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Intel® Desktop Board DQ77MK
SPECIFICATIONS
Essentials
Memory Specifications
Graphics Specifications
Expansion Options
I/O Specifications
Package Specifications
Advanced Technologies
Intel® Platform Protection
Technology
COMPATIBLE PRODUCTS
ORDERING / SSPECS /
STEPPINGS
SPECIFICATIONS
Essentials
Status Launched
Launch Date Q2'12
Board Form Factor Micro ATX
Socket LGA1155
Extended Life Program (XLP) Yes
Max TDP 95 W
Recommended Customer Price $129.00
Description Link
Memory Specifications
Max Memory Size (dependent on memory type) 32 GB
Memory Types Dual DDR3-1600/1333
# of Memory Channels 2
# of DIMMs 4
ECC Memory Supported ‡No
Graphics Specifications
Integrated Graphics ‡Yes
Graphics Output DP DVI-I DVI-D
# of Displays Supported ‡2
Discrete Graphics 1 PCIe 3.0 x16
Requires a Processor with Intel Graphics
Technology Yes
Expansion Options
PCI Support 1
PCI Express Revision 3.0, 2.0
Max # of PCI Express Lanes 2
PCIe x1 Gen 2.x 1
PCIe x4 Gen 2.x 1
PCIe x8 Gen 2.x 0
PCIe x16 Gen 2.x 0
PCIe x1 Gen 1.x 0
PCIe x4 Gen 1.x 0
PCIe x8 Gen 1.x 0
PCIe x16 Gen 1.x 0
PCIe Mini Card Slot (Full Length) 1
I/O Specifications
USB Revision 3.0/2.0
# of USB Ports 12
USB 2.0 Configuration (Back + Internal) 4,4
USB 3.0 Configuration (Back + Internal) 2,2
Total # of SATA Ports 6
Max # of SATA 6.0 Gb/s Ports 2
# of eSATA Ports 1
RAID Configuration 0,1,5,10
# of PATA Ports 0
# of Parallel Ports 0
Parallel Port via Internal Header No
# of Serial Ports 1
Serial Port via Internal Header Yes
Audio (back channel + front channel) 6,2
Integrated LAN Dual 10/100/1000
Firewire 1,1
S/PDIF Out Connector 1
# of PS2 Ports 0
RELATED PRODUCTS
Intel® Desktop Boards
Intel® Desktop Boards with
Intel® Q77 Express Chipset
QUICK LINKS
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PCN/MDDS Information
918171: PCN
918174: PCN
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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The
information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability,
functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
"Intel classifications" consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and
shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company may be the exporter of record, and as such, your company is responsible for determining the
correct classification of any item at the time of export.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please
contact OEM for the BIOS that includes the latest Processor configuration update.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications
(motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility.
Functionality, performance, and other benefits of this feature may vary depending on system configuration.
The Recommended Customer Price (“RCP”) is pricing guidance for Intel products. Prices are for direct Intel customers and are subject to change without notice. Taxes and shipping, etc. not included.
Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. Listing of these RCP does not constitute a formal pricing offer from Intel. Please
work with your appropriate Intel representative to obtain a formal price quotation.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet
JS-709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.
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Package Specifications
Max CPU Configuration 1
Low Halogen Options Available See MDDS
Advanced Technologies
Intel® vPro Technology ‡Yes
Intel® ME Firmware Version 8.0
Intel® Remote Wake Technology Yes
Intel® Remote PC Assist Technology Yes
TPM Yes
TPM Version 1.2
Intel® HD Audio Technology Yes
Intel® Matrix Storage Technology Yes
Intel® Rapid Storage Technology Yes
Intel® Platform Protection Technology
Anti-Theft Technology Yes
