TC1071VCTTR - Microchip Technology, Inc.

TC1070/TC1071/TC1187

Features:

• Zero Ground Current for Longer Battery Life

• Adjustable Output Voltage

• Very Low Dropout Voltage

• Choice of 50 mA (TC1070), 100 mA (TC1071)

and 150 mA (TC1187) Output

• Power-Saving Shutdown Mode

• Over Current and Over Temperature Protection

• Space-Saving 5-Pin SOT-23A Package

• Pin Comp a tib le with Bipo la r Regu lat ors

Applications:

• Bat tery Operated Systems

• Portable Computers

• Medical Instruments

• Instrumentation

• Cellular/GSM/PHS Phones

• Linear Post-Regulators for SMPS

• Pagers

Device Selection Table

Package Type

General Description:

The TC1070, TC1071 and TC1187 are adjustable

LDOs de signed to supers ede a variety of older (bipolar)

voltage regulators. Total supply current is typically 50

μA at ful l l oa d ( 20 to 60 time s lowe r than i n b ip ola r re g-

ulators).

The devices’ key features include ultra low-noise

operation, very low dropout voltage – typically 85 mV

(TC1070 ); 180 mV (T C1071); an d 270 m V (TC1187) at

full load, and fast response to step changes in load.

Supply current is reduced to 0.5 μA (max) when the

shutdown input is low. The devices incorporate both

over-temperature and over-current protection. Output

voltage is programmed with a simple resistor divider

from VOUT to ADJ to GND.

The TC1070, TC1071 and TC1187 are stable with an

output capacitor of only 1 μF and have a maximum

output current of 50 mA, 100 mA and 150 mA,

respect ively . For higher o utput versi ons, please s ee the

TC1174 (IOUT = 300 mA) data sheet.

Typical Application

Part

Number

Output

Voltage

(V) Package Junction

Temp. Range

TC1070VCT Adjustable 5-Pin SOT-23A -40°C to +125°C

TC1071VCT Adjustable 5-Pin SOT-23A -40°C to +125°C

TC1187VCT Adjustable 5-Pin SOT-23A -40°C to +125°C

SHDN

5-Pin SOT-23A

TC1070

TC1071

TC1187

VIN

VOUT

GND

ADJ

NOTE: 5-Pin SOT - 23A is equivalent to the EIAJ (SC-74A)

TC1070

TC1071

TC1187

OUT

GND

1 μF

OUT

SHDN

Shutdown Control

(from Power Control Logic)

ADJ

[ ]

OUT

= V

REF

x +1

50mA, 100mA and 150mA Adjustable CMOS LDOs with Shutdown

TC1070/TC1071/TC1187

1.0 ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings*

Input Voltage .........................................................6.5V

Output Voltage.................... ...... .(-0.3V) to (VIN + 0.3V)

Power Dissipation................Internally Limited (Note 5)

Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V

Operating Temperature Range......-40°C < TJ < 125°C

Storage Temperature..........................-65°C to +150°C

*Stresses above those listed under "Absolute Maxi-

mum Ratings" may cause permanent damage to the

device. These are stress ratings only and functional

operatio n of the devic e at these or an y other con ditions

above those indicated in the operation sections of the

specifications is not implied. Exposure to Absolute

Maximum Rating conditions for extended periods may

affect device reliability.

TABLE 1-1: TC1070/TC1071/TC1187 ELECTRICAL SPECIFICATIONS

Electrical Characteristics: VIN = V OUT + 1V, IL = 0.1 mA, CL = 3.3 μF, SHDN > V IH, TA = 25°C, unless otherwise noted. Boldface

type specifications apply for junction temperatures of -40°C to +125°C.

Symbol Parameter Min Typ Max Units Test Conditions

VIN Input Operating Voltage 2.7 —6.0 VNote 6

IOUTMAX Maximum Output Current 50

100

150

—

mA TC1070

TC1071

TC1187

VOUT Adjustable Output

Volt age Range VREF —5.5V

VREF Reference Voltage 1.165 1.20 1.235 V

ΔVREF/ΔTV

REF Temperature Coefficient — 40 —ppm/°CNote 1

ΔVOUT/ΔVIN Line Regulation — 0.05 0.35 %(V

R + 1V) ≤ VIN ≤ 6V

ΔVOUT/VOUT Load Regulation TC1070; TC1071

TC1187 —

—0.5

0.5 2

3%I

L = 0.1 mA to IOUTMAX

IL = 0.1 mA to IOUTMAX

(Note 2)

