Product Family Data Sheet Rev. 1.5 2018.11.27 Middle Power LED Series Flip Chip Package LM101B New technology provides high performance and energy conservation Features & Benefits Greater freedom of design with compact package size High degree of reliability with plastic-free structure Low thermal resistance High efficiency providing optimized solution 1 2 Table of Contents 1. Characteristics ----------------------- 3 2. Product Code Information ----------------------- 6 3. Typical Characteristics Graphs ----------------------- 15 4. Outline Drawing & Dimension ----------------------- 17 5. Reliability Test Items & Conditions ----------------------- 19 6. Soldering Conditions ----------------------- 20 7. Tape & Reel ----------------------- 21 8. Label Structure ----------------------- 23 9. Packing Structure ----------------------- 24 Precautions in Handling & Use ----------------------- 26 10. 3 1. Characteristics a) Absolute Maximum Rating Item Symbol Rating Unit Condition Operating Temperature Ta -40 ~ +105 C - Storage Temperature Tstg -40 ~ +120 C - LED Junction Temperature Tj 125 C - Forward Current IF 350 mA - Assembly Process Temperature - 260 <10 s - ESD (HBM) - 2 kV - 4 b) Electro-optical Characteristics (IF = 150 mA, Ts = 85 C) Item Unit Rank Forward Voltage (VF) V 6E Bin Min. Typ. Max. 6A 2.7 - 2.9 AE 2.9 - 3.1 -10.0 - - 80 - - Reverse Voltage (@ -10 A) V Color Rendering Index (Ra) - Special CRI (R9) - 0 - - Thermal Resistance (junction to chip point) K/W - 2 - Beam Angle - 120 - 8 Note: Samsung maintains measurement tolerance of : Forward voltage = 0.1 V, Luminous flux = 5 %, CRI = 3, R9 = 6.5 5 c) Luminous Flux Characteristics Item CRI Nominal CCT (K) (IF = 150 mA, Ts = 85 C) SA SB SC SD SE Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. 43 47 47 51 51 55 55 59 59 63 63 67 67 71 71 75 3500 4000 5000 5700 6500 2700 3000 (v) 3500 80 4000 5000 5700 6500 2700 3000 90 SH Min. 3000 Luminous Flux SG Max. 2700 70 SF Min. 3500 4000 5000 Note: 1) The LM101B is tested in pulsed condition at rated test current (10 ms pulse width) 2) Calculated flux values are for reference only 3) Samsung maintains measurement tolerance of: luminous flux = 5 % 6 2. Product Code Information (IF = 150 mA, Ts = 85 C) 1 2 3 4 5 6 7 S C P 8 W T 7 Digit 1 2 3 4 Code Samsung Chip SCP 9 10 11 12 13 8 Min. 80 9 Min. 90 W 2700 V 3000 U 3500 T 4000 R 5000 Q 5700 P 6500 Chip Shape T Square Chip Code 78H Product Purpose EL1 CCT (K) 14 9 10 11 12 13 14 15 16 17 18 H E L 1 W L S 0 6 E Specification Min. 70 CCT (K) 6 8 7 CRI 5 7 8 PKG Information 8 FeC for Lighting W 2700K V 3000K U 3500K T 4000K R 5000K Q 5700K P 6500K L Single Bin for MacAdam 5-step L(MacAdam 5-step Bin) U Single Bin for MacAdam 3-step U(MacAdam 3-step Bin) MacAdam Step 15 16 Luminous Flux (lm) S0 17 18 Forward Voltage (V) 6E Bin Code: 2.7~3.1 Bin Code: SY, SZ, SA, SB, SC, SD, SE, SF, SG, SH 6A 2.7~2.9 AE 2.9~3.1 7 a) Luminous Flux Bins CRI (Ra) Min. (IF = 150 mA, Ts = 85 C) Nominal CCT (K) 2700 3000 3500 4000 Product Code 5700 6500 Flux Range (v, lm) SE 59 ~ 63 SF 63 ~ 67 SF 63 ~ 67 SG 67 ~ 71 SF 63 ~ 67 SG 67 ~ 71 SG 67 ~ 71 SH 71 ~ 75 SG 67 ~ 71 SH 71 ~ 75 SF 63 ~ 67 SG 67 ~ 71 SF 63 ~ 67 SG 67 ~ 71 SCP7WT78HEL1WS06E SCP7VT78HEL1VS06E SCP7UT78HEL1US06E SCP7TT78HEL1TS06E 70 5000 Flux Bin SCP7RT78HEL1RS06E SCP7QT78HEL1QS06E SCP7PT78HEL1PS06E Note: "" can be "L" (Single bin for MacAdam 5-step), "U" (Single bin for MacAdam 3-step) 8 a) Luminous Flux Bins CRI (Ra) Min. (IF = 150 mA, Ts = 85 C) Nominal CCT (K) 2700 3000 3500 80 4000 5000 5700 6500 Product Code Flux Bin Flux Range (v, lm) SD 55 ~ 59 SE 59 ~ 63 SE 59 ~ 63 SF 63 ~ 67 SE 59 ~ 63 SF 63 ~ 67 SF 63 ~ 67 SG 67 ~ 71 SF 63 ~ 