DATA SHEET GaAs INTEGRATED CIRCUIT PG2164T5N DPDT SWITCH FOR 2.4 GHz AND 6 GHz DUAL-BAND WIRELESS LAN DESCRIPTION The PG2164T5N is a GaAs MMIC DPDT (Double Pole Double Throw) switch which was developed for 2.4 GHz and 6 GHz dual-band wireless LAN. This device can operate frequency from 2.4 GHz band and 6 GHz band, having the low insertion loss and high isolation. This device is housed in a 6-pin plastic TSON (Thin Small Out-line Non-leaded) package. And this package is able to high-density surface mounting. FEATURES * Operating frequency * Switch control voltage : f = 2.4 to 2.5 GHz and 4.9 to 6.0 GHz : Vcont (H) = 2.8 to 5.0 V (3.0 V TYP.) : Vcont (L) = -0.3 to 0.3 V (0 V TYP.) * Low insertion loss : Lins1 = 0.50 dB TYP. @ f = 2.4 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Lins2 = 0.70 dB TYP. @ f = 4.9 to 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V * High isolation : ISL1 = 25 dB TYP. @ f = 2.4 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : ISL2 = 17 dB TYP. @ f = 4.9 to 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V * Handling power : Pin (1 dB) = +31.0 dBm TYP. @ f = 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Pin (1 dB) = +29.0 dBm TYP. @ f = 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V * High-density surface mounting : 6-pin plastic TSON package (1.5 x 1.5 x 0.37 mm) APPLICATION * Dual-band wireless LAN (IEEE802.11a + b/g) ORDERING INFORMATION Part Number Order Number PG2164T5N-E2 PG2164T5N-E2-A Package 6-pin plastic TSON (Pb-Free) Marking G5B Supplying Form * Embossed tape 8 mm wide * Pin 1, 6 face the perforation side of the tape * Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: PG2164T5N Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PG10636EJ02V0DS (2nd edition) Date Published February 2008 NS Printed in Japan The mark <R> shows major revised points. The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field. 2006, 2008 PG2164T5N PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) G5B 1 2 3 (Bottom View) (Top View) 6 1 6 6 1 5 2 5 5 2 4 3 4 Pin No. Pin Name 1 ANT2 2 Vcont2 3 OUT2 (RX) 4 OUT1 (TX) 5 Vcont1 6 ANT1 3 4 Remark Exposed pad : GND TRUTH TABLE Vcont1 Vcont2 ANT1-OUT1 (TX) ANT1- OUT2 (RX) ANT2- OUT1 (TX) ANT2-OUT2 (RX) High Low OFF ON ON OFF Low High ON OFF OFF ON ABSOLUTE MAXIMUM RATINGS (TA = +25C, unless otherwise specified) Parameter Symbol Ratings Unit Vcont -6.0 to +6.0 V Input Power Pin +32 dBm Operating Ambient Temperature TA -45 to +85 C Storage Temperature Tstg -55 to +135 C Switch Control Voltage RECOMMENDED OPERATING RANGE (TA = +25C, unless otherwise specified) Parameter Symbol MIN. TYP. MAX. Unit Switch Control Voltage (H) Vcont (H) 2.8 3.0 5.0 V Switch Control Voltage (L) Vcont (L) -0.3 0 0.3 V Operating Frequency 1 f1 2.4 - 2.5 GHz Operating Frequency 2 f2 4.9 - 6.0 GHz 2 Data Sheet PG10636EJ02V0DS PG2164T5N ELECTRICAL CHARACTERISTICS (TA = +25C, Vcont (H) = 3.0 V, Vcont otherwise specified) Parameter Symbol (L) = 0 V, Z0 = 50 , DC blocking capacitors = 4 pF, unless Test Conditions MIN. TYP. MAX. Unit Insertion Loss 1 Lins1 f = 2.4 to 2.5 GHz - 0.50 0.75 dB Insertion Loss 2 Lins2 f = 4.9 to 6.0 GHz - 0.70 1.00 dB Isolation 1 (ANT to OUT) ISL1 f = 2.4 to 2.5 GHz 22 25 - dB Isolation 2 (ANT to OUT) ISL2 f = 4.9 to 6.0 GHz 14 17 - dB Isolation 3 (ANT1 to ANT2, TX to RX) ISL3 f = 2.4 to 2.5 GHz 22 25 - dB Isolation 4 (ANT1 to ANT2, TX to RX) ISL4 f = 4.9 to 6.0 GHz 15 17 - dB Input Return Loss 1 RLin1 f = 2.4 to 2.5 GHz - 15 - dB Input Return Loss 2 RLin2 f = 4.9 to 6.0 GHz - 15 - dB Output Return Loss 1 RLout1 f = 2.4 to 2.5 GHz - 15 - dB Output Return Loss 2 RLout2 f = 4.9 to 6.0 GHz - 15 - dB 1 dB Loss Compression Note Input Power 1 Pin (1 dB) 1 f = 2.4 to 2.5 GHz - +31.0 - dBm 1 dB Loss Compression Note Input Power 2 Pin (1 dB) 2 f = 4.9 to 6.0 GHz - +29.0 - dBm - +50 - dBm - 0.1 1.0 A - 50 - ns Input 3rd Order Intercept Point IIP3 f1 = 2 500 MHz, f2 = 2 501 MHz, Pin (1 tone) = +20 dBm Switch Control Current Icont Switch Control Speed tSW Note Pin (1 dB) 50% CTL to 90/10% is measured the input power level when the insertion loss increases more 1 dB than that of linear range. Caution This device is used it is necessary to use DC blocking capacitors. Data Sheet PG10636EJ02V0DS 3 PG2164T5N EVALUATION CIRCUIT 4 pF ANT2 Vcont2 4 pF 1 6 2 5 1 000 pF Vcont1 1 000 pF 4 3 OUT2 (RX) ANT1 OUT1 (TX) 4 pF 4 pF The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4 Data Sheet PG10636EJ02V0DS PG2164T5N MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS 6-PIN PLASTIC TSON (UNIT: mm) MOUNTING PAD 0.3 0.2 0.5 1.0 0.5 0.3 0.5 0.3 0.3 SOLDER MASK 0.475 0.15 0.5 0.55 0.5 0.25 0.35 0.475 0.25 Solder thickness : 0.08 mm Remark The mounting pad and solder mask layouts in this document are for reference only. Data Sheet PG10636EJ02V0DS 5 PG2164T5N PACKAGE DIMENSIONS 6-PIN PLASTIC TSON (UNIT: mm) (Bottom View) (Side View) 0.30.07 0.50.06 1.50.1 0.2+0.07 -0.05 1.20.1 (Top View) 1.50.1 <R> 0.37+0.03 -0.05 6 0.20.1 Data Sheet PG10636EJ02V0DS 0.70.1 PG2164T5N RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Wave Soldering Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260C or below Time at peak temperature : 10 seconds or less Time at temperature of 220C or higher : 60 seconds or less Preheating time at 120 to 180C : 12030 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260C or below Time at peak temperature : 10 seconds or less IR260 WS260 Preheating temperature (package surface temperature) : 120C or below Partial Heating Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10636EJ02V0DS 7 PG2164T5N * The information in this document is current as of February, 2008. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. 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