EHHD006A0B41-SZ - ABB - Product.Network

Data Sheet

EHHD006A0B Hammerhead* Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Features

 Compliant to RoHS II EU “Directive 2011/65/EU (-Z versions)

 Compliant to REACH Directive (EC) No 1907/2006

 Flat and high-efficiency curve

 Industry standard, DOSA compliant footprint

57.9mm x 22.8mm x 7.6mm

(2.28 in x 0.9 in x 0.30 in)

 Low-profile height and reduced component skyline

 Ultra-wide input voltage range: 18-75 V

 Tightly regulated output

 Remote sense

 Output voltage adjust: 90% to 110% of V

O,nom

 Constant switching frequency

 Positive remote On/Off logic

 Input under/overvoltage protection

 Output overcurrent and overvoltage protection

 Overtemperature protection

 No reverse current during output shutdown

 Wide operating temperature range (-40°C to 85°C)

 Suitable for cold wall cooling using suitable Gap Pad applied

directly to top side of module

 ANSI/UL

60950-1-2011 and CAN/CSA† C22.2 No. 60950-1-

07, Second Edition + A1:2011 (MOD), dated March 19, 2011;

and DIN EN 60950-1 (VDE

‡

0805 Teil 1):2011-01; EN 60950-

1:2006 + A11:2009 + A1:2010, DIN EN 60950-1/A12 (VDE

0805-1/A12):2011-08; EN 60950-1/A12:2011-02, IEC 60950-

1(ed.2);am1:2009

 CE mark meets 2006/95/EC directive

 Meets the voltage and current requirements for ETSI 300-

132-2 and complies with and licensed for basic insulation

rating per EN60950-1

 2250 Vdc Isolation tested in compliance with IEEE 802.3

PoE standards

 ISO

9001 and ISO 14001 certified manufacturing facilities

Applications

 Distributed Power Architectures

 Wireless Networks

 Access and Optical Network Equipment

 Industrial Equipment

Options

 Negative Remote On/Off logic (preferred)

 Overcurrent/Overtemperature/Overvoltage protections

(Auto-restart) (preferred)

 Heat plate version (-H)

 Surface Mount version (-S)

Description

The EHHD006A0B Series, eighth-brick, low-height power modules are isolated DC-DC converters that provide a single, precisely

regulated output voltage over an ultra-wide input voltage range of 18-75V

. The EHHD006A0B provides 12V

nominal output

voltage rated for 6A

output current. The module incorporates GE’s vast heritage for reliability and quality, while also using the

latest in technology and component and process standardization to achieve highly competitive cost. The open frame module

construction, available in both surface mount and through-hole packaging, enables designers to develop cost and space efficient

solutions. The module achieves typical full load efficiency greater than 92% at V

=24V

and greater than 90% at V

=48V

Standard features include remote On/Off, remote sense, output voltage adjustment, overvoltage, overcurrent and

overtemperature protection. An optional heat plate allows for external standard, eighth-brick heat sink attachment to

achieve higher output current in high temperature applications.

Trademark Of General Electric Company

UL is a registered trademark of Underwriters Laboratories, Inc.

†

CSA is a registered trademark of Canadian Standards Association.

‡

VDE is a trademark of Verband Deutscher Elektrotechniker e.V.

§ This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed.

¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.

** ISO is a registered trademark of the International Organization of Standards

RoHS Compliant

GE Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings

only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations

sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.

Parameter Device Symbol Min Max Unit

Input Voltage

Continuous All VIN -0.3 80 Vdc

Transient, operational (≤100 ms) All VIN,trans -0.3 100 Vdc

Operating Ambient Temperature All TA -40 85 °C

(see Thermal Considerations section)

Storage Temperature All Tstg -55 125 °C

Altitude All

4000 m

I/O Isolation Voltage (100% factory Hi-Pot tested) All   2250 Vdc

* For higher altitude applications, contact your GE Sales Representative for alternative conditions of use.

Electrical Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load and temperature conditions.

Parameter Device Symbol Min Typ Max Unit

Operating Input Voltage All VIN 18 24/48 75 Vdc

Maximum Input Current All IIN 4.4 5.0 Adc

(VIN= VIN, min to VIN, max, VO= VO, set, IO=IO, max)

Input No Load Current All IIN,No load 80 mA

(VIN = 48V, IO = 0, module enabled)

Input Stand-by Current All IIN,stand-by 5 8 mA

(VIN = 48V, module disabled)

Inrush Transient All I2t 0.5 A2s

Input Reflected Ripple Current, peak-to-peak

(5Hz to 20MHz, 1μH source impedance; VIN, min to VIN, max, IO= IOmax ; See

test configuration section)

All 30 mAp-p

Input Ripple Rejection (120Hz) All 50 dB

CAUTION: This power module is not internally fused. An input line fuse must always be used.

