Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge
BIPOLAR ANALOG INTEGRATED CIRCUIT
UPC3227TB
5 V, SILICON GERMANIUM MMIC
WIDEBAND AMPLIFIER
Document No. PU10557EJ02V0DS (2nd edition)
Date Published July 2005 CP(K)
DESCRIPTION
The
PC3227TB is a silicon germanium (SiGe) monolithic integrated circuit designed as IF amplifier for DBS
tuners. This IC is manufactured using our 50 GHz fmax UHS2 (Ultra High Speed Process) SiGe bipolar process.
FEATURES
• Low current : ICC = 4.8 mA TYP. @ VCC = 5.0 V
• Output power : PO (sat) = 1.0 dBm TYP. @ f = 1.0 GHz
: PO (sat) = 3.5 dBm TYP. @ f = 2.2 GHz
• High linearity : PO (1dB) = 6.5 dBm TYP. @ f = 1.0 GHz
: PO (1dB) = 8.0 dBm TYP. @ f = 2.2 GHz
• Power gain : GP = 22.0 dB TYP. @ f = 1.0 GHz
: GP = 22.0 dB TYP. @ f = 2.2 GHz
• Noise Figure : NF = 4.7 dB TYP. @ f = 1.0 GHz
: NF = 4.6 dB TYP. @ f = 2.2 GHz
• Supply voltage : VCC = 4.5 to 5.5 V
• Port impedance : input/output 50
APPLICATIONS
• IF amplifiers in LNB for DBS converters etc.
ORDERING INFORMATION
Part Number
Order Number
Package
Marking
Supplying Form
PC3227TB-E3
PC3227TB-E3-A
6-pin super minimold
(Pb-Free) Note
C3P
Embossed tape 8 mm wide.
1, 2, 3 pins face the perforation side of the tape.
Qty 3 kpcs/reel.
Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact
your nearby sales office.
Remark To order evaluation samples, please contact your nearby sales office.
Part number for sample order:
PC3227TB-A
Data Sheet PU10557EJ02V0DS
UPC3227TB
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
Pin No.
Pin Name
1
INPUT
2
GND
3
GND
4
OUTPUT
5
GND
6
VCC
PRODUCT LINE-UP OF 5 V-BIAS SILICON MMIC WIDEBAND AMPLIFIER
(TA = +25°C, f = 1 GHz, VCC = 5.0 V, ZS = ZL = 50 )
Part No.
fu
(GHz)
PO (sat)
(dBm)
GP
(dB)
NF
(dB)
ICC
(mA)
Package
Marking
PC2711TB
2.9
+1.0
13
5.0
12
6-pin super minimold
C1G
PC2712TB
2.6
+3.0
20
4.5
12
C1H
PC3215TB Note
2.9
+3.5
20.5
2.3
14
C3H
PC3224TB
3.2
+4.0
21.5
4.3
9.0
C3K
PC3227TB
3.2
1.0
22
4.7
4.8
C3P
Note
PC3215TB is f = 1.5 GHz
Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
Data Sheet PU10557EJ02V0DS
3
UPC3227TB
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Conditions
Ratings
Unit
Supply Voltage
VCC
TA = +25°C
6.0
V
Total Circuit Current
ICC
TA = +25°C
15
mA
Power Dissipation
PD
TA = +85C Note
270
mW
Operating Ambient Temperature
TA
40 to +85
°C
Storage Temperature
Tstg
55 to +150
°C
Input Power
Pin
TA = +25°C
+10
dBm
Note Mounted on double-sided copper-clad 50 50 1.6 mm epoxy glass PWB
RECOMMENDED OPERATING RANGE
Parameter
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
Supply Voltage
VCC
4.5
5.0
5.5
V
Operating Ambient Temperature
TA
40
+25
+85
°C
Data Sheet PU10557EJ02V0DS
UPC3227TB
ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = 5.0 V, ZS = ZL = 50 )
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Circuit Current
ICC
No input signal
4.0
4.8
6.0
mA
Power Gain 1
GP1
f = 0.1 GHz, Pin = 40 dBm
20.5
22.5
24.5
dB
Power Gain 2
GP2
f = 1.0 GHz, Pin = 40 dBm
19.5
22.0
24.5
Power Gain 3
GP3
f = 1.8 GHz, Pin = 40 dBm
19.0
22.0
25.0
Power Gain 4
GP4
f = 2.2 GHz, Pin = 40 dBm
19.0
22.0
25.0
Power Gain 5
GP5
f = 2.6 GHz, Pin = 40 dBm
19.0
22.0
25.0
Power Gain 6
GP6
f = 3.0 GHz, Pin = 40 dBm
18.0
21.0
24.5
Saturated Output Power 1
PO (sat) 1
f = 1.0 GHz, Pin = 12 dBm
3.5
1.0
dBm
Saturated Output Power 2
PO (sat) 2
f = 2.2 GHz, Pin = 12 dBm
6.0
3.5
Gain 1 dB Compression Output Power 1
PO (1 dB) 1
f = 1.0 GHz
9.0
6.5
dBm
Gain 1 dB Compression Output Power 2
PO (1 dB) 2
f = 2.2 GHz