67 SG 67 ~ 71 SE 59 ~ 63 SF 63 ~ 67 SE 59 ~ 63 SF 63 ~ 67 SCP8WT78HEL1WS06E SCP8VT78HEL1VS06E SCP8UT78HEL1US06E SCP8TT78HEL1TS06E SCP8RT78HEL1RS06E SCP8QT78HEL1QS06E SCP8PT78HEL1PS06E Note: "" can be "L" (Single bin for MacAdam 5-step) "U" (Single bin for MacAdam 3-step) 9 a) Luminous Flux Bins CRI (Ra) Min. (IF = 150 mA, Ts = 85 C) Nominal CCT (K) 2700 3000 90 3500 4000 5000 Product Code Flux Bin Flux Range (v, lm) SA 43 ~ 47 SB 47 ~ 51 SA 43 ~ 47 SB 47 ~ 51 SB 47 ~ 51 SC 51 ~ 55 SB 47 ~ 51 SC 51 ~ 55 SB 47 ~ 51 SC 51 ~ 55 SCP9WT78HEL1WS06E SCP9VT78HEL1VS06E SCP9UT78HEL1US06E SCP9TT78HEL1TS06E SCP9RT78HEL1RS06E Note: "" can be "L" (Single bin for MacAdam 5-step), "U" (Single bin for MacAdam 3-step) 10 b) Color Bins (IF = 150 mA, Ts = 85 C) CRI Min. Nominal CCT (K) Product Code 2700 SCP7WT78HEL1WS06E 3000 3500 70 4000 5000 5700 6500 2700 3000 3500 80 4000 5000 5700 6500 2700 3000 90 3500 4000 5000 Color Rank Chromaticity Bins WL WL WU WU VL VL VU VU UL UL UU UU TL TL TU TU RL RL RU RU QL QL QU QU PL PL PU PU WL WL WU WU VL VL VU VU UL UL UU UU TL TL TU TU RL RL RU RU QL QL QU QU PL PL PU PU WL WL WU WU VL VL VU VU UL UL UU UU UL UL UU UU UL UL UU UU SCP7VT78HEL1VS06E SCP7UT78HE1US06E SCP7TT78HEL1TS06E SCP7RT78HEL1RS06E SCP7QT78HEL1QS06E SCP7PT78HEL1PS06E SCP8WT78HEL1WS06E SCP8VT78HEL1VS06E SCP8UT78HEL1US06E SCP8TT78HEL1TS06E SCP8RT78HEL1RS06E SCP8QT78HEL1Q S06E SCP8PT78HEL1PS06E SCP9WT78HEL1WS06E SCP9VT78HEL1VS06E SCP9UT78HEL1US06E SCP9TT78HEL1TS06E SCP9RT78HEL1RS06E Note: "" can be "L" (Single bin for MacAdam 5-step), "U" (Single bin for MacAdam 3-step) 11 c) Voltage Bins Nominal CCT (K) (IF = 150 mA, Ts = 85 C) CRI Min. Product Code Voltage Rank Voltage Bin Voltage Range (V) 6A 2.7 ~ 2.9 AE 2.9 ~ 3.1 6E 12 d) Chromaticity Region & Coordinates (IF = 150 mA, Ts = 85 C) : "L" (Single bin for MacAdam 5-step) 13 d) Chromaticity Region & Coordinates (IF = 150 mA, Ts = 85 C) : "U" (Single bin for MacAdam 3-step) 14 d) Chromaticity Region & Coordinates CCT (K) MacAdam 3 step (U code) 5 step (L code) (IF = 150 mA, Ts = 85 C) Center point CIE x CIE y Major-axis Minor-axis Rotation a b 2700 0.4578 0.4101 0.0081 0.0042 53.70 3000 0.4338 0.4030 0.0083 0.0041 53.22 3500 0.4073 0.3917 0.0093 0.0041 54.00 4000 0.3818 0.3797 0.0094 0.0040 53.72 5000 0.3447 0.3553 0.0082 0.0035 59.62 5700 0.3287 0.3417 0.0075 0.0032 59.10 6500 0.3123 0.3282 0.0067 0.0029 58.57 2700 0.4578 0.4101 0.0135 0.0070 53.70 3000 0.4338 0.4030 0.0138 0.0068 53.22 3500 0.4073 0.3917 0.0155 0.0068 54.00 4000 0.3818 0.3797 0.0157 0.0067 53.72 5000 0.3447 0.3553 0.0137 0.0058 59.62 5700 0.3287 0.3417 0.0125 0.0053 59.10 6500 0.3123 0.3282 0.0112 0.0048 58.57 Note: Samsung maintains measurement tolerance of: Cx, Cy = 0.005 15 3. Typical Characteristics Graphs a) Spectrum Distribution (IF = 150 mA, Ts = 85 C) CCT: 2700 K, CRI80 CCT: 5000 K, CRI80 b) Forward Current Characteristics (Ts = 85 C) c) Temperature Characteristics (IF = 150 mA) 16 d) Color Shift Characteristics (Ts = 85 C, IF = 150 mA) e) Derating Curve Rth is measured after soldering of LED chip on the metal based substrate. *metal: aluminum (refer to page 17) f) Beam Angle Characteristics (IF =150 mA) 17 4. Outline Drawing & Dimension 1. Tolerance is 0.1mm (only height 0.06 mm) 2. Do not place LEDs with pressure Measurement unit: Tolerance: mm 0.1mm (only height 0.06 mm) Precautions: 1) Pressure on the LEDs will influence to the reliability of the LEDs. Precautions should be taken to avoid strong pressure on the LEDs. Do not put stress on the LEDs during heating. 2) Re-soldering should not be done after the LEDs have been soldered. If re-soldering is unavoidable, LEDs characteristics should be carefully checked before and after such repair. 