RJ80536GE0362M - Intel Corporation

Intel® Pentium® M Processor with

2-MB L2 Cache and 533-MHz

Front Side Bus

Datasheet

July 2005

Reference Number: 305262-002

2 Datasheet

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Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “re served” or “undefined.” Intel reserves these for

future definition and shall have no resp onsibility whatsoever for conflicts or incompatibilities arising from f uture changes to them.

The Intel® Pentium® M Processor with 2-MB L2 cache and 533-MHz Front Side Bus may cont ain design defect s or errors known as errat a which may

cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain th e latest specifications and before placing your product order.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across

different processor families. See www.intel.com/products/pr ocessor_number for details

Intel, Pentium, and Intel SpeedStep, MMX and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the

United States and other countries.

*Other names and brands may be claimed as the property of othe rs.

Datasheet 3

Contents

1 Introduction....................................................................................................................................7

1.1 Terminology..................................................................................................................................8

1.2 References ...................................................................................................................................9

2 Low Power Features....................................................................................................................11

2.1 Clock Control and Low Power States.........................................................................................11

2.1.1 Normal State..................................................................................................................11

2.1.2 AutoHALT Powerdown State.........................................................................................11

2.1.3 Stop-Grant State............................................................................................................12

2.1.4 HALT/Grant Snoop State...............................................................................................12

2.1.5 Sleep State ....................................................................................................................12

2.1.6 Deep Sleep State . ... ................ ... ... .... ... ... ................ .... ... ... ... ... ................. ... ... ... ... .... ......13

2.1.7 Deeper Sleep State ................ ... ... .... ... ... ... .... ... ................ ... ... .... ... ... ... .... ... ................ ...13

2.2 Enhanced Intel SpeedStep® Technology............ ... .... ... ... ................ ... ................. ... ... ................14

2.3 FSB Low Power Enhancements.................................................................................................15

2.4 Processor Power Status Indicator (PSI#) Signal........................................................................15

3 Electrical Specifications .............................................................................................................17

3.1 Power and Ground Pins .... ... ... ... .... ... ... ................ ... .... ... ................ ... ... .... ................ ... ... ... ..........17

3.2 FSB Clock (BCLK[1:0]) and Processor Clocking........................................................................17

3.3 Voltage Identification ..................................................................................................................17

3.4 Catastrophic Thermal Protection................................................................................................18

3.5 Signal Terminations and Unused Pins........................................................................................19

3.6 FSB Frequency Select Signals (BSEL[1:0]) ...............................................................................19

3.7 FSB Signal Groups.....................................................................................................................19

3.8 CMOS Signals............................................................................................................................20

3.9 Maximum Ratings.......................................................................................................................21

3.10 Processor DC Specifications......................................................................................................21

4 Package Mechanical Specifications and Pin Information .......................................................27

4.1 Processor Pinout and Pin List.....................................................................................................35

4.2 Alphabetical Signals Reference..................................................................................................51

5 Thermal Specifications and Design Considerations................................................................59

5.1 Thermal Specifications ...............................................................................................................61

5.1.1 Thermal Diode...............................................................................................................61

5.1.2 Thermal Diode Offset.....................................................................................................61

5.1.3 Intel® Thermal Monitor.. .... ... ... ... ... .... ... ................ ... .... ... ................ ... ... .... ................ ... ...62

4 Datasheet

Figures

2-1 Clock Control States......................... ... ... ... ... .... ... ... ... .... ... ... ... ................ .... ... ... ... .... ................11

3-1 Active VCC and ICC Load Line...............................................................................................23

3-2 Deep Sleep VCC and ICC Load Line......................................................................................24

4-1 Micro-FCPGA Package Top and Bottom Isometric Views ............... ... ... .... ... ... ... .... ... ... ... ... ....27

4-2 Micro-FCPGA Package - Top and Side Views........................................................................28

4-3 Micro-FCPGA Package - Bottom View....................................................................................29

4-4 Micro-FCBGA Package Top and Bottom Isometric View ........................... ... ... ... .... ... ... ... ... ....31

4-5 Micro-FCBGA Package Top and Side Views ..........................................................................32

4-6 Micro-FCBGA Package Bottom View......................................................................................34

4-7 The Coordinates of the Processor Pins As Viewed from the Top of the Package ..................35

Tables

1-1 References ................................................................................................................................9

3-1 Voltage Identification Definition...............................................................................................18

3-2 BSEL[1:0] Encoding for BCLK Frequency...............................................................................19

3-3 FSB Pin Groups.......................................................................................................................20

3-4 Processor DC Absolute Maximum Ratings .............................................................................21

3-5 Voltage and Current Specifications .........................................................................................22

3-6 FSB Differential BCLK Specifications......................................................................................24

3-7 AGTL+ Signal Group DC Specifications..................................................................................25

3-8 CMOS Signal Group DC Specifications ..................................................................................25

3-9 Open Drain Signal Group DC Specifications...........................................................................26

4-1 Micro-FCPGA Package Dimensions .......................................................................................30

4-2 Micro-FCBGA Package Dimensions .......................................................................................33

4-3 Pin Listing by Pin Name ......... ... ... .... ... ... .................................................................................37

4-4 Pin Listing by Pin Number...................... ... ..............................................................................43

4-5 Signal Description....................................................................................................................51

5-1 Power Specifications for Intel® Pentium® M Processor.......... .... ... ... ... ... .... ... ... ... .... ... .............60

5-2 Thermal Diode Interface..........................................................................................................61

5-3 Thermal Diode Specifications..................................................................................................62

Datasheet 5

Revision History

Revision Description Date

001 Initial release January 2005

002 Added Intel® Pentium® M Processor 780 specifications July 2005

6 Datasheet

Datasheet 7

Introduction

1Introduction

The Intel® Pentium® M Processor with 533-MHz front side bus (FSB) is the next generation high-

performance, low-power mobile processor based on the Pentium M Processor architecture.

All instances of the Pentium M Processor in this document refer to the Pentium M Processor with

2-MB L2 cache and 533-MHz front side bus unless stated otherwise.

This document contains specifications for the Pentium M Processor 780, 770, 760, 750, 740, 730.

Note: Intel processor numbers are not a measure of performance. Processor numbers differentiate

features within each processor family, not across different processor families. See www.intel.com/

products/processor_numb er for detail s.

The following list provides some of the key featu res on this processor:

•Supports Intel Architecture with Dynamic Execution

•On-die, primary 32-KB instruction cache and 32-KB write-back data cache

•On-die, 2 MB second level cache with Advanced Transfer Cache Architecture

•Data Prefetch Logic

•Streaming SIMD Extensions 2 (SSE2)

•533-MHz, Source-Synchronous FSB

•Advanced Power Management features including Enhanced Intel SpeedStep® Technology

•Micro-FCPGA and Micro-FCBGA packaging technologies, including Lead Free SLI (Second

Level Interconnect) technology for the Micro-FCBGA package (for Pentium M Processors

780, 770, 760, 750, 740, 730).

•Execute Disable Bit Support for enhan c ed security.

The Pentium M Processor will be manufactured on Intel’s advanced 90 nanometer pro cess

technology with copper interconnect. The processor maintains support for MMX™ technology and

Internet Streaming SIMD instructions and full compatibility with IA-32 software. The on-die,

32-KB Level 1 instruction and data caches along with the 2 MB Level 2 cache with advanced

transfer cache architecture enable significant performance improvement over existing mobile

processors. The processor’s data prefetch logic fetches data to the L2 cache before L1 cache

requests occurs, resulting in reduced bus cycle penalties and im proved performance.

The streaming SIMD extensions 2 (SSE2) enable break-through levels of performance in

multimedia applications including 3-D graphics, video decoding/encoding, and speech recognition.

The new packed double-precision floating-point instructions enhance performance for applications

that require greater range and precision, including scientific and engineering applications and

advanced 3-D geometry techniques, such as ray tracing.

The Pentium M Processor’ s 533-MHz FSB utilizes a split-transaction, de ferred reply protocol. The

533-MHz FSB uses source-synchronous transfer (SST) of address and data to improve

performance by transferring data four times per bus clock (4X data transfer rate, as in AGP 4X).

Along with the 4X data bus, the address bus can deliver addresses two times per bus clock and is

referred to as a “double-clocked” or 2X address bus. Working together, the 4X data bus and 2X

8 Datasheet

Introduction

address bus provide a data bus bandwidth of up to 4.3 GB/second. The FSB uses Advanced

Gunning Transceiver Logic (AGTL+) signaling technology, a variant of GTL+ signaling

technology with low power enhancements.

The processor features Enhanced Intel SpeedStep Technology, which enables real-time dynamic

switching between mu lt iple voltage and frequ en c y po ints. This results in op timal performan ce

without compromising low power. The processor features the Auto Halt, Stop Grant, Deep Sleep,

and Deeper Sleep low power states.

The Pentium M Processor utilizes socketable Micro Flip-Chip Pin Grid Array (Micro-FCPGA) and

surface mount Micro Flip-Chip Ball Grid Array (Micro-FCBGA) package technology. The Micro-

FCPGA package plugs into a 479-hole, surface-mount, zero insertion force (ZIF) socket, which is

referred to as the mPGA479M socket.

Pentium M Processors with CPU Si gnature = 06D8h wil l al so include the Execute Disable Bit

capability. This feature combined with a support operating system allows memory to be marked as

executable or non executable. If code attempts to ru n in non-executable memory th e processor

raises an error to the operating system. This feature can prevent some classes of viruses or worms

that exploit buffer overrun vulnerabilities and can thus help improve the overall security of the

system. See the Intel® Architecture Software Developer's Manual for more detailed information.

Intel will validate this feature only on Intel® 915 Express chipset family-based platforms and

recommends customers implement BIOS changes related to this feature, only on Intel 915 Express

chipset family-based platforms.

Note: The term AGTL+ is used to refer to Assisted GTL+ signalling technology on some Intel processors.

1.1 Terminology

Term Definition

# A “#” symbol after a signal name refers to an active low signal, indicating a signal is in

the active state when driven to a low level. For example, when RESET# is low, a reset

has been requested. Conversely, when NMI is high, a nonmaskable interrupt has

occurred. In the case of signals where the name does not imply an active state but

describes part of a binary sequence (such as address or data), the “#” symbol implies

that the signal is inverted. For example, D[3:0] = “HLHL” refers to a hex ‘A’, and

D[3:0]# = “LHLH” also refers to a hex “A” (H= High logic level, L= Low logic level).

XXXX means that the specification or value is yet to be determined.

Front Side Bus

(FSB) Refers to the interface between the processor and system core logic (also known as

the chipset components).

Datasheet 9

Introduction

1.2 References

Material and concepts available in the following documents may be beneficial when reading this

document. Chipset references in this document are to Intel 915 Express chipset family unless

specified otherwise.

Note: All instances of the Pentium M Processor in this document refer to the Pentium M Processor with

2-MB L2 cache and 533-MHz Front Side Bus unless stated otherwise.

NOTE: Contact your Intel representative for the latest revision and order number of this document.

Table 1-1. References

Document Document Number/Location1

Mobile Intel 915PM/GM/GMS and 910GML Express Chipset

Datasheet http://www.intel.com/design/

mobile/datashts/305264.htm

Mobile Intel 915PM/GM/GMS and 910GML Express Chipset

Specification Update http://www.intel.com/design/

mobile/specupdt/307167.htm

Intel® I/O Controller Hub 6 (ICH6) Family Datasheet http://www.intel.com/design/

chipsets/datashts/301473.htm

Intel® I/O Controller Hub 6 (ICH6) Family Specification Update http://www.intel.com/design/

chipsets/specupdt/301474.htm

Intel® Pentium M Processor on 90nm Process with 2-MB L2

Cache Specification Update http://www.intel.com/design/

mobile/datashts/302189.htm

IA-32 Intel Architecture Software Developer's Manual http://www.intel.com/design/

pentium4/manuals/

index_new.htm

Volume 1: Basic Architecture

Volume 2A: Instruction Set Reference

Volume 2B: Instruction Set Reference

10 Datasheet

Introduction

Datasheet 11

Low Power Features

2Low Power Features

2.1 Clock Control and Low Power States

The Pentium M Processor suppo rt s th e AutoHALT, Stop Grant, Sleep, Deep Sleep, and Deeper

Sleep states for optimal power management. See Figure 2-1 for a visual representation of the

processor low-power states.

2.1.1 Normal State

This is the normal operating state for the processor.

2.1.2 AutoHALT Powerdown State

AutoHALT is a low-power state entered when the processor executes the HALT instruction. The

processor will tr an sition to the Normal state upon the occurrence of SMI#, INIT#, LINT[1:0]

(NMI, INTR), or FSB interr upt me ssag e. RESET# will cause the processor to immediately

initialize itself.

A system management interrupt (SMI) handler will return execution to either Normal state or the

AutoHALT Powerdown state. See the Intel Architecture Softwar e Developer's Manual, Volume III:

System Programmer's guide for more information.

The system can generate a STPCLK# while the processor is in the AutoHALT Powerd own state.

When the system deasserts the STPCLK# interrupt, the processor will return executio n to the

HALT state.

While in AutoHALT Powerdown state, the processor will process bus snoops and interrupts.

Figure 2-1. Clock Control States

snoop

occurs

Stop

Grant

Normal Sleep

HALT/

Grant

Snoop

Au to Hal t Deep

Sleep

STP C LK # a sse rted SLP# as serted

SLP# de-asserted

STP CLK # de-as serted

snoop

serviced

HLT

instruction

snoop

serviced snoop

occurs

DPSLP#

de-asserted DPSLP#

asserted

STPCLK#

asserted

STPCLK#

de-asserted

halt

break

V0001-04

core voltage raised

core vo lta ge lo we red

Halt break - A20M#, INIT#, INTR, NMI, PREQ #, R ES ET #, SMI#, or AP IC interrupt

Deeper

Sleep

12 Datasheet

Low Power Features

2.1.3 Stop-Grant State

When the STPCLK# pin is asserted, the Stop-Grant state of the processor is entered 20 bus clocks

after the response phase of the processor- issued Stop Grant Acknowledge special bus cycle.

Since the AGTL+ signal pins receive power from the FSB, these pins should not be driven

(allowing the level to return to VCCP) for minimum power drawn by the termination resistors in this

state. In addition, all other input pins on the FSB should be driven to the inactive state.

RESET# will cause the processor to immediately initialize itself, but the processor will stay in

Stop-Grant state. A transition back to the Normal state will occur with the de-assertion of the

STPCLK# signal. When re-entering the Stop-Grant state from the Sleep state, STPCLK# should be

deasserted ten or more bus clocks after the de-assertion of SLP#.

A transition to the HALT/Grant Snoop state will occur when the processor detects a snoop on the

FSB (see Section 2.1.4). A transition to the Sleep state (see Section 2.1.5) will occur with the

assertion of the SLP# signal.

While in the Stop-Grant State, SMI#, INIT# and LINT[1:0] will be latched by the processor, and

only serviced when the processor returns to the Normal State. Only one occurrence of each event

will be recognized upon return to the Normal state.

While in Stop-Grant state, the processor will process snoops on the FSB and it will latch interrupts

delivered on the FSB.

The PBE# signal can be driven when the processor is in St op-Grant st ate. PBE# will be asserted if

there is any pending interrupt latched within the processor. Pending interrupts that are blo cked by

the EFLAGS.IF bit being clear will still cause assertion of PBE#. Assertion of PBE# indicates to

system logic that it should return the processor to the Normal state.

