April 2007 Rev 10 1/35
1
M24128
M24C64 M24C32
128 Kbit, 64 Kbit and 32 Kbit serial I²C bus EEPROM
Features
■Two-wire I2C serial interface
supports 400 kHz protocol
■Single supply voltages (see Table 1 fo r r oo t
part numbers):
– 2.5 V to 5.5 V
– 1.8 V to 5.5 V
– 1.7 V to 5.5 V
■Write Control input
■Byte and Page Write
■Random and Sequential Read modes
■Self-timed programming cycle
■Automatic address incrementing
■Enhanced ESD/Latch-Up Protection
■More than 1 Million Write cycles
■More than 40-year data retention
■Packages
– ECOPACK® (RoHS compliant)
Table 1. Device summary
Reference Root part number Supply voltage
M24128 M24128-BW 2.5 V to 5.5V
M24128-BR 1.8 V to 5.5V
M24C64
M24C64-W 2.5 V to 5.5V
M24C64-R 1.8 V to 5.5V
M24C64-F 1.7 V to 5.5V
M24C32
M24C32-W 2.5 V to 5.5V
M24C32-R 1.8 V to 5.5V
M24C32-F 1.7 V to 5.5V
PDIP8 (BN)
SO8 (MN)
150 mil width
TSSOP8 (DW)
169 mil width
UFDFPN8 (MB)
2x3mm² (M LP)
www.st.com
Contents M24128, M24C64, M24C32
2/35
Contents
1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2 Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.0.1 Serial Clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.0.2 Serial Data (SDA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 Chip Enable (E0, E1, E2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2 Write Control (WC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3 Supply voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3.1 Operating supp ly voltage VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
2.3.2 Internal device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3.3 Power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3 Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4 Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.1 Start condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.2 Stop condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.3 Acknowledge bit (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.4 Data Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.5 Memory addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.6 Write operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.7 Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.8 Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.9 Minimizing system delays by polling on ACK . . . . . . . . . . . . . . . . . . . . . . 17
4.10 Read operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.11 Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.12 Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.13 Sequential Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.14 Acknowledge in Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5 Initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
M24128, M24C64, M24C32 Contents
3/35
7 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
8 Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
9 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
List of tables M24128, M24C64, M24C32
4/35
List of tables
Table 1. Device summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 3. Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 4. Address most significant byte. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 0
Table 5. Address least significant byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 6. Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 7. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 8. Operating conditions (M24128-BW, M24C64-W, M24C32-W). . . . . . . . . . . . . . . . . . . . . . 21
Table 9. Operating conditions (M24128-BR, M24C64-R, M24C32-R) . . . . . . . . . . . . . . . . . . . . . . . 21
Table 10. Operating conditions (M24C64-F, M24C32-F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 11. AC test measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 12. Input parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 13. DC characteri st ic s (V CC = 2.5 V to 5.5 V, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 14. DC characteri st ic s (V CC = 2.5 V to 5.5 V, device grade 3) . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 15. DC characteri st ic s (V CC = 1.8 V to 5.5 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 16. DC characteri st ic s (V CC = 1.7 V to 5.5 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 17. AC characteristics (VCC = 2.5 V to 5.5 V or VCC = 1.8 V to 5.5 V) . . . . . . . . . . . . . . . . . . . 24
Table 18. AC characteristics (VCC = 1.7 V to 5.5 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Table 19. PDIP8 – 8 pin Plastic DIP, 0.25 mm lead frame, package mech anical data . . . . . . . . . . . 27
Table 20. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width,
package mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 21. TSSOP8 – 8 lead Thin Shrink Small Outline, package mechanical data . . . . . . . . . . . . . . 29
Table 22. UFDFPN8 (MLP8) – 8-lead Ultra thin Fi ne pitch Dual Flat Package No lead
2 × 3mm, package mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 23. Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1
Table 24. Available M24C32 products (package, voltage range, temperature grade) . . . . . . . . . . . . 32
Table 25. Available M24C64 products (package, voltage range, temperature grade) . . . . . . . . . . . . 32
Table 26. Available M24128 products (package, voltage range , temperature grade) . . . . . . . . . . . . 32
Table 27. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
M24128, M24C64, M24C32 List of figures
5/35
List of figures
Figure 1. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 2. DIP, SO, TSSOP and UFDFPN connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 3. Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 4. Maximum RP value versus bus parasitic capacitance (C) for an I2C bus . . . . . . . . . . . . . . 9
Figure 5. I2C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 6. Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 7. Write mode sequen ce s with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 8. Write mode sequen ce s with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 9. Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 10. Read mode sequences. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 11. AC test measurement I/O waveform. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 12. AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 13. PDIP8 – 8 pin Plastic DIP, 0.25 mm lead frame, package outline . . . . . . . . . . . . . . . . . . . 27
Figure 14. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, package outline . . . . . . 28
Figure 15. TSSOP8 – 8 lead Thin Shrink Small Outline, package outline. . . . . . . . . . . . . . . . . . . . . . 29
Figure 16. UFDFPN8 (MLP8) – 8-lead Ultra thin Fine pitch Dual Flat Package No lead
2 × 3mm, package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Description M24128, M24C64, M24C32
6/35
1 Description
The M24C32, M24C64 and M24128 devices are I 2C-compatible electrically erasable
programmable memories (EEPROM). They are organized as 4096 × 8 bits, 8192 × 8 bits
and 16384 × 8 bits, respectively.
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages.
ECOPACK® packages are Lead-free and RoHS compliant. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 1. Logic diagram
I2C uses a two-wire serial interface, comprising a bi-directional data line and a clock line.
The devices carry a built-in 4-bit Device Type Identifier code (1010) in accordance with the
I2C bus definition.
The de vice beh av e s as a slave in the I2C prot ocol, with all memory operations synchroniz ed
by the serial clock. Read and Wr ite operations are initiated by a Start condition, generated
by the bus master. The Start condition is followed by a Device Select Code and Read/Write
bit (RW) (as described in Table 3), terminated by an acknowledge bit.