VIN-VOUT Dropout Voltage

TC1071; TC1187

TC1187

—

180

270

—

120

250

400

mV IL = 0.1 mA

IL = 20 mA

IL = 50 mA

IL = 100 mA

IL = 150 mA (No te 3)

IIN Supply Current — 50 80 μA SHDN = VIH, IL = 0

IINSD Shutdown Supply Current — 0.05 0.5 μA SHDN = 0V

PSRR Power Supply Rejectio n Ratio — 64 — dB FRE ≤ 1 kHz

IOUTSC Output Short Circuit Current — 300 450 mA VOUT = 0V

ΔVOUT/ΔPDThermal Regulation — 0.04 — V/W Note 4

TSD Thermal Shutdown Die Temperature — 160 — °C

ΔTSD Thermal Shutdown Hysteresis — 10 — °C

eN Output Noise — 260 — nV/√Hz IL = IOUTMAX

SHDN Input

VIH SHDN Input High Threshold 45 ——%V

IN VIN = 2.5V to 6.5V

VIL SHDN Input Low Threshold — — 15 %VIN VIN = 2.5V to 6.5V

Note 1:

2: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range

from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal

regulation specification.

3: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value.

4: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding lo ad o r

line regulat i on effects. Specific ati on s are for a curre nt pulse equa l to ILMAX at VIN = 6V for T = 10 msec.

5: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the

thermal resistance from junction-to-air (i.e., T A, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate

thermal shutdown. Please see Section 4.0 “Thermal Considerations” for more d etails.

6: The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1 mA to IOUTMAX.

C VOUT = (VOUTMAX – VOUTMIN) x 10

VOUT x ΔT

TC1070/TC1071/TC1187

ADJ Input

IADJ Adjust Input Leakage Current — 50 — pA

TABLE 1-1: TC1070/TC1071/TC1187 ELECTRICAL SPECIFICATIONS (CONTINUED)

Electrical Characteristics: VIN = V OUT + 1V, IL = 0.1 mA, CL = 3.3 μF, SHDN > VIH, TA = 25°C, unless otherwise noted. Boldface

type specifications apply for junction temperatures of -40°C to +125°C.

Symbol Parameter Min Typ Max Units Test Conditions

Note 1:

2: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range

from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal

regulation specification.

3: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value.

4: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding lo ad o r

line regulat i on effects. Specific ati on s are for a curre nt pulse equa l to ILMAX at VIN = 6V for T = 10 msec.

5: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the

thermal resistance from junction-to-air (i.e., T A, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate

thermal shutdown. Please see Section 4.0 “Thermal Considerations” for more d etails.

6: The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1 mA to IOUTMAX.

C VOUT = (VOUTMAX – VOUTMIN) x 10

VOUT x ΔT

TC1070/TC1071/TC1187

2.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 2-1.

TABLE 2-1: PIN FUNCTION TABLE

Pin No.

(5-Pin SOT-23A) Symbol Description

IN Unregu lat ed sup pl y inpu t.

2 GND Ground terminal.

3 SHDN Shutd own c ontrol input. T he regul ator is fully enable d when a l ogic h igh is appli ed to

this input. The regulator enters shutdown when a logic low is applied to this input.

During shutd own, out put volt age f alls to z ero and su pply curre nt is redu ced to 0.5 μA

(max).

4 ADJ Output v ol t ag e adjust te rmi nal . O utp ut v oltage se ttin g is pro gram m ed w i th a re si st or

divider from V OUT to this in put . A ca pac itor may also be a dded to this inp ut to re duce

output noise (see Section 3.2 “Output Cap acit or” ).

OUT Regulated voltage output.

TC1070/TC1071/TC1187

3.0 DETAILED DESCRIPTION

The T C1070, TC1 071 and T C1187 are adj ust able fixe d

output voltage regulators. (If a fixed version is desired,

please see the TC1014/TC1015/TC1185 data sheet.)

Unlike bipolar regulators, the TC1070, TC1071 and

TC1187 supply current does not increase with load

current. In addition, VOUT remains stable and within

regulation over the entire 0 mA to IOUTMAX operating

load c urren t ra nge , (a n i mp ort a nt conside r ati on in RTC

and CMOS RAM battery back-up applications).

Figure shows a typical application circuit. The

regulator is enabled any time the shutdown input

(SHDN) is at or above VIH, and shutdown (disabled)

when SHDN is at or below VIL. SHDN may be

controlled by a CMOS logic gate, or I/O port of a

microcontroller. If the SHDN input is not required, it

should be connected dire ct ly to the input suppl y. Whil e

in shutdown, supply current decreases to 0.05 μA

(typical), VOUT falls to zero volt s .