2.1.4 HALT/Grant Snoop State

The processor will respond to snoop or interrupt transactions on the FSB while in Stop-Grant state

or in AutoHALT Power Down state. Durin g a snoop or interrup t transaction, the processor enters

the HALT/Grant Snoop state. The processor will stay in this state unt il the snoop on the FSB has

been serviced (whether by the processor or another agent on the FSB) or the interrupt has been

latched. After the snoop is serviced or the interrupt is latched, the processor will return to the Stop-

Grant state or AutoHALT Power Down state, as appropriate.

2.1.5 Sleep State

The Sleep state is a low power state in which the processor maintains its context, maintains the

phase-locked loop (PLL), and has stopped all in ternal clocks. The Sleep state can only be entered

from Stop-Grant state. Once in the Stop-Grant state, the processor will enter the Sleep state upon

the assertion of the SLP# signal. The SLP# pin should only be asserted when the processor is in the

Stop Grant state. SLP# assertions while the processor is not in the Stop-Grant state is out of

specification and may result in unappro ved operation.

Snoop events that occur while in Sleep State or during a transition into or out of Sleep state will

cause unpredictable behavior.

Datasheet 13

Low Power Features

In the Sleep state, the processor is incapable of responding to snoop transactions or latching

interrupt signals. No transitions or assertions of signals (with the exception of SLP#, DPSLP# or

RESET#) are allowed on the FSB while the processor is in Sleep state. Any transition on an input

signal before the processor has returned to Stop-Grant state will result in unpredictable behavior.

If RESET# is driven active while the processor is in the Sleep state, and held active as specified in

the RESET# pin specification, then the processor will reset itself, ignoring the transition through

Stop-Grant State. If RESET# is driven active while the processor is in the Sleep State, the SLP#

and STPCLK# signals should be deasserted immedi ately after RESET# is asserted to ensure the

processor correctly executes the Reset sequence.

While in the Sleep state, the processor is capable of entering an even lower power state, the Deep

Sleep state by asserting the DPSLP# pin. (See Section 2.1.6.) While the processor is in the Sleep

state, the SLP# pin must be deasserted if another asynchronous FSB event needs to occur .

2.1.6 Deep Sleep State

Deep Sleep state is a very low power state the processor can enter while maintaining context. Deep

Sleep state is entered by asserting the DPSLP# pin while in the Sleep state. BCLK may be stopped

during the Deep Sleep state for additional platform level power savings. BCLK stop/restart timings

on Intel® 915PM/GM and Intel® 915GMS/ICH6-M Express chipset-based platforms with the

CK410/CK410M clock chip are as follows:

•Deep Sleep entry - DPSLP# and CPU_STP# are asserted simultaneously. CK410/CK410M

will stop/tristate BCLK within 2 BCLKs +/- a few nanoseconds.

•Deep Sleep exit - DPSLP# and CPU_STP# are deasserted simultaneously. CK410/CK410M

will drive BCLK to differential DC levels within 2 ~3 ns and starts toggling BCLK 2~6 BCLK

periods later.

To re-enter the Sleep state, the DPSLP# pin must be deasserted. BCLK can be re-started after

DPSLP# de-assertion as described above. A period of 30 microseconds (to allo w for PLL

stabilization) must occur before the processor can be considered to be in the Sleep state. Once in

the Sleep state, the SLP# pin must be deasserted to re-enter the Stop-Grant state.

While in Deep Sleep state, the processor is incapable of responding to snoop transactions or

latching interrupt signals. No transitions of signals are allowed on the FSB while the processor is in

Deep Sleep state. Any transition on an input signal before the processor has returned to S top-Grant

state will result in unpredictable behavior.

When the processor is in Deep Sleep state, it will not respond to interrupts or snoop transactions.

2.1.7 Deeper Sleep State

The Deeper Sleep State is the lowest state power the processor can enter. This state is functionally

identical to the Deep Sleep state but at a lower core voltage. The control signals to the voltage

regulator to initiate a transition to the Deeper Sleep state are provided on the platform.

14 Datasheet

Low Power Features

2.2 Enhanced Intel SpeedStep® Technology

The Pentium M Processor features Enhanced Intel SpeedStep Technology. Unlike previous

implementations of Intel Sp eedStep Technology, this technology enables the processor to switch

between multiple frequency and voltage points instead of two. This will enable superior

performance with optimal power savings. Switching between states is softw a re cont rolled unlike

previous implementations where the GHI# pin is used to toggl e between two states.

Following are the key features of Enhanced Intel SpeedStep Technology:

•Multiple voltage/frequency operating points provide optimal performance at the lowest power .

•Voltage/Frequency selection is software controlled by writing to processor MSR’ s (Model

Specific Registers) thus eliminating chipset dependency.

— If the target frequency is higher than the current frequency, Vcc is ramped up by placing a

new value on the VID pins and the PLL then locks to the new frequency.

— If the target frequency is lower than the current frequency, the PLL locks to the new

frequency and the Vcc is changed through the VID pin mech anism .

— Software transitions are accepted at any time. If a previous transition is in progress, the

new transition is deferred until its completion.

•The processor controls voltage ramp rates internally to ensure glitch free transitions.

•Low transition latency and large number of transitions possible per second.

— Processor core (including L2 cache) is unavailable for up to 10 s during the frequency

transition

— The bus protocol (BNR# mechanism) is used to block snooping

•No bus master arbiter disable required prior to transition and no processor cache flush

necessary.

•Improved Intel® Thermal Monitor mode.

— When the on-die therm a l sensor indicates that the die temperature is too high, the

processor can automatically perform a transition to a lower frequency/voltage specified in

a software programmable MSR.

— The processor waits for a fixed time period. If the die temperature is down to acceptable

levels, an up transi ti o n to th e pr evious frequency/voltage point occurs.

— An interrupt is generated for the up and down In tel Thermal Monitor transitions enabling

better system level thermal managemen t.

Datasheet 15

Low Power Features

2.3 FSB Low Power Enhancements

The Pentium M Processor incorporates the following FSB low power enhancements:

•Dynamic FSB Power Down

•BPRI# control for address and control input buffers

•Dynamic On Die Termination disabling

•Low VCCP (I/O termination voltage)

The Pentium M Processor incorporates the DPWR# signal that controls the data bus input buffers

on the processor. The DPWR# signal disables the buffers when not used and activates them only

when data bus activity occurs, resulting in signi ficant power savings with no performance impact.

BPRI# control also allows the processor address and control input buffers to be turned off when the

BPRI# signal is inactive. The On Die Termination on the processor FSB buffers is disabled when

the signals are driven low, resulting in additional power savings. The low I/O termination voltage is

on a dedicated voltage plane independent of the core voltage, enabling low

I/O switching power at all times.

2.4 Processor Power Status Indicator (PSI#) Signal

The Pentium M Processor incorporates the PSI# signal that is asserted when the processor is in a

low power (Deep Sleep or Deeper Sleep) state. This signal is asserted upon Deep Sleep entry and

deasserted upon exit. PSI# can be used to improve the light load efficiency of the voltage regulator,

resulting in platform power savings and extended batt e ry life. PSI# can also be us ed to simplify

voltage regulator designs since it removes the need for integrated 100 s timers required to mask

the PWRGOOD signal during Deeper Sleep transitions. It also helps loosen PWRGOOD

monitoring requirements in the Deeper Sleep state

16 Datasheet

Low Power Features

Datasheet 17

Electrical Specifications

3Electrical Specifications

3.1 Power and Ground Pins

For clean, on-chip power distribution, the Pentium M Processo r will have a large number of VCC

(power) and VSS (ground) inputs. All power pins must be connected to VCC power planes while all

VSS pins must be connected to system ground planes. Use of multiple power and ground planes is

recommended to reduce I*R drop. The processor VCC pins must be supplied the voltage determined

by the VID (Voltage ID) pins.

3.2 FSB Clock (BCLK[1:0]) and Processor Clocking

BCLK[1:0] directly controls the FSB interface speed as well as the co re frequency of the processor .

As in previous generation processors, the Pentium M Processor core frequency is a multiple of the

BCLK[1:0] frequency. The Pentium M Processor uses a differential clocking implementation.

3.3 Voltage Identification

The Pentium M Processor uses six voltage identification pins, VID[5:0], to support automatic

selection of power supply voltages. The VID pins for the Pentium M Processor are CMOS outputs

driven by the processor VID circuitry. Table 3-1 specifies the voltage level corresponding to the

state of VID[5:0]. A “1” in this refers to a high-voltage level and a “0” refers to low-voltage level.

18 Datasheet

Electrical Specifications

Table 3-1. Voltage Identification Definition

3.4 Catastrophic Thermal Protection

The Pentium M Processor supports the THERMTRIP# signal for catastrophic thermal protection.

An external thermal sensor should also be used to protect the processor and the system against

excessive temperatures. Even with the activation of THERMTRIP#, which halts all processor

internal clocks and activity, leakage current can be high enough such that the processor cannot be

protected in all conditions without the removal of power to the processor. If the external thermal

sensor detects a catastrophic processor temperature of 125 °C (maximum), or if the THERMTRIP#

signal is asserted, the VCC supply to the processor must be turned off within

500 ms to prevent permanent silicon damage due to thermal runaway of the processor.

VID VID

5 4 3 2 1 0

VCC

V 5 4 3 2 1 0

VCC

0 0 0 0 0 0 1.708 1 0 0 0 0 0 1.196

0 0 0 0 0 1 1.692 1 0 0 0 0 1 1.180

0 0 0 0 1 0 1.676 1 0 0 0 1 0 1.164

0 0 0 0 1 1 1.660 1 0 0 0 1 1 1.148

0 0 0 1 0 0 1.644 1 0 0 1 0 0 1.132

0 0 0 1 0 1 1.628 1 0 0 1 0 1 1.116

0 0 0 1 1 0 1.612 1 0 0 1 1 0 1.100

0 0 0 1 1 1 1.596 1 0 0 1 1 1 1.084

0 0 1 0 0 0 1.580 1 0 1 0 0 0 1.068

0 0 1 0 0 1 1.564 1 0 1 0 0 1 1.052

0 0 1 0 1 0 1.548 1 0 1 0 1 0 1.036

0 0 1 0 1 1 1.532 1 0 1 0 1 1 1.020

0 0 1 1 0 0 1.516 1 0 1 1 0 0 1.004

0 0 1 1 0 1 1.500 1 0 1 1 0 1 0.988

0 0 1 1 1 0 1.484 1 0 1 1 1 0 0.972

0 0 1 1 1 1 1.468 1 0 1 1 1 1 0.956

0 1 0 0 0 0 1.452 1 1 0 0 0 0 0.940

0 1 0 0 0 1 1.436 1 1 0 0 0 1 0.924

0 1 0 0 1 0 1.420 1 1 0 0 1 0 0.908

0 1 0 0 1 1 1.404 1 1 0 0 1 1 0.892

0 1 0 1 0 0 1.388 1 1 0 1 0 0 0.876

0 1 0 1 0 1 1.372 1 1 0 1 0 1 0.860

0 1 0 1 1 0 1.356 1 1 0 1 1 0 0.844

0 1 0 1 1 1 1.340 1 1 0 1 1 1 0.828

0 1 1 0 0 0 1.324 1 1 1 0 0 0 0.812

0 1 1 0 0 1 1.308 1 1 1 0 0 1 0.796

0 1 1 0 1 0 1.292 1 1 1 0 1 0 0.780

0 1 1 0 1 1 1.276 1 1 1 0 1 1 0.764

0 1 1 1 0 0 1.260 1 1 1 1 0 0 0.748

0 1 1 1 0 1 1.244 1 1 1 1 0 1 0.732

0 1 1 1 1 0 1.228 1 1 1 1 1 0 0.716

0 1 1 1 1 1 1.212 1 1 1 1 1 1 0.700

Datasheet 19

Electrical Specifications

3.5 Signal Terminations and Unused Pins

All RSVD (RESERVED) pins must remain unconnected. Connection of these pins to VCC, VSS, or

to any other signal (including each other) can result in component malfunction or incompatibility

with future Pentium M Processors. See Section 4.1 for a pin listing of the pro cessor and the

location of all RSVD pins.

For reliable operation, always connect unused inputs or bidirectional signals to an appro priate

signal level. Unused active low AGTL+ inputs may be left as no connects if AGTL+ termination is

provided on the processor silicon. Unused active high inputs should be connected through a resistor

to ground (VSS). Unused outputs can be left unconnected.

The TEST1 and TEST2 pins must have a stuffing option connection to VSS separately via 1 k

pull-down resistors.

3.6 FSB Frequency Select Signals (BSEL[1:0])

The BSEL[1:0] signals are used to select the frequenc y of the processor input clock (BCLK[1:0]).

These signals should be connected to the clock chip and Intel 915PM/ GM and Intel 915GMS

Express chipset on the platform. The BSEL encoding for BCLK[1:0] is shown in Table 3-2.

3.7 FSB Signal Groups

In order to simplify the following discussion, the FSB signals hav e been combined into groups by

buffer type. AGTL+ input signals have differential input buffers, which use GTLREF as a reference

level. In this document, the term “AGTL+ Input” refers to the AGTL+ input group as well as the

AGTL+ I/O group when receiving. Similarly, “AGTL+ Output” refers to the AGTL+ output group

as well as the AGTL+ I/O group when driving.

With the implementation of a source synchronous data bus comes the need to sp ecify two sets of

timing parameters. One set is for commo n clock signals which are dependant upon the rising edge

of BCLK0 (ADS#, HIT#, HITM#, etc.) and the second set is for the source synchronous signals

which are relative to their respective strobe lines (data and address) as well as the rising edge of

BCLK0. Asychronous signals are still present (A20M#, IGNNE#, etc.) and can become active at

any time during the clock cycle. Table 3-3 identifies which signals are common clock, source

synchronous, and asynchronous.

Table 3-2. BSEL[1: 0] Encoding for BCLK Frequency

BSEL[1] BSEL[0] BCLK Frequency

L H 100 MHz

L L 133 MHz

H L RESERVED

H H RESERVED

20 Datasheet

Electrical Specifications

NOTES:

1. Refer to Table 4-5 for signal descriptions and termination requirements.

2. In processor systems where there is no debug port implemented on the system board, these signals are used

to support a debug port interposer. In systems with the debug port implemente d on the system board, these

signals are no connects.

3. BPM[2:0]# and PRDY# are AGTL+ output only signals.

3.8 CMOS Signals

CMOS input signals are shown in Table 3-3. Legacy output FERR#, IERR# and other non-AGTL+

signals (THERMTRIP# and PROCHOT#) utilize Open Drain outp ut bu ffers. These signals do not

have setup or hold time specifications in relation to BCLK[1:0]. However , all of the CMOS signals

are required to be asserted for at least three BCLKs in order for the processor to recognize them.

See Section 3.10 for the DC and AC specifications for the CMOS signal groups.