When writing data to the memory, the device inserts an acknowledge bit during the 9th bit
time, f ollowing the bus master’s 8-bit t ransmission. When d ata is read b y the b us master, the
bus master acknowledges the receipt of the data byte in the same way. Data transfers are
terminated by a Stop condition after an Ack for Write, and after a NoAck for Read.
AI01844e
3
E0-E2 SDA
VCC
M24128
M24C64
M24C32
WC
SCL
VSS
M24128, M24C64, M24C32 Description
7/35
Figure 2. DIP, SO, TSSOP and UFDFPN connections
1. See Package mechanical section for package dimensions, and how to identify pin-1.
Table 2. Signal names
E0, E1, E2 Chip Enable
SDA Serial Data
SCL Serial Clock
WC Write Con trol
VCC Supply Voltage
VSS Ground
SDAVSS SCL
WCE1
E0 VCC
E2
AI01845e
M24128
M24C64
M24C32
1
2
3
4
8
7
6
5
Signal description M24128, M24C64, M24C32
8/35
2 Signal description
2.0.1 Serial Clock (SCL)
This input signal is used to strobe all data in and out of the device. In applications where this
signal is used by slave devices to synchronize the bus to a slower clock, the bus master
must h ave an open d rain output, and a pull- up resist or must be connected from Serial Cloc k
(SCL) to VCC. (Figure 4 indicates how the value of the pull-up resistor can be calculated). In
most applications, though, this method of synchronization is not employed, and so the pull-
up resistor is not n ecessary, provided that the bus master has a push -p ull (rather than open
drain) output.
2.0.2 Serial Data (SDA)
This bi-directional signal is used to transfer data in or out of the device. It is an open drain
output that may be wire-OR’ed with other open drain or open collector signals on the b u s . A
pull up resistor must be connected from Serial Data (SDA) to VCC. (Figure 4 indicates how
the value of the pull-up resistor can be calculated) .
2.1 Chip Enable (E0, E1, E2)
These input signals are used to set the value that is to be looked for on the three least
significant bits (b3, b2, b1) of the 7-bit Device Select Code. These inputs must be tied to
VCC or VSS, to establish the De vice Select Code as shown in Figure 3. When not connected
(left floating), these inputs are read as Low (0,0,0).
Figure 3. Device select code
2.2 Write Control (WC)
This input signal is useful for protecting the entire contents of the memory from inadvertent
write operations. Write operations are disabled to the entire memory array when Write
Control (WC) is driven High. When unconnected, the signal is internally read as VIL, and
Write ope ration s ar e allowed.
When Write Control (WC) is driven High, Device Select and Address bytes are
acknowledged, Data bytes are not acknowledged.
Ai12806
VCC
M24xxx
VSS
Ei
VCC
M24xxx
VSS
Ei
M24128, M24C64, M24C32 Signal description
9/35
2.3 Supply voltage (VCC)
2.3.1 Operating supply voltage VCC
Prior to selecting the memory and issuing instructions to it, a valid and stable VCC voltage
within the specified [VCC(min), VCC(max)] r ange must be applied (see Table 9 and Table 10).
In order to secure a stable DC supply voltage, it is recommended to decouple the VCC line
with a suitable capacitor (usually of the order of 10 nF to 100nF) close to the VCC/VSS
package pins.
This v oltage m ust remain st ab le and v a lid until the end of the tr an smission of the instruction
and, for a Write instruction, until the completion of the internal write cycle (tW).
2.3.2 Internal device reset
In order to prev en t inadvertent Write operations during Power-up, a Power On Reset (POR)
circuit is included. At Po wer-u p (continuou s rise of VCC), th e de vice does no t respond to an y
instruction until V CC has reached the Power On Reset threshold voltage (this threshold is
lower than the minimum VCC operating voltage defined in Table 9 and Table 10).
When VCC has passed the POR threshold, the device is reset and is in Standby Power
mode.
2.3.3 Power-down
At Power-down (continuous decrease of VCC), as soon as VCC drops from the normal
operating voltage to below the Pow er On Reset threshold voltage, the device stops
responding to any instruction sent to it.
During Pow er-do wn, th e device must be desele cted an d in the Standby Pow er mode (that is
there should be no internal Write cycle in pr ogres s) .
Figure 4. Maximum RP value versus bus parasitic capacitance (C) for an I2C b us
AI01665b
VCC
C
SDA
RP
MASTER
RP
SCL C
100
0
4
8
12
16
20
C (pF)
Maximum RP value (kΩ)
10 1000
fc = 400kHz
fc = 100kHz
Signal description M24128, M24C64, M24C32
10/35
Figure 5. I2C bus protocol
Table 3. Device select code
Device Type Identifier(1)
1. The most significant bit, b7, is sent first.
Chip Enable Address(2)
2. E0, E1 and E2 are compared against the respective external pins on the memory device.
RW
b7 b6 b5 b4 b3 b2 b1 b0
Device Select Code 1 0 1 0 E2 E1 E0 RW
Table 4. Address most significant byte
b15 b14 b13 b12 b11 b10 b9 b8
Table 5. Address least significant b yte
b7 b6 b5 b4 b3 b2 b1 b0
SCL
SDA
SCL
SDA
SDA
START
Condition
SDA
Input SDA
Change
AI00792B
STOP
Condition
123 789
MSB ACK
START
Condition
SCL 123 789
MSB ACK
STOP
Condition
Device operation M24128, M24C64, M24C32
12/35
4 Device operation
The de vice supports the I2C protocol. This is summarize d in Figure 5. Any de vice that sends
data on to the bus is defined to be a transmitter, and any device that reads the data to be a
receiver. The device that controls the data transfer is known as the bus master, and the
other as the slave device . A data transfer can only be initiated by the bus master, which will
also provide the ser ia l clock for synchronization. The M24C32, M24C64 and M24128
devic es ar e always slaves in all communications.