This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part

of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included; however, to achieve

maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a

maximum rating of 10 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy

and maximum DC input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data

sheet for further information.

GE Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Electrical Specifications (continued)

Parameter Device Symbol Min Typ Max Unit

Nominal Output Voltage Set-point All VO, set 11.80 12.00 12.24 Vdc

VIN= 24V to 48V IO=IO, max, TA=25°C)

Output Voltage

All VO 11.64  12.36 Vdc

(Overall operating input voltage, resistive load, and temperature

conditions until end of life)

Output Regulation

Line (VIN=VIN, min to VIN, max) All

  ±0.2 % VO, set

Load (IO=IO, min to IO, max) All 

 ±0.2 % VO, set

Temperature (Tref=TA, min to TA, max) All

  ±1.0 % VO, set

Output Ripple and Noise

(VIN=VIN, min to VIN, max, IO= IO, max , TA=TA, min to TA, max)

RMS (5Hz to 20MHz bandwidth) All  25 50 mVrms

Peak-to-Peak (5Hz to 20MHz bandwidth) All  75 200 mVpk-pk

External Capacitance All CO, max 0  2,000 μF

Output Current All IO 0 6 Adc

Output Current Limit Inception (Hiccup Mode ) All IO, lim 6.6 7.8 9.0 Adc

(VO= 90% of VO, set)

Output Short-Circuit Current All IO, s/c 5 Arms

(VO≤250mV) ( Hiccup Mode )

Efficiency

VIN=24V, TA=25°C, IO=3A, VO = 12V All η 90.0 %

VIN=24V, TA=25°C, IO=6A, VO = 12V All η 92.5 %

VIN=48V, TA=25°C, IO=3A, VO = 12V All η 90.0 %

VIN=48V, TA=25°C, IO=6A, VO = 12V All η 90.5 %

Switching Frequency All fsw 280 kHz

Dynamic Load Response

(dIo/dt=0.1A/s; VIN = 24V or 48V; TA=25°C; CO>100μF)

Load Change from Io= 50% to 75% or 25% to 50% of Io,max

Peak Deviation All Vpk  3  % VO, set

Settling Time (Vo<10% peak deviation) All ts  200  s

Isolation Specifications

Parameter Device Symbol Min Typ Max Unit

Isolation Capacitance All Ciso  1000  pF

Isolation Resistance All Riso 100   MΩ

I/O Isolation Voltage (100% factory Hi-pot tested) All All   2250 Vdc

General Specifications

Parameter Device Symbol Min Typ Max Unit

Calculated Reliability based upon Telcordia SR-332 Issue 3: Method I

Case 3 (IO=80%IO, max, TA=40°C, airflow = 200 lfm, 90% confidence)

All FIT 169.9 109/Hours

All MTBF 5,887,341 Hours

Weight (Open Frame) All 19 (0.7) g (oz.)

Weight (with Heat Plate) All 30 (1.1) g (oz.)

GE Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Feature Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load and temperature conditions. See

Feature Descriptions for additional information.

Parameter Device Symbol Min Typ Max Unit

Remote On/Off Signal Interface

(VIN=VIN, min to VIN, max ; open collector or equivalent,

Signal referenced to VIN- terminal)

Negative Logic: device code suffix “1”

Logic Low = module On, Logic High = module Off

Positive Logic: No device code suffix required

Logic Low = module Off, Logic High = module On

Logic Low - Remote On/Off Current All Ion/off   0.15 mA

Logic Low - On/Off Voltage All Von/off -0.7  0.6 Vdc

Logic High Voltage – (Typ = Open Collector) All Von/off 2.5  6.7 Vdc

Logic High maximum allowable leakage current All Ion/off   25 μA

Turn-On Delay and Rise Times

(IO=IO, max , VIN=VIN, nom, TA = 25oC)

Case 1: Input power is applied for at least 1 second

then the On/Off input is set from OFF to ON

(Tdelay = On/Off pin transition until VO = 10% of VO, set)

All Tdelay — 12 — msec

Case 2: On/Off input is set to Logic Low (Module

ON) then input power is applied

(Tdelay = VIN reaches VIN, min until Vo=10% of VO,set)