Table 3-3. FSB Pin Groups

Signal Group Type Signals1

AGTL+ Common Clock Input Synchronous

to BCLK[1:0] BPRI#, DEFER#, DPWR#, PREQ#, RESET#, RS[2:0]#,

TRDY#

AGTL+ Common Clock I/O Synchronous

to BCLK[1:0] ADS#, BNR#, BPM[3:0]#3, BR0#, DBSY#, DRDY#, HIT#,

HITM#, LOCK#, PRDY#3

AGTL+ Source Synchronous I/O Synchronous

to assoc.

strobe

AGTL+ Strobes Synchronous

to BCLK[1:0] ADSTB[1:0]#, DSTBP[3:0]#, DSTBN[3:0]#

CMOS Input Asynchronous A20M#, DPSLP#, IGNNE#, INIT#, LINT0/INTR, LINT1/

NMI, PWRGOOD, SMI#, SLP#, STPCLK#

Open Drain Output Asynchronous FERR#, IERR#, PROCHOT#, THERMTRIP#

CMOS Output Asynchronous PSI#, VID[5:0], BSEL[1:0]

CMOS Input Synchronous

to TCK TCK, TDI, TMS, TRST #

Open Drain Output Synchronous

to TCK TDO

FSB Clock Clock BCLK[1:0], ITP_CLK[1:0]2

Power/Other COMP[3:0], DBR#2, GTLREF, RSVD, TEST2, TEST1,

THERMDA, THERMDC, VCC, VCCA, VCCP, VCCQ[1:0],

VCC_SENSE, VSS, VSS_SENSE

Signals Associated Strobe

REQ[4:0]#, A[16:3]# ADSTB[0]#

A[31:17]# ADSTB[1]#

D[15:0]#, DINV0# DSTBP0#, DSTBN0#

D[31:16]#, DINV1# DSTBP1#, DSTBN1#

D[47:32]#, DINV2# DSTBP2#, DSTBN2#

D[63:48]#, DINV3# DSTBP3#, DSTBN3#

Datasheet 21

Electrical Specifications

3.9 Maximum Ratings

Table 3-4 lists the processor’s maximum environmental stress ratings. The processor sh ould not

receive a clock while subjected to these conditions. Functional operating parameters are listed in

the AC and DC tables. Extended exposure to the maxim um ratings may affect device reliability.

Furthermore, although the processor contains protective circuitry to resist damage from Electro

Static Dischar ge (ESD), one should always take precautions to avoid high static voltages or electric

fields.

NOTES:

1. This rating applies to any processor pin.

2. Contact Intel for storage requirements in excess of one year.

3.10 Processor DC Specifications

The processor DC specifications in this section are defined at the processor core (pads) unless

noted otherwise. See Table 4-5 for the pin signal definitions and signal pin assignments.

Table through Table 3-8 list the DC specifications for the Pentium M Processor and are valid only

while meeting specifications for junction temperature, clock frequency, and input vo ltages. The

highest frequency mode (HFM) and lowest frequency mode (LFM) refer to the highest and lowest

core operating frequencies supported on the processor. Active mode load line specifications apply

in all states except in the Deep Sleep and Deeper Sleep states. VCC,BOOT is the default voltage

driven by the voltage regulator at power up in order to set the VID values. Unless specified

otherwise, all specifications for the Pentium M Processor are at Tjunction = 100C. Care should be

taken to read all notes associated with each parameter.

Table 3-4. Processor DC Absolute Maximum Ratings

Symbol Parameter Min Max Unit Notes

TSTORAGE Processor storage

temperature -40 85 °C 2

VCC Any processor supply

voltage with respect to VSS -0.3 1.6 V 1

VinAGTL+ AGTL+ buffer DC input

voltage with respect to VSS

-0.1 1.6 V 1, 2

VinAsynch_CMOS CMOS buffer DC input

voltage with respect to VSS

-0.1 1.6 V 1, 2

22 Datasheet

Electrical Specifications

Table 3-5. Voltage and Current Specifications

Symbol Parameter Min Typ Max Unit Notes

VCCHFM1 Vcc at Highest Frequency Mode (HFM)

for Intel® Pentium® M Processors 730,

740, 750, 760

1.260 1.356 V 1, 2

VCCHFM2 Vcc at Highest Frequency Mode (HFM)

for the Pentium M Processor 770 1.260 1.372 V 1, 2

VCCHFM3 Vcc at Highest Frequency Mode (HFM)

for the Pentium M Processor 780 1.260 1.404 V 1, 2

VCCLFM Vcc at Lowest Frequency Mode (LFM) 0.988 V 1, 2

VCC,BOOT Default VCC Voltage for initial power up 1.14 1.20 1.26 V 2

VCCP AGTL+ Termination Voltage 0.997 1.05 1.102 V 2

VCCA PLL supply voltage 1.425 1.5 1.575 V 2

VCCDPRSLP,

RP1 Ripple Deeper Sleep voltage 0.689 0.748 0.807 V 2,9

VCCDPRSLP,

ST1 Static Deeper Sleep voltage 0.699 0.748 0.797 V 2,9

VCCDPRSLP,

RP2 Ripple Deeper Sleep voltage 0.669 0.726 0.783 V 2,9

VCCDPRSLP,

ST2 Static Deeper Sleep voltage 0.679 0.726 0.773 V 2,9

ICCDES ICC for Pentium M Processors

Recommended Design Target 27 A 5

ICC Icc for Pentium M Processors A 3,4

Processor

Number Core Frequency/Voltage

780 2.26 GHz and HFM Vcc 26

770 2.13 GHz and HFM Vcc 26

760 2.0 GHz and HFM Vcc 26

750 1.86 GHz and HFM Vcc 26

740 1.73 GHz and HFM Vcc 26

730 1.6 GHz and HFM Vcc 26

Not

Applicable 800 MHz and LFM Vcc 12.2

IAH,

ISGNT

ICC Auto-Halt & Stop-Grant A 3,4

LFM 9.2

HFM 23.1

ISLP ICC Sleep A 3,4

LFM 9.1

HFM 22.7

IDSLP ICC Deep Sleep A 3,4

LFM 8.9

HFM 22.1

Datasheet 23

Electrical Specifications

NOTES:

1. These are VID values. Individual processor VID values may be calibrated during manufacturing such that two

devices at the same speed may have different VID settings. Actual voltage supplied to the processor should

be as specified in the load lines in Figures 2 & 3. Adherence to load line specifications is required to ensure

reliable processor operation.

2. The voltage specifications are assumed to be measured at a via on the motherboard’s opposite side of the

processor’s socket (or BGA) ball with a 100-MHz bandwidth oscilloscope, 1.5-pF maximum probe

capacitance, and 1-Mohm minimum impedance. The maximum length of ground wire on the probe should be

less than 5 mm. Ensure external noise from the system is not coupled in the scope probe.

3. Specified at 100C Tj.

4. Specified at the VID voltage.

5. The ICCDES(max) specification comprehends future processor HFM frequencies. Platforms should be

designed to this specification.

6. Based on simulations and averaged over the duration of any change in current. Specified by design/

characterization at nominal VCC. Not 100% tested.

7. Measured at the bulk capacitors on the motherboard.

8. The Pentium M Processor will support Deeper Sleep voltages of 0.726V(typical) and 0.748V(typical) with the

tolerances specified. A typical voltage setting between 0.726V and 0.748V may also be used but the

minimum/maximum static and ripple tolerances must be within the range specified in the table.

9. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within

each processor family, not across different processor families. See www.intel.com/products/

processor_number for details.

IDPRSLP1 ICC Deeper Sleep @0.748 V 3.9 A 4,9

IDPRSLP2 ICC Deeper Sleep @0.726 V 3.7 A 4,9

dICC/DT VCC power supply current slew rate 0.5 A/ns 6, 8

ICCA ICC for VCCA supply 120 mA

ICCP ICC for VCCP supply 2.5 A

Table 3-5. Voltage and Current Specifications

Symbol Parameter Min Typ Max Unit Notes

Figure 3-1. Active VCC and ICC Load Line

24 Datasheet

Electrical Specifications

NOTES:

1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.

2. Crossing Voltage is defined as absolute voltage where rising edge of BCLK0 is equal to the falling edge of

BCLK1.

3. Threshold Region is defined as a region entered about the crossing voltage in which the differential receiver

switches. It includes input threshold hysteresis.

4. For Vin between 0 V and VH.

5. Cpad includes die capacitance only. No package parasitics are included.

6. VCROSS is defined as the total variation of all crossing voltages as defined in note 2.

Figure 3-2. Deep Sleep VCC and ICC Load Line

ICC max

{HFM|LFM}

VCC [V]

Slope= -3.0 m V /A

Vcc

nom {HFM|LFM }

- 1.2%

+ /-1 .5 % fro m N o mina l = V R E rro r

10m V= R IP PLE

ICC

[A]

0Deep Sleep

Table 3-6. FSB Differential BCLK Specifications

Symbol Parameter Min Typ Max Unit Notes1

VLInput Low Voltage 0 V

VHInput High Voltage 0.660 0.710 0.85 V

VCROSS Crossing Voltage 0.25 0.35 0.55 V 2

VCROSS Range of Crossing

Points N/A N/A 0.140 V 6

VTH Threshold Region VCROSS -0.100 VCROSS+0.100 V 3

ILI Input Leakage

Current ± 100 µA 4

Cpad Pad Capacitance 1.8 2.3 2.75 pF 5

Datasheet 25

Electrical Specifications

1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.

2. VIL is defined as the maximum volt age level at a receiving agent that will be interpreted as a logical low value.

3. VIH is defined as the minimum voltage level at a receiving agent that will be interpreted as a logical high

value.

4. VIH and VOH may experience excursions above VCCP. However, input signal drivers must comply with the

signal quality specifications in Chapter 3.

5. This is the pull down driver resistance. Refer to processor I/O Buffer Models for I/V characteristics. Measured

at 0.31*VCCP. RON (min) = 0.38*RTT, RON (typ) = 0.45*RTT, RON (max) = 0.52*RTT.

6. G TLREF should be generated from VCCP with a 1% tolerance resistor divider . The VCCP referred to in these

specifications is the instantaneous VCCP.

7. RTT is the on-die termination resistance measured at VOL of the AGTL+ output driver. Measured at

0.31*VCCP. RTT is connected to VCCP on die. Refer to processor I/O buffer models for I/V characteristics.

8. Specified with on die RTT and RON are turned off.

9. Cpad includes die capacitance only. No package parasitics are included.

NOTES:

1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.

2. The VCCP referred to in these specifications refers to instantaneous VCCP.

3. Refer to the processor I/O Buffer Models for I/V characteristics.

4. Measured at 0.1*VCCP.

5. Measured at 0.9*VCCP.

6. For Vin between 0V and VCCP. Measured when the driver is tristated.

7. Cpad includes die capacitance only. No package parasitics are included.

Table 3-7. AGTL+ Signal Group DC Specifications

Symbol Parameter Min Typ Max Unit Notes1

VCCP I/O Voltage 0.997 1.05 1.102 V

GTLREF Reference Voltage 2/3 VCCP -

2% 2/3 VCCP 2/3 VCCP +

2% V6

VIH Input High Voltage GTLREF+0.1 VCCP+0.1 V 3,6

VIL Input Low Voltage -0.1 GTLREF-0.1 V 2,4

VOH Output High Voltage VCCP 6

RTT Termination Resistance 50 55 61  7

RON Buffer On Resistance 22 25 28 5

ILI Input Leakage Current ± 100 µA 8

Cpad Pad Capacitance 1.8 2.3 2.75 pF 9

Table 3-8. CMOS Signal Group DC Specifications

Symbol Parameter Min Typ Max Unit Notes1

VCCP I/O Voltage 0.997 1.05 1.102 V

VIL Input Low Voltage

CMOS -0.1 0.3*VCCP V 2, 3

VIH Input High Voltage 0.7*VCCP VCCP+0.1 V 2

VOL Output Low Voltage -0.1 0 0.1*VCCP V 2

VOH Output High Voltage 0.9*VCCP VCCP VCCP+0.1 V 2

IOL Output Low Current 1.49 4.08 mA 4

IOH Output High Current 1.49 4.08 mA 5

ILI Leakage Current ± 100 µA 6

Cpad Pad Capacitance 1.0 2.3 3.0 pF

26 Datasheet

Electrical Specifications

NOTES:

1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.

2. Measured at 0.2 V

3. VOH is determined by value of the external pullup resistor to VCCP. Please refer to platform RDDP for details.

4. For Vin between 0 V and VOH.

5. Cpad includes die capacitance only. No package parasitics are included.

Table 3-9. Open Drain Signal Group DC Specifications

Symbol Parameter Min Typ Max Unit Notes1

VOH Output High Voltage VCCP V 3

VOL Output Low Voltage 0 0.20 V

IOL Output Low Current 16 50 mA 2

ILO Leakage Current ± 200 µA 4

Cpad Pad Capacitance 1.7 2.3 3.0 pF 5

Datasheet 27

Package Mechanical Specifications and Pin Information

4Package Mechanical

Specifications and Pin Information

The Pentium M Processor will be available in 478 pin Micro-FCPGA and 479 ball Micro-FCBGA

packages. The Pentium M Processors 780, 770, 760, 750, 740 and 730 will also be available in a

lead free SLI (second level interconnect) version of the Micro-FCBGA package. Package

specifications are the same for all Micro-FCBGA packages. Different views of the Micro-FCPGA

package are shown in Figure 4-1 throu gh Figure 4-3. Package dimensions are shown in Table 4-1.

Different views of the Micro-FCBGA package are shown in Figure 4-4 through Figure 4-6.

Package dimensions are shown in Table 4-7.

The Micro-FCBGA may have capacitors placed in the area surrounding the die. Because the die-

side capacitors are electrically conductive, and only slightly shorter than the die height, care should

be taken to avoid contacting the capacitors with electrically conductive materials. Doing so may

short the capaci t or s, and possibly damage the devi ce or render it inactive. The use of an insulating

material between the capacitors and any thermal so lution should be considered to prevent capacitor

shorting.

NOTE: All dimensions in millimeters. Values shown for reference on ly. Refer to Table 4-1 for details.

Figure 4-1. Micro-FCPGA Packag e Top and Bottom Isometric Views

TOP VIEW BOTTOM VIEW

LABEL

PACKAGE KEEPO UT

DIE

CAPACITOR AREA

28 Datasheet

Package Mechanical Specifications and Pin Information

NOTE: Die is centered. All dimensions in millimeters. Values shown for reference only. Refer to Table 4-1 for

details.

Figure 4-2. Micro-FCPGA Package - Top and Side Views

35 (E)

35 (D )

PIN A1 CORNER

1.25 M AX

(A3)

Ø0.32 (B)

478 places

2.03

±0.08

(A1)

SUBSTRATE KEEPOUT ZONE

DO NO T CONTACT PACKAGE

IN SIDE T H IS LINE

7 (K1)

8 places

5 (K)

4 places

0.286

35 (E)

35 (D )

PIN A1 CORNER

1.25 M AX

(A3)

Ø0.32 (B)

478 places

2.03

±0.08

(A1)

SUBSTRATE KEEPOUT ZONE

DO NO T CONTACT PACKAGE

IN SIDE T H IS LINE

7 (K1)

8 places

5 (K)

4 places

0.286 0.286

Datasheet 29

Package Mechanical Specifications and Pin Information

NOTE: All dimensions in millimeters. Values shown for reference on ly. Refer to Table 4-1 for details.

Figure 4-3. Micro-FCPGA Package - Bottom View

1 234 6 8 10 12 14 16 18 20 22 24 26

5 7 9 11 13 15 17 19 21 23 25

B C

F G

H J

K L

M N

P R

T U

V W

Y AA

AB AC

AD AE

25X 1.27

(e)

25X 1.27

(e)

14 (K3)

30 Datasheet

Package Mechanical Specifications and Pin Information

1. Overall height with socket is based on design dimensions of the Micro-FCPGA package with no thermal

solution attached. Values are based on design specifications and tolerances. This dimension is subject to

change based on socket design, OEM motherboard design or OEM SMT process.

