FAN7383MX_WS - ON SEMICONDUCTOR

To learn more about ON Semiconductor, please visit our website at

www.onsemi.com

Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers

will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor

product management systems do not have the ability to manage part nomenclature that utilizes an underscore

(_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain

device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated

device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please

email any questions regarding the system integration to Fairchild_questions@onsemi.com.

Is Now Part of

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number

of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right

to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability

arising out of the application or use of any product or circuit, and speciﬁcally disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON

Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON

Semiconductor data sheets and/or speciﬁcations can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s

technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA

Class 3 medical devices or medical devices with a same or similar classiﬁcation in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended

or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its ofﬁcers, employees, subsidiaries, afﬁliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out

of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor

is an Equal Opportunity/Afﬁrmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

FAN7383 Half-Bridge Gate-Drive IC

February 2007

FAN7383 Rev. 1.0.3

FAN7383

Half-Bridge Gate-Drive IC

Features

 Floating Channel Designed for Bootstrap Operation to

+600V.

Typically 350mA/650mA Sourcing/Sinking Current

Driving Capability for Both Channels

Extended Allowable Negative VS Swing to -9.8V for

Signal Propagation at VDD=VBS=15V

High-Side Output in Phase of IN Signal

Built-in UVLO Functions for Both Channels

Built-in Common-Mode dv/dt Noise Canceling Circu it

Typically Internal 330ns Minimum Dead-Time

Programmable Turn-On Delay Time Control

(Dead-Time)

Applications

SMPS

Motor Drive Inverter

Fluorescent Lamp Ballast

HID Ballast

Description

The FAN7383 is a half-bridge gate-drive IC with

shutdown and programmable dead-time control

functions for driving MOSFETs and IGBTs that operate

up to +600V.

Fairchild’s high voltage process and common-mode

noise canceling technique give stable operation of high-

side drivers under high-dv/dt noise circumst ances.

An advanced level-shift circuit allows high-side gate

driver operation up to VS= -9.8V (typical) for VBS=15V.

The UVLO circuits for both channels prevent malfunction

when VDD and VBS are lower than the specified

threshold voltage.

Output drivers typically source/sink 350mA/650mA,

respectively, which is suitable for all kinds of half and fu ll

bridge inverter.

Ordering Information

Note:

1. These devices passed wave soldering test by JESD22A-111.

14-SOP

Part Number Package Pb-Free Operating Temperature Range Packing Method

FAN7383M(1) 14-SOP Yes -40°C ~ 125°C Tube

FAN7383MX(1) Tape & Reel

FAN7383 Half-Bridge Gate-Drive IC

FAN7383 Rev. 1.0.3 2

Typical Application Circuit

Figure 1. Application Circuit for Half-Bridge Switching Power Supply

Figure 2. Application Circuit for Full-Bridge DC Motor Driver

VDD

VDC

PWM

Shutdown

LO1

GND

HO1

VDD

LO2

HO2

PWM IC

Control

RDT

DBOOT

CBOOT

RHON

RHOFF

RLON

RLOFF

RBOOT

FAN7383 Rev.01

Forward

VDC

VCC

Reverse

DC Motor

Controller

PHA

PHB

HO1

LO2

VDD

GND

FAN7383

LO1

HO2

HO1

LO2

VDD

GND

FAN7383

LO1

HO2

FAN7383 Rev.01

FAN7383 Half-Bridge Gate-Drive IC

FAN7383 Rev. 1.0.3 3

Internal Block Diagram

Figure 3. Functional Block Diagram of FAN7383

UVLO

DRIVER

PULSE

GENERATOR

VDD

GND

LO1

HO1

DRIVER

HS(ON/OFF)

LS(ON/OFF) DELAY

UVLO

HO2

LO2

SCHMITT

TRIGGER INPUT

SHOOT THOUGH

PREVENTION

DEAD-TIME

{ DTMIN=330nsec }

NOISE

CANCELLER

FAN7383 Rev:01

FAN7383 Half-Bridge Gate-Drive IC

FAN7383 Rev. 1.0.3 4

Pin Configuration

Figure 4. Pin Configuration (Top View)

Pin Definitions

Pin # Name Description

1 IN Logic Input for Gate Driver

2SD

Logic Input for Shutdown (Active Low)

