UPG2027TQ
NEC's L-BAND 4W
HIGH POWER SPDT SWITCH IC
California Eastern Laboratories
LOW INSERTION LOSS:
0.40 dB TYP. @ 1.0 GHz
0.50 dB TYP. @ 2.0 GHz
HIGH LINEARITY:
2f0, 3f0 = 70 dBc TYP. @ 1.0 GHz, Pin = +35 dBm
2f0, 3f0 = 70 dBc TYP. @ 2.0 GHz, Pin = +33 dBm
HIGH-DENSITY SURFACE MOUNTING:
10-pin plastic TSON package (2.30 × 2.55 × 0.60 mm)
Pb FREE
FEATURES
DATA SHEET
ORDERING INFORMATION
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: UPG2027TQ-A
NEC's UPG2027TQ is a high power SPDT GaAs Switch IC
for digital cellular and cordless telephone applications. This
device can operate from 500 MHz to above 2.0 GHz, with low
insertion loss and high linearity.
DESCRIPTION
GSM Triple / Quad Band Cellular
Cordless Phones
Short Range Wireless
APPLICATIONS
PART NUMBER PACKAGE MARKING SUPPLYING FORM
UPG2027TQ-E1-A 10-pin plastic TSON 2027 Embossed tape 8 mm wide
Pins 5, 6 face the perforation side of the tape
Qty 3 kpcs/reel
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UPG2027TQ
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
ABSOLUTE MAXIMUM RATINGS (TA =+25ºC, unless otherwise specified)
PARAMETER SYMBOL RATINGS UNIT
Control Voltage Vcont +8.0 V
Input Power Pin +38 dBm
Operating Ambient Temperature TA45 to +85 °C
Storage Temperature Tstg 55 to +150 °C
2027
10 9 8 7 6
12345
(Top View)
6 7 8 9 10
54321
(Bottom View)
NC
PIN NO. PIN NAME
1 Vcont2
2 NC (GND)
3 Common
4 NC (GND)
5 Vcont1
6 RF1
7 NC (GND)
8 NC (GND)
9 NC (GND)
10 RF2
PARAMETER SYMBOL MIN. TYP. MAX. UNIT
Control Voltage (High) Vcont (H) +2.5 +2.7 +5.0 V
Control Voltage (Low) Vcont (L) 0 0 +0.2 V
RECOMMENDED OPERATING RANGE (TA =+25ºC)
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UPG2027TQ
ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont = +2.5 V/0 V, ZO = 50 Ω, DC blocking capacitors value: 56 pF,
Each port, unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Insertion Loss LINS f = 0.5 to 1.0 GHz 0.40 0.65 dB
f = 1.0 to 2.0 GHz 0.50 0.75 dB
Isolation ISL f = 0.5 to 1.0 GHz 23 25 dB
f = 1.0 to 2.0 GHz 17 18.5 dB
2nd Harmonics 2f0 f = 1.0 GHz, Pin = +35 dBm 65 70 dBc
f = 2.0 GHz, Pin = +33 dBm 65 70 dBc
3rd Harmonics 3f0 f = 1.0 GHz, Pin = +35 dBm 65 70 dBc
f = 2.0 GHz, Pin = +33 dBm 65 70 dBc
Switching Speed tsw 1 5 μs
Control Current Icont No RF 50 μA
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UPG2027TQ
EVALUATION CIRCUIT
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
2027
RF2
C1
RF1
C1
Common
C1
C2
C2
Vcont1
Vcont2
Off chip DC blocking capacitors value C1 = 56 pF, C2 = 1 000 pF (Bypass), using NEC standard evaluation board.
TRUTH TABLE
RF2
NC (GND)
NC (GND)
NC (GND)
RF1
Vcont2
NC (GND)
Common
NC (GND)
Vcont1
VCONT1 VCONT2 COMMON-RF1 COMMON-RF2
High Low ON OFF
Low High OFF ON
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UPG2027TQ
PACKAGE DIMENSIONS
10-PIN PLASTIC TSON (UNIT:mm)
(Bottom View)
(0.15)
(1.70) (0.30)
(0.95) (0.05)
(1.95) (0.30)
0.40±0.05
2.25±0.1
2.55±0.15
0.18±0.05
2.20±0.1
2.30±0.15
(0.125)
(0.60 MAX.)
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UPG2027TQ
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method Soldering Conditions Condition Symbol
Infrared Reflow Peak temperature (package surface temperature) : 260°C or below
Time at peak temperature : 10 seconds or less
Time at temperature of 220°C or higher : 60 seconds or less
Preheating time at 120 to 180°C : 120±30 seconds
Maximum number of reflow processes : 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
IR260
VPS Peak temperature (package surface temperature) : 215°C or below
Time at temperature of 200°C or higher : 25 to 40 seconds
Preheating time at 120 to 150°C : 30 to 60 seconds
Maximum number of reflow processes : 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
VP215
Wave Soldering Peak temperature (molten solder temperature) : 260°C or below
Time at peak temperature : 10 seconds or less
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes : 1 time
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
WS260
Partial Heating Peak temperature (pin temperature) : 350°C or below
Soldering time (per side of device) : 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
11/12/2004
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