4.1 Start condition
Start is identified by a falling edge of Serial Data (SD A) while Serial Clock (SCL) is stab le in
the High state. A Start condition must precede any data transfer command. The device
continuously monitors (except during a Write cycle) Serial Data (SDA) and Serial Clock
(SCL) for a Start condition, and will not respond unless one is given.
4.2 Stop condition
Stop is identified by a rising edge of Serial Data (SDA) while Serial Clock (SCL) is stable
and driven High. A Stop condition terminates communication between the device and the
bus m aster . A Read command that is follo wed b y NoAc k can be follo wed b y a Stop conditi on
to force the device into the Standby mode. A Stop condition at the end of a Write command
triggers the internal Write cycle.
4.3 Acknowledge bit (ACK)
The acknowledge bit is used to indicate a successful byte transfer. The bus transmitter,
whether it be bus master or slav e device , releases Serial Data (SDA) after sending eight bits
of data. During the 9th clock pulse period, the receiver pulls Serial Data (SDA) Low to
acknowledge the receipt of the eight data bits.
4.4 Data Input
During data input, the device samples Serial Data (SDA) on the rising edge of Serial Clock
(SCL). F or correct de vice o peration, Serial Data (SDA) must be stab le during the rising edge
of Serial Clock (SCL), and the Serial Data (SD A) signal must change only when Serial Clock
(SCL) is driven Low.
M24128, M24C64, M24C32 Device operation
13/35
4.5 Memory addressing
To start communication between the bus master and the slave device, the bus master must
initiate a Start condition. F ollowing this, the bus master sends the Device Select Code,
shown in Table 3 (on Serial Data (SDA), most significant bit first).
The Device Select Code consists of a 4-bit Device Type Identifier, and a 3-bit Chip Enable
“Address” (E2, E1, E0). To address the memory array, the 4-bit Device Type Identifier is
1010b.
Up to eight memory devices can be connected on a sin gle I2C bus. Each one is given a
unique 3-bit code on the Chip Enable (E0, E1, E2) input s. When the Device Select Code is
received, the device only responds if the Chip Enable Ad dress is the same as the value on
the Chip Enable (E0, E1, E2) inputs.
The 8th bit is the Read/Write bit (RW). This b it is set to 1 for Read and 0 f or Write ope ration s.
If a match occurs on the Device Select code, the corresponding device gives an
acknowledgment on Serial Data (SDA) during the 9th bit time. If the device does not match
the Device Select code, it deselects itself from the bus, and goes into Standby mode.
Table 6. Operating modes
Mode RW bit WC(1)
1. X = VIH or VIL.
Bytes Initial Sequence
Current Address
Read 1 X 1 START, Device Select, RW = 1
Random Address
Read 0X 1START, Device Select, RW = 0, Address
1 X reSTART, Device Select, RW = 1
Sequential Read 1 X ≥ 1 Similar to Current or Random Address
Read
Byte Write 0 VIL 1 START, Device Select, RW = 0
Page Write 0 VIL
≤ 32 for M24C64
and M24C32 START, Device Select, RW = 0
≤ 64 for M24128
Device operation M24128, M24C64, M24C32
14/35
Figure 7. Write mode sequences with WC = 1 (data write inhibited)
STOP
START
BYTE WRITE DEV SEL BYTE ADDR BYTE ADDR DATA IN
WC
START
PAGE WRITE DEV SEL BYTE ADDR BYTE ADDR DATA IN 1
WC
DATA IN 2
AI01120C
PAGE WRITE
(cont'd)
WC (cont'd)
STOP
DATA IN N
ACK ACK ACK NO ACK
R/W
ACK ACK ACK NO ACK
R/W
NO ACK NO ACK
M24128, M24C64, M24C32 Device operation
15/35
4.6 Write operations
F ollo wing a Start condition the b us master sends a Device Select Code with the Read/Write
bit (RW) reset to 0. Th e device acknowledges this, as shown in Figure 8, and waits for two
address bytes. The device responds to each address byte with an acknowledge bit, and
then waits for the data Byte.
Writing to the mem o ry m ay be inhibited if Write Control (WC) is driven High. Any Wr ite
instruction with Write Control (WC) dr iven High (during a period of time fr om the Start
condition until the end of the two address byte s) will not modify the memory contents, and
the accompanying data bytes are not acknowledged, as shown in Figure 7.
Each data byte in the memory has a 16-bit (two by te wide) address. The Most Significant
Byte (Table 4) is sent first, followed by the Least Significa nt Byte ( Table 5). Bits b15 to b0
form the address of the byte in memory.
When the bus master generates a Stop condition immediately after the Ack bit (in the “10th
bit” time slot) , either at the end of a Byte Write or a Page Write, the internal Write cycle is
triggered. A Stop condition at any other time slot does not trigger the internal Write cycle.
After the Stop condition, the delay tW, and the successful completion of a Write operation,
the device’s internal address counter is incremented automat ically, to point to the next byte
address after the last one that was modified.
During the internal Write cycle, Serial Data (SDA) is disab led internally, and the device does
not respond to any requests.
4.7 Byte Write
After the Device Select code and the address bytes, the bus master sends one data byte. If
the addressed loc at i on is Write-protecte d , by Write Contr o l (WC ) being driven High, the
de vice replies with NoAck, and the location is not modified. If, instead, the addressed
location is not Write-protected, the device replies with Ac k. The bus master terminates the
transfer by generating a Stop condition, as sho wn in Figure 8.
4.8 Page Write
The Page Write mode allows up to 32 bytes (for the M24C32 and M24C64) or 6 4 bytes (for
the M24128) to be written in a single Write cycle, p rovide d t ha t they are all located in the
same ’row’ in the memory: that is, the most significant memory address bits (b13-b6 for
M24128, b12- b5 for M24C64, and b11-b 5 for M24C32) are the sa me . If mor e b yte s are sen t
than will fit up to the end of the row, a condition known as ‘roll-over’ occurs. This should be
avoided, as data starts to become overwritten in an implementation depen dent way.