2. All dimensions are preliminary and subject to change.

Table 4-1. Micro-FCPGA Package Dimensions

Symbol Parameter Min Max Unit

A Overall height, top of die to package seating plane 1.88 2.02 mm

– Overall height, top of die to PCB surface, including

socket (Refer to Note 1) 4.74 5.16 mm

A1 Pin length 1.95 2.11 mm

A2 Die height 0.820 mm

A3 Pin-side capacitor height – 1.25 mm

B Pin diameter 0.28 0.36 mm

D Package substrate length 34.9 35.1 mm

E Package substrate width 34.9 35.1 mm

D1 Die length 12.54 mm

E1 Die width 6.99 mm

e Pin Pitch 1.27 mm

K Package edge keep-out 5 mm

K1 Package corner keep-out 7 mm

K3 Pin-side capacitor boundary 14 mm

N Pin count 478 each

Pdie Allowable pressure on the die for thermal solution 689 kPa

W Package weight 4.5 g

Package Surface Flatness 0.286 mm

Datasheet 31

Package Mechanical Specifications and Pin Information

Figure 4-4. Micro-FCBGA Packag e Top and Bottom Isometric View

TOP VIEW BOTTOM VIEW

LABEL DIE

PACKAG E KEEPOUT

CAPACITOR AREA

32 Datasheet

Package Mechanical Specifications and Pin Information

NOTE: Die is centered. All dimensions in millimeters. Values shown for reference only. Refer to Table 4-2 for

details.

Figure 4-5. Micro-FCBGA Package Top and Side Views

35 (E)

35 (D)

PIN A1 CORNER

Ø0.78 (b)

479 places

SUBSTRATE KEEPOUT ZONE

DO NOT CONTACT PACKAGE

INSIDE THIS LI NE

7 (K1)

8 places

5 (K)

4 places A2

0.20

Datasheet 33

Package Mechanical Specifications and Pin Information

NOTES:

1. Overall heigh t as delivered. Values are based on design specifications and tolerances. This dimension is

subject to change based on OEM motherboard design or OEM SMT process.

2. All dimensions are preliminary and subject to change.

Table 4-2. Micro-FCBGA Package Dimensions

Symbol Parameter Min Max Unit

A Overall height, as delivered (Refer to Note 1) 2.60 2.85 mm

A2 Die height 0.82 mm

b Ball diameter 0.78 mm

D Package substrate length 34.9 35.1 mm

E Package substrate width 34.9 35.1 mm

D1 Die length 12.54 mm

E1 Die width 6.99 mm

e Ball pitch 1.27 mm

K Package edge keep-out 5 mm

K1 Package corner keep-out 7 mm

K2 Die-side capacitor height - 0.7 mm

S Package edge to first ball center 1.625 mm

N Ball count 479 each

- Solder ball coplanarity 0.2 mm

Pdie Allowable pressure on the die for thermal solution - 689 kPa

W Package weight 4.5 g

34 Datasheet

Package Mechanical Specifications and Pin Information

NOTE: All dimensions in millimeters. Values shown for reference only. Refer to Table 4-2 for details.

Figure 4-6. Micro-FCBGA Package Bottom View

34 6 8 10 12 14 16 18 20 22 24

5 7 9 11 13 15 17 19 21 23

25X 1.27

(e)

25X 1.27

(e)

1.625 (S )

4 places

1.625 (S )

4 places

Datasheet 35

Package Mechanical Specifications and Pin Information

4.1 Processor Pinout and Pin List

Figure 4-7 on the next page shows the top view pinout of Pentium M Processor. The pin list

arranged in two different formats is shown in the following pages.

Figure 4-7. The Coordinates of the Processor Pins As Viewed from the Top of the Package

12 3 456 7891011 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26

IGNNE# IERR# VSS SLP# DBR# VSS BPM[2]# PRDY# VSS TDO TCK VSS ITP_CLK

[1] ITP_CLK

[0] VSS THER

MDC D[0]# VSS D[6]# D[2]# VSS D[4]# D[1]# VSS

VSS SMI# INIT# VSS DPSLP# BPM [1]# VSS PREQ# RESET# VSS TRST# BCLK1 BCLK0 VSS PROC

HOT# THER

MDA VSS D[7]# D[3]# VSS D[13]# D[9]# VSS D[5]#

VSS A20M# RSVD VSS TEST1 STP CLK# VSS BP M [0]# BP M [3]# VSS TMS TDI VSS BSEL[1] VSS BSEL[0] THERM

TRIP# VSS DPWR# D[8]# VSS DSTBP

[0]# DSTBN

[0]# VSS D[15]# D[12]#

LINT0 VSS FERR# LINT1 VSS VCC VSS VCC VSS VCCP VSS VCCP VSS VCCP VSS VCCP VSS VCC VSS VCC VSS VCC VSS D[10]# DINV

[0]# VSS

PSI# VID[0] PWR

GOOD VCC VSS VCC VSS VCC VSS VCCP VSS VCCP VSS VCCP VSS VCC VSS VCC VSS VCC VSS D[14]# D[11]# VSS RSVD

VSS VID[1] VID[2] VSS VSS VCC VSS VCC VSS VCCP VSS VCCP VSS VCCP VSS VCCP VSS VCC VSS VCC VSS VCC TEST2 VSS D[21]# VCCA

VSS VID[3] VID[4] VCC VSS VCC VSS VSS D[22]# D[17]# VSS

RS[0]# DRDY# VSS VID[5] VSS VCC VSS VCC D[16]# D[20]# VSS D[29]#

VSS LOCK# BPRI# VSS VCC VSS VCC VSS D[23]# VSS D[25]# DINV

[1]#

RS[1]# VSS HIT# HITM# VSS VCCP VSS VCC VSS DSTBN

[1]# D[31]# VSS

BNR# RS[2]# VSS DEFER# VCCP VSS VCCP VSS D[18]# DSTBP

[1]# VSS D[26]#

DBSY# TRDY# VSS VSS VCCP VSS VCCP D[24]# VSS D[28]# D[19]#

RSVD ADS# VSS BR0# VCCP VSS VCCP VSS VSS D[27]# D[30]# VSS

REQ[3]# VSS REQ[1]# A[3]# VSS VCCP VSS VCCP VCCQ[0] VSS COMP

[0] COMP

[1]

VSS REQ[0]# A[6]# VSS VCCP VSS VCCP VSS D[39]# D[37]# VSS D[38]#

REQ[4]# REQ[2]# VSS A[9]# VSS VCCP VSS VCCP VSS DINV

[2]# D[34]# VSS

A[13]# VSS ADSTB

[0]# A[4]# VCC VSS VCCP VSS D[35]# VSS D[43]# D[41]#

VSS A[7]# A[5]# VSS VSS VCC VSS VCC D[36]# D[42]# VSS D[44]#

A[8]# A[10]# VSS VCCQ[1] VCC VSS VCC VSS VSS DSTBP

[2]# DSTBN

[2]# VSS

A[12]# VSS A[15]# VSS VCC VSS VCC D[45]# VSS D[47]# D[32]#

VSS A[16]# A[14]# VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS D[40]# D[33]# VSS D[46]#

COMP

[3] COMP

[2] VSS A[24]# VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS D[50]# D[48]# VSS

RSVD VSS A[20]# A[18]# VSS A[25]# A[19]# VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC D[51]# VSS D[52]# D[49]# VSS D[53]# RSVD

VSS A[23]# A[21]# VSS A[26]# A[28]# VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS DINV [3]# D[60]# VSS D[54]# D[57]# VSS GTLREF

A[30]# A[27]# VSS A[22]# ADSTB

[1]# VSS VCC

SENSE VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS D[59]# D[55]# VSS DSTBN

[3]# DSTBP

[3]# VSS

A[31]