All Tdelay — 25 35 msec

Output voltage Rise time (time for Vo to rise from 10%

of Vo,set to 90% of Vo, set) All Trise — 15 25 msec

Output Voltage Overshoot – Startup All

— 3 % VO, set

IO= IO, max; VIN=VIN, min to VIN, max, TA = 25 oC

Remote Sense Range All VSENSE 10 % VO, set

Output Voltage Adjustment Range All 90 110 % VO, set

Output Overvoltage Protection All VO, limit 13.8  16.5 Vdc

Overtemperature Protection – Hiccup Auto Restart

Open

frame Tref 135 OC

Heat Plate Heat

Plate

Tref 120 OC

Input Undervoltage Lockout All VUVLO

Turn-on Threshold  17 18 Vdc

Turn-off Threshold 14 15.5 16 Vdc

Hysteresis 1 2.0 Vdc

Input Overvoltage Lockout All VOVLO

Turn-on Threshold 76 77  Vdc

Turn-off Threshold  79 81 Vdc

Hysteresis 1 2

 Vdc

GE Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Characteristic Curves

The following figures provide typical characteristics for the EHHD006A0B (12.0V, 6A) at 25oC. The figures are identical for either

positive or negative remote On/Off logic.

EFFICIENCY,  (%)

OUTPUT VOLTAGE OUTPUT CURRENT

VO (V) (200mV/div) Io(A) (1A/div)

OUTPUT CURRENT, IO (A) TIME, t (200µs/div)

Figure 1. Converter Efficiency versus Output Current. Figure 4. Transient Response to 0.1A/µS Dynamic Load

Change from 50% to 75% to 50% of full load, Vin=48V,

CO>100μF.

OUTPUT VOLTAGE

VO (V) (100mV/div)

OUTPUT VOLTAGE On/Off VOLTAGE

VO (V) (5V/div) VOn/Off (V) (5V/div)

TIME, t (2s/div) TIME, t (10ms/div)

Figure 2. Typical output ripple and noise (Io = Io,max).

Figure 5. Typical Start-up Using Remote On/Off, negative

logic version shown (VIN = 24V or 48V, Io = Io,max).

OUTPUT VOLTAGE OUTPUT CURRENT

VO (V) (200mV/div) Io(A) (1A/div)

OUTPUT VOLTAGE INPUT VOLTAGE

VO (V) (5V/div) VIN (V) (20V/div)

TIME, t (200µs/div) TIME, t (10ms/div)

Figure 3. Transient Response to 0.1A/µS Dynamic Load Change

from 50% to 75% to 50% of full load, Vin=24V, CO>100μF.

Figure 6. Typical Start-up Using Input Voltage (VIN

= 24V,

Io = Io,max).

GE Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Test Configurations

TO OSCILLOSCOPE CURRENT PROBE

LTEST

12μH

BATTERY

CS 220μF

E.S .R .<0 .1 

@ 20 °C 100kHz

33-10 0μF

Vi n+

Vin-

NOTE: M easure input reflected ripple current with a simulated

source inductance (LTES T) of 12μH. Capacitor CS o ffsets

possible battery impedance. Measure current as shown

above.

Figure 7. Input Reflected Ripple Current Test Setup.

NOTE: All voltage measurements to be t aken at the module

terminals, as shown above. If sockets are used then

Kelvin connections are required at the module terminals

to avoid measurement errors due to socket contact

resistance.

O (+ )

V O

( – )

RESISTIVE

LOAD

SCOPE

COPPER STRIP

GROUND PLANE

10uF

1uF

Figure 8. Output Ripple and Noise Test Setup.

Vout+

Vout-

Vin+

Vin-

RLOAD

Rcontact Rdistribution

Rcontact

Rdistribution

VIN VO

NOTE: All voltage measurements to be taken at the module

terminals, as shown above. If sockets are used then

Kelvin connections are required at the module terminals

to avoid measurement errors due to socket contact

resistance.

Figure 9. Output Voltage and Efficiency Test Setup.

 =

VO. IO

VIN. IIN

x 100 %

Efficiency

Design Considerations

Input Filtering

The power module should be connected to a low AC

impedance source. Highly inductive source impedance can

affect the stability of the power module. For the test

configuration in Figure 7, a 33-100μF electrolytic capacitor

(ESR<0.7 at 100kHz), mounting close to the power module

helps ensure the stability of the unit. Consult the factory for

further application guidelines.