3) Do not stack assembled PCBs together. Since materials of LEDs is soft, abrasion between two PCB assembled with LED might cause catastrophic failure of the LEDs. 18 Ts Point & Measurement Method: Measure nearest point from the center of LED chip () as shown below. Distance between chip center and Ts point () = 3.5 mm Tj = Ts + Power x Thermal resistance at Ts (Rj-s) Precautions: 4) This LED chip PKG does not contain built-in ESD protection device. 5) Pressure on the LEDs will influence to the reliability of the LEDs. Precautions should be taken to avoid strong pressure on the LEDs. Do not put stress on the LEDs during heating. 6) Re-soldering should not be done after the LEDs have been soldered. If re-soldering is unavoidable, LEDs characteristics should be carefully checked before and after such repair. 7) Do not stack assembled PCBs together. Since materials of LEDs is soft, abrasion between two PCB assembled with LED might cause catastrophic failure of the LEDs 19 5. Reliability Test Items & Conditions a) Test Items Test Item Test Condition Test Hour / Cycle Room Temperature Life Test 25 C, Derated max current 1000 h High Temperature Life Test 85 C, Derated max current 1000 h High Temperature Humidity Life Test 85 C, 85 % RH, Derated max current 1000 h Low Temperature Life Test -40 C, DC Derated max current 1000 h Powered Temperature Cycle Test -45 C / 20 min 85 C / 20 min, sweep 100 min cycle on/off: each 5 min, Derated max current 100 cycles Temperature Cycling -45 C / 15 min 125 C / 15 min Hot plate 180 C 500 cycles High Temperature Storage 120 C 1000 h Low Temperature Storage -40 C 1000 h R1: 10 R2: 1.5 ESD (HBM) 5 times C: 100 V: 2 kV Vibration Test 20~2000~20 Hz, 200 m/s2, sweep 4 min X, Y, Z 3 direction, each 1 cycle 4 cycles Mechanical Shock Test 1500 g, 0.5 ms 5 cycles b) Criteria for Judging the Damage Item Symbol Test Condition (Ts = 25 C) Limit Min Max Forward Voltage VF IF = Derated max current Init. Value * 0.9 Init. Value * 1.1 Luminous Flux v IF = Derated max current Init. Value * 0.7 Init. Value * 1.1 20 6. Soldering Conditions a) Reflow Conditions (Pb free) Reflow frequency: 2 times max. b) Manual Soldering Conditions Not more than 5 seconds @ max. 300 C, under soldering iron 21 7. Tape & Reel a) Taping Dimension (unit: mm) Taping Direction 22 b) Reel Dimension Notes: 1) Quantity: The quantity/reel is 4,000 pcs 2) Cumulative Tolerance: 3) Packaging: Cumulative tolerance / 10 pitches is 0.2 mm P/N, Manufacturing data code no. and quantity are indicated on the aluminum packing bag 23 8. Label Structure a) Label Structure LM101B [CRI] [CCT] WLSD6A Model SCP8WT78HEL1WLS06E WLSD6A Bin Code IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII /I/ 4,000 pcs Product Code IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Lot Number Note: Denoted product code and bin code above is only an example Bin Code: : Chromaticity bin : Luminous Flux bin : Forward Voltage bin (refer to page 10-14) (refer to page 7-9) (refer to page 11) b) Lot Number The lot number is composed of the following characters: LM101B [CRI] [CCT] WLSD6A SCP8WT78HEL1WLS06E WLSD6A IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII /I/ 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII / I / 4,000 pcs : Production site (GB: Nanchang China) : Product state : Year (Y: 2014, Z: 2015, A: 2016 ...) : Month : Day (1~9, A, B~V) : Product serial number : Reel number (A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample) (1~9, A, B, C) (001 ~ 999) (001 ~ 999) or (AAA ~ ZZZ) 24 9. Packing Structure a) Packing Process Reel LM101B [CRI] [CCT] WLSD6A SCP8WT78HEL1WLS06E WLSD6A IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII /I/ 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Aluminum Vinyl Bag Outer Box Material: Paper (SW3B(A)) Size (mm) Type Note 7 inch L W H 295 5 290 5 260 5 Up to 7 reels max. Side Label LM101B [CRI] [CCT] WLSD6A SCP8WT78HEL1WLS06E WLSD6A IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII /I/ 28,000 pcs H CHIP LED IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII W L 25 b) Aluminum Vinyl Packing Bag LM101B [CRI] [CCT] WLSC6A SCP8WT78HEL1WLS06E WLSD6A IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII /I/ 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII c) Silica Gel & Humidity Indicator Card inside Aluminum Vinyl Bag 26 10. Precautions in Handling & Use 1) For over-current-proof function, customers are recommended to apply resistors to prevent sudden change of the current caused by slight shift of the voltage. 2) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When washing is required, IPA is recommended to use. 3) When the LEDs illuminate, operating current should be decided after considering the ambient maximum temperature. 4) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped from Samsung, they should be packed by a sealed container with nitrogen gas injected (shelf life of sealed bags: 12 months, temperature ~40 C, ~90 % RH). 5) After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be: a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 C / 60 % RH, or b. Stored at <10 % RH 6) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. 7) Devices require baking before mounting, if humidity card reading is >60 % at 23 5 C. 8) Devices must be baked for 1 hour at 60 5 C, if baking is required. 9) The LEDs are sensitive to the static electricity and surge. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as increase in leak current, lowered turn-on voltage, or abnormal lighting of LEDs at low current. 10) VoCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in luminaires (fixtures). LED silicone encapsulant is permeable to those chemicals and they may lead to a discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical properties of materials used in luminaires and they must be carefully selected. 11) Risk of sulfurization (or tarnishing) The LED from Samsung does not use a silver-plated lead frame but if the LED is attached in silver-plated substrate, the surface color of substrate may change to black (or dark colored) when it is exposed to sulfur (S), chlorine (Cl) or other halogen compound. Sulfurization of substrate may cause intensity degradation, change of chromaticity coordinates and, in extreme cases, open circuit, It requires caution. Due to possible sulfurization of substrate, LED should not be used and stored together with oxidizing substances made of materials such as rubber, plain paper, lead solder cream, etc. Legal and additional information. About Samsung Electronics Co., Ltd. Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at news.samsung.com. US$216.7 billion. To discover more, please visit www.samsungled.com. Copyright (c) 2018 Samsung Electronics Co., Ltd. All rights reserved. Samsung is a registered trademark of Samsung Electronics Co., Ltd. Specifications and designs are subject to change without notice. Non-metric weights and measurements are approximate. All data were deemed correct at time of creation. Samsung is not liable for errors or omissions. All brand, product, service names and logos are trademarks and/or registered trademarks of their respective owners and are hereby recognized and acknowledged. Samsung Electronics Co., Ltd. 95, Samsung 2-ro Giheung-gu Yongin-si, Gyeonggi-do, 446-711 KOREA www.samsungled.com