A[31]# VSS A[29]# A[17]# VSS VSS

SENSE RSVD VCC VSS VCC VSS VCC VCC VSS VCC VSS VCC VSS D[58]# VSS D[62]# D[56]# VSS D[61]# D[63]#

VSS

123456789101112131415161718192021

22 23 24 25 26

VSS VCC Other

VSS

A[11]#

VSS

TOP

VIEW

RSVD

Pin B2 is depopulated on the Micro-FCPGA package

RSVD

VSS

36 Datasheet

Package Mechanical Specifications and Pin Information

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37 Datasheet

Table 4-3. Pin Listing by Pin Name

Pin Name Pin

Number Signal Buffer

Type Direction

A[3]# P4 Source Synch Input/Output

A[4]# U4 Source Synch Input/Output

A[5]# V3 Source Synch Input/Output

A[6]# R3 Source Synch Input/Output

A[7]# V2 Source Synch Input/Output

A[8]# W1 Source Synch Input/Output

A[9]# T4 Source Synch Input/Output

A[10]# W2 Source Synch Input/Output

A[11]# Y4 Source Synch Input/Output

A[12]# Y1 Source Synch Input/Output

A[13]# U1 Source Synch Input/Output

A[14]# AA3 Source Synch Input/Output

A[15]# Y3 Source Synch Input/Output

A[16]# AA2 Source Synch Input/Output

A[17]# AF4 Source Synch Input/Output

A[18]# AC4 Source Synch Input/Output

A[19]# AC7 Source Synch Input/Output

A[20]# AC3 Source Synch Input/Output

A[21]# AD3 Source Synch Input/Output

A[22]# AE4 Source Synch Input/Output

A[23]# AD2 Source Synch Input/Output

A[24]# AB4 Source Synch Input/Output

A[25]# AC6 Source Synch Input/Output

A[26]# AD5 Source Synch Input/Output

A[27]# AE2 Source Synch Input/Output

A[28]# AD6 Source Synch Input/Output

A[29]# AF3 Source Synch Input/Output

A[30]# AE1 Source Synch Input/Output

A[31]# AF1 Source Synch Input/Output

A20M# C2 CMOS Input

ADS# N2 Common Clock Input/Output

ADSTB[0]# U3 Source Synch Input/Output

ADSTB[1]# AE5 Source Synch Input/Output

BCLK[0] B15 Bus Clock Input

BCLK[1] B14 Bus Clock Input

BNR# L1 Common Clock Input/Output

BPM[0]# C8 Common Clock Output

BPM[1]# B8 Common Clock Output

BPM[2]# A9 Common Clock Output

BPM[3]# C9 Common Clock Input/Output

BPRI# J3 Common Clock Input

BR0# N4 Common Clock Input/Output

BSEL[1] C14 CMOS Output

BSEL[0] C16 CMOS Output

COMP[0] P25 Power/Other Input/Output

COMP[1] P26 Power/Other Input/Output

COMP[2] AB2 Power/Other Input/Output

COMP[3] AB1 Power/Other Input/Output

D[0]# A19 Source Synch Input/Output

D[1]# A25 Source Synch Input/Output

D[2]# A22 Source Synch Input/Output

D[3]# B21 Source Synch Input/Output

D[4]# A24 Source Synch Input/Output

D[5]# B26 Source Synch Input/Output

D[6]# A21 Source Synch Input/Output

D[7]# B20 Source Synch Input/Output

D[8]# C20 Source Synch Input/Output

D[9]# B24 Source Synch Input/Output

D[10]# D24 Source Synch Input/Output

D[11]# E24 Source Synch Input/Output

D[12]# C26 Source Synch Input/Output

D[13]# B23 Source Synch Input/Output

D[14]# E23 Source Synch Input/Output

D[15]# C25 Source Synch Input/Output

D[16]# H23 Source Synch Input/Output

D[17]# G25 Source Synch Input/Output

D[18]# L23 Source Synch Input/Output

D[19]# M26 Source Synch Input/Output

D[20]# H24 Source Synch Input/Output

D[21]# F25 Source Synch Input/Output

D[22]# G24 Source Synch Input/Output

D[23]# J23 Source Synch Input/Output

D[24]# M23 Source Synch Input/Output

D[25]# J25 Source Synch Input/Output

D[26]# L26 Source Synch Input/Output

Table 4-3. Pin Listing by Pin Name

Pin Name Pin

Number Signal Buffer

Type Direction

Datasheet 38

D[27]# N24 Source Synch Input/Output

D[28]# M25 Source Synch Input/Output

D[29]# H26 Source Synch Input/Output

D[30]# N25 Source Synch Input/Output

D[31]# K25 Source Synch Input/Output

D[32]# Y26 Source Synch Input/Output

D[33]# AA24 Source Synch Input/Output

D[34]# T25 Source Synch Input/Output

D[35]# U23 Source Synch Input/Output

D[36]# V23 Source Synch Input/Output

D[37]# R24 Source Synch Input/Output

D[38]# R26 Source Synch Input/Output

D[39]# R23 Source Synch Input/Output

D[40]# AA23 Source Synch Input/Output

D[41]# U26 Source Synch Input/Output

D[42]# V24 Source Synch Input/Output

D[43]# U25 Source Synch Input/Output

D[44]# V26 Source Synch Input/Output

D[45]# Y23 Source Synch Input/Output

D[46]# AA26 Source Synch Input/Output

D[47]# Y25 Source Synch Input/Output

D[48]# AB25 Source Synch Input/Output

D[49]# AC23 Source Synch Input/Output

D[50]# AB24 Source Synch Input/Output

D[51]# AC20 Source Synch Input/Output

D[52]# AC22 Source Synch Input/Output

D[53]# AC25 Source Synch Input/Output

D[54]# AD23 Source Synch Input/Output

D[55]# AE22 Source Synch Input/Output

D[56]# AF23 Source Synch Input/Output

D[57]# AD24 Source Synch Input/Output

D[58]# AF20 Source Synch Input/Output

D[59]# AE21 Source Synch Input/Output

D[60]# AD21 Source Synch Input/Output

D[61]# AF25 Source Synch Input/Output

D[62]# AF22 Source Synch Input/Output

D[63]# AF26 Source Synch Input/Output

DBR# A7 CMOS Output

Table 4-3. Pin Listing by Pin Name

Pin Name Pin

Number Signal Buffer

Type Direction

DBSY# M2 Common Clock Input/Output

DEFER# L4 Common Clock Input

DINV[0]# D25 Source Synch Input/Output

DINV[1]# J26 Source Synch Input/Output

DINV[2]# T24 Source Synch Input/Output

DINV[3]# AD20 Source Synch Input/Output

DPSLP# B7 CMOS Input

DPWR# C19 Common Clock Input

DRDY# H2 Common Clock Input/Output

DSTBN[0]# C23 Source Synch Input/Output

DSTBN[1]# K24 Source Synch Input/Output

DSTBN[2]# W25 Source Synch Input/Output

DSTBN[3]# AE24 Source Synch Input/Output

DSTBP[0]# C22 Source Synch Input/Output

DSTBP[1]# L24 Source Synch Input/Output

DSTBP[2]# W24 Source Synch Input/Output

DSTBP[3]# AE25 Source Synch Input/Output

FERR# D3 Open Drain Output

GTLREF AD26 Power/Other Input

HIT# K3 Common Clock Input/Output

HITM# K4 Common Clock Input/Output

IERR# A4 Open Drain Output

IGNNE# A3 CMOS Input

INIT# B5 CMOS Input

ITP_CLK[0] A16 CMOS input

ITP_CLK[1] A15 CMOS input

LINT0 D1 CMOS Input

LINT1 D4 CMOS Input

LOCK# J2 Common Clock Input/Output

PRDY# A10 Common Clock Output

PREQ# B10 Common Clock Input

PROCHOT# B17 Open Drain Output

PSI# E1 CMOS Output

PWRGOOD E4 CMOS Input

REQ[0]# R2 Source Synch Input/Output

REQ[1]# P3 Source Synch Input/Output

REQ[2]# T2 Source Synch Input/Output

REQ[3]# P1 Source Synch Input/Output

Ta ble 4-3. Pin Listing by Pin Name

Pin Name Pin

Number Signal Buffer

Type Direction

39 Datasheet

REQ[4]# T1 Source Synch Input/Output

RESET# B11 Common Clock Input

RS[0]# H1 Common Clock Input

RS[1]# K1 Common Clock Input

RS[2]# L2 Common Clock Input

RSVD AF7 Reserved

RSVD B2 Reserved

RSVD G1 Reserved

RSVD C3 Reserved

RSVD E26 Reserved

RSVD AC1 Reserved

RSVD B1 Power/Other

RSVD N1 Power/Other

RSVD AC26 Power/Other

SLP# A6 CMOS Input

SMI# B4 CMOS Input

STPCLK# C6 CMOS Input

TCK A13 CMOS Input

TDI C12 CMOS Input

TDO A12 Open Drain Output

TEST1 C5 Test

TEST2 F23 Test

THERMDA B18 Power/Other

THERMDC A18 Power/Other

THERMTRIP# C17 Open Drain Output

TMS C11 CMOS Input

TRDY# M3 Common Clock Input

TRST# B13 CMOS Input

VCC D6 Power/Other

VCC D8 Power/Other

VCC D18 Power/Other

VCC D20 Power/Other

VCC D22 Power/Other

VCC E5 Power/Other

VCC E7 Power/Other

VCC E9 Power/Other

VCC E17 Power/Other

VCC E19 Power/Other

Table 4-3. Pin Listing by Pin Name

Pin Name Pin

Number Signal Buffer

Type Direction

VCC E21 Power/Other

VCC F6 Power/Other

VCC F8 Power/Other

VCC F18 Power/Other

VCC F20 Power/Other

VCC F22 Power/Other

VCC G5 Power/Other

VCC G21 Power/Other

VCC H6 Power/Other

VCC H22 Power/Other

VCC J5 Power/Other

VCC J21 Power/Other

VCC K22 Power/Other

VCC U5 Power/Other

VCC V6 Power/Other

VCC V22 Power/Other

VCC W5 Power/Other

VCC W21 Power/Other

VCC Y6 Power/Other

VCC Y22 Power/Other

VCC AA5 Power/Other

VCC AA7 Power/Other

VCC AA9 Power/Other

VCC AA11 Power/Other

VCC AA13 Power/Other

VCC AA15 Power/Other

VCC AA17 Power/Other

VCC AA19 Power/Other

VCC AA21 Power/Other

VCC AB6 Power/Other

VCC AB8 Power/Other

VCC AB10 Power/Other

VCC AB12 Power/Other

VCC AB14 Power/Other

VCC AB16 Power/Other

VCC AB18 Power/Other

VCC AB20 Power/Other

VCC AB22 Power/Other

Table 4-3. Pin Listing by Pin Name

Pin Name Pin

Number Signal Buffer

Type Direction

Datasheet 40

VCC AC9 Power/Other

VCC AC11 Power/Other

VCC AC13 Power/Other

VCC AC15 Power/Other

VCC AC17 Power/Other

VCC AC19 Power/Other

VCC AD8 Power/Other

VCC AD10 Power/Other

VCC AD12 Power/Other

VCC AD14 Power/Other

VCC AD16 Power/Other

VCC AD18 Power/Other

VCC AE9 Power/Other

VCC AE11 Power/Other

VCC AE13 Power/Other

VCC AE15 Power/Other

VCC AE17 Power/Other

VCC AE19 Power/Other

VCC AF8 Power/Other

VCC AF10 Power/Other

VCC AF12 Power/Other

VCC AF14 Power/Other

VCC AF16 Power/Other

VCC AF18 Power/Other

VCCA F26 Power/Other

VCCP D10 Power/Other

VCCP D12 Power/Other

VCCP D14 Power/Other

VCCP D16 Power/Other

VCCP E11 Power/Other

VCCP E13 Power/Other

VCCP E15 Power/Other

VCCP F10 Power/Other

VCCP F12 Power/Other

VCCP F14 Power/Other

VCCP F16 Power/Other

VCCP K6 Power/Other

VCCP L5 Power/Other

Table 4-3. Pin Listing by Pin Name

Pin Name Pin

Number Signal Buffer

Type Direction

VCCP L21 Power/Other

VCCP M6 Power/Other

VCCP M22 Power/Other

VCCP N5 Power/Other

VCCP N21 Power/Other

VCCP P6 Power/Other

VCCP P22 Power/Other

VCCP R5 Power/Other

VCCP R21 Power/Other

VCCP T6 Power/Other

VCCP T22 Power/Other

VCCP U21 Power/Other

VCCQ[0] P23 Power/Other

VCCQ[1] W4 Power/Other

VCCSENSE AE7 Power/Other Output

VID[0] E2 CMOS Output

VID[1] F2 CMOS Output

VID[2] F3 CMOS Output

VID[3] G3 CMOS Output

VID[4] G4 CMOS Output

VID[5] H4 CMOS Output

VSS A2 Power/Other

VSS A5 Power/Other

VSS A8 Power/Other

VSS A11 Power/Other

VSS A14 Power/Other

VSS A17 Power/Other

VSS A20 Power/Other

VSS A23 Power/Other

VSS A26 Power/Other

VSS B3 Power/Other

VSS B6 Power/Other

VSS B9 Power/Other

VSS B12 Power/Other

VSS B16 Power/Other

VSS B19 Power/Other

VSS B22 Power/Other

VSS B25 Power/Other

Ta ble 4-3. Pin Listing by Pin Name

Pin Name Pin

Number Signal Buffer

Type Direction

41 Datasheet

VSS C1 Power/Other

VSS C4 Power/Other

VSS C7 Power/Other

VSS C10 Power/Other

VSS C13 Power/Other

VSS C15 Power/Other

VSS C18 Power/Other

VSS C21 Power/Other

VSS C24 Power/Other

VSS D2 Power/Other

VSS D5 Power/Other

VSS D7 Power/Other

VSS D9 Power/Other

VSS D11 Power/Other

VSS D13 Power/Other

VSS D15 Power/Other

VSS D17 Power/Other

VSS D19 Power/Other

VSS D21 Power/Other

VSS D23 Power/Other

VSS D26 Power/Other

VSS E3 Power/Other

VSS E6 Power/Other

VSS E8 Power/Other

VSS E10 Power/Other

VSS E12 Power/Other

VSS E14 Power/Other

VSS E16 Power/Other

VSS E18 Power/Other

VSS E20 Power/Other

VSS E22 Power/Other

VSS E25 Power/Other

VSS F1 Power/Other

VSS F4 Power/Other

VSS F5 Power/Other

VSS F7 Power/Other

VSS F9 Power/Other

VSS F11 Power/Other

Table 4-3. Pin Listing by Pin Name

Pin Name Pin

Number Signal Buffer

Type Direction

VSS F13 Power/Other

VSS F15 Power/Other

VSS F17 Power/Other

VSS F19 Power/Other

VSS F21 Power/Other

VSS F24 Power/Other

VSS G2 Power/Other

VSS G6 Power/Other

VSS G22 Power/Other

VSS G23 Power/Other

VSS G26 Power/Other

VSS H3 Power/Other

VSS H5 Power/Other

VSS H21 Power/Other

VSS H25 Power/Other

VSS J1 Power/Other

VSS J4 Power/Other

VSS J6 Power/Other

VSS J22 Power/Other

VSS J24 Power/Other

VSS K2 Power/Other

VSS K5 Power/Other

VSS K21 Power/Other

VSS K23 Power/Other

VSS K26 Power/Other

VSS L3 Power/Other

VSS L6 Power/Other

VSS L22 Power/Other

VSS L25 Power/Other

VSS M1 Power/Other

VSS M4 Power/Other

VSS M5 Power/Other

VSS M21 Power/Other

VSS M24 Power/Other

VSS N3 Power/Other

VSS N6 Power/Other

VSS N22 Power/Other

VSS N23 Power/Other

Table 4-3. Pin Listing by Pin Name

Pin Name Pin

Number Signal Buffer

Type Direction

Datasheet 42

VSS N26 Power/Other

VSS P2 Power/Other

VSS P5 Power/Other

VSS P21 Power/Other

VSS P24 Power/Other

VSS R1 Power/Other

VSS R4 Power/Other

VSS R6 Power/Other

VSS R22 Power/Other

VSS R25 Power/Other

VSS T3 Power/Other

VSS T5 Power/Other

VSS T21 Power/Other

VSS T23 Power/Other

VSS T26 Power/Other

VSS U2 Power/Other

VSS U6 Power/Other

VSS U22 Power/Other

VSS U24 Power/Other

VSS V1 Power/Other

VSS V4 Power/Other

VSS V5 Power/Other

VSS V21 Power/Other

VSS V25 Power/Other

VSS W3 Power/Other

VSS W6 Power/Other

VSS W22 Power/Other

VSS W23 Power/Other

VSS W26 Power/Other

VSS Y2 Power/Other

VSS Y5 Power/Other

VSS Y21 Power/Other

VSS Y24 Power/Other

VSS AA1 Power/Other

VSS AA4 Power/Other

VSS AA6 Power/Other

VSS AA8 Power/Other

VSS AA10 Power/Other

Table 4-3. Pin Listing by Pin Name

Pin Name Pin

Number Signal Buffer

Type Direction

VSS AA12 Power/Other

VSS AA14 Power/Other

VSS AA16 Power/Other

VSS AA18 Power/Other

VSS AA20 Power/Other

VSS AA22 Power/Other

VSS AA25 Power/Other

VSS AB3 Power/Other

VSS AB5 Power/Other

VSS AB7 Power/Other

VSS AB9 Power/Other

VSS AB11 Power/Other

VSS AB13 Power/Other

VSS AB15 Power/Other

VSS AB17 Power/Other

VSS AB19 Power/Other

VSS AB21 Power/Other

VSS AB23 Power/Other

VSS AB26 Power/Other

VSS AC2 Power/Other

VSS AC5 Power/Other

VSS AC8 Power/Other

VSS AC10 Power/Other

VSS AC12 Power/Other

VSS AC14 Power/Other

VSS AC16 Power/Other

VSS AC18 Power/Other

VSS AC21 Power/Other

VSS AC24 Power/Other

VSS AD1 Power/Other

VSS AD4 Power/Other

VSS AD7 Power/Other

VSS AD9 Power/Other

VSS AD11 Power/Other

VSS AD13 Power/Other

VSS AD15 Power/Other

VSS AD17 Power/Other

VSS AD19 Power/Other

Ta ble 4-3. Pin Listing by Pin Name

Pin Name Pin

Number Signal Buffer

Type Direction

43 Datasheet

VSS AD22 Power/Other

VSS AD25 Power/Other

VSS AE3 Power/Other

VSS AE6 Power/Other

VSS AE8 Power/Other

VSS AE10 Power/Other

VSS AE12 Power/Other

VSS AE14 Power/Other

VSS AE16 Power/Other

VSS AE18 Power/Other

VSS AE20 Power/Other

VSS AE23 Power/Other

VSS AE26 Power/Other

VSS AF2 Power/Other

VSS AF5 Power/Other

VSS AF9 Power/Other

VSS AF11 Power/Other

VSS AF13 Power/Other

VSS AF15 Power/Other

VSS AF17 Power/Other

VSS AF19 Power/Other

VSS AF21 Power/Other

VSS AF24 Power/Other

VSSSENSE AF6 Power/Other Output

Table 4-4. Pin Listing by Pin Number

Number Pin Name Signal Buffer

Type Direction

A2 VSS Power/Other

A3 IGNNE# CMOS Input

A4 IERR# Open Drain Output

A5 VSS Power/Other

A6 SLP# CMOS Input

A7 DBR# CMOS Output

A8 VSS Power/Other

A9 BPM[2]# Common Clock Output

A10 PRDY# Common Clock Output

A11 VSS Power/Other

A12 TDO Open Drain Output

Table 4-3. Pin Listing by Pin Name

Pin Name Pin

Number Signal Buffer

Type Direction

A13 TCK CMOS Input

A14 VSS Power/Other

A15 ITP_CLK[1] CMOS input

A16 ITP_CLK[0] CMOS input

A17 VSS Power/Other

A18 THERMDC Power/Other

A19 D[0]# Source Synch Input/Output

A20 VSS Power/Other

A21 D[6]# Source Synch Input/Output

A22 D[2]# Source Synch Input/Output

A23 VSS Power/Other

A24 D[4]# Source Synch Input/Output

A25 D[1]# Source Synch Input/Output

A26 VSS Power/Other

AA1 VSS Power/Other

AA2 A[16]# Source Synch Input/Output