FIGURE 3-1: Battery-Operated Supply

3.1 Adjust Input

The output voltage setting is determined by the values

of R1 and R2 (Figure ). The ohmic values of these

resistors should be between 470K and 3M to minimize

bleeder current.

The output voltage setting is calculated using the

following equation.

EQUATION 3-1:

The voltage adjustment range of the TC1070, TC1071

and TC1187 is from V REF to (VIN – 0.05V). If so desired,

a small ca p ac ito r (100 pF to 0.0 1 μF) may be added to

the ADJ input to further reduce output noise.

3.2 Output Capacitor

A 1 μF (min) capacitor from VOUT to ground is

recommended. The output capacitor should have an

effective series resistance greater than 0.1Ω and less

than 5.0Ω, and a resonant frequency above 1 MHz. A

1 μF capacitor should be connected from VIN to GND

if there is more than 10 inches of wire between the

regulator and the AC filter capacitor, or if a battery is

used as the power source. Aluminum electrolytic or

tantalum capacitor types can be used. (Since many

aluminum electrolytic capacitors freeze at approxi-

mately -30°C, solid tantalums are recommended for

applications operating below -25°C.) When operating

from sources other than batteries, supply-noise

rejection and transient response can be improved by

increasing the value of the input and output capacitors

and employing passive filtering techniques.

TC1070

TC1071

TC1187

VOUT

SHDN

GND

1 μF

VIN +2.45

Shutdown Control

(from Power

Control Logic)

1 μF

3.0V

Battery

100 pF

to 0.01 μF

(Optional)

470K

43 ADJ

470K

VOUT = VREF x [ + 1]

TC1070/TC1071/TC1187

4.0 THERMAL CONSIDERATIONS

4.1 Thermal Shutdown

Integrated thermal protection circuitry shuts the

regulator off when die temperature exceeds 160°C.

The regulator remains off until the die temperature

drops to approximately 150°C.

4.2 Power Dissipation

The amount of power the regulator dissipates is

primarily a function of input and output voltage, and

output current. The following equation is used to

calculate worst-case actual power dissipati on:

EQUATIO N 4-1:

The maximum allowable power dissipation (Equation

4-2) is a function of the ma ximu m ambient tempe rature

(TAMAX), the maximum allowable die temperature

(TJMAX) and the thermal resistance from junction-to-air

(θJA). The 5-Pin SOT-23A package has a θJA of

approximately 220°C/Watt.

EQUATIO N 4-2:

Equation 4-1 can be used in con ju nction with Equa tio n

4-2 to ensure regulator thermal operation is within

limits. For example:

Given:

VINMAX = 3.0V ±10%

VOUTMIN = 2.7V – 2%

ILOADMAX = 40 mA

TJMAX = 125°C

TAMAX = 55°C

Find: 1. Actual power dissipation

2. Maximum allowable dissipation

Actual power dissipation:

PD ≈ (VINMAX – VOUTMIN)ILOADMAX

= [(3.0 x 1.10) – (2.7 x .0.98)]40 x 10–3

= 26.2 mW

Maximum allowable power dissipation:

In this example, the TC1070 dissipates a maximum of

26.2 mW; below the allowable limit of 318 mW. In a

similar manner, Equation 4-1 and Equation 4-2 can be

used to calculate maximum current and/or input

voltage limits.

4.3 Layout Considerati ons

The prima ry path of he at conductio n out of the p ackage

is via the package leads. Therefore, layouts having a

groun d plane , wide trace s at the p ads , and wide po wer

supply bus lines combine to lower θJA and therefore

increase the maximum allowable power dissipation

limit.

Where:

PD ≈ (VINMAX – VOUTMIN)ILOADMAX

VINMAX

VOUTMIN

ILOADMAX

= Worst-case actual power dissipation

= Minimum regulator output voltage

= Maximum output (load) current

= Maximum voltage on VIN

PDMAX = (TJMAX – TAMAX)

θJA

Where all terms are previously defined

PDMAX = (TJMAX – TAMAX)

θJA

= (125 – 55)

220

= 318 mW

TC1070/TC1071/TC1187

5.0 TYPICAL CHARACTERISTICS

(Unless Otherwise Specified, All Parts Are Measured At Temperature = 25°C)

Note: The graphs a nd t a bles prov ide d fo llowing thi s n ote a r e a st atistic al su mm ary bas ed on a lim it ed number o f

samples and are provided for informational purposes only. The performance characteristics listed herein

are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

0.000

0.002

0.004

0.006

0.008

0.010

0.012

0.014

0.016

0.018

0.020

-40 -20 0 20 50 70 125

DROPOUT VOLTAGE (V)

