohm output GSM850 150ohm output
FAR-G6QF-1G9600-N2GA 1.5×1.1×0.5 1.6/1.4 14/54
GSM1900 150ohm output GSM850 150ohm output
System Part number Package Size
（mm）
Insertion Loss
（dB）
Attenuation
（dB）Remarks
DCS Tx FAR-F6KA-1G7475-D4CY 1.4×1.0×0.5 2.5 30
DCS Rx
FAR-F6KA-1G8425-D4CK 1.4×1.0×0.5 2.1 20
FAR-F6KB-1G8425-B4GA 1.4×1.0×0.5 1.5 14 150ohm output
FAR-F6QB-1G8425-P2BF 1.1×0.9×0.5 1.6 17 150ohm output
System Part number Package Size
（mm）
Insertion Loss
（dB）
Attenuation
（dB）Remarks
EGSM Tx FAR-F5KA-897M50-D4DC 1.4×1.0×0.5 2.2 16 High Att. type
FAR-F5QA-897M50-M2AC 1.1×0.9×0.5 2.3 18 －
EGSM Rx
FAR-F5KA-942M50-D4DD 1.4×1.0×0.5 2.0 34 High Att. type
F5QA942M5M2AG 1.1×0.9×0.5 2.2 40 －
FAR-F5KB-942M50-B4EB 1.4×1.0×0.5 1.6 26 150ohm output
FAR-F5QB-942M50-P2BB 1.1×0.9×0.5 1.6 28 150ohm output
FAR-F5QG-942M50-P2KB 1.1x0.9x0.5 2.2 56 100ohm, High Att.
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
sawfilter01_e-01
●CDMA/GSM850
●EGSM
●DCS
●US-PCS/GSM1900
●GSM Dual
188
1
2
■ PART NUMBERS
System Part number Package Size
（mm）
Insertion Loss
（dB）
Attenuation
（dB）Remarks
GPS
FAR-F6KA-1G5754-L4AA 1.4×1.0×0.5 0.9 －Low loss type
FAR-F6KA-1G5754-L4AJ 1.4×1.0×0.5 0.9 －Low loss, High Att.
FAR-F6KA-1G5754-L4AB 1.4×1.0×0.5 0.44 －Ultra Low loss type
FAR-F6QA-1G5754-H2JC 1.1×0.9×0.5 1.11 －High Att.
F6QA1G575H2JD 1.1×0.9×0.5 0.87 －Low loss type
F6QA1G575H2JE 1.1×0.9×0.5 1.27 －High Att.
FAR-F6KB-1G5754-B4GE 1.4×1.0×0.5 1.1 －100ohm, Low loss
FAR-F6KB-1G5754-B4GU 1.4×1.0×0.5 1.2 －100ohm, High Att.
F6KB1G575B4HQ 1.4×1.0×0.5 1.1 －100ohm, High Att.
GPS （GNSS）FAR-F6KA-1G5859-D4MS 1.4×1.0×0.5 1.0（1.2） － －
FAR-F6KB-1G5859-B4HR 1.4×1.0×0.5 1.1（1.4） － 100ohm output
System Part number Package Size
（mm）
Insertion Loss
（dB）
Attenuation
（dB）Remarks
W-CDMA I （2G） Tx
FAR-F6KA-1G9500-D4CD 1.4×1.0×0.5 2.2 36
FAR-F6KA-1G9500-D4DG 1.4×1.0×0.5 1.6 38 Low loss, High Att.
FAR-F6KB-1G9500-B4GJ 1.4×1.0×0.5 2.1 34 100ohm input
F6QA1G950M2AA 1.1×0.9×0.5 1.8 38 Low loss, High Att.
W-CDMA I （2G） Rx
FAR-F6KA-2G1400-D4CG 1.4×1.0×0.5 1.9 39
F6KA2G140D4DW 1.4×1.0×0.5 1.9 48 High Att.
FAR-F6KB-2G1400-B4GC 1.4×1.0×0.5 1.7 39 100ohm output
FAR-F6KY-2G1400-B4UY 1.4×1.0×0.5 1.8 64 100ohm, High Att.
F6QG2G140P2KA 1.1×0.9×0.5 1.7 55 100ohm, High Att.