Safety Considerations

For safety-agency approval of the system in which the

power module is used, the power module must be installed

in compliance with the spacing and separation

requirements of the end-use safety agency standard, i.e.,

UL60950-1, CSA C22.2 No.60950-1, and VDE0805-

1(IEC60950-1).

If the input source is non-SELV (ELV or a hazardous voltage

greater than 60 Vdc and less than or equal to 75Vdc), for the

module’s output to be considered as meeting the

requirements for safety extra-low voltage (SELV), all of the

following must be true:

 The input source is to be provided with reinforced

insulation from any other hazardous voltages, including

the AC mains.

 One VIN pin and one VOUT pin are to be grounded, or

both the input and output pins are to be kept floating.

 The input pins of the module are not operator

accessible.

 Another SELV reliability test is conducted on the whole

system (combination of supply source and subject

module) as required by the safety agencies to verify

that under a single fault, hazardous voltages do not

appear at the module’s output.

Note: Do not ground either of the input pins of the module

without grounding one of the output pins. This may

allow a non-SELV voltage to appear between the

output pins and ground.

The power module has extra-low voltage (ELV) outputs when

all inputs are ELV.

All flammable materials used in the manufacturing of these

modules are rated 94V-0 or tested to the UL60950 A.2 for

reduced thickness.

For input voltages exceeding –60 Vdc but less than or equal

to –75 Vdc, these converters have been evaluated to the

applicable requirements of basic insulation between

secondary DC mains distribution input (classified as TNV-2 in

Europe) and unearthed SELV outputs.

The input to these units is to be provided with a maximum

10 A fast-acting fuse in the ungrounded lead.

GE Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Feature Descriptions

Remote On/Off

Two remote On/Off options are available. Positive logic turns

the module on during a logic high voltage on the On/Off pin

and off during a logic low. Negative logic remote On/Off,

device code suffix “1”, turns the module off during a logic

high and on during a logic low.

ON/OFF

Vin+

Vin-

Ion/off

Von/off

Vout+

TRIM

Vout-

Figure 10. Remote On/Off Implementation.

To turn the power module on and off, the user must supply a

switch (open collector or equivalent) to control the voltage

(Von/off) between the On/Off terminal and the VIN(-) terminal

(see Figure 10). Logic low is -0.7V ≤ Von/off ≤ 0.6V. The

maximum Ion/off during a logic low is 0.15mA and the switch

should maintain a logic low level while sinking this current.

During a logic high, the typical maximum Von/off generated

by the module is 5.6V and the maximum allowable leakage

current at Von/off = 5.6V is 25μA.

If not using the remote On/Off feature:

For positive logic, leave the On/Off pin open.

For negative logic, short the On/Off pin to VIN(-).

Remote Sense

Remote sense minimizes the effects of distribution losses by

regulating the voltage at the remote-sense connections (See

Figure 11). The voltage between the remote-sense pins and

the output terminals must not exceed the output voltage

sense range given in the Feature Specifications table:

[VO(+) – VO(–)] – [SENSE(+) – SENSE(–)]  0.5 V

Although the output voltage can be increased by both the

remote sense and by the trim, the maximum increase for

the output voltage is not the sum of both. The maximum

increase is the larger of either the remote sense or the trim.

The amount of power delivered by the module is defined as

the voltage at the output terminals multiplied by the output

current. When using remote sense and trim, the output

voltage of the module can be increased, which at the same

output current would increase the power output of the

module. Care should be taken to ensure that the maximum

output power of the module remains at or below the

maximum rated power (maximum rated power = Vo,set x

Io,max).

Figure 11. Circuit Configuration for Remote Sense .

Input Undervoltage Lockout

At input voltages below the input undervoltage lockout limit,

the module operation is disabled. The module will only

begin to operate once the input voltage is raised above the

undervoltage lockout turn-on threshold, VUV/ON.

Once operating, the module will continue to operate until

the input voltage is taken below the undervoltage turn-off

threshold, VUV/OFF.

Overtemperature Protection

To provide protection under certain fault conditions, the unit

is equipped with a thermal shutdown circuit. The unit will

shutdown if the thermal reference point, Tref, exceeds

135OC (Figure 13, typical) or 120OC (Figure 14, typical), but

the thermal shutdown is not intended as a guarantee that

the unit will survive temperatures beyond its rating. The

module will automatically restart upon cool-down to a safe

temperature.

Output Overvoltage Protection

The output overvoltage protection scheme of the modules

has an independent overvoltage loop to prevent single point

of failure. This protection feature latches in the event of

overvoltage across the output. Cycling the On/Off pin or

input voltage resets the latching protection feature. If the

auto-restart option (4) is ordered, the module will

automatically restart upon an internally programmed time

elapsing.

