Q3-0.005-AC-35 - Bergquist Company

www.bergquistcompany.com

All statements, technical information and recommendations herein are based on tests we believe to be reliable, and

THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED,INCLUDING THE IMPLIED

WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE.Sellers’ and manufacturer s’ only obligation shall be to

replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product

for its intended use, and the user assumes all r isks and liability whatsoever in connection therewith. NEITHER SELLER NOR

MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE,DIRECT,

INCIDENTAL, OR CONSEQUENTIAL,INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR

THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not

contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.

PDS_QP_3_12.08

The Bergquist Company -

North American Headquarters

18930 West 78th Street

Chanhassen, MN 55317

Phone: 800-347-4572

Fax: 952-835-0430

The Bergquist Company -

European Headquarters

Bramenber g 9a, 3755 BT Eemnes

Netherlands

Phone: 31-35-5380684

Fax: 31-35-5380295

The Bergquist Company - Asia

Room 15,8/F W ah Wai Industrial Centre

No.38-40,Au Pui Wan Street

Fotan, Shatin, N.T. Hong Kong

Ph: 852.2690.9296

Fax: 852.2690.2344

Q-Pad

Glass-Reinforced Grease Replacement Ther mal Interface

Features and Benefits

• Thermal impedance:

0.35°C-in2/W (@50 psi)

• Eliminates processing constraints typically

associated with grease

• Conforms to surface textures

• Easy handling

• May be installed prior to solder ing and

cleaning without worry

Ber gquist Q-Pad 3 eliminates problems

associated with ther mal grease such as conta-

mination of electronic assemblies and reflow

solder baths. Q-Pad 3 may be installed prior

to soldering and cleaning without worry.When

clamped between two surfaces, the elastomer

conforms to surface textures thereby creating

an air-free interface between heat-gener ating

components and heat sinks.

Fiber glass reinforcement enables Q-Pad 3 to

withstand processing stresses without losing

physical integrity. It also provides ease of

han dling dur ing application.

Typical Applications Include:

• Between a transistor and a heat sink

• Between two lar ge surfaces such as an L-br acket and the chassis of an assembly

• Between a heat sink and a chassis

• Under electrically isolated power modules or devices such as resistors,

tr ansformers and solid state relays

Configurations Available:

• Sheet form, die-cut parts and roll for m

• With or without pressure sensitive adhesive

Building a Part Number Standard Options

Sil-Pad®: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others

Section A

Section B

Section C

Section D

Section E

NA = Selected standard option. If not selecting a standard

option, insert company name, drawing number, and

revision level.

Q3 = Q-Pad 3 Material

Q3 0.005 AC 12/250 NA

Note: To build a part number, visit our website at www.bergquistcompany.com.

Standard thicknesses available: 0.005"

AC = Adhesive, one side

00 = No adhesive

_ _ _ = Standard configuration dash number,

1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or

00 = custom configuration

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TYPICAL PROPERTIES OF Q-PAD 3

PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD

Color Black Black Visual

Reinforcement Carr ier Fiberglass Fiberglass —

Thickness (inch) / (mm) 0.005 0.127 ASTM D374

Hardness (Shore A) 86 86 ASTM D2240

Continuous Use Temp (°F) / (°C) -76 to 356 -60 to 180 —

ELECTRICAL

Dielectric Breakdown Voltage (Vac) Non-Insulating Non-Insulating ASTM D149

Dielectric Constant (1000 Hz) NA NA ASTM D150

Volume Resistivity (Ohm-meter) 102102ASTM D257

Flame Rating V-O V-O U.L.94

THERMAL

Thermal Conductivity (W/m-K) 2.0 2.0 ASTM D5470

THERMAL PERFORMANCE vs PRESSURE

Pressure (psi) 10 25 50 100 200

TO-220 Ther mal Performance (°C/W) 2.26 1.99 1.76 1.53 1.30

Thermal Impedance (°C-in2/W) (1) 0.65 0.48 0.35 0.24 0.16

1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance .These values are provided for

reference only.Actual application perfor mance is directly related to the surface roughness, flatness and pressure applied.