The b us master sends from 1 to 32 b y tes of data (for the M24C32 and M24 C64) or 64 b ytes
of data (f or the M2412 8), each of which is ac knowledged b y the de vice if Write Control (WC)
is Low. If Write Control (WC) is High, the contents of the addressed memory location are not
modified, and each data byte is followed by a NoAck. After each byte is transferred, the
internal byte address cou nter (inside the page) is incre mented. The transf er is terminated by
the bus master generating a Stop condition.
Device operation M24128, M24C64, M24C32
16/35
Figure 8. Write mode sequences with WC = 0 (data write enabled)
STOP
START
BYTE WRITE DEV SEL BYTE ADDR BYTE ADDR DATA IN
WC
START
PAGE WRITE DEV SEL BYTE ADDR BYTE ADDR DATA IN 1
WC
DATA IN 2
AI01106C
PAGE WRITE
(cont'd)
WC (cont'd)
STOP
DATA IN N
ACK
R/W
ACK ACK ACK
ACK ACK ACK ACK
R/W
ACKACK
M24128, M24C64, M24C32 Device operation
17/35
Figure 9. Write cycle polling flowch art using ACK
4.9 Minimizing system delays by polling on ACK
During the internal Write cycle, the de vice d isconnect s itself fr om the b us , and writes a copy
of the data from its internal latches to the memory cells. The maximum Write time (tw) is
shown in Table 17 and Table 18, but the typical time is shorter . To make use of this , a polling
sequence can be used by the bus master.
The sequence, as shown in Figure 9, is:
– Initial condition: a Write cycle is in progress.
– Step 1: the bus master issues a Star t condition followed by a Device Select Code
(the first byte of the new instruction).
– Step 2: if the device is busy with the internal Write cycle, no Ack will be returned
and the bus master goes back to Step 1. If the device has terminated the internal
Write cycle, it responds with an Ack, indicating that the device is ready to receive
the second part of the instruction (the first b yte of this instruction ha ving been se nt
during Step 1).
WRITE Cycle
in Progress
AI01847C
Next
Operation is
Addressing the
Memory
START Condition
DEVICE SELECT
with RW = 0
ACK
Returned
YES
NO
YESNO
ReSTART
STOP
DATA for the
WRITE Operation DEVICE SELECT
with RW = 1
Send Address
and Receive ACK
First byte of instruction
with RW = 0 already
decoded by the device
YESNO START
Condition
Continue the
WRITE Operation Continue the
Random READ Operation
Device operation M24128, M24C64, M24C32
18/35
Figure 10. Read mode sequences
1. The seven most significant bits of the Device Select Code of a Random Read (in the 1st and 4th bytes)
must be identical.
START
DEV SEL * BYTE ADDR BYTE ADDR
START
DEV SEL DATA OUT 1
AI01105C
DATA OUT N
STOP
START
CURRENT
ADDRESS
READ DEV SEL DATA OUT
RANDOM
ADDRESS
READ
STOP
START
DEV SEL * DATA OUT
SEQUENTIAL
CURRENT
READ
STOP
DATA OUT N
START
DEV SEL * BYTE ADDR BYTE ADDR
SEQUENTIAL
RANDOM
READ
START
DEV SEL * DATA OUT 1
STOP
ACK
R/W
NO ACK
ACK
R/W
ACK ACK ACK
R/W
ACK ACK ACK NO ACK
R/W
NO ACK
ACK ACK ACK
R/W
ACK ACK
R/W
ACK NO ACK
M24128, M24C64, M24C32 Device operation
19/35
4.10 Read operations
Read opera tions are performed independently of the state of the Write Control (WC) signal.
After the successful completion of a Read oper ation, the de vice’ s internal address count er is
incremented by one, to point to the next byte address.
4.11 Random Address Read
A dummy Write is firs t performed to load the address into this addr ess coun ter (as sho w n in
Figure 10) but without sending a Stop condition. Then, the bus master sends another Start
condition, and repeats the Device Select Code, with the Read/Write bit (RW) set to 1. The
device acknowledges this, and outputs the contents of the addressed byte. The bus master
must not acknowledge the byte, and terminates the transfer with a Stop condition.
4.12 Current Address Read
F or the Current Address Read operation, following a Start condition, the bus master only
sends a Device Select Code with the Read/Write bit (RW) set to 1. The device
acknowledges this, and outputs the byte addressed by the internal address counter. The
counter is then incremented. The bus master terminates the transfer with a Stop condition,
as shown in Figure 10, without acknowledging the Byte.
4.13 Sequential Read
This operation can be used af ter a Cu rren t Address Read or a Random Addr ess Read. The
bus master does acknowledge the data byte output, and sends additional clock pulses so
that the device continues to output the next byte in sequence. To terminate the stream of
bytes, the bus ma ster mu st not acknowledge the last byte, and must generate a Stop
condition, as shown in Figure 10.
The output data comes from consecutive addresses, with the internal address counter
automatically incremented after each byte output. After the last memory address, the
address counter ‘rolls-over’, and the device continues to output data from memory address
00h.
4.14 Acknowledge in Read mode
For all Read commands, the device waits, after each byte read, for an acknowledgment
during the 9th bit ti me. If the b us master does not drive Serial Data (SDA) Low during this
time, the device terminates the data transfer and switches to its Standby mode.
Initial delivery state M24128, M24C64, M24C32
20/35
5 Initial delivery state
The device is delivered with all bits in the memory array set to 1 (each byte contains FFh).
