BIPOLAR ANALOG INTEGRATED CIRCUIT UPC3227TB 5 V, SILICON GERMANIUM MMIC WIDEBAND AMPLIFIER DESCRIPTION The PC3227TB is a silicon germanium (SiGe) monolithic integrated circuit designed as IF amplifier for DBS tuners. This IC is manufactured using our 50 GHz fmax UHS2 (Ultra High Speed Process) SiGe bipolar process. FEATURES * Low current : ICC = 4.8 mA TYP. @ VCC = 5.0 V * Output power : PO (sat) = 1.0 dBm TYP. @ f = 1.0 GHz : PO (sat) = 3.5 dBm TYP. @ f = 2.2 GHz : PO (1dB) = 6.5 dBm TYP. @ f = 1.0 GHz * High linearity : PO (1dB) = 8.0 dBm TYP. @ f = 2.2 GHz * Power gain : GP = 22.0 dB TYP. @ f = 1.0 GHz : GP = 22.0 dB TYP. @ f = 2.2 GHz * Noise Figure : NF = 4.7 dB TYP. @ f = 1.0 GHz : NF = 4.6 dB TYP. @ f = 2.2 GHz * Supply voltage : VCC = 4.5 to 5.5 V * Port impedance : input/output 50 APPLICATIONS * IF amplifiers in LNB for DBS converters etc. ORDERING INFORMATION Part Number PC3227TB-E3 Order Number Package PC3227TB-E3-A 6-pin super minimold (Pb-Free) Marking C3P Note Supplying Form Embossed tape 8 mm wide. 1, 2, 3 pins face the perforation side of the tape. Qty 3 kpcs/reel. Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office. Remark To order evaluation samples, please contact your nearby sales office. Part number for sample order: PC3227TB-A Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge Document No. PU10557EJ02V0DS (2nd edition) Date Published July 2005 CP(K) UPC3227TB PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM Pin No. Pin Name 1 INPUT 2 GND 3 GND 4 OUTPUT 5 GND 6 VCC PRODUCT LINE-UP OF 5 V-BIAS SILICON MMIC WIDEBAND AMPLIFIER (T A = +25C, f = 1 GHz, VCC = 5.0 V, ZS = ZL = 50 ) fu PO (sat) GP NF ICC (GHz) (dBm) (dB) (dB) (mA) 2.9 +1.0 13 5.0 12 2.6 +3.0 20 4.5 12 C1H 2.9 +3.5 20.5 2.3 14 C3H PC3224TB 3.2 +4.0 21.5 4.3 9.0 C3K PC3227TB 3.2 1.0 22 4.7 4.8 C3P Part No. PC2711TB PC2712TB PC3215TB Note Package 6-pin super minimold Note PC3215TB is f = 1.5 GHz Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. 2 Data Sheet PU10557EJ02V0DS Marking C1G UPC3227TB ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Ratings Unit Supply Voltage VCC TA = +25C 6.0 V Total Circuit Current ICC TA = +25C 15 mA Power Dissipation PD TA = +85C 270 mW Operating Ambient Temperature TA 40 to +85 C Storage Temperature Tstg 55 to +150 C Input Power Pin +10 dBm Note TA = +25C Note Mounted on double-sided copper-clad 50 50 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE Parameter Symbol Conditions MIN. TYP. MAX. Unit Supply Voltage VCC 4.5 5.0 5.5 V Operating Ambient Temperature TA 40 +25 +85 C Data Sheet PU10557EJ02V0DS 3 UPC3227TB ELECTRICAL CHARACTERISTICS (T A = +25C, VCC = 5.0 V, ZS = ZL = 50 ) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit No input signal 4.0 4.8 6.0 mA dB Circuit Current ICC Power Gain 1 GP1 f = 0.1 GHz, Pin = 40 dBm 20.5 22.5 24.5 Power Gain 2 GP2 f = 1.0 GHz, Pin = 40 dBm 19.5 22.0 24.5 Power Gain 3 GP3 f = 1.8 GHz, Pin = 40 dBm 19.0 22.0 25.0 Power Gain 4 GP4 f = 2.2 GHz, Pin = 40 dBm 19.0 22.0 25.0 Power Gain 5 GP5 f = 2.6 GHz, Pin = 40 dBm 19.0 22.0 25.0 Power Gain 6 GP6 f = 3.0 GHz, Pin = 40 dBm 18.0 21.0 24.5 Saturated Output Power 1 PO (sat) 1 f = 1.0 GHz, Pin = 12 dBm 3.5 1.0 Saturated Output Power 2 PO (sat) 2 f = 2.2 GHz, Pin = 12 