3 DT Programmable Dead-Time Control with External Resistor

DD Low-Side Supply Voltage

5 LO1 Low-Side Driver Source Output

6 LO2 Low-Side Driver Sink Output

7 GND Ground

8 N.C. Not connected

9 N.C. Not connected

10 N.C. Not connected

11 VSHigh-Side Floating Supply Return

12 HO2 High-Side Driver Sink Output

13 HO1 High-Side Driver Source Output

14 VBHigh-Side Floating Supply

LO2

LO1

GND

FAN7383

VDD

HO2

HO1

FAN7383 Rev:00

FAN7383 Half-Bridge Gate-Drive IC

FAN7383 Rev. 1.0.3 5

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In

addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.

The absolute maximum ratings are stress ratings only. TA = 25°C unless otherwise specified.

Notes:

2. When mounted on 76.2 x 114.3 x 1.6mm PCB. (FR-4 glass epoxy material).

3. Please refer to:

JESD51-2: Integral circuits thermal test method environmental conditions - Natural convection

JESD51-3: Low effective thermal conductivity test board for leaded surface mount packages

4. Do not exceed PD under any circumstances.

Recommended Operating Conditions

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended

operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not

recommend exceeding them or designing to Absolute Maximum Ratings.

Symbol Parameter Min. Max. Unit

VSHigh-side offset voltage VB-25 VB+0.3 V

VBHigh-side floating supply voltage -0.3 625 V

VHO High-side floating output voltag e HO1, HO2 VS-0.3 VB+0.3 V

VDD Low-side and logic fixed supply voltage -0.3 25 V

VLO Low-side output voltage LO1, LO2 -0.3 VDD+0.3 V

VIN Logic input voltage (IN) -0.3 VDD+0.3 V

VSD Shutdown logic input voltage -0.3 VDD+0.3 V

VDT Dead-time control voltage -0.3 5.0 V

GND Logic ground VDD-25 VDD+0.3 V

dVS/dt Allowable offset voltage slew rate 50 V/ns

PD(2)(3)(4) Power dissipation 1.0 W

θJA Thermal resistance, junction-to-ambient 110 °C/W

TJJunction temperature 150 °C

TSTG Storage temperature 150 °C

Symbol Parameter Condition Min. Max. Unit

VBHigh-side floating supply voltage VS+15 VS+20 V

VSHigh-side floating supply offset voltage 6-VDD 600 V

VDD Low-side supply voltage 15 20 V

VHO High-side (HO) output voltage VS VBV

VLO Low-side (LO) output voltage GND VDD V

VIN Logic input voltage (IN) GND VDD V

TAAmbient temperature -40 125 °C

FAN7383 Half-Bridge Gate-Drive IC

FAN7383 Rev. 1.0.3 6

Electrical Characteristics

VBIAS (VDD, VBS) = 15.0V, RDT = GND, TA = 25°C, unless otherwise specified. The VIN and IIN parameters are

referenced to GND. The VO and IO parameters are referenced to VS and GND and are applicable to the respective

outputs HO and LO.

Note:

5.This parameter guaranteed by design.

Symbol Parameter Condition Min. Typ. Max. Unit

SUPPLY CURRENT SECTION

IQBS Quiescent VBS supply current VIN=0V or 5V 35 90

μA

IQDD Quiescent VDD supply current VIN=0V or 5V, RDT=0Ω650 900

ISD(5) VDD supply current at shutdown mode SD=GND 650 900

IPBS Operating VBS supply current fIN=20kHz,rms valu e 400 700

IPDD Operating VDD supply current fIN=20kHz,rms value, RDT=0Ω950 1200

ILK Offset supply leakage current VB=VS=600V 10

POWER SUPPLY SECTION

VDDUV+

VBSUV+

VDD and VBS supply under-voltage

positive going threshold 10.7 11.6 12.5

VDDUV-

VBSUV-

VDD and VBS supply under-voltage

negative goi ng threshold 10.0 10.8 11.6

VDDUVH

VBSUVH

VDD and VBS supply under-voltage

lockout hysteresis 0.8

GATE DRIVER OUTPUT SECTION

VOH High-level output voltage, VBIAS-VOIO=20mA 1.0 V

VOL Low-level output voltage, VO0.6 V

IO+ Output high short-circuit pulse current VO=0V, VIN=5V with PW<10µs 250 350 mA