W-CDMA I（2G）+II（1900） Rx G6QL2G140M2PA 1.5x1.1x0.5 1.9/3.0 48/41
G6QH2G140N2LA 1.5x1.1x0.5 2.0/3.2 53/42 100ohm output
J-CDMA （2G/B.W.20MHz） Rx
FAR-F6KB-2G1200-B4GQ 1.4×1.0×0.5 1.4 48 100ohm output
W-CDMA IV （1.7G/2G） Tx FAR-F6KA-1G7400-D4DE 1.4×1.0×0.5 1.5 44
W-CDMA VIII （EGSM） Tx FAR-F5KA-897M50-D4VW 1.4×1.0×0.5 2.6 38 High Att.
F5KA897M5D4MH 1.4×1.0×0.5 1.6 20 Low Loss
W-CDMA VIII （EGSM） Rx
F5KA942M5D4MYB 1.4×1.0×0.5 1.9 53 High Att.
FAR-F5KB-942M50-B4ES 1.4×1.0×0.5 2.4 29 100ohm output
FAR-F5KY-942M50-B4UW 1.4×1.0×0.5 2.0 57 100ohm, High Att.
W-CDMA V (850)+ VIII(900) Rx
G5QH942M5N2LN 1.5×1.1×0.5 1.6/2.0 56/50 100ohm output
W-CDMA IX （1.7G） Tx FAR-F6KA-1G7675-D4CT 1.4×1.0×0.5 1.8 31
W-CDMA IX （1.7G） Rx FAR-F6KA-1G8625-D4DH 1.4×1.0×0.5 1.8 40
FAR-F6KB-1G8625-B4GT 1.4×1.0×0.5 2.1 40 100ohm output
W-CDMA V （850） ＋ I （2G） Tx
FAR-G6KG-1G9500-Y4PG 1.8×1.4×0.5 1.9/2.4 42/43
V （850） 200ohm in I （2G） 200ohm in
W-CDMA I （2G） ＋ V （850） Rx
FAR-G6KG-2G1400-Y4SH 1.8×1.4×0.5 1.6/1.5 42/64
I （2G） 200ohm out V （850） 200ohm out
LTE XIII （Upper C） Tx FAR-F5KA-782M00-D4VP 1.4×1.0×0.5 1.5 55
LTE XIII （Upper C） Rx FAR-F5KY-751M00-B4UQ 1.4×1.0×0.5 1.6 50 100ohm output
LTE XVII （Lower B,C） Tx FAR-F5KA-710M00-D4VQ 1.4×1.0×0.5 1.2 32
LTE XVII （Lower B,C） Rx FAR-F5KY-740M00-B4UR 1.4×1.0×0.5 1.4 60 100ohm output
LTE XX F5KA847M0D4ML 1.4×1.0×0.5 1.7 52
TD LTE XXXVIII Rx F6KB2G595B4HS 1.4×1.0×0.5 2.6 38 150ohm output
TD LTE XL Rx F6KB2G350B4HT 1.4×1.0×0.5 2.7 37 150ohm output
System Part number Package Size
（mm）
Insertion Loss
（dB）
Attenuation
（dB）Remarks
ISM900 （B.W.26MHz）FAR-F5QA-915M00-M2AK 1.1×0.9×0.5 1.8 －
TD-SCDMA
FAR-F6KA-2G0175-D4DR 1.4×1.0×0.5 1.8 －High Att
FAR-F6KA-1G9000-D4DS 1.4×1.0×0.5 1.6 －
FAR-F6KA-1G9000-D4MZ 1.4×1.0×0.5 1.4 －Low IL
TD-SCDMA （2G＋1.9G）FAR-G6QJ-2G0175-M2MD 1.5×1.1×0.5 1.3/1.4 －2 IN/2 OUT
TD-SCDMA (1.9G+2G) G6QJ2G017M2RD 1.5×1.1×0.5 1.6/2.0 －1 IN/2 OUT
Wireless LAN
FAR-F6KA-2G4418-D4CU 1.4×1.0×0.5 2.6 － ＋10dBm
FAR-F6KA-2G4418-A4VA 1.4×1.0×0.5 3.0 － ＋23dBm
FAR-F6KA-2G4500-A4VD 1.4×1.0×0.5 1.9 40 Low IL,+19dBm
F6KA2G436A4VE 1.4×1.0×0.5 2.5 47 BW=72MHz,+24dBm
F6KA2G450A4VF 1.4×1.0×0.5 1.9 35 BW=100MHz,+24dBm , Low loss
F6KA2G441A4VG 1.4×1.0×0.5 2.4 36 BW=83.5MHz,+24dBm
F6KA2G466A4VJ 1.4×1.0×0.5 2.8 40 BW=68MHz,+24dBm
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
sawfilter01_e-01
●GPS
●W-CDMA
●Other
HIGH FREQUENCY PRODUCTS
189
1
2
■ ELECTRICAL CHARACTERISTICS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
sawfilter01_e-01
FAR-D5NF-942M50-P1GWQ
Tx to Ant
Frequency[MHz]