6 Maximum rating
Stressing the device outside the ratings listed in Table 7 may cause permanent damage to
the device. These are stress ratings only, and operation of the device at these, or any other
conditions outside those indicated in the Opera ting sections of this specification, is not
implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect
device reliability. Refer also to the STMicroelectronics SURE Program and other relevant
quality documents.
Table 7. Absolute maximum ratings
Symbol Parameter Min. Max. Unit
TAAmbient operating temperature –40 130 °C
TSTG Storage temperature –65 150 °C
TLEAD Lead temperature during soldering see note (1)
1. Compliant with JEDEC Std J-STD-020C (for small body, Sn-Pb or Pb assembly), the ST ECOPACK®
7191395 specification, and the European directive on Restrictions on Hazardous Substances (RoHS)
2002/95/EU.
°C
PDIP-specific lead temperature during soldering 260(2)
2. TLEAD max must not be applied for more than 10s.
°C
VIO Input or output range –0.50 6.5 V
VCC Supply vol ta ge –0.50 6.5 V
VESD Electrostatic discharge voltage (human body model)(3)
3. AEC-Q100-002 (compliant with JEDEC Std JESD22-A114A, C1=100pF, R1=1500Ω, R2=500Ω)
–4000 4000 V
M24128, M24C64, M24C32 DC and AC parameters
21/35
7 DC and AC parameters
This section summarizes the operating and measurement conditions, and the DC and AC
characteristics of the device. The parameters in the DC and AC Characteristic tables that
follow are derived from tests performed under the Measurement Conditions summarized in
the relevant tables. Designers should check that the operating conditions in their circuit
match the measurem ent conditions when relying on the quoted parameters.
Figure 11. AC test measurement I/O waveform
Table 8. Operating conditions (M24128-BW, M24C64-W, M24C32-W)
Symbol Parameter Min. Max. Unit
VCC Supply voltage 2.5 5.5 V
TAAmbient operating temperature (Device Grade 6) –40 85 °C
Ambient operating temperature (Device Grade 3) –40 125 °C
Table 9. Operating conditions (M24128-BR, M24C64-R, M24C32-R)
Symbol Parameter Min. Max. Unit
VCC Supply voltage 1.8 5.5 V
TAAmbient operating temperature – 40 85 °C
Table 10. Operating conditions (M24C64-F, M24C32-F)
Symbol Parameter Min. Max. Unit
VCC Supply voltage 1.7 5.5 V
TAAmbient operating temperature – 20 85 °C
Table 11. AC test measurement conditions
Symbol Parameter Min. Max. Unit
CLLoad capacitance 100 pF
Input Rise and Fall times 50 ns
Input levels 0.2VCC to 0.8VCC V
Input and output timing reference levels 0.3VCC to 0.7VCC V
AI00825B
0.8VCC
0.2VCC
0.7VCC
0.3VCC
Input and Output
Timing Reference Levels
Input Levels
DC and AC parameters M24128, M24C64, M24C32
22/35
Table 12. Input parameters
Symbol Parameter Test condition Min. Max. Unit
CIN Input capacitance (SDA) 8 pF
CIN Input capacitance (other pins) 6 pF
ZWCL(1)
1. Characterized only.
WC input impedance VIN < 0.3VCC 50 200 kΩ
ZWCH(1) WC input impedance VIN > 0.7VCC 500 kΩ
tNS(1) Pulse width ignored
(Input filter on SCL and SD A) 200 ns
Table 13. DC characteristics (VCC = 2.5 V to 5.5 V, device grade 6)
Symbol Parameter Test condition
(in addition to those in Table 8)Min. Max. Unit
ILI Input Leakage Current
(SCL, SDA, E2, E1, E0) VIN = VSS or VCC
device in Standby mode ± 2 µA
ILO Output Leakage Current VOUT = VSS or VCC, SDA in Hi-Z ± 2 µA
ICC Supply Current (Read) 2.5 V < VCC < 5.5 V, fc = 400 kHz 2 mA
ICC0 Supply Current (Write) During tW, 2.5 V < VCC < 5.5 V 5(1)
1. Characterized value, not tested in production.
mA
ICC1
Standby Supply Current VIN = VSS or VCC,
VCC = 5.5 V 5µA
Standby Supply Current VIN = VSS or VCC,
VCC = 2.5 V 2µA
VIL Input Low Voltage (SDA,
SCL, WC)–0.45 0.3VCC V
VIH Input High Vol ta ge (SDA,
SCL, WC)0.7VCC VCC+0.6 V
VOL Output Low Voltage IOL = 2.1 mA, VCC = 2.5 V or
IOL = 3 mA, VCC = 5.5 V 0.4 V
M24128, M24C64, M24C32 DC and AC parameters
23/35
Table 14. DC characteristics (VCC = 2.5 V to 5.5 V, device grade 3)
Symbol Parameter Test condition
(in addition to those in Table 8)Min. Max. Unit
ILI Input Leakage Current
(SCL, SDA, E2, E1, E0) VIN = VSS or VCC
device in Standby mode ± 2 µA
ILO Output Leakage Current VOUT = VSS or VCC, SDA in Hi-Z ± 2 µA
ICC Supply Current (Read) 2.5 V < VCC < 5.5 V, fc = 400 kHz 2 mA
ICC0 Supply Current (Write) During tW, 2.5 V < VCC < 5.5 V 5(1)
1. Characterized value, not tested in production.
mA
ICC1 Standby Supply Current VIN = VSS or VCC,
2.5 V < VCC < 5.5 V 10 µA
VIL Input Low Voltage (SDA,
SCL, WC)–0.45 0.3VCC V
VIH Input High Vol ta ge (SDA,
SCL, WC)0.7VCC VCC+0.6 V
VOL Output Low Voltage IOL = 2.1 mA, VCC = 2.5 V or
IOL = 3 mA, VCC = 5.5 V 0.4 V
Table 15. DC characteristics (VCC = 1.8 V to 5.5 V)
Symbol Parameter Test condition
(in addition to those in Table 9)Min. Max. Unit
ILI Input Leakage Current
(SCL, SDA, E2, E1, E0) VIN = VSS or VCC
device in Standby mode ± 2 µA
ILO Output Leakage Current VOUT = V SS or VCC, SDA in Hi-Z ± 2 µA
ICC Supply Current (Read) VCC = 1.8 V, fc = 400 kH z 0.8 mA
ICC0 Supply Current (Write) Dur ing tW, 1.8 V < VCC < 2.5 V 3(1)