AA3 A[14]# Source Synch Input/Output

AA4 VSS Power/Other

AA5 VCC Power/Other

AA6 VSS Power/Other

AA7 VCC Power/Other

AA8 VSS Power/Other

AA9 VCC Power/Other

AA10 VSS Power/Other

AA11 VCC Power/Other

AA12 VSS Power/Other

AA13 VCC Power/Other

AA14 VSS Power/Other

AA15 VCC Power/Other

AA16 VSS Power/Other

AA17 VCC Power/Other

AA18 VSS Power/Other

AA19 VCC Power/Other

AA20 VSS Power/Other

AA21 VCC Power/Other

AA22 VSS Power/Other

AA23 D[40]# Source Synch Input/Output

AA24 D[33]# Source Synch Input/Output

Table 4-4. Pin Listing by Pin Number

Number Pin Name Signal Buffer

Type Direction

Datasheet 44

AA25 VSS Power/Other

AA26 D[46]# Source Synch Input/Output

AB1 COMP[3] Power/Other Input/Output

AB2 COMP[2] Power/Other Input/Output

AB3 VSS Power/Other

AB4 A[24]# Source Synch Input/Output

AB5 VSS Power/Other

AB6 VCC Power/Other

AB7 VSS Power/Other

AB8 VCC Power/Other

AB9 VSS Power/Other

AB10 VCC Power/Other

AB11 VSS Power/Other

AB12 VCC Power/Other

AB13 VSS Power/Other

AB14 VCC Power/Other

AB15 VSS Power/Other

AB16 VCC Power/Other

AB17 VSS Power/Other

AB18 VCC Power/Other

AB19 VSS Power/Other

AB20 VCC Power/Other

AB21 VSS Power/Other

AB22 VCC Power/Other

AB23 VSS Power/Other

AB24 D[50]# Source Synch Input/Output

AB25 D[48]# Source Synch Input/Output

AB26 VSS Power/Other

AC1 RSVD Reserved

AC2 VSS Power/Other

AC3 A[20]# Source Synch Input/Output

AC4 A[18]# Source Synch Input/Output

AC5 VSS Power/Other

AC6 A[25]# Source Synch Input/Output

AC7 A[19]# Source Synch Input/Output

AC8 VSS Power/Other

AC9 VCC Power/Other

AC10 VSS Power/Other

Table 4-4. Pin Listing by Pin Number

Number Pin Name Signal Buffer

Type Direction

AC11 VCC Power/Other

AC12 VSS Power/Other

AC13 VCC Power/Other

AC14 VSS Power/Other

AC15 VCC Power/Other

AC16 VSS Power/Other

AC17 VCC Power/Other

AC18 VSS Power/Other

AC19 VCC Power/Other

AC20 D[51]# Source Synch Input/Output

AC21 VSS Power/Other

AC22 D[52]# Source Synch Input/Output

AC23 D[49]# Source Synch Input/Output

AC24 VSS Power/Other

AC25 D[53]# Source Synch Input/Output

AC26 RSVD Reserved

AD1 VSS Power/Other

AD2 A[23]# Source Synch Input/Output

AD3 A[21]# Source Synch Input/Output

AD4 VSS Power/Other

AD5 A[26]# Source Synch Input/Output

AD6 A[28]# Source Synch Input/Output

AD7 VSS Power/Other

AD8 VCC Power/Other

AD9 VSS Power/Other

AD10 VCC Power/Other

AD11 VSS Power/Other

AD12 VCC Power/Other

AD13 VSS Power/Other

AD14 VCC Power/Other

AD15 VSS Power/Other

AD16 VCC Power/Other

AD17 VSS Power/Other

AD18 VCC Power/Other

AD19 VSS Power/Other

AD20 DINV[3]# Source Synch Input/Output

AD21 D[60]# Source Synch Input/Output

AD22 VSS Power/Other

Ta ble 4-4. Pin Listing by Pin Number

Number Pin Name Signal Buffer

Type Direction

45 Datasheet

AD23 D[54]# Source Synch Input/Output

AD24 D[57]# Source Synch Input/Output

AD25 VSS Power/Other

AD26 GTLREF Power/Other

AE1 A[30]# Source Synch Input/Output

AE2 A[27]# Source Synch Input/Output

AE3 VSS Power/Other

AE4 A[22]# Source Synch Input/Output

AE5 ADSTB[1]# Source Synch Input/Output

AE6 VSS Power/Other

AE7 VCCSENSE Power/Other Output

AE8 VSS Power/Other

AE9 VCC Power/Other

AE10 VSS Power/Other

AE11 VCC Power/Other

AE12 VSS Power/Other

AE13 VCC Power/Other

AE14 VSS Power/Other

AE15 VCC Power/Other

AE16 VSS Power/Other

AE17 VCC Power/Other

AE18 VSS Power/Other

AE19 VCC Power/Other

AE20 VSS Power/Other

AE21 D[59]# Source Synch Input/Output

AE22 D[55]# Source Synch Input/Output

AE23 VSS Power/Other

AE24 DSTBN[3]# Source Synch Input/Output

AE25 DSTBP[3]# Source Synch Input/Output

AE26 VSS Power/Other

AF1 A[31]# Source Synch Input/Output

AF2 VSS Power/Other

AF3 A[29]# Source Synch Input/Output

AF4 A[17]# Source Synch Input/Output

AF5 VSS Power/Other

AF6 VSSSENSE Power/Other Output

AF7 RSVD Reserved

AF8 VCC Power/Other

Table 4-4. Pin Listing by Pin Number

Number Pin Name Signal Buffer

Type Direction

AF9 VSS Power/Other

AF10 VCC Power/Other

AF11 VSS Power/Other

AF12 VCC Power/Other

AF13 VSS Power/Other

AF14 VCC Power/Other

AF15 VSS Power/Other

AF16 VCC Power/Other

AF17 VSS Power/Other

AF18 VCC Power/Other

AF19 VSS Power/Other

AF20 D[58]# Source Synch Input/Output

AF21 VSS Power/Other

AF22 D[62]# Source Synch Input/Output

AF23 D[56]# Source Synch Input/Output

AF24 VSS Power/Other

AF25 D[61]# Source Synch Input/Output

AF26 D[63]# Source Synch Input/Output

B1 RSVD Reserved

B2 RSVD Reserved

B3 VSS Power/Other

B4 SMI# CMOS Input

B5 INIT# CMOS Input

B6 VSS Power/Other

B7 DPSLP# CMOS Input

B8 BPM[1]# Common Clock Output

B9 VSS Power/Other

B10 PREQ# Common Clock Input

B11 RESET# Common Clock Input

B12 VSS Power/Other

B13 TRST# CMOS Input

B14 BCLK[1] Bus Clock Input

B15 BCLK[0] Bus Clock Input

B16 VSS Power/Other

B17 PROCHOT# Open Drain Output

B18 THERMDA Power/Other

B19 VSS Power/Other

B20 D[7]# Source Synch Input/Output

Table 4-4. Pin Listing by Pin Number

Number Pin Name Signal Buffer

Type Direction

Datasheet 46

B21 D[3]# Source Synch Input/Output

B22 VSS Power/Other

B23 D[13]# Source Synch Input/Output

B24 D[9]# Source Synch Input/Output

B25 VSS Power/Other

B26 D[5]# Source Synch Input/Output

C1 VSS Power/Other

C2 A20M# CMOS Input

C3 RSVD Reserved

C4 VSS Power/Other

C5 TEST1 Test

C6 STPCLK# CMOS Input

C7 VSS Power/Other

C8 BPM[0]# Common Clock Output

C9 BPM[3]# Common Clock Input/Output

C10 VSS Power/Other

C11 TMS CMOS Input

C12 TDI CMOS Input

C13 VSS Power/Other

C14 BSEL[1] CMOS Output

C15 VSS Power/Other

C16 BSEL[0] CMOS Output

C17 THERMTRIP# Open Drain Output

C18 VSS Power/Other

C19 DPWR# Common Clock Input

C20 D[8]# Source Synch Input/Output

C21 VSS Power/Other

C22 DSTBP[0]# Source Synch Input/Output

C23 DSTBN[0]# Source Synch Input/Output

C24 VSS Power/Other

C25 D[15]# Source Synch Input/Output

C26 D[12]# Source Synch Input/Output

D1 LINT0 CMOS Input

D2 VSS Power/Other

D3 FERR# Open Drain Output

D4 LINT1 CMOS Input

D5 VSS Power/Other

D6 VCC Power/Other

Table 4-4. Pin Listing by Pin Number

Number Pin Name Signal Buffer

Type Direction

D7 VSS Power/Other

D8 VCC Power/Other

D9 VSS Power/Other

D10 VCCP Power/Other

D11 VSS Power/Other

D12 VCCP Power/Other

D13 VSS Power/Other

D14 VCCP Power/Other

D15 VSS Power/Other

D16 VCCP Power/Other

D17 VSS Power/Other

D18 VCC Power/Other

D19 VSS Power/Other

D20 VCC Power/Other

D21 VSS Power/Other

D22 VCC Power/Other

D23 VSS Power/Other

D24 D[10]# Source Synch Input/Output

D25 DINV[0]# Source Synch Input/Output

D26 VSS Power/Other

E1 PSI# CMOS Output

E2 VID[0] CMOS Output

E3 VSS Power/Other

E4 PWRGOOD CMOS Input

E5 VCC Power/Other

E6 VSS Power/Other

E7 VCC Power/Other

E8 VSS Power/Other

E9 VCC Power/Other

E10 VSS Power/Other

E11 VCCP Power/Other

E12 VSS Power/Other

E13 VCCP Power/Other

E14 VSS Power/Other

E15 VCCP Power/Other

E16 VSS Power/Other

E17 VCC Power/Other

E18 VSS Power/Other

Ta ble 4-4. Pin Listing by Pin Number

Number Pin Name Signal Buffer

Type Direction

47 Datasheet

E19 VCC Power/Other

E20 VSS Power/Other

E21 VCC Power/Other

E22 VSS Power/Other

E23 D[14]# Source Synch Input/Output

E24 D[11]# Source Synch Input/Output

E25 VSS Power/Other

E26 RSVD Reserved

F1 VSS Power/Other

F2 VID[1] CMOS Output

F3 VID[2] CMOS Output

F4 VSS Power/Other

F5 VSS Power/Other

F6 VCC Power/Other

F7 VSS Power/Other

F8 VCC Power/Other

F9 VSS Power/Other

F10 VCCP Power/Other

F11 VSS Power/Other

F12 VCCP Power/Other

F13 VSS Power/Other

F14 VCCP Power/Other

F15 VSS Power/Other

F16 VCCP Power/Other

F17 VSS Power/Other

F18 VCC Power/Other

F19 VSS Power/Other

F20 VCC Power/Other

F21 VSS Power/Other

F22 VCC Power/Other

F23 TEST2 Test

F24 VSS Power/Other

F25 D[21]# Source Synch Input/Output

F26 VCCA Power/Other

G1 RSVD Reserved

G2 VSS Power/Other

G3 VID[3] CMOS Output

G4 VID[4] CMOS Output

Table 4-4. Pin Listing by Pin Number

Number Pin Name Signal Buffer

Type Direction

G5 VCC Power/Other

G6 VSS Power/Other

G21 VCC Power/Other

G22 VSS Power/Other

G23 VSS Power/Other

G24 D[22]# Source Synch Input/Output

G25 D[17]# Source Synch Input/Output

G26 VSS Power/Other

H1 RS[0]# Common Clock Input

H2 DRDY# Common Clock Input/Output

H3 VSS Power/Other

H4 VID[5] CMOS Output

H5 VSS Power/Other

H6 VCC Power/Other

H21 VSS Power/Other

H22 VCC Power/Other

H23 D[16]# Source Synch Input/Output

H24 D[20]# Source Synch Input/Output

H25 VSS Power/Other

H26 D[29]# Source Synch Input/Output

J1 VSS Power/Other

J2 LOCK# Common Clock Input/Output

J3 BPRI# Common Clock Input

J4 VSS Power/Other

J5 VCC Power/Other

J6 VSS Power/Other

J21 VCC Power/Other

J22 VSS Power/Other

J23 D[23]# Source Synch Input/Output

J24 VSS Power/Other

J25 D[25]# Source Synch Input/Output

J26 DINV[1]# Source Synch Input/Output

K1 RS[1]# Common Clock Input

K2 VSS Power/Other

K3 HIT# Common Clock Input/Output

K4 HITM# Common Clock Input/Output

K5 VSS Power/Other

K6 VCCP Power/Other

Table 4-4. Pin Listing by Pin Number

Number Pin Name Signal Buffer

Type Direction

Datasheet 48

K21 VSS Power/Other

K22 VCC Power/Other

K23 VSS Power/Other

K24 DSTBN[1]# Source Synch Input/Output

K25 D[31]# Source Synch Input/Output

K26 VSS Power/Other

L1 BNR# Common Clock Input/Output

L2 RS[2]# Common Clock Input

L3 VSS Power/Other

L4 DEFER# Common Clock Input

L5 VCCP Power/Other

L6 VSS Power/Other

L21 VCCP Power/Other

L22 VSS Power/Other

L23 D[18]# Source Synch Input/Output

L24 DSTBP[1]# Source Synch Input/Output

L25 VSS Power/Other

L26 D[26]# Source Synch Input/Output

M1 VSS Power/Other

M2 DBSY# Common Clock Input/Output

M3 TRDY# Common Clock Input

M4 VSS Power/Other

M5 VSS Power/Other

M6 VCCP Power/Other

M21 VSS Power/Other

M22 VCCP Power/Other

M23 D[24]# Source Synch Input/Output

M24 VSS Power/Other

M25 D[28]# Source Synch Input/Output

M26 D[19]# Source Synch Input/Output

N1 RSVD Reserved

N2 ADS# Common Clock Input/Output

N3 VSS Power/Other

N4 BR0# Common Clock Input/Output

N5 VCCP Power/Other

N6 VSS Power/Other

N21 VCCP Power/Other

N22 VSS Power/Other

Table 4-4. Pin Listing by Pin Number

Number Pin Name Signal Buffer

Type Direction

N23 VSS Power/Other

N24 D[27]# Source Synch Input/Output

N25 D[30]# Source Synch Input/Output

N26 VSS Power/Other

P1 REQ[3]# Source Synch Input/Output

P2 VSS Power/Other

P3 REQ[1]# Source Synch Input/Output

P4 A[3]# Source Synch Input/Output

P5 VSS Power/Other

P6 VCCP Power/Other

P21 VSS Power/Other

P22 VCCP Power/Other

P23 VCCQ[0] Power/Other

P24 VSS Power/Other

P25 COMP[0] Power/Other Input/Output

P26 COMP[1] Power/Other Input/Output

R1 VSS Power/Other

R2 REQ[0]# Source Synch Input/Output

R3 A[6]# Source Synch Input/Output

R4 VSS Power/Other

R5 VCCP Power/Other

R6 VSS Power/Other

R21 VCCP Power/Other

R22 VSS Power/Other

R23 D[39]# Source Synch Input/Output

R24 D[37]# Source Synch Input/Output

R25 VSS Power/Other

R26 D[38]# Source Synch Input/Output

T1 REQ[4]# Source Synch Input/Output

T2 REQ[2]# Source Synch Input/Output

T3 VSS Power/Other

T4 A[9]# Source Synch Input/Output

T5 VSS Power/Other

T6 VCCP Power/Other

T21 VSS Power/Other

T22 VCCP Power/Other

T23 VSS Power/Other

T24 DINV[2]# CMOS Input/Output

Ta ble 4-4. Pin Listing by Pin Number

Number Pin Name Signal Buffer

Type Direction

49 Datasheet

T25 D[34]# Source Synch Input/Output

T26 VSS Power/Other

U1 A[13]# Source Synch Input/Output

U2 VSS Power/Other

U3 ADSTB[0]# Source Synch Input/Output

U4 A[4]# Source Synch Input/Output

U5 VCC Power/Other

U6 VSS Power/Other

U21 VCCP Power/Other

U22 VSS Power/Other

U23 D[35]# Source Synch Input/Output

U24 VSS Power/Other

U25 D[43]# Source Synch Input/Output

U26 D[41]# Source Synch Input/Output

V1 VSS Power/Other

V2 A[7]# Source Synch Input/Output

V3 A[5]# Source Synch Input/Output

V4 VSS Power/Other

V5 VSS Power/Other

V6 VCC Power/Other

V21 VSS Power/Other

V22 VCC Power/Other

V23 D[36]# Source Synch Input/Output

V24 D[42]# Source Synch Input/Output

V25 VSS Power/Other

V26 D[44]# Source Synch Input/Output

W1 A[8]# Source Synch Input/Output

W2 A[10]# Source Synch Input/Output

W3 VSS Power/Other

W4 VCCQ[1] Power/Other

W5 VCC Power/Other

W6 VSS Power/Other

W21 VCC Power/Other

W22 VSS Power/Other

W23 VSS Power/Other

W24 DSTBP[2]# Source Synch Input/Output

W25 DSTBN[2]# Source Synch Input/Output

W26 VSS Power/Other

Table 4-4. Pin Listing by Pin Number

Number Pin Name Signal Buffer

Type Direction

Y1 A[12]# Source Synch Input/Output

Y2 VSS Power/Other

Y3 A[15]# Source Synch Input/Output

Y4 A[11]# Source Synch Input/Output

Y5 VSS Power/Other

Y6 VCC Power/Other

Y21 VSS Power/Other

Y22 VCC Power/Other

Y23 D[45]# Source Synch Input/Output

Y24 VSS Power/Other

Y25 D[47]# Source Synch Input/Output

Y26 D[32]# Source Synch Input/Output

Table 4-4. Pin Listing by Pin Number

Number Pin Name Signal Buffer

Type Direction

50 Datasheet

Contents

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Datasheet 51

4.2 Alphabetical Signals Reference

Table 4-5. Signal Description (Sheet 1 of 7)

Name Type Description

A[31:3]# Input/

Output A[31:3]# (Address) define a 232-byte physical memory address space. In sub-

phase 1 of the address phase, these pins transmit the address of a transaction.

In sub-phase 2, these pins tran smit transaction type information. These signals

must connect the appropriate pins of both agents on Intel® Pentium® M

Processor FSB. A[31:3]# are source synchronous signals and are latched into

the receiving buffers by ADSTB[1:0]#. Address signals are used as straps which

are sampled before RESET# is deasserted.

A20M# Input If A20M# (Address-20 Mask) is asserted, the processor masks physical address

bit 20 (A20#) before looking up a line in any internal cache and before driving a

read/write transaction on the bus. Asserting A20M# emulates the 8086

processor's address wrap-around at the 1-Mbyte boundary. Assertion of A20M#

is only supported in real mode.

A20M# is an asynchronous signal. However, to ensure recognition of this signal

following an Input/Output write instruction, it must be valid along with the TRDY#

assertion of the corresponding Input/Output Write bus transaction.

ADS# Input/

Output ADS# (Address Strobe) is asserted to indicate the validity of the transaction

address on the A[31:3]# and REQ[4:0]# pins. All bus agents observe the ADS#

activation to begin parity checking, protocol checking, address decode, internal

snoop, or deferred reply ID match operations associated with the new

transaction.

ADSTB[1:0]# Input/

Output Address strobes are used to latch A[31:3]# and REQ[4:0]# on their rising and

falling edges. Strobes are associated with signals as shown below.

BCLK[1:0] Input The differential pair BCLK (Bus Clock) determines the FSB frequency. All FSB

agents must receive these signals to drive their outputs and latch their inputs.