Attenuation[dB]
0.0
−10.0
−20.0
−30.0
−40.0
−50.0
−60.0
−70.0
−80.0
−90.0
−100.0
820 840 860 860 900 920 940 960 980 1000 1020
Mk1: 882.4MHz
S21=
−
1.869dB
Mk2: 912.6MHz
S21=
−
1.895dB
Mk3: 927.4MHz
S21=
−
61.812dB
Mk4: 957.6MHz
S21=
−
54.141dB
12
3
4
A
nt to Rx
Frequency[MHz]
Attenuation[dB]
0.0
−10.0
−20.0
−30.0
−40.0
−50.0
−60.0
−70.0
−80.0
−90.0
−100.0
820 840 860 860 900 920 940 960 980 1000 1020
Mk1: 925.0MHz
S32=
−
2.815dB
Mk2: 960.0MHz
S32=
−
2.348dB
Mk3: 882.4MHz
S32=
−
64.673dB
Mk4: 912.6MHz
S32=
−
63.538dB
12
34
Tx to Rx Isolation
Frequency[MHz]
Attenuation[dB]
0.0
−10.0
−20.0
−30.0
−40.0
−50.0
−60.0
−70.0
−80.0
−90.0
−100.0
820 840 860 860 900 920 940 960 980 1000 1020
Mk1: 882.4MHz
S31=
−
81.875dB
Mk2: 912.6MHz
S31=
−
65.043dB
Mk3: 927.4MHz
S31=
−
67.022dB
Mk4: 957.6MHz
S31=
−
54.321dB
1
23
4
Tx to Ant, Ant to Rx
Frequency[MHz]
Attenuation[dB]
0.0
−1.0
−2.0
−3.0
−4.0
−5.0
−6.0
−7.0
−8.0
−9.0
−10.0
870 880 890 900 910 920 930 940 950 960 970
Mk1: 882.4MHz
S21=
−
1.869dB
S32=
−
64.673dB
Mk2: 912.6MHz
S21=
−
1.895dB
S32=
−
63.538dB
Mk3: 925.0MHz
S21=
−
68.590dB
S32=
−
2.815dB
Mk4: 960.0MHz
S21=
−
54.051dB
S32=
−
2.348dB
124
3
＊ These date include loss that comes from the test board. （Approximately 0.05dB）
Pass-band （Tx to Ant）Pass-band （Ant to Rx）In-band Characteristic Tx to Rx Isolation
FAR-F6KY-2G1400-B4UY
Tx to Ant (Wide span)
Frequency[MHz]
Attenuation[dB]
0.0
−10.0
−20.0
−30.0
−40.0
−50.0
−60.0
−70.0
−80.0
−90.0
−100.0
0 600 1200 1800 2400 3000 3600 4200 4800 5400 6000
Mk1: 897.5MHz
S21=
−
1.482dB
Mk2: 1575.0MHz
S21=
−
48.665dB
Mk3: 1830.0MHz
S21=
−
52.034dB
Mk4: 2500.0MHz
S21=
−
39.380dB
Mk5: 2745.0MHz
S21=
−
37.117dB
1
23
45
Frequency[MHz]
Attenuation[dB]
0.0
−10.0
−20.0
−30.0
−40.0
−50.0
−60.0
−70.0
−80.0
−90.0
−100.0
1840 1900 1960 2020 2080 2140 2200 2260 2320 2380 2440
Mk1: 2110.0MHz
S21=
−
1.624dB
Mk2: 2170.0MHz
S21=
−
1.615dB
Mk3: 1920.0MHz
S21=
−
67.953dB
Mk4: 1980.0MHz
S21=
−
73.634dB
Mk5: 2200.0MHz
S21=
−
51.021dB
1
4
3
2
5
A
nt to Rx (Wide span)
Frequency[MHz]
Attenuation[dB]
0.0
−10.0
−20.0
−30.0
−40.0
−50.0
−60.0
−70.0
−80.0
−90.0
−100.0
0 600 1200 1800 2400 3000 3600 4200 4800 5400 6000
Mk1: 942.5MHz
S32=
−
1.916dB
Mk2: 1045.0MHz
S32=
−
56.269dB
Mk3: 1750.0MHz
S32=
−
60.796dB
Mk4: 4810.0MHz
S32=
−
34.991dB
1
23
4
Frequency[MHz]
Attenuation[dB]
0.0
−1.0
−2.0
−3.0
−4.0
−5.0
−6.0
−7.0
−8.0
−9.0
−10.0
2080 2092 2104 2116 2128 2140 2152 2164 2176 2188 2200
Mk1: 2110.0MHz
S21=
−
1.624dB
Mk2: 2170.0MHz
S21=
−
1.615dB
12
Frequency[MHz]
VSWR
11.0
10.0