1. Characterized value, not tested in production.
mA
ICC1 Standby Supply Current VIN = VSS or VCC,
1.8 V < VCC < 2.5 V 1µA
VIL Input Low Voltage (SDA,
SCL, WC)–0.45 0.3 VCC V
VIH Input High Voltage (SDA,
SCL, WC)0.7VCC VCC+0.6 V
VOL Output Low Voltage I OL = 0.7 mA, VCC = 1.8 V 0.2 V
DC and AC parameters M24128, M24C64, M24C32
24/35
Table 16. DC characteristics (VCC = 1.7 V to 5.5 V)(1)
1. Preliminary data.
Symbol Parameter Test condition
(in addition to those in
Table 10)Min. Max. Unit
ILI Input Leakage Current
(SCL, SDA, E2, E1, E0) VIN = VSS or VCC
device in Standby mode ± 2 µA
ILO Output Leakage Current VOUT = VSS or VCC, SDA in Hi-Z ± 2 µA
ICC Supply Current (Read) VCC =1.7 V, fc = 400 kHz 0.8 mA
ICC0 Supply Current (Write) Dur ing tW, 1.7 V < VCC < 2.5 V 3(2)
2. Characterized value, not tested in production.
mA
ICC1 Standby Supply Current VIN = VSS or VCC,
1.7 V < VCC < 2.5 V 1µA
VIL Input Low Voltage (SDA,
SCL, WC)–0.45 0.3 VCC V
VIH Input High Voltage (SDA,
SCL, WC)0.7VCC VCC+0.6 V
VOL Output Low Voltage IOL = 0.7 mA, VCC = 1.7 V 0.2 V
Table 17. AC characteristics (VCC = 2.5 V to 5.5 V or VCC = 1.8 V to 5.5 V)
Test conditions specified in Table 11 and Table 8
Symbol Alt. Parameter Min. Max. Unit
fCfSCL Clock Frequency 400 kHz
tCHCL tHIGH Clock Pulse Width High 600 ns
tCLCH tLOW Clock Pulse Width Low 1300 ns
tDL1DL2(1)
1. Sampled only, not 100% tested.
tFSDA Fall Time 20 300 ns
tDXCX tSU:DAT Data In Set Up Time 100 ns
tCLDX tHD:DAT Data In Hold Time 0 ns
tCLQX tDH Data Out Hold Time 200 ns
tCLQV(2)
2. To avoid spurious START and STOP conditions, a minimum delay is placed between SCL=1 and the
falling or rising edge of SDA.
tAA Clock Low to Next Data Valid (Access Time) 200 900 ns
tCHDX(3)
3. For a reSTART condition, or following a Write cycle.
tSU:STA Start Cond ition Set Up Time 600 ns
tDLCL tHD:STA Start Condition Hold Time 600 ns
tCHDH tSU:STO Stop Condition Set Up Time 600 ns
tDHDL tBUF Time between Stop condition and next Start condition 1300 ns
tWtWR Write Time 5(4)
4. For production lots assembled from 1st July 2007 (data code 727: week27, year 2007), the M24xxx-R
(1.8 V to 5.5 V range) memories are specified with tW = 5 ms (instead of 10ms).
ms
M24128, M24C64, M24C32 DC and AC parameters
25/35
Table 18. AC characteristics (VCC = 1.7 V to 5.5 V)
Test conditi ons sp eci f ied in Table 11 and Table 9 or Table 10
Symbol Alt. Parameter Min. Max. Unit
fCfSCL Clock Frequency 400 kHz
tCHCL tHIGH Clock Pulse Width High 600 ns
tCLCH tLOW Clock Pulse Width Low 1300 ns
tDL1DL2(1)
1. Sampled only, not 100% tested.
tFSDA Fall Time 20 300 ns
tDXCX tSU:DAT Data In Set Up Time 100 ns
tCLDX tHD:DAT Data In Hold Time 0 ns
tCLQX tDH Data Out Hold Time 200 ns
tCLQV(2)
2. To avoid spurious START and STOP conditions, a minimum delay is placed between SCL=1 and the
falling or rising edge of SDA.
tAA Clock Low to Next Data Valid (Access Time) 200 900 ns
tCHDX(3)
3. For a reSTART condition, or following a Write cycle.
tSU:STA Start Condition Set Up Time 600 ns
tDLCL tHD:STA Start Condition Hold Time 600 ns
tCHDH tSU:STO Stop Condition Set Up Time 600 ns
tDHDL tBUF Time between Stop Condition and Next Start Condition 1300 ns
tWtWR Write Time 10 ms
DC and AC parameters M24128, M24C64, M24C32
26/35
Figure 12. AC waveforms
SCL
SDA In
SCL
SDA Out
SCL
SDA In
tCHCL
tDLCL
tCHDX
START
Condition
tCLCH
tDXCXtCLDX
SDA
Input
SDA
Change tCHDH tDHDL
STOP
Condition
Data Valid
tCLQV tCLQX
tCHDH
STOP
Condition
tCHDX
START
Condition
Write Cycle
tW
AI00795C
START
Condition
M24128, M24C6 4, M24C32 Package mechanical
27/35
8 Package mechanical
Figure 13. PDIP8 – 8 pin Plasti c DIP, 0.25 mm lead frame, package outline
1. Drawing is not to scale.
Table 19. PDIP8 – 8 pin Plastic DIP, 0.25 mm lead frame, package mechanical data
Symbol millimeters inches
Typ. Min. Max. Typ. Min. Max.