11.0
8.0
Noise Figure 1
NF1
f = 1.0 GHz
4.7
5.5
dB
Noise Figure 2
NF2
f = 2.2 GHz
4.6
5.5
Isolation 1
ISL1
f = 1.0 GHz, Pin = 40 dBm
35
40
dB
Isolation 2
ISL2
f = 2.2 GHz, Pin = 40 dBm
35
43
Input Return Loss 1
RLin1
f = 1.0 GHz, Pin = 40 dBm
7.5
10.5
dB
Input Return Loss 2
RLin2
f = 2.2 GHz, Pin = 40 dBm
7.5
10.5
Output Return Loss 1
RLout1
f = 1.0 GHz, Pin = 40 dBm
10.0
13.5
dB
Output Return Loss 2
RLout2
f = 2.2 GHz, Pin = 40 dBm
7.5
9.5
Input 3rd Order Distortion
Intercept Point 1
IIP31
f1 = 1 000 MHz, f2 = 1 001 MHz,
Pin = 40 dBm
18.0
dBm
Input 3rd Order Distortion
Intercept Point 2
IIP32
f1 = 2 200 MHz, f2 = 2 201 MHz,
Pin = 40 dBm
20.5
Output 3rd Order Distortion
Intercept Point 1
OIP31
f1 = 1 000 MHz, f2 = 1 001 MHz,
Pin = 40 dBm
+4.0
dBm
Output 3rd Order Distortion
Intercept Point 2
OIP32
f1 = 2 200 MHz, f2 = 2 201 MHz,
Pin = 40 dBm
+1.5
2nd Order Intermodulation Distortion
IM2
f1 = 1 000 MHz, f2 = 1 001 MHz,
Pin = 40 dBm
30.5
dBc
K factor 1
K1
f = 1.0 GHz
3.8
K factor 2
K2
f = 2.2 GHz
3.9
Data Sheet PU10557EJ02V0DS
5
UPC3227TB
TEST CIRCUIT
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
COMPONENTS OF TEST CIRCUIT FOR MEASURING
ELECTRICAL CHARACTERISTICS
Type
Value
C1, C2
Chip Capacitor
100 pF
C3
Chip Capacitor
1 000 pF
C4
Feed-through Capacitor
1 000 pF
CAPACITORS FOR VCC AND INPUT PINS
Bypass capacitor for VCC pin is intended to minimize VCC pin’s ground impedance. Therefore, stable bias can be
supplied against VCC fluctuation.
Coupling capacitors for input/output pins are intended to minimize RF serial impedance and cut DC.
Data Sheet PU10557EJ02V0DS
UPC3227TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
Notes
1. 30 30 0.4 mm double sided copper clad polyimide board.
2. Back side: GND pattern
3. Solder plated on pattern
4. : Through holes
COMPONENT LIST
Value
C1, C2
100 pF
C3, C4
1 000 pF
Data Sheet PU10557EJ02V0DS
7
UPC3227TB
TYPICAL CHARACTERISTICS (TA = +25C, VCC = 5.0 V, ZS = ZL = 50 , unless otherwise specified)
Remark The graphs indicate nominal characteristics.
Data Sheet PU10557EJ02V0DS
UPC3227TB
Remark The graphs indicate nominal characteristics.
Data Sheet PU10557EJ02V0DS
9
UPC3227TB
Remark The graphs indicate nominal characteristics.
Data Sheet PU10557EJ02V0DS
10
UPC3227TB
S-PARAMETERS (TA = +25C, VCC = 5.0 V, Pin = 40 dBm)
S11FREQUENCY
S22FREQUENCY
Data Sheet PU10557EJ02V0DS
11
UPC3227TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT: mm)
12 Data Sheet PU10557EJ02V0DS
UPC3227TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground terminals must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to the VCC line.
(4) The DC cut capacitor must be attached to input and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Peak temperature (package surface temperature) : 260C or below
Time at peak temperature : 10 seconds or less
Time at temperature of 220C or higher : 60 seconds or less
Preheating time at 120 to 180C : 12030 seconds
Maximum number of reflow processes : 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
IR260
Wave Soldering
Peak temperature (molten solder temperature) : 260C or below
Time at peak temperature : 10 seconds or less
Preheating temperature (package surface temperature) : 120C or below
Maximum number of flow processes : 1 time
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
WS260
Partial Heating
Peak temperature (terminal temperature) : 350C or below
Soldering time (per side of device) : 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).