UPG2164T5N-E2-A - Renesas Electronics

2006, 2008

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DESCRIPTION

The

PG2164T5N is a GaAs MMIC DPDT (Double Pole Double Throw) switch which was developed for 2.4 GHz

and 6 GHz dual-band wireless LAN. This device can operate frequency from 2.4 GHz band and 6 GHz band, having

the low insertion loss and high isolation.

This device is housed in a 6-pin plastic TSON (Thin Small Out-line Non-leaded) package. And this package is able

to high-density surface mounting.

FEATURES

• Operating frequency : f = 2.4 to 2.5 GHz and 4.9 to 6.0 GHz

• Switch control voltage : Vcont (H) = 2.8 to 5.0 V (3.0 V TYP.)

: Vcont (L) = −0.3 to 0.3 V (0 V TYP.)

• Low insertion loss : Lins1 = 0.50 dB TYP. @ f = 2.4 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V

: Lins2 = 0.70 dB TYP. @ f = 4.9 to 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V

• High isolation : ISL1 = 25 dB TYP. @ f = 2.4 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V

: ISL2 = 17 dB TYP. @ f = 4.9 to 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V

• Handling power : Pin (1 dB) = +31.0 dBm TYP. @ f = 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V

: Pin (1 dB) = +29.0 dBm TYP. @ f = 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V

• High-density surface mounting : 6-pin plastic TSON package (1.5 × 1.5 × 0.37 mm)

APPLICATION

• Dual-band wireless LAN (IEEE802.11a + b/g)

ORDERING INFORMATION

Part Number Order Number Package Marking Supplying Form

PG2164T5N-E2

PG2164T5N-E2-A 6-pin plastic TSON

(Pb-Free)

G5B • Embossed tape 8 mm wide

• Pin 1, 6 face the perforation side of the tape

• Qty 3 kpcs/reel

Remark To order evaluation samples, contact your nearby sales office.

Part number for sample order:

PG2164T5N

DATA SHEET

Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.

The information in this document is subject to change without notice. Before using this document, please

confirm that this is the latest version.

Not all products and/or types are available in every country. Please check with an NEC Electronics

sales representative for availability and additional information.

DPDT SWITCH FOR 2.4 GHz AND 6 GHz DUAL-BAND WIRELESS LAN

GaAs INTEGRATED CIRCUIT

PG2164T5N

Document No. PG10636EJ02V0DS (2nd edition)

Date Published February 2008 NS

Printed in Japan

PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM

Pin No. Pin Name

1 ANT2

2 Vcont2

3 OUT2 (RX)

4 OUT1 (TX)

5 Vcont1

(Top View)(Top View)

G5B

(Bottom View)

6 ANT1

Remark Exposed pad : GND

TRUTH TABLE

Vcont1 Vcont2 ANT1−OUT1 (TX) ANT1− OUT2 (RX) ANT2− OUT1 (TX) ANT2−OUT2 (RX)

High Low OFF ON ON OFF

Low High ON OFF OFF ON

ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified)

Parameter Symbol Ratings Unit

Switch Control Voltage Vcont −6.0 to +6.0 V

Input Power Pin +32 dBm

Operating Ambient Temperature TA −45 to +85 °C

Storage Temperature Tstg −55 to +135 °C

RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified)

Parameter Symbol MIN. TYP. MAX. Unit

Switch Control Voltage (H) Vcont (H) 2.8 3.0 5.0 V

Switch Control Voltage (L) Vcont (L) −0.3 0 0.3 V

Operating Frequency 1 f1 2.4 − 2.5 GHz

Operating Frequency 2 f2 4.9 − 6.0 GHz

Data Sheet PG10636EJ02V0DS

PG2164T5N

ELECTRICAL CHARACTERISTICS

(TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, Z0 = 50 Ω, DC blocking capacitors = 4 pF, unless

otherwise specified)

Parameter Symbol Test Conditions MIN. TYP. MAX. Unit

Insertion Loss 1 Lins1 f = 2.4 to 2.5 GHz − 0.50 0.75 dB

Insertion Loss 2 Lins2 f = 4.9 to 6.0 GHz − 0.70 1.00 dB

Isolation 1 (ANT to OUT) ISL1 f = 2.4 to 2.5 GHz 22 25 − dB

Isolation 2 (ANT to OUT) ISL2 f = 4.9 to 6.0 GHz 14 17 − dB

Isolation 3 (ANT1 to ANT2, TX to RX) ISL3 f = 2.4 to 2.5 GHz 22 25 − dB

Isolation 4 (ANT1 to ANT2, TX to RX) ISL4 f = 4.9 to 6.0 GHz 15 17 − dB

Input Return Loss 1 RLin1 f = 2.4 to 2.5 GHz − 15 − dB

Input Return Loss 2 RLin2 f = 4.9 to 6.0 GHz − 15 − dB

Output Return Loss 1 RLout1 f = 2.4 to 2.5 GHz − 15 − dB

Output Return Loss 2 RLout2 f = 4.9 to 6.0 GHz − 15 − dB

1 dB Loss Compression

Input Power 1 Note

Pin (1 dB) 1 f = 2.4 to 2.5 GHz − +31.0 − dBm

1 dB Loss Compression

Input Power 2 Note

Pin (1 dB) 2 f = 4.9 to 6.0 GHz − +29.0 − dBm

Input 3rd Order Intercept Point IIP3 f1 = 2 500 MHz, f2 = 2 501 MHz,

Pin (1 tone) = +20 dBm

− +50 − dBm

Switch Control Current Icont − 0.1 1.0

Switch Control Speed tSW 50% CTL to 90/10% − 50 − ns

Note P

in (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear

range.