Overcurrent Protection

To provide protection in a fault (output overload) condition,

the unit is equipped with internal

current-limiting circuitry and can endure current

limiting continuously. At the point of current-limit

inception, the unit enters hiccup mode. If the unit is

not configured with auto–restart, it will latch off following

the overcurrent condition. The module can be restarted by

cycling the DC input power for at least one second or by

toggling the remote On/Off signal for at least one second.

VO(+)

SENSE(+)

SENSE(–)

VO(–)

VI(+)

VI(-)

IOLOAD

CONTACT AND

DISTRIBUTION LOSS

SUPPLY II

CONTACT

RESISTANCE

GE Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

If the unit is configured with the auto-restart option (4), it will

remain in the hiccup mode as long as the overcurrent

condition exists. Once the output current is brought back

into its specified range, the unit will operate normally. The

average output current during hiccup is 10% IO, max.

Output Voltage Programming

Trimming allows the output voltage set point to be

increased or decreased from the default value. This is

accomplished by connecting an external resistor between

the TRIM pin and either the VO(+) pin or the VO(-) pin.

VO(+)

VOTRIM

VO(-)

Rtrim-down

LOAD

VIN(+)

ON/OFF

VIN(-)

Rtrim-up

Figure 12. Circuit Configuration to Trim Output Voltage.

Connecting an external resistor (Rtrim-down) between the TRIM

pin and the VO(-) (or Sense(-)) pin decreases the output

voltage set point. To maintain set point accuracy, the trim

resistor tolerance should be ±1.0%.

The following equation determines the required external

resistor value to obtain a percentage output voltage change

of ∆%



















22.10

511

downtrim

Where 100

0.12

%













 V

VV desired

For example, to trim-down the output voltage of the module

by 6% to 11.28V, Rtrim-down is calculated as follows:



















22.10

511

downtrim



9.74

downtrim

Connecting an external resistor (Rtrim-up) between the TRIM

pin and the VO(+) (or Sense (+)) pin increases the output

voltage set point. The following equation determines the

required external resistor value to obtain a percentage

output voltage change of ∆%:

























22.10

511

%225.1 %)100(0.1211.5

uptrim

Where 100

0.12 0.12

%













 desired

For example, to trim-up the output voltage of the module by

4% to 12.48V, Rtrim-up is calculated is as follows:

























22.10

511

4225.1 )4100(0.1211.5

uptrim





MR uptrim 16.1

The voltage between the VO(+) and VO(–) terminals must not

exceed the minimum output overvoltage protection value

shown in the Feature Specifications table. This limit includes

any increase in voltage due to remote-sense compensation

and output voltage set-point adjustment trim.

Although the output voltage can be increased by both the

remote sense and by the trim, the maximum increase for

the output voltage is not the sum of both. The maximum

increase is the larger of either the remote sense or the trim.

The amount of power delivered by the module is defined as

the voltage at the output terminals multiplied by the output

current. When using remote sense and trim, the output

voltage of the module can be increased, which at the same

output current would increase the power output of the

module. Care should be taken to ensure that the maximum

output power of the module remains at or below the

maximum rated power (maximum rated power = VO,set x

IO,max).

Thermal Considerations

The power modules operate in a variety of thermal

environments; however, sufficient cooling should be

provided to help ensure reliable operation.

Considerations include ambient temperature, airflow,

module power dissipation and the need for increased

reliability. A reduction in the operating temperature of the

module will result in an increase in reliability.

The thermal data presented here is based on physical

measurements taken in a wind tunnel, using automated

thermo-couple instrumentation to monitor key component

temperatures: FETs, diodes, control ICs, magnetic cores,

ceramic capacitors, opto-isolators, and module pwb

conductors, while controlling the ambient airflow rate and

temperature. For a given airflow and ambient temperature,

the module output power is increased, until one (or more) of

the components reaches its maximum derated operating

temperature, as defined in IPC-9592. This procedure is then

repeated for a different airflow or ambient temperature until

a family of module output derating curves is obtained.

Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Thermal Considerations (continued)

The thermal reference points, T

ref

used in the specifications

for open frame modules is shown in Figure 13. For reliable

operation, these temperatures should not exceed 125

Figure 13. T

ref

Temperature Measurement Locations for

Open Frame Module.

The thermal reference point, T

ref

used in the specifications

for modules with a heat plate is shown in Figure 14. For

reliable operation, this temperature should not exceed

115

Figure 14. T

ref

Temperature Measurement Location for

Module with Heat plate.