All external timing parameters are specified with respect to the rising edge of

BCLK0 crossing VCROSS.

BNR# Input/

Output BNR# (Block Next Request) is used to assert a bus stall by any bus agent who is

unable to accept new bus transactions. During a bus stall, the current bus owner

cannot issue any new transactions.

BPM[2:0]#

BPM[3] Output

Input/

Output

BPM[3:0]# (Breakpoint Monitor) are breakpoint and performance monitor

signals. They are outputs from the processor which indicate the status of

breakpoints and programmable counters used for monitoring processor

performance. BPM[3:0]# should connect the appropriate pins of all Intel®

Pentium® M FSB agents.This includes debug or performance monitoring tools.

BPRI# Input BPRI# (Bus Priority Request) is used to arbitrate for ownership of the FSB. It

must connect the appropriate pins of both FSB agents. Observing BPRI# active

(as asserted by the priority agent) causes the other agent to stop issuing new

requests, unless such requests are part of an ongoing locked operation. The

priority agent keeps BPRI# asserted until all of its requests are completed, then

releases the bus by deasserting BPRI#.

BR0# Input/

Output BR0# is used by the processor to request the bus. The arbitration is done

between Intel® Pentium® M (Symmetric Agent) and Intel® 915PM/GM and Intel®

915GMS Express chipset GMCH-M (High Priority Agent).

Signals Associated Strobe

REQ[4:0]#, A[16:3]# ADSTB[0]#

A[31:17]# ADSTB[1]#

52 Datasheet

BSEL[1:0] Output BSEL[1:0] (Bus Select) are used to select the processor input clock frequency.

Table 3-2 defines the possible combinations of the signals and the frequency

associated with each combination. The r equired frequency is determined by the

processor, chipset and clock synthesizer. All agents must operate at the same

frequency. The Pentium M Processor operates at a 533-MHz front side bus

frequency (133 MHz BCLK).

COMP[3:0] Analog COMP[3:0] must be terminated on the system board using precision (1%

tolerance) resistors.

D[63:0]# Input/

Output D[63:0]# (Data) are the data signals. These signals provide a 64-bit data path

between the FSB agents, and must connect the appropriate pins on both agents.

The data driver asserts DRDY# to indicate a valid data transfer.

D[63:0]# are quad-pumped signals and will thus be driven four times in a

common clock period. D[63:0]# are latched off the falling edge of both

DSTBP[3:0]# and DSTBN[3:0]#. Each group of 16 data signals correspond to a

pair of one DSTBP# and one DSTBN#. The following table shows the grouping

of data signals to data strobes and DINV#.

Furthermore, the DINV# pins determine the polarity of the data signals. Each

group of 16 data signals corresponds to one DINV# signal. When the DINV#

signal is active, the corresponding data group is inverted and therefore sampled

active high.

DBR# Output DBR# (Data Bus Reset) is used only in processor systems where no debug port

is implemented on the system board. DBR# is used by a debug port interposer

so that an in-target probe can drive system reset. If a debug port is implemented

in the system, DBR# is a no connect in the system. DBR# is not a processor

signal.

DBSY# Input/

Output DBSY# (Data Bus Busy) is asserted by the agent responsible for driving data on

the FSB to indicate that the data bus is in use. The data bus is released after

DBSY# is deasserted. This signal must connect the appropriate pins on both

FSB agents.

DEFER# Input DEFER# is asserted by an agent to indicate that a transaction cannot be

guaranteed in-order completion. Assertion of DEFER# is normally the

responsibility of the addressed memory or Input/Output agent. This signal must

connect the appropriate pins of both FSB agents.

Table 4-5. Signal Description (Sheet 2 of 7)

Name Type Description

Quad-Pumped Signal Groups

Data Group DSTBN#/

DSTBP# DINV#

D[15:0]# 0 0

D[31:16]# 1 1

D[47:32]# 2 2

D[63:48]# 3 3

Datasheet 53

DINV[3:0]# Input/

Output DINV[3:0]# (Data Bus Inversion) are source synchronous and indicate the

polarity of the D[63:0]# signals. The DINV[3:0]# signals are activated when the

data on the data bus is inverted. The bus agent will invert the data bus signals if

more than half the bits, within the covered group, would change level in the next

cycle.

DPSLP# Input DPSLP# when asserted on the platform causes the processor to transition from

the Sleep State to the Deep Sleep state. In order to return to the Sleep State,

DPSLP# must be deasserted. DPSLP# is driven by the ICH6-M chipset.

DPWR# Input DPWR# is a control signal from the Intel® 915PM/GM/GMS Express chipsets

used to reduce power on Intel® Pentium® M data bus input buffers.

DRDY# Input/

Output DRDY# (Data Ready) is asserted by the data driver on each data transfer,

indicating valid data on the data bus. In a multi-common clock data transfer,

DRDY# may be deasserted to insert idle clocks. This signal must connect the

appropriate pins of both FSB agents.

DSTBN[3:0]# Input/

Output Data strobe used to latch in D[63:0]#.

DSTBP[3:0]# Input/

Output Data strobe used to latch in D[63:0]#.

Table 4-5. Signal Description (Sheet 3 of 7)

Name Type Description

DINV[3:0]# Assignment To Data Bus

Bus Signal Data Bus Signals

DINV[3]# D[63:48]#

DINV[2]# D[47:32]#

DINV[1]# D[31:16]#

DINV[0]# D[15:0]#

Signals Associated Strobe

D[15:0]#, DINV[0]# DSTBN[0]#

D[31:16]#, DINV[1]# DSTBN[1]#

D[47:32]#, DINV[2]# DSTBN[2]#

D[63:48]#, DINV[3]# DSTBN[3]#

Signals Associated Strobe

D[15:0]#, DINV[0]# DSTBP[0]#

D[31:16]#, DINV[1]# DSTBP[1]#

D[47:32]#, DINV[2]# DSTBP[2]#

D[63:48]#, DINV[3]# DSTBP[3]#

54 Datasheet

FERR#/PBE# Output FERR# (Floating-point Error)PBE#(Pending Break Event) is a multiplexed signal

and its meaning is qualified with STPCLK#. When STPCLK# is not asserted,

FERR#/PBE# indicates a floating point when the processor detects an

unmasked floating-point error. FERR# is similar to the ERROR# signal on the

Intel 387 coprocessor, and is included for compatibility with systems using MS-

DOS*-type floating-point error reporting. When STPCLK# is asserted, an

assertion of FERR#/PBE# indicates that the processor has a pending break

event waiting for service. The assertion of FERR#/PBE# indicates that the

processor should be returned to the Normal state. When FERR#/PBE# is

asserted, indicating a break event, it will remain asserted until STPCLK# is

deasserted. Assertion of PREQ# when STPCLK# is active will also cause an

FERR# break event.

For additional information on the pending break event functionality, including

identification of support of the f eature and enable/disable information, refer to

V olume 3 of the Intel  Architecture Software Developer’s Manual and the Intel 

Processor Identification and CPUID Instruction application note.

GTLREF Input GTLREF determines the signal reference level for AGTL+ input pin s. GTLREF

should be set at 2/3 VCCP. GTLREF is used by the AGTL+ receivers to determine

if a signal is a logical 0 or logical 1.

HIT#

HITM#

Input/

Output

Input/

Output

HIT# (Snoop Hit) and HITM# (Hit Modified) convey transaction snoop operation

results. Either FSB agent may assert both HIT# and HITM# together to indicate

that it requires a snoop stall, which can be continued by reasserting HIT# and

HITM# together.

IERR# Output IERR# (Internal Error) is asserted by a processor as the result of an internal

error. Assertion of IERR# is usually accompanied by a SHUTDOWN transaction

on the FSB. This transaction may optionally be converted to an external error

signal (e.g., NMI) by system core logic. The processor will keep IERR# asserted

until the assertion of RESET#, BINIT#, or INIT#.

IGNNE# Input IGNNE# (Ignore Numeric Error) is asserted to force the processor to ignore a

numeric error and continue to execute noncontrol floating-point instructions. If

IGNNE# is deasserted, the processor generates an exception on a noncontrol

floating-point instruction if a previous floating-point instruction caused an error.

IGNNE# has no effect when the NE bit in control register 0 (CR0) is set.

IGNNE# is an asynchronous signal. However, to ensure recognition of this signal

following an Input/Output write instruction, it must be valid along with the TRDY#

assertion of the corresponding Input/Output Write bus transaction.

INIT# Input INIT# (Initialization), when asserted, resets integer registers inside the processor

without affecting its internal caches or floating-point registers. The processor

then begins execution at the power-on Reset vector configured during power-on

configuration. The processor continues to handle snoop r equests during INIT#

assertion. INIT# is an asynchronous signal. However, to ensure recognition of

this signal following an Input/Output Write instruction, it must be valid along with

the TRDY# assertion of the corresponding Input/Output Write bus transaction.

INIT# must connect the appropriate pins of both FSB agents.

If INIT# is sampled active on the active to inactive transition of RESET#, then the

processor executes its Built-in Self-Test (BIST).

ITP_CLK[1:0] Input ITP_CLK[1:0] are copies of BCLK that are used only in processor systems

where no debug port is implemented on the system board. ITP_CLK[1:0] are

used as BCLK[1:0] references for a debug port implemented on an interposer . If

a debug port is implemented in the system, ITP_CLK[1:0] are no connects in the

system. These are not processor signals.

Table 4-5. Signal Description (Sheet 4 of 7)

Name Type Description

Datasheet 55

LINT[1:0] Input LINT[1:0] (Local APIC Interrupt) must connect the appropriate pins of all APIC

Bus agents. When the APIC is disabled, the LINT0 signal becomes INTR, a

maskable interrupt request signal, and LINT1 becomes NMI, a nonmaskable

interrupt. INTR and NMI are backward compatible with the signals of those

names on the Pentium Processor. Both signals are asynchronous.

Both of these signals must be software configured via BIOS programming of the

APIC register space to be used either as NMI/INTR or LINT[1:0]. Because the

APIC is enabled by default after Reset, operation of these pins as LINT[1:0] is

the default configuration.

LOCK# Input/

Output LOCK# indicates to the system that a transaction must occur atomically. This

signal must connect the appropriate pins of both FSB agents. For a locked

sequence of transactions, LOCK# is asserted from the beginning of the first

transaction to the end of the last transaction.

When the priority agent asserts BPRI# to arbitrate for ownership of the FSB, it

will wait until it observes LOCK# deasserted. This enables symmetric agents to

retain ownership of the FSB throughout the bus locked operation and ensure the

atomicity of lock.

PRDY# Output Probe Ready signal used by debug tools to determine processor debug

readiness.

PREQ# Input Probe Request signal used by debug tools to request debug operation of the

processor.

PROCHOT# Output PROCHOT# (Processor Hot) will go active when the processor temperature

monitoring sensor detects that the processor has reached its maximum safe

operating temperature. This indicates that the processor Thermal Control Circuit

has been activated, if enabled. See Chapter 5 for more details.

This signal may require voltage translation on the motherboard.

PSI# Output Processor Power Status Indicator signal. This signal is asserted when the

processor is in a lower state (Deep Sleep and Deeper Sleep). See Section 2.1.5

for more details.

PWRGOOD Input PWRGOOD (Power Good) is a processor input. The processor requires this

signal to be a clean indication that the clocks and power supplies are stable and

within their specifications. ‘Clean’ implies that the signal will remain low (capable

of sinking leakage current), without glitches, from the time that the power

supplies are turned on until they come within specification. The signal must then

transition monotonically to a high state.

The PWRGOOD signal must be supplied to the processor; it is used to protect

internal circuits against voltage sequencing issues. It should be driven high

throughout boundary scan operation.

REQ[4:0]# Input/

Output REQ[4:0]# (Request Command) must connect the appropriate pins of both FSB

agents. They are asserted by the current bus owner to define the currently active

transaction type. These signals are sour ce synchronous to ADSTB[0]#.

RESET# Input Asserting the RESET# signal resets the processor to a known state and

invalidates its internal caches without writing back any of their contents. For a

power-on Reset, RESET# must stay active for at least two milliseconds after

VCC and BCLK have reached their proper specifications. On observing active

RESET#, both FSB agents will deassert their outputs within two clocks. All

processor straps must be valid within the specified setup ti me before RESET# is

deasserted.

There is a 55 ohm (nominal) on die pullup resistor on this signal.

RS[2:0]# Input RS[2:0]# (Response Status) are driven by the response agent (the agent

responsible for completion of the current transaction), and must connect the

appropriate pins of both FSB agents.

Table 4-5. Signal Description (Sheet 5 of 7)

Name Type Description

56 Datasheet

RSVD Reserved/

Connect

These pins are RESERVED and must be left unconnected on the board.

However, it is recommended that routing channels to these pins on the board be

kept open for possible future use. Please refer to the platform design guide for

more details.

SLP# Input SLP# (Sleep), when asserted in Stop-Grant state, causes the processor to enter

the Sleep state. During Sleep state, the processor stops providing internal clock

signals to all units, leaving only the Phase-Locked Loop (PLL) still operating.

Processors in this state will not recognize snoops or interrupts. The processor

will recognize only assertion of the RESET# signal, deassertion of SLP#, and

removal of the BCLK input while in Sleep state. If SLP# is deasserted, the

processor exits Sleep state and returns to Stop-Grant state, rest arting its internal

clock signals to the bus and processor core units. If DPSLP# is asserted while in

the Sleep state, the processor will exit the Sleep state and transition to the Deep

Sleep state.

SMI# Input SMI# (System Management Interrupt) is asserted asynchronously by system

logic. On accepting a System Management Interrupt, the processor saves the

current state and enter System Management Mode (SMM). An SMI

Acknowledge transaction is issued, and the processor begins program execution

from the SMM handler.

If SMI# is asserted during the deassertion of RESET# the processor will tristate

its outputs.

STPCLK# Input STPCLK# (Stop Clock), when asserted, causes the processor to enter a low

power Stop-Grant state. The processor issues a Stop-Grant Acknowledge

transaction, and stops providing internal clock signals to all processor core units

except the FSB and APIC units. The processor continues to snoop bus

transactions and service interrupts while in Stop-Grant state. When STPCLK# is

deasserted, the processor restarts its internal clock to all units and resumes

execution. The assertion of STPCLK# has no effect on the bus clock; STPCLK#

is an asynchronous input.

TCK Input TCK (Test Clock) provides the clock input for the processor Test Bus (also

known as the Test Access Port).

Please refer to the platform design guide for termination requirements and

implementation details.

TDI Input TDI (Test Data In) transfers serial test data into the processor. TDI provides the

serial input needed for JTAG specification support.

Please refer to the platform design guide for termination requirements and

implementation details.

TDO Output TDO (Test Data Out) transfers serial test data out of the processor. TDO

provides the serial output needed for JTAG specification support.

Please refer to the platform design guide for termination requirements and

implementation details.

TEST1,

TEST2 Input TEST1 and TEST2 must have a stuffing option of sep arate pull down resistors to

VSS. Please refer to the platform design guide for more details.

THERMDA Other Thermal Diode Anode.

THERMDC Other Thermal Diode Cathode.

THERMTRIP# Output The processor protects itself from catastrophic overheating by use of an internal

thermal sensor. This sensor is set w ell above the normal operating temperature

to ensure that there are no false trips. The processor will stop all execution when

the junction temperature exceeds approximately 125 °C. This is signalled to the

system by the THERMTRIP# (Thermal Trip) pin.

For termination requirements please refer to the platform design guide .

Table 4-5. Signal Description (Sheet 6 of 7)

Name Type Description

Datasheet 57

TMS Input TMS (Test Mode Select) is a JTAG specification support signal used by debug

tools.