A 5.33 0.210
A1 0.38 0.015
A2 3.30 2.92 4.95 0.130 0.115 0.195
b 0.46 0.36 0.56 0.018 0.014 0.022
b2 1.52 1.14 1.78 0.060 0.045 0.070
c 0.25 0.20 0.36 0.010 0.008 0.014
D 9.27 9.02 10.16 0.365 0.355 0.400
E 7.87 7.62 8.26 0.310 0.300 0.325
E1 6.35 6.10 7.11 0.250 0.240 0.280
e 2.54 – – 0.100 – –
eA 7.62 – – 0.300 – –
eB 10.92 0.430
L 3.30 2.92 3.81 0.130 0.115 0.150
PDIP-B
A2
A1
A
L
be
D
E1
8
1
c
eA
b2
eB
E
Package mechanical M24128, M24C64, M24C32
28/35
Figure 14. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, package
outline
1. Drawing is not to scale.
Table 20. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width,
package mechanical data
Symbol millimeters inches
Typ Min Max Typ Min Max
A1.750.069
A1 0.10 0.25 0.004 0.010
A2 1.25 0.049
b 0.28 0.48 0.011 0.019
c 0.17 0.23 0.007 0.009
ccc 0.10 0.004
D 4.90 4.80 5.00 0.193 0.189 0.197
E 6.00 5.80 6.20 0.236 0.228 0.244
E1 3.90 3.80 4.00 0.154 0.150 0.157
e1.27– –0.050– –
h 0.25 0.50 0.010 0.020
k0°8°0°8°
L 0.40 1.27 0.016 0.050
L1 1.04 0.041
SO-A
E1
8
ccc
be
A
D
c
1E
h x 45˚
A2
k
0.25 mm
L
L1
A1
GAUGE PLANE
M24128, M24C6 4, M24C32 Package mechanical
29/35
Figure 15. TSSOP8 – 8 lead Thin Shrink Small Outline, pac kage outline
1. Drawing is not to scale.
Table 21. TSSOP8 – 8 lead Thin Shrink Small Outline, packa ge mechanical data
Symbol millimeters inches
Typ. Min. Max. Typ. Min. Max.
A 1.200 0.0472
A1 0.050 0.150 0.0020 0.0059
A2 1.000 0.800 1.050 0.0394 0.0315 0.0413
b 0.190 0.300 0.0075 0.0118
c 0.090 0.200 0.0035 0.0079
CP 0.100 0.0039
D 3.000 2.900 3.100 0.1181 0.1142 0.1220
e 0.650 – – 0.0256 – –
E 6.400 6.200 6.600 0.2520 0.2441 0.2598
E1 4.400 4.300 4.500 0.1732 0.1693 0.1772
L 0.600 0.450 0.750 0.0236 0.0177 0.0295
L1 1.000 0.0394
α0° 8° 0° 8°
TSSOP8AM
1
8
CP
c
L
EE1
D
A2A
α
eb
4
5
A1
L1
Package mechanical M24128, M24C64, M24C32
30/35
Figure 16. UFDFPN8 (MLP8) – 8-lead Ultra thin Fine pit ch Dual Flat Package No lead
2 × 3mm, package outline
1. Drawing is not to scale.
Table 22. UFDFPN8 (MLP8) – 8-lead Ultra thin Fine pitch Dual Flat Package No lead
2 × 3mm, pac kage mechanical data
Symbol millimeters inches
Typ Min Max Typ Min Max
A 0.55 0.50 0.60 0.022 0.020 0.024
A1 0.02 0.00 0.05 0.001 0.000 0.002
b 0.25 0.20 0.30 0.010 0.008 0.012
D 2.00 1.90 2.10 0.079 0.075 0.083
D2 1.60 1.50 1.70 0.063 0.059 0.067
ddd 0.08 0.003
E 3.00 2.90 3.10 0.118 0.114 0.122
E2 0.20 0.10 0.30 0.008 0.004 0.012
e0.50– –0.020– –
L 0.45 0.40 0.50 0.018 0.016 0.020
L1 0.15 0.006
L3 0.30 0.012
D
E
UFDFPN-01
A
A1 ddd
L1
eb
D2
L
E2
L3
M24128, M24C64, M24C32 Part numbering
31/35
9 Part numbering
F o r a list of available options (speed, package, etc. ) or for further information on an y aspect
of this device, please contact your nearest ST Sales Office.
The category of Second Level Interconnect is marked on the package and on the inner box
label, in compliance with JEDEC Standar d JESD97. The maximum ratings related to
soldering conditions are also marked on the inner box label.
Table 23. Ordering information scheme
Example: M24C32– W MN 6 T P /B
Device type
M24 = I2C serial access EEPROM
Device function
128–B = 128 Kbit (16384 x 8)
C64– = 64 Kbit (8192 x 8)
C32– = 32 Kbit (4096 x 8)
Operatin g voltage
W = VCC = 2.5 V to 5.5 V
R = VCC = 1.8 V to 5.5 V
F = VCC = 1.7 V to 5.5 V
Package
BN = PDIP8
MN = SO8 (150 mil width)
DW = TSSOP8 (169 mil width)
MB = UFDFPN8 (MLP8)
Device grade
6 = Industrial: device tested with standard test flow over –40 to 85 °C
3 = Automotive: device tested with High Reliability Certified Flow(1) o ver –40 to 125°C.
1. ST strongly recommends the use of the Automotive Grade devices for use in an automotive environment.
The High Reliability Certified Flow (HRCF) is described in the quality note QNEE9801. Please ask your
nearest ST sales office for a copy.