Heat Transfer via Convection

Increased airflow over the module enhances the heat

transfer via convection. Derating curves showing the

maximum output current that can be delivered by

each module versus local ambient temperature (T

)

for natural convection and up to 2m/s (400 ft./min) forced

airflow are shown in Figures 15 - 18.

OUTPUT CURRENT, I

(A)

AMBIENT TEMEPERATURE, T

(

)

Figure 15. Output Current Derating for the Open Frame

Module; Airflow in the Transverse Direction from V

out

(-) to

out

(+); V

=48.

OUTPUT CURRENT, I

(A)

AMBIENT TEMEPERATURE, T

(

)

Figure 16. Output Current Derating for the Module with

Heat plate; Airflow in the Transverse Direction from V

out

(-)

to V

out

(+);V

=48V.

OUTPUT CURRENT, I

(A)

AMBIENT TEMEPERATURE, T

(

)

Figure 17. Output Current Derating for the Open Frame

Module; Airflow in the Transverse Direction from V

out

(-) to

out

(+); V

=24V.

AIRFLOW

GE Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Thermal Considerations (continued)

OUTPUT CURRENT, IO (A)

AMBIENT TEMEPERATURE, TA (oC)

Figure 18. Output Current Derating for the Module with

Heat plate; Airflow in the Transverse Direction from Vout(-)

to Vout(+);VIN =24V.

Please refer to the Application Note ‘Thermal

Characterization Process For Open-Frame Board-Mounted

Power Modules’ for a detailed discussion of thermal aspects

including maximum device temperatures.

Heat Transfer via Conduction

The module can also be used in a sealed environment with

cooling via conduction from the

module’s top surface through a gap pad material to a

cold wall, as shown in Figure 19. This capability is achieved

by insuring the top side component skyline profile achieves

no more than 1mm height difference between the tallest

and the shortest power train part that benefits from contact

with the gap pad material. The output current derating

versus cold wall temperature, when using a gap pad such as

Bergquist GP2500S20, is shown in Figure 20.

Figure 19. Cold Wall Mounting

OUTPUT CURRENT, IO (A)

COLDPLATE TEMEPERATURE, TC (oC)

Figure 20. Derated Output Current versus Cold Wall

Temperature with Local Ambient Temperature Around

Module at 85C; VIN =24V or 48V.

Through-Hole Soldering Information

Lead-Free Soldering

The EHHD006A0Bxx RoHS-compliant through-hole products

use SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant

components. They are designed to be processed through

single or dual wave soldering machines. The pins have a

RoHS-compliant finish that is compatible with both Pb and

Pb-free wave soldering processes. A maximum preheat rate

of 3C/s is suggested. The wave preheat process should be

such that the temperature of the power module board is

kept below 210C. For Pb solder, the recommended pot

temperature is 260C, while the Pb-free solder pot is 270C

max.

Paste-in-Hole Soldering

The EHHD006A0Bxx module is compatible with reflow

paste-in-hole soldering processes shown in Figures 23-25.

Since the EHHD006A0BxxZ module is not packaged per J-

STD-033 Rev.A, the module must be baked prior to the

paste-in-hole reflow process. EHHD006A0Bxx-HZ modules

are not compatible with paste-in-hole reflow soldering.

Please contact your GE Sales Representative for further

information.

Surface Mount Information

MSL Rating

The EHHD006A0B-SZ module has a MSL rating of 2a.

Storage and Handling

The recommended storage environment and handling

procedures for moisture-sensitive surface mount packages

is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping

and Use of Moisture/Reflow Sensitive Surface Mount

Devices). Moisture barrier bags (MBB) with desiccant are

provided for the EHHD006A0Bxx-SZ modules. These sealed

packages should not be broken until time of use. Once the

original package is broken, the floor life of the product at

conditions of  30°C and 60% relative humidity varies

according to the MSL rating (see J-STD-033A). The shelf life

for dry packed SMT packages is a minimum of 12 months

from the bag seal date, when stored at the following

conditions: < 40° C, < 90% relative humidity.

Pick and Place

The EHHD006A0Bxx-S modules use an open frame

construction and are designed for a fully automated

assembly process. The modules are fitted with a label

designed to provide a large surface area for pick and place

operations. The label meets all the requirements for surface

mount processing, as well as safety standards, and is able

to withstand reflow temperatures of up to 300oC. The label

also carries product information such as product code,

serial number and the location of manufacture.