dBm 6.0 3.5 Gain 1 dB Compression Output Power 1 PO (1 dB) 1 f = 1.0 GHz 9.0 6.5 Gain 1 dB Compression Output Power 2 PO (1 dB) 2 f = 2.2 GHz 11.0 8.0 Noise Figure 1 NF1 f = 1.0 GHz 4.7 5.5 Noise Figure 2 NF2 f = 2.2 GHz 4.6 5.5 Isolation 1 ISL1 f = 1.0 GHz, Pin = 40 dBm 35 40 Isolation 2 ISL2 f = 2.2 GHz, Pin = 40 dBm 35 43 Input Return Loss 1 RLin1 f = 1.0 GHz, Pin = 40 dBm 7.5 10.5 Input Return Loss 2 RLin2 f = 2.2 GHz, Pin = 40 dBm 7.5 10.5 Output Return Loss 1 RLout1 f = 1.0 GHz, Pin = 40 dBm 10.0 13.5 Output Return Loss 2 RLout2 f = 2.2 GHz, Pin = 40 dBm 7.5 9.5 Input 3rd Order Distortion IIP31 f1 = 1 000 MHz, f2 = 1 001 MHz, 18.0 20.5 +4.0 +1.5 30.5 dBc IIP32 OIP31 OIP32 dB dB dBm f1 = 2 200 MHz, f2 = 2 201 MHz, f1 = 1 000 MHz, f2 = 1 001 MHz, dBm f1 = 2 200 MHz, f2 = 2 201 MHz, Pin = 40 dBm Intercept Point 2 2nd Order Intermodulation Distortion dB Pin = 40 dBm Intercept Point 1 Output 3rd Order Distortion dB Pin = 40 dBm Intercept Point 2 Output 3rd Order Distortion dBm Pin = 40 dBm Intercept Point 1 Input 3rd Order Distortion dBm IM2 f1 = 1 000 MHz, f2 = 1 001 MHz, Pin = 40 dBm K factor 1 K1 f = 1.0 GHz 3.8 K factor 2 K2 f = 2.2 GHz 3.9 4 Data Sheet PU10557EJ02V0DS UPC3227TB TEST CIRCUIT The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL CHARACTERISTICS Type Value C1, C2 Chip Capacitor 100 pF C3 Chip Capacitor 1 000 pF C4 Feed-through Capacitor 1 000 pF CAPACITORS FOR VCC AND INPUT PINS Bypass capacitor for VCC pin is intended to minimize VCC pin's ground impedance. Therefore, stable bias can be supplied against VCC fluctuation. Coupling capacitors for input/output pins are intended to minimize RF serial impedance and cut DC. Data Sheet PU10557EJ02V0DS 5 UPC3227TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD COMPONENT LIST Notes Value 1. 30 30 0.4 mm double sided copper clad polyimide board. C1, C2 100 pF 2. Back side: GND pattern C3, C4 1 000 pF 3. Solder plated on pattern 4. : Through holes 6 Data Sheet PU10557EJ02V0DS UPC3227TB TYPICAL CHARACTERISTICS (T A = +25C, VCC = 5.0 V, ZS = ZL = 50 , unless otherwise specified) Remark The graphs indicate nominal characteristics. Data Sheet PU10557EJ02V0DS 7 UPC3227TB Remark The graphs indicate nominal characteristics. 8 Data Sheet PU10557EJ02V0DS UPC3227TB Remark The graphs indicate nominal characteristics. Data Sheet PU10557EJ02V0DS 9 UPC3227TB S-PARAMETERS (T A = +25C, VCC = 5.0 V, Pin = 40 dBm) S11FREQUENCY S22FREQUENCY 10 Data Sheet PU10557EJ02V0DS UPC3227TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) Data Sheet PU10557EJ02V0DS 11 UPC3227TB NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground terminals must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to the VCC line. (4) The DC cut capacitor must be attached to input and output pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Wave Soldering Partial Heating Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260C or below Time at peak temperature : 10 seconds or less Time at temperature of 220C or higher : 60 seconds or less Preheating time at 120 to 180C : 12030 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Caution Do not use different soldering methods together (except for partial heating). 12 Data Sheet PU10557EJ02V0DS IR260 WS260 HS350