ILOAD = 10mA

CIN = 1μF

COUT = 1μF

TEMPERATURE (°C)

Dropout Voltage vs. Temperature (VOUT = 3.3V)

0.000

0.020

0.040

0.060

0.080

0.100

0.120

0.140

0.160

0.180

0.200

-40 -20 0 20 50 70 125

DROPOUT VOLTAGE (V)

LOAD

= 100mA

= 1μF

OUT

= 1μF

TEMPERATURE (°C)

Dropout Voltage vs. Temperature

(VOUT

= 3.3V)

GND CURRENT (

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5

ILOAD = 10mA

CIN = 1μF

COUT = 1μF

Ground Current vs. VIN (VOUT = 3.3V)

VIN (V)

0.000

0.010

0.020

0.030

0.040

0.050

0.060

0.070

0.080

0.090

0.100

-40 -20 0 20 50 70 125

DROPOUT VOLTAGE (V)

ILOAD = 50mA

CIN = 1μF

COUT = 1μF

TEMPERATURE (°C)

Dropout Voltage vs. Temperature (VOUT = 3.3V)

0.000

0.050

0.100

0.150

0.200

0.250

0.300

-40 -20 0 20 50 70 125

DROPOUT VOLTAGE (V)

LOAD

= 150mA

= 1μF

OUT

= 1μF

TEMPERATURE (°C)

Dropout Voltage vs. Temperature

(VOUT

= 3.3V)

GND CURRENT (

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5

LOAD

= 100mA

= 1μF

OUT

= 1μF

Ground Current vs. V

(VOUT

= 3.3V)

(V)

TC1070/TC1071/TC1187

5.0 TYPICAL CHARACTERISTICS (CONTINUED)

(Unless Otherwise Specified, All Parts Are Measured At Temperature = 25°C)

GND CURRENT (μA)

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5

ILOAD = 150mA

CIN = 1μF

COUT = 1μF

VIN (V)

Ground Current vs. VIN (VOUT = 3.3V)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

LOAD

= 100mA

= 1μF

OUT

= 1μF

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7

(V)

OUT

(V)

OUT

vs.

OUT

= 3.3V)

3.274

3.276

3.278

3.280

3.282

3.284

3.286

3.288

3.290

-40 -20 -10 0 20 40 85 125

ILOAD = 150mA

CIN = 1μF

COUT = 1μF

VIN = 4.3V

TEMPERATURE (°C)

VOUT (V)

Output Voltage vs. Temperature (VOUT = 3.3V)

0.5

1.5

2.5

3.5

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7

LOAD

= 0

= 1μF

OUT

= 1μF

(V)

OUT

(V)

OUT

vs.

OUT

= 3.3V)

3.275

3.280

3.285

3.290

3.295

3.300

3.305

3.310

3.315

3.320

-40 -20 -10 0 20 40 85 125

ILOAD = 10mA

CIN = 1μF

COUT = 1μF

VIN = 4.3V

TEMPERATURE (°C)

VOUT (V)

Output Voltage vs. Temperature (VOUT = 3.3V)

TC1070/TC1071/TC1187

5.0 TYPICAL CHARACTERISTICS (CONTINUED)

(Unless Otherwise Specified, All Parts Are Measured At Temperature = 25°C)

4.985

4.990

4.995

5.000

5.005

5.010

5.015

5.020

5.025

-40 -20 -10 0 20 40 85 125

ILOAD = 10mA

VIN = 6V

CIN = 1μF

COUT = 1μF

TEMPERATURE (°C)

Output Voltage vs. Temperature (VOUT = 5V)

VOUT (V)

-40 -20 -10 0 20 40 85 125

GND CURRENT (

ILOAD = 10mA

VIN = 6V

CIN = 1μF

COUT = 1μF

TEMPERATURE (°C)

Temperature

vs. Quiescent Current

(VOUT = 5V)

4.974

4.976

4.978

4.980

4.982

4.984

4.986

4.988

4.990

4.992

4.994

-40 -20 -10 0 20 40 85 125

ILOAD = 150mA

VIN = 6V

CIN = 1μF

COUT = 1μF

TEMPERATURE (°C)

Output Voltage vs. Temperature (VOUT = 5V)

VOUT (V)

Temperature vs. Quiescent Current (VOUT

= 5V)

-40 -20 -10 0 20 40 85 125

GND CURRENT (μA)