IO- Output low short-circuit pulsed current VO=15V, VIN=0V with PW<10µs 500 650 mA

VSAllowable negative VS pin voltage for IN

signal propagation to HO -9.8 -7.0 V

LOGIC INPUT SECTION (INPUT AND SHUTDOWN)

VIH Logic "1" input voltage 2.9 V

VIL Logic "0" input voltage 1.2 V

IIN+ Logic "1" input bias current VIN=5V 50 100 μA

IIN- Logic "0" input bias current VIN=0V 2.0 μA

SD+ Shutdown "1" inpu t voltage 1.2 V

SD- Shutdown "0" input voltage 2.9 V

RPD Input pull- do w n resi sta n c e 100 KΩ

FAN7383 Half-Bridge Gate-Drive IC

FAN7383 Rev. 1.0.3 7

Dynamic Electrical Characteristics

VBIAS (VDD, VBS) = 15.0V, VS = GND, CL=1000pF, RDT = GND, and TA = 25°C, unless otherwise specifie d.

Note:

5.These parameters guaranteed by design.

Symbol Parameter Conditions Min. Typ. Max. Unit

tON Turn-on propagation delay VS=0V 500 670

tOFF Turn-off propagation delay VS=0V or 600V(5) 170 250

tRTurn-on rise time 50 100

tFTurn-off fall time 30 80

tSD(5) Shutdown propagation delay 100 180

DT1,

DT2 Dead-time LO OFF to HO ON and HO

OFF to LO ON RDT=0Ω250 330 420 ns

RDT=200KΩ1.20 1.68 2.30 µs

DMT Dead-time matching RDT=0Ω060

RDT=200KΩ0150

FAN7383 Half-Bridge Gate-Drive IC

FAN7383 Rev. 1.0.3 8

Typical Characteristics

Figure 5. VDD/VBS UVLO (+) vs. Temperature Figure 6. VDD/VBS UVLO (-) vs. Temperature

Figure 7. VDD Quiescent Current vs. Temperature Figure 8. VBS Quiescent Current vs. Temperature

Figure 9. VDD Operating Current vs. Temperature Figure 10. VBS Operating Current vs. Temperature

-40 -20 0 20 40 60 80 100 120

10.8

11.0

11.2

11.4

11.6

11.8

12.0

VDDUV+ ,VBSUV+ [V]

Temperature [°C] -40 -20 0 20 40 60 80 100 120

10.0

10.2

10.4

10.6

10.8

11.0

11.2

11.4

11.6

VDDUV- ,VBSUV- [V]

Temperature [°C]

-40 -20 0 20 40 60 80 100 120

200

400

600

800

1000

IQDD [μA]

Temperat ure [° C] -40-200 20406080100120

100

IQBS [μA]

Temperature [°C]

-40 -20 0 20 40 60 80 100 120

400

600

800

1000

1200

1400

1600

IPDD [μA]

Temperat ure [° C] -40 -20 0 20 40 60 80 100 120

200

400

600

800

IPBS [μA]

Temperat ure [° C]

FAN7383 Half-Bridge Gate-Drive IC

FAN7383 Rev. 1.0.3 9

Typical Characteristics (Continued)

Figure 11. Logic Input Current vs. Temperature Figure 12. Logic Input High Voltage vs. Temperature

Figure 13. Logic Input Low Voltage vs. Temperature Figure 14. SD Positive Threshold vs. Temperature

Figure 15. SD Negative Threshold vs. Temperature Figure 16. Rising Time vs. Temperature

-40 -20 0 20 40 60 80 100 120

100

IIN+ [μA]

Temperat ure [° C] -40-200 20406080100120

0.0

0.5

1.0

1.5

2.0

2.5

3.0

VIH [V]

Temperature [°C]

-40 -20 0 20 40 60 80 100 120

0.0

0.5

1.0

1.5

2.0

2.5

3.0

VIL [V]

Temperature [°C] -40-200 20406080100120

0.0

0.5

1.0

1.5

2.0

2.5

3.0

SD+ BAR [V]

Temperature [°C]

-40-200 20406080100120

0.0

0.5

1.0

1.5

2.0

2.5

3.0

SD- BAR [V]

Temperature [°C] -40 -20 0 20 40 60 80 100 120

100

tR [nsec]

Temperat ure [° C]