5 = Consumer: device tested with standard test flow over –20 to 85°C
Option
blank = Standard Packing
T = Tape and Reel Packing
Plating technology
blank = Standard SnPb plating
P or G = ECOPACK® (RoHS compliant)
Process
B = F6DP26% Rousset
P = F6DP26% Chartered
C = F6DP26% AmMokio
Part numbering M24128, M24C64, M24C32
32/35
Table 24. Available M24C32 prod ucts (package, voltage range, temperature grade)
Package M24C32-F
1.7 V to 5.5 V M24C32-R
1.8 V to 5.5 V M24C32-W
2.5 V to 5.5 V
DIP8 (BN) - - Grade6
SO8N (MN) - Grade 6 Grade 3
Grade 6
TSSOP8 (DW) Grade 5 Grade 6 Grade 6
MLP8 (MB) Grade 5 Grade 6 -
Table 25. Available M24C64 prod ucts (package, voltage range, temperature grade)
Package M24C64-F
1.7 V to 5.5 V M24C64-R
1.8 V to 5.5 V M24C64-W
2.5 V to 5.5 V
DIP8 (BN) - - Grade 6
SO8N (MN) - Grade 6 Grade 3
Grade 6
TSSOP8 (DW) Grade 5 Grade 6 Grade 6
MLP8 (MB) - - -
Table 26. Available M24128 products (package, voltage range , temperature grade)
Package M24128-BR
1.8 V to 5.5 V M24128-BW
2.5 V to 5.5 V
DIP8 (BN) - -
SO8N (MN) Grade 6 Grade 3
Grade 6
TSSOP8 (DW) Grade 6 Grade 6
MLP8 (MB) - -
M24128, M24C64, M24C32 Revision history
33/35
10 Revision history
Table 27. Document revision history
Date Revision Changes
22-Dec-1999 2.3 TSSOP8 packag e in place of TSSOP14 (pp 1, 2, OrderingInfo,
PackageMechData).
28-Jun-2000 2.4 TSSOP8 package data corrected
31-Oct-2000 2.5 Ref erences to Temperature Range 3 removed from Ordering Information
Voltage range -S added, and range -R removed from text and tables
throughout.
20-Apr-2001 2.6
Lead Soldering Temperature in the Absolute Maximum Ratings table
amended
Write Cycl e Polling Flow Chart using ACK illustration updated
References to PSDIP changed to PDIP and Package Mechanical data
updated
16-Jan-2002 2.7 Test condition for ILI made more precise, and value of ILI for E2-E0 and
WC added
-R voltage range added
02-Aug-2002 2.8 Document reformatted usi ng new template.
TSSOP8 (3x3mm² body size) package (MSOP8) added.
5ms write time offered for 5V and 2.5V devices
04-Feb-2003 2.9 SO8W package removed. -S voltage range removed
27-May-2003 2.10 TSSOP8 (3x3mm² body size) package (MSOP8) removed
22-Oct-2003 3.0 Table of contents , and Pb-free options added. Minor wording changes in
Summar y Description, Power-On Reset, Memory Addressing, Write
Operations, Read Operations. VIL(min) improved to -0.45V.
01-Jun-2004 4.0 Absolute Maximum Ratings for VIO(min) and VCC(min) improved.
Soldering temperature information clarified for RoHS compliant de vices.
Device Grade clarified
04-Nov-2004 5.0
Product List summary table added. Device Grade 3 added. 4.5-5.5V
range is Not f or New Design. Some minor wording changes. AEC-Q100-
002 compliance. tNS(max) changed. VIL(min) is the same on all input
pins of the device. ZWCL changed.
05-Jan-2005 6.0 UFDFPN8 package added. Small text changes.
Revision history M24128, M24C64, M24C32
34/35
29-Jun-2006 7
Document converted to new ST template.
M24C32 and M24C64 products (4.5 to 5.5V supply voltage) removed.
M24C64 and M24C32 products (1.7 to 5.5V supply voltage) added.
Section 2.1: Chip Enable (E0, E1, E2) and Section 2.2: Write Control
(WC) modified, Section 2.3: Supply voltage (VCC) added and replaces
Power On Reset: VCC Lock-Out Write Protect section.
TA added, Note 1 updated and TLEAD specified for PDIP packages in
Table 7: Absolute maximum ratings.
ICC0 added, ICC voltage conditions changed and ICC1 specified over the
whole voltage range in Table 13: DC characteristics (VCC = 2.5 V to 5.5
V, device grade 6).
ICC0 added, ICC frequency conditions changed and ICC1 specified over
the whole voltage range in Table 15: DC characteristics (VCC = 1.8 V to
5.5 V).
tW modified in Table 17: AC characteristics (VCC = 2.5 V to 5.5 V or
VCC = 1.8 V to 5.5 V).
SO8N package specifications updated (see Figure 14 and Table 20).
Device grade 5 added, B and P Process letters added to Table 23:
Ordering information scheme. Small text changes.
03-Jul-2006 8
ICC1 modified in Table 13: DC characteristics (VCC = 2.5 V to 5.5 V,
device grade 6).
Note 1 added to Table 16: DC characteristics (VCC = 1.7 V to 5.5 V) and
table title modified.
17-Oct-2006 9
UFDFPN8 package specifications updated (see Table 22). M24128-BW-
and M24128-BR part numbers added.
Generic part number corrected in Features on page 1.
ICC0 corrected in Table 14 and Table 13.
Packages are ECOPACK® compliant.
27-Apr-2007 10
Available packages and temperature ranges by product specified in
Table 24, Table 25 and Table 26.
Notes modified below Table 12: Input parameters.
VIH max modified in DC characteristics tables (see Table 13, Table 14,
Table 15 and Table 16).
C process code added to Table 23: Ordering information scheme.
F or M24xxx-R (1.8 V to 5.5 V range) products assembled from July 2007
on, tW will be 5 ms (see Table 17: A C characteristics (VCC = 2.5 V to 5.5
V or VCC = 1.8 V to 5.5 V).
Table 27. Document revision history (continued)
Date Revision Changes
M24128, M24C64, M24C32
35/35
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