Caution This device is used it is necessary to use DC blocking capacitors.

Data Sheet PG10636EJ02V0DS 3

PG2164T5N

EVALUATION CIRCUIT

Vcont2

OUT1 (TX)

OUT2 (RX)

Vcont1

1 000 pF

ANT1

1 000 pF

4 pF

ANT2

4 pF

The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.

Data Sheet PG10636EJ02V0DS

PG2164T5N

MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS

6-PIN PLASTIC TSON (UNIT: mm)

0.3 0.5 0.3

0.2

0.3

0.5

MOUNTING PAD

0.3

1.0

SOLDER MASK

0.475 0.25 0.475

0.15

0.25

0.5

0.35

0.55

Solder thickness : 0.08 mm

Remark The mounting pad and solder mask layouts in this document are for reference only.

Data Sheet PG10636EJ02V0DS 5

PG2164T5N

PACKAGE DIMENSIONS

6-PIN PLASTIC TSON (UNIT: mm)

0.5±0.06

0.2±0.1 0.7±0.1

(Bottom View)

(Top View)

1.5±0.1

0.37+0.03

–0.05

0.2+0.07

–0.05

0.3±0.07

(Side View)

1.2±0.1

<R>

Data Sheet PG10636EJ02V0DS

PG2164T5N

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered and mounted under the following recommended conditions. For soldering

methods and conditions other than those recommended below, contact your nearby sales office.

Soldering Method Soldering Conditions Condition Symbol

Infrared Reflow Peak temperature (package surface temperature) : 260°C or below

Time at peak temperature : 10 seconds or less

Time at temperature of 220°C or higher : 60 seconds or less

Preheating time at 120 to 180°C : 120±30 seconds

Maximum number of reflow processes : 3 times

Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below

IR260

Wave Soldering Peak temperature (molten solder temperature) : 260°C or below

Time at peak temperature : 10 seconds or less

Preheating temperature (package surface temperature) : 120°C or below

Maximum number of flow processes : 1 time

Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below

WS260

Partial Heating Peak temperature (terminal temperature) : 350°C or below

Soldering time (per side of device) : 3 seconds or less

Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below

HS350

Caution Do not use different soldering methods together (except for partial heating).

Data Sheet PG10636EJ02V0DS 7

PG2164T5N

The information in this document is current as of February, 2008. The information is subject to

change without notice. For actual design-in, refer to the latest publications of NEC Electronics data

sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not

all products and/or types are available in every country. Please check with an NEC Electronics sales

representative for availability and additional information.

No part of this document may be copied or reproduced in any form or by any means without the prior

written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may

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NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual

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or any other liability arising from the use of such products. No license, express, implied or otherwise, is

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purposes in semiconductor product operation and application examples. The incorporation of these

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(Note)

•

M8E 02. 11-1

(1)

(2)

"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its

majority-owned subsidiaries.

"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as

defined above).

Computers, office equipment, communications equipment, test and measurement equipment, audio

and visual equipment, home electronic appliances, machine tools, personal electronic equipment

and industrial robots.

Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster

systems, anti-crime systems, safety equipment and medical equipment (not specifically designed

for life support).

Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life

support systems and medical equipment for life support, etc.

"Standard":

"Special":

"Specific":

Data Sheet PG10636EJ02V0DS

PG2164T5N

Caution GaAs Products This product uses gallium arsenide (GaAs).

GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe

the following points.

• Follow related laws and ordinances when disposing of the product. If there are no applicable laws

and/or ordinances, dispose of the product as recommended below.

1. Commission a disposal company able to (with a license to) collect, transport and dispose of

materials that contain arsenic and other such industrial waste materials.

2. Exclude the product from general industrial waste and household garbage, and ensure that the

product is controlled (as industrial waste subject to special control) up until final disposal.

• Do not burn, destroy, cut, crush, or chemically dissolve the product.

• Do not lick the product or in any way allow it to enter the mouth.

PG2164T5N

To our customers,

Old Company Name in Catalogs and Other Documents

On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology

Corporation, and Renesas Electronics Corporation took over all the business of both

companies. Therefore, although the old company name remains in this document, it is a valid

Renesas Electronics document. We appreciate your understanding.

Renesas Electronics website: http://www.renesas.com

April 1st, 2010

Renesas Electronics Corporation

Issued by: Renesas Electronics Corporation (http://www.renesas.com)

Send any inquiries to http://www.renesas.com/inquiry.

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