10/23/2014 SCGD Series - Basic information
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Part number SCGD1B0208
Applicable media microSIM card
Media ejection structure Push-push type
Mounting type Surface mounting type
Mounting style Standard mount
Card eject stroke 3mm
Stand-off 0mm
Minimum order unit (pcs.) 1,600
Operating temperature range -25℃ to +60℃
Voltage proof 250V AC 1 minute
Insulation resistance (Initial) 1,000MΩ min.
Contact resistance
(Initial)
Connector contacts 100mΩ max.
Detection Switch 500mΩ max.
Insertion and removal cycle 5,000 cycles
Photo
For microSIM Card (Push-push Type) SCGD Series
10/23/2014 SCGD Series - Basic information
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Dimensions
10/23/2014 SCGD Series - Basic information
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Mounting Dimensions
10/23/2014 SCGD Series - Basic information
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Packing Specifications
Taping
Number of packages
(pcs.)
1 reel 1,600
1 case / Japan 4,800
1 case / export 9,600
10/23/2014 SCGD Series - Basic information
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packing
Reel width W(mm) 57.5
Tape width (mm) 56
Export package measurements (mm) 403×403×303
Soldering Conditions
Example of Reflow Soldering Condition (Reference)
1. Heating method
Double heating method with infrared heater.
2. Temperature measurement
Thermocouple 0.1 to 0.2 Φ CA (K) or CC (T) at soldering portion.
3. Temperature profile.
Notes are common to this series/models.
1. This site catalog shows only outline specifications. When using the products, please obtain formal
specifications for supply.
2. Please place purchase orders per minimum order unit (integer).