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
2080 2092 2104 2116 2128 2140 2152 2164 2176 2188 2200
Mk1: 2110.0MHz
VSWR2= 1.564
Mk2: 2170.0MHz
VSWR2= 1.525
12
Frequency[MHz]
11.0
10.0
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
2080 2092 2104 2116 2128 2140 2152 2164 2176 2188 2200
Mk1: 2110.0MHz
VSWR1= 1.542
Mk2: 2170.0MHz
VSWR1= 1.551
VSWR
12
Pass-band Characteristic
Wide-band （Tx to Ant）
In-band Characteristic
Wide-band （Ant to Rx）
VSWR（OUTPUT）VSWR（INPUT）
Frequency[MHz]
Attenuation[dB]
0.0
−10.0
−20.0
−30.0
−40.0
−50.0
−60.0
−70.0
−80.0
−90.0
−100.0
0 600 1200 1800 2400 3000 3600 4200 4800 5400 6000
Mk1: 2140.0MHz
S21=
−
1.303dB
Mk2: 925.0MHz
S21=
−
61.972dB
Mk3: 1950.0MHz
S21=
−
69.270dB
Mk4: 2500.0MHz
S21=
−
54.864dB
Mk5: 6000.0MHz
S21=
−
45.717dB
1
4
3
2
5
Wide-band Characteristic
1
2
sawfil_reli-PRP1 sawfil_reli_e-01
■ PACKAGING
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
◦Material of Tape（Conductive）
Tape : Polystyrene
Top cover tape : Polyethylene terephthalate（PET）and Polyethylene
◦Material of Reel
Material : Polystyrene＋Carbon
Characteristics : Conform to EIAJ-ET-7200A
Color : Black
Surface resistance（reference value） :109Ω/sq Max.
◦Taping dimensions
①Minimum Quantity
Type
Size
（mm）abcde f
Duplexer
3.0×2.5 3.4±0.1 2.85±0.1 1.05±0.05 1.55±0.05 1.0±0.1 0.25±0.05
2.5×2.0 2.8±0.1 2.3±0.1 1.5+0.1/－0 1.5+0.1/－0 1.0+0.1/－0.0 0.25±0.05
2.0×1.6 2.4±0.1 2.0±0.1 1.05±0.05 1.5+0.1/－0 0.90 － 0.05 0.25±0.05
Single
Filter
2.0×1.6 2.4±0.1 2.0±0.1 1.05±0.05 1.5+0.1/－0 0.90 － 0.05 0.25±0.05
1.4×1.0 1.7±0.1 1.3±0.1 0.5±0.05 1.5+0.1/－0 0.63±0.05 0.20±0.05
1.1×0.9 1.3±0.1 1.1±0.1 0.5±0.05 1.55±0.05 0.63±0.05 0.20±0.05
Dual Filter
2.0×1.6 2.4±0.1 2.0 1.05±0.05 1.5+0.1/－0 0.90 － 0.05 0.25±0.05
1.8×1.4 2.2±0.1 1.8 0.5±0.05 1.55±0.05 0.8±0.1 0.30±0.05
1.5×1.1 1.8±0.1 1.4 0.5±0.05 1.5+0.1/－0 0.7±0.1 0.25±0.05
Unit：mm
Code Quantity A B C W1 W2
Z
3,000 pcs
φ180.0 +0.0 / －1.5
φ66.0 ±0.5 φ13.0 ±0.2 9.0 +1.0 / －0.0 11.4 ±1.0
J
5,000 pcs
φ180.0 +0.0 / －1.5
φ66.0 ±0.5 φ13.0 ±0.2 9.0 +1.0 / －0.0 11.4 ±1.0
U
10,000 pcs φ330.0 ±2.0 φ100.0 ±1.0 φ13.0 ±0.2 9.4 ±1.0 13.4 ±1.0
Y
15,000 pcs φ330.0 ±2.0 φ100.0 ±1.0 φ13.0 ±0.2 9.4 ±1.0 13.4 ±1.0
Unit：mm
c
1.75＋/−0.1
3.50＋/−0.05
8.0＋/−0.2
4.0＋/−0.1
ｂ
a
2.00＋/−0.05
Blank portions Blank portions
component fixed area
Direction of tape feed
Unit
：
mm
400mm or more
（15.7inch or more）
240mm min
4.0＋/−0.1
e
ｆ
ｄ
⑤Reel label and Reel C-Label sticking and Winding method
◦Surface
②Tape material
A
④Reel size
③Top Tape Strength