Please refer to the platform design guide for termination requirements and

implementation details.

TRDY# Input TRDY# (Target Ready) is asserted by the target to indicate that it is ready to

receive a write or implicit writeback data transfer. TRDY# must connect the

appropriate pins of both FSB agents.

TRST# Input TRST# (Test Reset) resets the Test Access Port (TAP) logic. TRST# must be

driven low during power on Reset. Please refer to the platform design guide for

termination requirements and implementation details.

VCC Input Processor core power supply.

VCCA Input VCCA provides isolated power for the internal processor core PLL’s. Pins

previously named VCCA[3:1] pins are now reserved and should be left

unconnected on the board. Refer to the platform design guide for complete

implementation details.

VCCP Input Processor I/O Power Supply.

VCCQ[1:0] Input Quiet power supply for on die COMP circuitry. These pins should be connected

to VCCP on the motherboard. However , these connections should enable addition

of decoupling on the VCCQ lines if necessary.

VCCSENSE Output VCCSENSE is an isolated low impedance connection to processor core power

(VCC). It can be used to sense or measure power near the silicon with little noise.

Please refer to the platform design guide for termination recommendations and

more details.

VID[5:0] Output VID[5:0] (Voltage ID) pins are used to support automatic selection of power

supply voltages (Vcc). Unlike some previous generations of processors, these

are CMOS signals that are driven by Pentium M Processor. The voltage supply

for these pins must be valid before the VR can supply Vcc to the processor.

Conversely, the VR output must be disabled until the voltage supply for the VID

pins becomes valid. The VID pins are needed to support the processor voltage

specification variations. See Table 3-2 for definitions of these pins. The VR must

supply the voltage that is requested by the pins, or disable itself.

VSSSENSE Output VSSSENSE is an isolated low impedance connection to processor core VSS. It can

be used to sense or measure ground near the silicon with little noise. Please

refer to the platform design guide for termination recommendations and more

details.

Table 4-5. Signal Description (Sheet 7 of 7)

Name Type Description

58 Datasheet

Datasheet 59

Thermal Specifications and Design Considerations

5Thermal Specifications and

Design Considerations

The Pentium M Processor requires a thermal solution to maintain temperatures within operating

limits as set forth in Section 5.1. Any attempt to operate that processor outside these operating

limits may result in permanent damage to the processor and potentially other components in the

system. As processor technology changes, thermal management becomes increasingly crucial

when building computer systems. Maintaining the proper thermal environment is key to reliable,

long-term system operation. A complete thermal solution includes both component and system

level thermal management features. Component level thermal solu tions include active or passive

heatsinks or heat exchangers attached to the processor exposed die. The solution should make firm

contact to the die while maintaining processor mechanical specifications such as pressure. A

typical system level thermal solution may consist of a processor fan ducted to a heat exchanger that

is thermally coupled to the processor via a heat pipe or direct die attachment. A secondar y fan or air

from the processor fan may also be used to cool other platform components or lower th e internal

ambient temperature within the system.

To allow for the optimal operation and long-term reliability of Intel processor-based systems, the

system/processor thermal sol ution should be designed such that the processor must remain within

the minimum and maximum junction temperature (Tj) specifi cations at the corresponding therm a l

design power (TDP) value listed in Table 5-1. Thermal solutions not design to provide this level of

thermal capability may affect the long-term reliability of the processor and system.

The maximum junction temperature is defined by an activation of the processor Intel Thermal

Monitor. Refer to Section 5.1.3 for more details. Analysis indicates that real applications are

unlikely to cause the processor to consume the theoretical maximum power dissipation for

sustained time periods. Int el recommends that complete thermal solution designs target the TDP

indicated in Table 5-1. The Intel Thermal Monitor feature is designed to help protect the processor

in the unlikely event that an application exceeds the TDP recommendation for a sustained period of

time. For more details on the usage of this feature, refer to Section 5.1.3. In all cases the Intel

Thermal Monitor feature must be enabled for the processor to remain within specification.

60 Datasheet

Thermal Specifications and Design Considerations

NOTES:

1. The TDP specification should be used to design the processor thermal solution. The TDP is not the maximum

theoretical power the processor can dissipate.

2. Not 100% tested. These power specifications are determined by characterization of the processor currents at

higher temperatures and extrapolating the values for the temperature indicated.

3. As measured by the on-die Intel Thermal Monitor. The Intel Thermal Monitor’s automatic mode is used to

indicate that the maximum TJ has been reached. Refer to Section 5.1 for more details.

4. The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within

specifications.

Table 5-1. Power Specifications for Intel® Pentium® M Processor

Symbol Processor Number Core Frequency

& Voltage Thermal Design

Power Unit Notes

TDP 780 2.26 GHz & HFM Vcc 27 W At 100 °C, Notes

1, 4

770 2.13 GHz & HFM Vcc 27

760 2.00 GHz & HFM Vcc 27

750 1.86 GHz & HFM Vcc 27

740 1.73 GHz & HFM Vcc 27

730 1.60 GHz & HFM Vcc 27

Not Applicable 800 MHz & LFM Vcc 10.8

Symbol Parameter Min Typ Max Unit Notes

PAH,

PSGNT

Auto Halt, Stop Grant Power W At 50 °C, Note 2

at LFM Vcc 5.1

at HFM Vcc 16.2

PSLP Sleep Power W At 50 °C, Note 2

at LFM Vcc 4.9

at HFM Vcc 15.8

PDSLP Deep Sleep Power W At 35 °C, Note 2

at LFM Vcc 3.7

at HFM Vcc 12.2

PDPRSLP1 Deeper Sleep Power @0.748 V 1.2 W At 35 °C, Note 2

PDPRSLP2 Deeper Sleep Power @0.726 V 1.1 W At 35 °C, Note 2

TJJunction Temperature 0 100 C Notes 3, 4

Datasheet 61

Thermal Specifications and Design Considerations

5.1 Thermal Specifications

5.1.1 Thermal Diode

The Pentium M Processor incorporates two methods of monitoring die temperature, the Intel®

Thermal Monitor and the thermal diode. The Intel Thermal Monitor (detailed in Section 5.1) must

be used to determine when the maximum specified processor junction temperature has been

reached. The second method, the thermal diode, can be read by an off-die analog/digital converter

(a thermal sensor) located on the motherboard, or a stand-alone measurement kit. The thermal

diode may be used to monitor the die temperature of the processor for thermal management or

instrumentation purposes but cannot be used to indicat e that the m aximum TJ of the processor has

been reached. When using the thermal diode, a temperature offset value must be read from a

processor Model Specific Register (MSR) and applied. See Section 6.1.2 for more details. Please

see Section 5.1.3 for thermal diode usage recommendation when the PROCHOT# signal is not

asserted.

Table 5-2 and Table 5-3 provide the diode interface and specifications.

Note: The reading of the external thermal sensor (on the motherboard) connected to the processor

thermal diode signals, will not necessarily reflect the temperature of the hottest location on the die.

This is due to inaccuracies in the external thermal sensor , on-die temperature gradients between the

location of the thermal diode and the hottest location on the die, and time based variations in the die

temperature measurement. Time based variations can occur when the sampling rate of the thermal

diode (by the thermal sensor) is slower than the rate at which the TJ temperature can change.

Offse t between the thermal diode based temperature reading and the Intel Thermal Monitor reading

may be characterized using the Intel Thermal Monitor’s Automatic mode activation of therm a l

control circuit. This temperature offset must be taken into account when using the processo r

thermal diode to implement power management events.

5.1.2 Thermal Diode Offset

A temperature offset value (specified as Toffset in Table 5-3) will be programmed into a the

Pentium M Processor Model Specific Register (MSR). This offset is determined by using a thermal

diode ideality factor mean value of n = 1.0022 (shown in Table 5-3) as a reference. This of fset must

be applied to the junction temperature read by the thermal diode. Any temperature adjustments due

to differences between the reference ideality value of 1.0022 and the default ideality values

programmed into the on-board thermal sensors, will have to be made before the above offset is

applied.

Table 5-2. Thermal Diode Interface

Signal Name Pin/Ball Number Signal Description

THERMDA B18 Ther mal diode anode

THERMDC A18 Thermal diode cathode

62 Datasheet

Thermal Specifications and Design Considerations

NOTES:

1. Intel does not support or recommend operation of the thermal diode under reverse bias. Intel does not

support or recommend operation of the thermal diode when the processor power supplies are not within their

specified tolerance range.

2. Characterized at 100 °C.

3. Not 100% te sted. Specified by design/characterization.

4. The ideality factor, n, represents the deviation from ideal diode behavior as exemplified by the diode

equation:

IFW=Is *(e(qVD/nkT) -1)

Where IS = saturation current, q = electronic charge, VD = volt age across the diode, k = Boltzmann Const ant,

and T = absolute temperature (Kelvin) .

Value shown in the table is not the Pentium M Processor thermal diode ideality factor. It is a reference value

used to calculate Pentium M thermal diode temperature offset.

5. The series resistance, RT, is provided to allow for a more accurate measurement of the diode junction

temperature. RT as defined includes the pins of the processor but does not include any socket resistance or

board trace resistance between the socket and the external remote diode thermal sensor. RT can be used by

remote diode thermal sensors with automatic series resistance cancellation to calibrate out this error term.

Another application is that a temperature offset can be manually calculated and programmed into an offset

Terror = [RT*(N-1)*IFWmin]/[(no/q)*ln N]

6. Offset value is programmed in processor Model Specific Register.

5.1.3 Intel® Thermal Monitor

The Intel® Thermal Monitor helps control the processor temperature by activating the TCC when

the processor silicon reaches its maximum operating temperature. The temperature at which Intel

Thermal Monitor activates the thermal control circuit is not user confi gurable and is not software

visible. Bus traffic is snooped in the normal manner, and interrupt requests are latched (and

serviced during the time that the clocks are on) while the TCC is active.

With a properly designed and char acterized thermal solution, it is anticipated that the TCC would

only be activated for very short periods of time when running the m ost power intensive

applications. The processor performance impact due to these brief peri od s of TCC activation is

expected to be so minor that it would not be detectable. An under-designed thermal solution that is

not able to prevent excessive activation of the TCC in the anticipated ambient environment may

cause a noticeable performance loss, and may affect the long-term reliability of the processor. In

addition, a thermal solution that is significantly under desig ned may not be capable of cooling the

processor even when the TCC is active continuously.

The Intel Thermal Monitor controls the processor temperature by modulating (starting and

stopping) t he pr o cesso r core clocks or by initiating an Enhanced Intel SpeedStep Technology

transition when the processor silicon reaches its maximum operating temperature. The Intel

Thermal Monitor uses two modes to activate the TCC: Automatic mode and on-demand mode. If

both modes are activated, Automatic mode takes precedence.

Table 5-3. Thermal Diode Specifications

Symbol Parameter Min Typ Max Unit Notes

IFW Forward Bias Current 5 300 ANote 1

Toffset Thermal diode temperature

offset -4 11 °C 2, 6

n Reference Diode Ideality

Factor used to calculate

temperature offset

1.0022 Notes 2, 3,

RTSeries Resistance 3.06 ohms 2, 3, 5

Datasheet 63

Thermal Specifications and Design Considerations

Note: The Intel Thermal Monitor automatic mode must be enabled through BIOS for the processor to be

operating within specifications.

There are two automatic modes called Intel Thermal Monitor 1 and Intel Thermal Monitor 2. These

modes are selected by writing values to the Model Specific Registers (MSRs) of the processor.

After Automatic mode is enabled, the TCC will activate only when the internal die temperature

reaches the maximum allowed value for operation.

Likewise, when Intel Thermal Monitor 2 is enabled, and a high temperature situation exists, the

processor will perform an Enhanced Intel SpeedStep Technology transition to a lower operating

point. When the processor temperature drops below the critical level, the processor will make an

Enhanced Intel SpeedStep Technology transition to the last requested operating po int. Intel

Thermal Monitor 2 is the recommend e d mod e on Pentium M Processors.

If a processor load based Enhanced Intel SpeedStep Technology transition (through MSR write) is

initiated when an Intel Therm al Monitor 2 period is active, there are two possible results:

1.If the processor load based Enhanced Intel SpeedStep Technology transition target frequency is

higher than the Intel Thermal Mon itor 2 transition based target frequency, the processor load-

based transition will be deferred until the Intel Thermal Monitor 2 event has been completed.

2.If the processor load-based Enhanced Intel SpeedStep Technology transition target frequency is

lower than the Intel Thermal Monito r 2 transition based target frequency, the processor will

transition to the processor load-based Enhanced Intel SpeedStep Technology target frequency

point.

When Intel Thermal Monitor 1 is enabled, and a high temperature situation exists, the clocks will

be modulat e d by alternately turning the clocks off and on at a 50% duty cycle. Cycle times are

processor speed dependent and will decrease linearly as processor core frequencies increase. Once

the temperature has returned to a non-critical level, modulation ceases and TCC goes inactive. A

small amount of hyst eresis has been included to prevent rapid active/inactive transitions of the

TCC when the processor temperature is near the trip point. The duty cycle is factory configured

and cannot be modified. Also, aut omatic mode does not require any addi tional hardware, software

drivers, or interrupt handling ro utines. Processor performance will be decreased by the same

amount as the duty cycle when the TCC is active, however, with a properly desi gned and

characterized thermal solution the TCC most likely will never be activated, or only will be

activated briefly duri ng the m ost power intensive applications.

The TCC may also be activated via on-demand mode. If bit 4 of the ACPI Intel Therm al Monitor

control register is written to a 1, the TCC will be activated immediately, independent of the

processor temperature. When using on-demand mode to activate the TCC, the duty cycle of the

clock modulation is prog rammable via bits 3:1 of the same ACPI Intel Thermal Monitor control

mode, the duty cycle can be programmed from 12.5% on/ 87.5% off, to 87.5% on/12.5% off in

12.5% increments. On-demand mode may be used at the same time automatic mode is enabled,

however, if the system tries to enable th e TCC via on -dem and mode at the same time automatic

mode is enabled and a high temperature condition exists, automatic mode will take precedence.

An external signal, PROCHOT# (processor hot) is asserted when the processor detects that its

temperature is above the therma l tri p point. Bus snooping and interrupt latching are also active

while the TCC is active.

64 Datasheet

Thermal Specifications and Design Considerations

Besides the thermal sensor and thermal control circuit, the Intel Thermal Monitor thermal monitor

feature also includes one ACPI register, one performan ce counter register , three model specific

registers (MSR), and one I/O pin (PROCHOT#). All are available to monitor and control the state

of the Intel Thermal Monitor feature. The Intel Thermal Monitor can be configured to generate an

interrupt upon the assertion or deassertion of PROCHOT#.

Note: PROCHOT# will not be asserted when the processor is in the Stop Grant, Sleep, Deep Sleep, and

Deeper Sleep low power states (internal clocks stopped), hence the thermal diode readi ng must be

used as a safeguard to maintain the processor junction temperature within the 100 °C (maximum)

specification. If the platform thermal solution is not able to maintain the processor junction

temperature within the maximum specification, the system must initiate an orde rl y sh utdown to

prevent damage. If the processor enters one of the above low power states with PROCHOT#

already asserted, PROCHOT# will remain asserted unti l the processor exi ts the low power state

and the processor junction temperature drops below the thermal trip point.

If automatic mode is disabled, the processor will be operating out of specification. Regardless of

enabling the automatic or on-demand modes, in the event of a catastrophic cooling failure, the

processor will automatically shut down when the silicon has reached a temperature of

approximately 125 °C. At th is point the THERMTRIP# signal will go active. THERMTRIP#

activation is independent of processo r activity and does not generate any bus cycles. When

THERMTRIP# is asserted, the processor core voltage must be shut down within the time specified

in Chapter 3.