FAN7383 Half-Bridge Gate-Drive IC

FAN7383 Rev. 1.0.3 10

Typical Characteristics (Continued)

Figure 17. Falling Time vs. Temperature Figure 18. Turn-on Delay Time vs. Temperature

Figure 19. Turn-off Falling Time vs. Temperature Figure 20. Dead-Time (RDT=0kΩ) vs. Temperature

Figure 21. Dead Time (RDT=200kΩ) vs. Temperature Figure 22. RDT vs. Dead Time

-40 -20 0 20 40 60 80 100 120

tF [nsec]

Temperature [°C] -40 -20 0 20 40 60 80 100 120

200

300

400

500

600

700

tON [nsec]

Temperat ure [° C]

-40-200 20406080100120

100

150

200

250

300

tOFF [nsec]

Temperature [°C] -40-200 20406080100120

240

280

320

360

400

DT1, RDT= 0Ω [nsec]

Temperature [°C]

-40 -20 0 20 40 60 80 100 120

1.2

1.4

1.6

1.8

2.0

2.2

2.4

DT1, RDT= 200kΩ [nsec]

Temperature [°C] 0 20 40 60 80 100 120 140 160 180 200

0.0

0.4

0.8

1.2

1.6

2.0

Deadtime [μS]

RDT [kohm]

FAN7383 Half-Bridge Gate-Drive IC

FAN7383 Rev. 1.0.3 11

Typical Characteristics (Continued)

Figure 23. Allowable Negative VS Voltage for Signal

Propagation to High Side vs. Temperature

-40 -20 0 20 40 60 80 100 120

-14

-12

-10

-8

-6

VS [V]

Temperat ure [° C]

FAN7383 Half-Bridge Gate-Drive IC

FAN7383 Rev. 1.0.3 12

Switching Time Definitions

Figure 24. Switching Time Test Circuit

Figure 25. Input / Output Waveforms

Figure 26. Switching Time Waveform Definitions

+15V

LO1

GND

HO1

VDD

FAN7383 10μF 100nF

1nF

+15V 100nF10μF

LO2

HO2

HO1, 2

LO1, 2

FAN7383 Rev:00

HO1, 2

LO1, 2

DT1 DT2 DT1DT2 DT1

Shutdown Shutdown FAN7383 Rev:00

HO1, 2

LO1, 2

10%

90%

50% 50%

90%

10%

tOFF

tON

FAN7383 R ev:00

FAN7383 Half-Bridge Gate-Drive IC

FAN7383 Rev. 1.0.3 13

Figure 27. Shutdown Waveform Definition

Figure 28. Dead-Time Waveform Definition

90%

50%

tSD

HO or LO

FAN7383 Rev:00

10%

90%

DT1

90%

10%

DT2

MDT= DT1-DT2

FAN7383 Rev:00

FAN7383 Half-Bridge Gate-Drive IC

FAN7383 Rev. 1.0.3 14

Typical Application Information

1. Normal Operating Consideration

The FAN7383 is a single PWM input half-bridge gate-

drive IC with programmable dead-time and shutdown

function.

The dead-time is set with a resisto r (RDT) at the DT pin.

The wide dead-time programming range provides the

flexibility to optimi ze drive signal timing for a selection of

switching devices (MOSFET or IGBT) and applications.

The turn-on time delay circuitry (Dead-Time)

accommodates resistor values fro m 0Ω to 200kΩ with a

dead-time proportional to the RDT resistance.

Grounding the DT pin programs the FAN7383 to drive

both outputs with minimum dead time.

If the SD pin voltage decrease below 1.2V in normal

operation, the IC enters the shutdown mode.

2. Under-Voltage Lockout (UVLO)

The FAN7383 has an under-voltage lockout (UVLO)

protection circuitry for high and low side channels to

prevent malfunction when VDD or VBS is lower than the

specified threshold voltage. The UVLO circuitry monitors

the supply voltage (VDD) and b ootstrap capacitor voltage

(VBS) independently.

3. Layout Consideration

For optimum performance of high- and low-side gate

drivers, cannot be achieved without taking due

considerations must be taken during printed circuit board

(PCB) layout.

3.1 Supply Capacitors

If the output stages are able to quickly turn on the

switching device with high value of current, the supply

capacitors must be placed as close as possible to the

device pins (VDD and GND for the ground-tied supply, VB

and VS for the floating supply) to minimize parasitic

inductance and resistance.

