IGBT Module IC25 = 30 A
VCES = 1200 V
VCE(sat)typ. = 2.6 V
Features
•Package with DCB ceramic base plate
•Isolation voltage 3000 V∼
•Planar glass passivated chips
•Low forward voltage drop
•Leads suitable for PC board
soldering
•UL registered, E 148688
Applications
•AC and DC motor control
•AC servo and robot drives
•power supplies
•welding inverters
Advantages
•Easy to mount with two screws
•Space and weight savings
•Improved temperature and power
cycling capability
•High power density
•Small and light weight
•Leads with expansion bend for
stress relief
POWERSEM GmbH, Walpersdorfer Str. 53
D - 91126 Schwabach
Phone: 09122 - 9764 - 0 FAX: 09122 - 9764 - 20
ECO-PACTM 2
2002 POWERSEM reserves the right to change limits, test conditions and dimensions
Preliminary Data Sheet
Caution: These Devices are sensitive
to electrostatic discharge. Users should
observe proper ESD handling precautions.
PSIG 25/12
PSI 25/12*
PSIS 25/12*
PSSI 25/12*
IGBTs
Symbol Conditions Maximum Ratings
VCES TVJ = 25°C to 150°C 1200 V
VGES ± 20 V
IC25 TC = 25°C 30 A
IC80 TC = 80°C 21 A
ICM VGE = ±15 V; RG = 82 Ω; TVJ = 125°C 35 A
VCEK RBSOA, Clamped inductive load; L = 100 µH VCES
tSC VCE = VCES; VGE = ±15 V; RG = 82 Ω; TVJ = 125°C 10 µs
(SCSOA) non-repetitive
Ptot TC = 25°C 130 W
Symbol Conditions Characteristic Values
(TVJ = 25°C, unless otherwise specified)
min. typ. max.
VCE(sat) IC = 25 A; VGE = 15 V; TVJ = 25°C 2.6 3.3 V
TVJ = 125°C 2.9 V
VGE(th) IC = 0.6 mA; VGE = VCE 4.5 6.5 V
ICES VCE = VCES; VGE = 0 V; TVJ = 25°C 0.9 mA
TVJ = 125°C 3.7 mA
IGES VCE = 0 V; VGE = ± 20 V 100 nA
td(on) 100 ns
tr75 ns
td(off) 500 ns
tf70 ns
Eon 2.7 mJ
Eoff 2.1 mJ
Cies VCE = 25 V; VGE = 0 V; f = 1 MHz 1nF
RthJC (per IGBT) 0.96 K/W
RthJH with heatsink compound (0.42 K/m.K; 50 µm) 1.92 K/W
Inductive load, TVJ = 125°C
VCE = 600 V; IC = 17.5 A
VGE = 15/0 V; RG = 82 Ω
PSSI
PSIS
PSIS 25/12*
PSIG 25/12 PSI 25/12* PSSI 25/12*
PSIG
*NTC optional
Short Circuit SOA Capability
Square RBSOA
K 1 0
X 1 6
X 1 3
X 1 5
N T C
E 2
L 9
P 9
G 1 0
X 1 8
PSI
http://store.iiic.cc/