The top tape requires a peel-off force of 0.1 to 1.0N in the direction of the arrow
as illustrated below.
0〜15°
Top cover tape
Tape
Type Size
（mm）Code&Quantity（Pieces）
Duplexer
3.0×2.5
Z 3000 U 10000
2.5×2.0
Z 3000 U 10000
2.0×1.6
Z 3000 Y 15000
Single
Filter
2.0×1.6
Z 3000 Y 15000
1.4×1.0
Z 3000 Y 15000
1.1×0.9
J 5000 Y 15000
Dual
Filter
2.0×1.6
Z 3000 Y 15000
1.8×1.4
Z 3000 Y 15000
1.5×1.1
J 5000 Y 15000
1
2
sawfil_reli-PRP2 sawfil_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Filter
1. Terminal stregth
Specifications No damage to be found.
Conditions Bending Test.
according to IEC60068-2-21(JISC60068-2-21)
45±245±2
1.6±0.20
Solder Device
Board
Ｒ
340
2. Mechanical shock
Specifications After testing, meet the specified characteristics at a room temperature.
Conditions Apply 14700m/s2 for 0.5ms 5 times for each of 6 directions.
according to IEC68-2-27(JISC60068-2-27).
3. Vibration
Specifications After testing, meet the specified characteristics at a room temperature.
Conditions With 1.5 mm of whole amplitude at 10 to 55 Hz of frequency, and 98m/s2 of acceleration at 55 to 500Hz, apply a
vibration for 2 hours for each of 3 directions, period is 15 minutes(10 to 500 to 10Hz)
4. Drop 1
Specifications After testing, meet the specified characteristics at a room temperature.
Conditions Drop 3 times onto concrete floor from the height of 1.0m.
5. Drop 2
Specifications After testing, meet the specified characteristics at a room temperature.
Conditions Drop with 150g weight 3 times in each 6 direction onto concrete floor from the height of 1.8m.
6. Temperature cycling
Specifications After testing, meet the specified characteristics at a room temperature.
Conditions Temp. range －40 to ＋100℃. 500cycle.
７. Static humidity
Specifications After testing, meet the specified characteristics at a room temperature.
Conditions ＋85℃, 90% to 95%RH, apply DC5V, 1000hours.
8. High temperature storage life
Specifications After testing, meet the specified characteristics at a room temperature.
Conditions ＋100℃, 1000hours.
9. Low temperature storage life
Specifications After testing, meet the specified characteristics at a room temperature.
Conditions －40℃, 1000hours.
10. Solderbility 1
Specifications More than 90% of area of terminals to be covered with the solder.
A change of the remarkable appearance do not have it.
Conditions Lead-free Solder paste, Reflow；Peak temperature 245℃
11. Solderbility 2
Specifications More than 90% of area of terminals to be covered with the solder.
A change of the remarkable appearance do not have it.