GE Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Surface Mount Information (continued)

Figure 21. Pick and Place Location.

Nozzle Recommendations

The module weight has been kept to a minimum by using

open frame construction. Even so, these modules have a

relatively large mass when compared to conventional SMT

components. Variables such as nozzle size, tip style,

vacuum pressure and placement speed should be

considered to optimize this process. The minimum

recommended nozzle diameter for reliable operation is

6mm. The maximum nozzle outer diameter, which will safely

fit within the allowable component spacing, is 9 mm.

Oblong or oval nozzles up to 11 x 9 mm may also be used

within the space available.

Reflow Soldering Information

The surface mountable modules in the EHHD006A0Bxx-S

family use our newest SMT technology called “Column Pin”

(CP) connectors. Figure 22 shows the new CP connector

before and after reflow soldering onto the end-board

assembly. The CP is constructed from a solid copper pin with

an integral solder ball attached, which is composed of

tin/lead (Sn/Pb) solder for non-Z codes, or Sn/Ag3/Cu (SAC)

solder for –Z codes.

EHHD Board

Insulator

Solder Ball

End assembly PCB

Figure 22. Column Pin Connector Before and After Reflow

Soldering.

The CP connector design is able to compensate for large

amounts of planarity and still ensure a reliable SMT solder

joint. Typically, the eutectic solder melts at 183°C (Sn/Pb

solder) or 217-218°C (SAC solder), wets the land, and

subsequently wicks the device connection. Sufficient time

must be allowed to fuse the plating on the connection to

ensure a reliable solder joint. There are several types of SMT

reflow technologies currently used in the industry. These

surface mount power modules can be reliably soldered

using natural forced convection, IR (radiant infrared), or a

combination of convection/IR. The following instructions

must be observed when SMT soldering these units. Failure to

observe these instructions may result in the failure of or

cause damage to the modules, and can adversely affect

long-term reliability.

Tin Lead Soldering

The EHHD006A0Bxx-S power modules are lead free modules

and can be soldered either in a lead-free solder process or

in a conventional Tin/Lead (Sn/Pb) process. It is

recommended that the customer review data sheets in

order to customize the solder reflow profile for each

application board assembly. The following instructions must

be observed when soldering these units. Failure to observe

these instructions may result in the failure of or cause

damage to the modules, and can adversely affect long-term

reliability.

In a conventional Tin/Lead (Sn/Pb) solder process, peak

reflow temperatures are limited to less than 235°C.

Typically, the eutectic solder melts at 183°C, wets the land,

and subsequently wicks the device connection. Sufficient

time must be allowed to fuse the plating on the connection

to ensure a reliable

solder joint. There are several types of SMT reflow

technologies currently used in the industry. These surface

mount power modules can be reliably soldered using

natural forced convection, IR (radiant infrared), or a

combination of convection/IR. For reliable soldering, the

solder reflow profile should be established by accurately

measuring the modules CP connector temperatures.

Lead Free Soldering

The –Z version of the EHHD006A0B modules are lead-free

(Pb-free) and RoHS compliant and are both forward and

backward compatible in a Pb-free and a SnPb soldering

process. Failure to observe the instructions below may

result in the failure of or cause damage to the modules and

can adversely affect long-term reliability.

REFLOW TEMP (C)

REFLOW TIME (S)

Figure 23. Reflow Profile for Tin/Lead (Sn/Pb) process.

10 0

15 0

200

250

300

Preheat zo ne

max 4

-1

Soak zo ne

30-240s

Heat zo ne

max 4

-1

Peak Temp 235

Cooling

zo ne

1- 4

-1

lim

above

205

GE Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Surface Mount Information (continued)

MAX TEMP SOLDER (C)

Figure 24. Time Limit Curve Above 205oC for Tin/Lead

(Sn/Pb) process

Pb-free Reflow Profile

Power systems will comply with J-STD-015 Rev. C

(Moisture/Reflow Sensitivity Classification for Nonhermetic

Solid State Surface Mount Devices) for both Pb-free solder

profiles and MSL classification procedures. This standard

provides a recommended forced-air-convection reflow

profile based on the volume and thickness of the package

(table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu

(SAC). The recommended linear reflow profile using

Sn/Ag/Cu solder is shown in Figure 25.

Figure 25. Recommended linear reflow profile using

Sn/Ag/Cu solder.