3.2 Gate Drive Loop

Current loops behave like an antenna, able to receive

and transmit noise. To reduce the noise coupling/

emission and improve the power switch turn-on and off

performances, gate drive loops must be reduced as

much as possible.

3.3 Ground Plane

Ground plane must not be placed under or nearby the

high-voltage floating side to minimize noise coupling.

FAN7383 Half-Bridge Gate-Drive IC

FAN7383 Rev. 1.0.3 15

Package Dimensions

14-SOP

Dimensions are in millimeters unless otherwise noted.

Figure 29. 14-Lead Small Outline Package (SOP)

January 2001, Rev. A

8.56

±0.20

0.337

±0.008

1.27

0.050

5.72

0.225

1.55

±0.10

0.061

±0.004

0.05

0.002

6.00

±0.30

0.236

±0.012

3.95

±0.20

0.156

±0.008

0.60

±0.20

0.024

±0.008

8.70

0.343 MAX

#7 #8

0~8°

#14

0.47

0.019

()

1.80

0.071

MAX0.10

MAX0.004

MAX

MIN

0.10

-0.05

0.20

0.004

-0.002

0.008

0.10

-0.05

0.406

0.004

-0.002

0.016

TRADEMARKS

The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an

exhaustive list of all such trademarks.

ACEx

Across the board. Around the world.¥

ActiveArray¥

Bottomless¥

Build it Now¥

CoolFET¥

CROSSVOLT¥

CTL™

Current Transfer Logic™

DOME¥

CMOS¥

EcoSPARK

EnSigna¥

FACT Quiet Series™

FACT

FAST

FASTr¥

FPS¥

FRFET

GlobalOptoisolator¥

GTO¥

HiSeC¥

i-Lo¥

ImpliedDisconnect¥

IntelliMAX¥

ISOPLANAR¥

MICROCOUPLER¥

MicroPak¥

MICROWIRE¥

MSX¥

MSXPro¥

OCX¥

OCXPro¥

OPTOLOGIC

OPTOPLANAR

PACMAN¥

POP¥

Power220

Power247

PowerEdge¥

PowerSaver¥

PowerTrench

Programmable Active Droop¥

QFET

QS¥

QT Optoelectronics¥

Quiet Series¥

RapidConfigure¥

RapidConnect¥

ScalarPump¥

SMART START¥

SPM

SuperFET¥

SuperSOT¥-3

SuperSOT¥-6

SuperSOT¥-8

TCM¥

The Power Franchise

™

TinyBoost¥

TinyBuck¥

TinyLogic

TINYOPTO¥

TinyPower¥

TinyWire¥

TruTranslation¥

PSerDes¥

UHC

UniFET¥

VCX¥

Wire¥

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS

HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE

APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER

ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S

WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR

SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.

As used herein:

1. Life support devices or systems are devices or systems

which, (a) are intended for surgical implant into the body or

(b) support or sustain life, and (c) whose failure to perform

when properly used in accordance with instructions for use

provided in the labeling, can be reasonably expected to

result in a significant injury of the user.

2. A critical component in any component of a life support,

device, or system whose failure to perform can be

reasonably expected to cause the failure of the life support

device or system, or to affect its safety or effectiveness.

PRODUCT STATUS DEFINITIONS

Definition of Terms

Datasheet Identification Product Status Definition

Advance Information Formative or In Design This datasheet contains the design specifications for product

development. Specifications may change in any manner without notice.

Preliminary First Production This datasheet contains preliminary data; supplementary data will be

published at a later date. Fairchild Semiconductor reserves the right to

make changes at any time without notice to improve design.

No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor

reserves the right to make changes at any time without notice to improve

design.

Obsolete Not In Production This datasheet contains specifications on a product that has been

discontinued by Fairchild Semiconductor. The datasheet is printed for

reference information only.

Rev. I23

FAN7383 Half-Bridge Gate-Drive IC

FAN7383 Rev. 1.0.3 16

www.onsemi.com

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent

coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.

ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,

regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or

specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer

application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not

designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification

in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized

application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and

expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such

claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This

literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

www.onsemi.com

LITERATURE FULFILLMENT:

Literature Distribution Center for ON Semiconductor

19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA

Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

For additional information, please contact your local

Sales Representative