Conditions Sn-Pb Solder paste, Reflow；Peak temperature 235℃
12. Solder heat resistance
Specifications After testing, meet the specified characteristics at a room temperature.
A change of the remarkable appearance do not have it.
Conditions Temperature profile of reflow soldering is as follows (Figure).
◆Recommended temperature profile of reflow soldering
　Figure shows recommended temperature profile of reflow soldering in the case of lead-free solder alloy Sn3.0Ag0.5Cu.
　Suitable condition for solder heating is differed depending on composition and manufacturing method.
　Please contact to solder manufacturer for the details.
300
Temperature
（℃） 30〜50sec.
10sec.50~110sec.
Ambient temperature
rise slope
: 1~4℃/sec.
Pre-Heating
150~180℃
Ambient temperature
cool slope
: 1~4℃/sec.
Temperature in heat condition
: 230℃min. 50sec. max.
Temperature of upper surface of package
and PCB surface.
: 260℃min. 10sec. max.
250
200
150
100
50
1
2
sawfil_reli-PRP3
sawfil_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Duplexer
1. Terminal stregth
Specifications No damage to be found.
Conditions Bend width 4mm, hold for 5＋/－1 sec.
according to IEC60068-2-21(JISC60068-2-21)
45±245±2
1.6±0.20
Solder Device
Board
Ｒ
340
2. Mechanical shock
Specifications After testing, meet the specified characteristics at a room temperature.
Conditions Apply 14700m/s2 for 0.5ms 5 times for each of 6 directions.
according to IEC68-2-27(JISC60068-2-27).
3. Vibration
Specifications After testing, meet the specified characteristics at a room temperature.
Conditions With 1.5 mm of whole amplitude at 10 to 55 Hz of frequency, and 98m/s2 of acceleration at 55 to 500Hz, apply a
vibration for 2 hours for each of 3 directions, period is 15 minutes(10 to 500 to 10Hz)
4. Drop 1
Specifications After testing, meet the specified characteristics at a room temperature.
Conditions Drop 3 times onto concrete floor from the height of 1.0m.
5. Drop 2
Specifications After testing, meet the specified characteristics at a room temperature.
Conditions Drop with 150g weight 3 times in each 6 direction onto concrete floor from the height of 1.8m.
6. Temperature cycling
Specifications After testing, meet the specified characteristics at a room temperature.
Conditions Temp. range －40 to ＋100℃. 500cycle.
７. Static humidity
Specifications After testing, meet the specified characteristics at a room temperature.
Conditions ＋85℃, 90% to 95%RH, apply DC5V, 1000hours.
8. High temperature storage life
Specifications After testing, meet the specified characteristics at a room temperature.
Conditions ＋100℃, 1000hours.
9. Low temperature storage life
Specifications After testing, meet the specified characteristics at a room temperature.
Conditions －40℃, 1000hours.
10. High Temperature Bias
Specifications After testing, meet the specified characteristics at a room temperature.
Conditions ＋50℃, ＋29dBm, 50000hours.
11. Solderbility 1
Specifications More than 90% of area of terminals to be covered with the solder.
A change of the remarkable appearance do not have it.
Conditions Lead-free Solder paste, Reflow；Peak temperature 245℃
12. Solderbility 2
Specifications More than 90% of area of terminals to be covered with the solder.
A change of the remarkable appearance do not have it.
Conditions Sn-Pb Solder paste, Reflow；Peak temperature 235℃
13. Solder heat resistance
Specifications After testing, meet the specified characteristics at a room temperature.
A change of the remarkable appearance do not have it.
Conditions Temperature profile of reflow soldering is as follows (Figure).
◆Recommended temperature profile of reflow soldering
　Figure shows recommended temperature profile of reflow soldering in the case of lead-free solder alloy Sn3.0Ag0.5Cu.
　Suitable condition for solder heating is differed depending on composition and manufacturing method.
　Please contact to solder manufacturer for the details.
300
Temperature
（℃） 30〜50sec.
10sec.50~110sec.
Ambient temperature
rise slope
: 1~4℃/sec.
Pre-Heating
150~180℃
Ambient temperature
cool slope
: 1~4℃/sec.
Temperature in heat condition
: 230℃min. 50sec. max.
Temperature of upper surface of package
and PCB surface.
: 260℃min. 10sec. max.
250
200
150
100
50