Post Solder Cleaning and Drying Considerations

Post solder cleaning is usually the final circuit board

assembly process prior to electrical board testing. The result

of inadequate cleaning and drying can affect both the

reliability of a power module and the testability of the

finished circuit board assembly. For guidance on

appropriate soldering, cleaning and drying procedures, refer

to GE Board

Mounted Power Modules: Soldering and Cleaning Application

Note (AN04-001).

200

205

210

215

220

225

230

235

240

0 10 203040 5060

Pe r J-STD-020 Re v. C

100

150

200

250

300

Reflow Time (Seconds)

R eflow T em p (°C )

He ating Zone

1°C/Second

Pe ak Temp 260°C

* Min. Time Above 235°C

15 Sec onds

*Time Above 217°C

60 Seconds

Cooling

Zone

GE Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

EMC Considerations

The circuit and plots in Figure 26 shows a suggested configuration to meet the conducted emission limits of EN55022 Class B.

Figure 26. EMC Considerations

For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028).

VIN = 48V, Io = Io,max, L Line

VIN = 48V, Io = Io,max, N Line

GE Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Mechanical Outline for Through-Hole Module

Dimensions are in millimeters and [inches].

Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (unless otherwise indicated)

x.xx mm  0.25 mm [x.xxx in  0.010 in.]

*Top side label includes GE name, product designation and date code.

GE Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Mechanical Outline for Surface Mount Module (-S Option)

Dimensions are in millimeters and [inches].

Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (unless otherwise indicated)

x.xx mm  0.25 mm [x.xxx in  0.010 in.]

* Top side label includes GE name, product designation and date code.

GE Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Mechanical Outline for Through-Hole Module with Heat Plate (-H Option)

Dimensions are in millimeters and [inches].

Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (unless otherwise indicated)

x.xx mm  0.25 mm [x.xxx in  0.010 in.]

GE Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Recommended Pad Layout

Dimensions are in millimeters and [inches].

Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (unless otherwise indicated)

x.xx mm  0.25 mm [x.xxx in  0.010 in.]

Pin Function

1 Vi(+)

2 ON/OFF

3 Vi(-)

4 Vo(-)

5 SENSE(-)

6 TRIM

7 SENSE(+)

8 Vo(+)

SMT Recommended Pad Layout (Component Side View)

Pin Function

1 Vi(+)

2 ON/OFF

3 Vi(-)

4 Vo(-)

5 SENSE(-)

6 TRIM

7 SENSE(+)

8 Vo(+)

NOTES:

FOR 0.030” X 0.025”

RECTANGULAR PIN, USE

0.050” PLATED THROUGH-

HOLE DIAMETER

FOR 0.62 DIA” PIN, USE

0.076” PLATED THROUGH-

HOLE DIAMETER

TH Recommended Pad Layout (Component Side View)

GE Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Packaging Details

The surface mount versions of the EHHD006A0B (suffix –S) are

supplied as standard in the plastic trays shown in Figure 27.

Tray Specification

Material Antistatic coated PVC

Max surface resistivity 1012/sq

Color Clear

Capacity 12 power modules

Min order quantity 48 pcs (1 box of 4 full trays + 1

empty top tray)

Each tray contains a total of 12 power modules. The trays are

self-stacking and each shipping box for the EHHD006A0B

(suffix –S) surface mount module contains 4 full trays plus one

empty hold-down tray giving a total number of 48 power

modules.

Figure 27. Surface Mount Packaging Tray

GE Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

For more information, call us at

USA/Canada:

+1 888 546 3243, or +1 972 244 9288

Asia-Pacific:

+86.021.54279977*808

Europe, Middle-East and Africa:

+49.89.878067-280

India:

+91.80.28411633

www.ge.com/powerelectronics

Ordering Information

Please contact your GE Sales Representative for pricing, availability and optional features.

Table 1. Device Codes

Product Codes Input Voltage Output

Voltage Output

Current On/Off Logic Connector

Type Comcodes

EHHD006A0B41Z 24/48V (18-75Vdc) 12.0V 6A Negative Through-hole CC109159364

EHHD006A0B641Z 24/48V (18-75Vdc) 12.0V 6A Negative Through-hole 150024112

EHHD006A0B41-HZ 24/48V (18-75Vdc) 12.0V 6A Negative Through-hole CC109167755

EHHD006A0B641-HZ 24/48V (18-75Vdc) 12.0V 6A Negative Through-hole 150024113

EHHD006A0B841-HZ 24/48V (18-75Vdc) 12.0V 6A Negative Through-hole CC109171443

EHHD006A0B41-SZ 24/48V (18-75Vdc) 12.0V 6A Negative Surface mount CC109167763

Table 2. Device Coding Scheme and Options