LOAD

= 150mA

= 6V

= 1μF

OUT

= 1μF

TEMPERATURE (°C)

10.0

1.0

0.1

0.0

0.01K 0.1K 1K 10K 100K 1000K

FREQUENCY (Hz)

Output Noise vs. Frequency

NOISE (μV/√Hz)

RLOAD = 50Ω

COUT = 1μF

CIN = 1μF

1000

100

0.1

0.01

010 20 30 40 50 60 70 80 90 100

LOAD CURRENT (mA)

Stability Region vs. Load Current

COUT ESR (Ω)

COUT = 1μF

to 10μF

Stable Region

table Re

-30

-35

-40

-45

-50

-60

-55

-65

-70

-75

-80

0.01K 0.1K 1K 10K 100K 1000

FREQUENCY (Hz)

Power Supply Rejection Ratio

PSRR (dB)

IOUT = 10mA

VINDC = 4V

VINAC = 100mVp-p

VOUT = 3V

CIN = 0

COUT = 1μF

TC1070/TC1071/TC1187

5.0 TYPICAL CHARACTERISTICS (CONTINUED)

VOUT

VSHDN

Measure Rise Time of 3.3V LDO

Conditions: CIN = 1μF, COUT = 1μF, ILOAD = 100mA, VIN = 4.3V,

Temp = 25

C, Fall Time = 184μS

VSHDN

Measure Rise Time of 5.0V LDO

Conditions: CIN = 1μF, COUT = 1μF, ILOAD = 100mA, VIN = 6V,

Temp = 25°C, Fall Time = 192μS

VOUT

Thermal Shutdown Response of 5.0V LDO

Conditions: V

= 6V, C

= 0μF, C

OUT

= 1μF

LOAD

was increased until temperature of die reached about 160°C, at

which time integrated thermal protection circuitry shuts the regulator

off when die temperature exceeds approximately 160°C. The regulator

remains off until die temperature drops to approximately 150°C.

OUT

Measure Fall Time of 3.3V LDO

Conditions: C

= 1μF, C

OUT

= 1μF, I

LOAD

= 100mA, V

= 4.3V,

Temp = 25°C, Fall Time = 52μS

OUT

SHDN

Measure Fall Time of 5.0V LDO

Conditions: C

= 1μF, C

OUT

= 1μF, I

LOAD

= 100mA, V

= 6V,

Temp = 25°C, Fall Time = 88μS

OUT

SHDN

TC1070/TC1071/TC1187

6.0 P ACKAGING INFORMATION

6.1 Package Marking Information

“1” & “2” = part number code + temperature range and

voltage

“3” represents year and quarter code

“4” represents lot ID number

6.2 Taping Form

(V) TC1070

Code TC1071

Code TC1187

Code

Adjustable BA BB R9

Component Taping Orientation for 5-Pin SOT-23A (EIAJ SC-74A) Devices

Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size

5-Pin SOT-23A 8 mm 4 mm 3000 7 in

Carrier Tape, Number of Components Per Reel and Reel Size

User Direction of Feed

Device

Marking

PIN 1

Standard Reel Component Orientation

713 Suffix Device

(Mark Right Side Up)

TC1070/TC1071/TC1187

6.3 Package Dimensions

.071 (1.80)

.059 (1.50)

.122 (3.10)

.098 (2.50)

.075 (1.90)

Ref.

.020 (0.50)

.012 (0.30)

Pin 1

.037 (0.95)

Ref.

.122 (3.10)

.106 (2.70)

.057 (1.45)

.035 (0.90)

.006 (0.15)

.000 (0.00)

.024 (0.60)

.004 (0.10)

10° Max. .010 (0.25)

.004 (0.09)

SOT-23A-5

Dimensions: inches (mm)

TC1070/TC1071/TC1187

SALES AND SUPPORT

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-

mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office

2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

3. The Microchip Worldwide Site (www.micr ochip.com)

Please specify which device, revision of silicon and Dat a Sheet (include Literature #) you are using.

New Customer Notification System

TC1070/TC1071/TC1187

NOTES:

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applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

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in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that it s family of products is one of the most secure families of it s kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is c onstantly evolving. We a t Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’ s code protection f eature may be a violati on of t he Digit al Millennium Copyright Act. If such act s

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2002 quality system certification for

its worldwide headquarters, design and wafer fabrication facilities in

Chandler and Tempe, Arizona and Mountain View, California in

October 2003. The Company’s quality system processes and

procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping

devices, Serial EEPROMs, micro peripherals, nonvolat ile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

AMERICAS

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WORLDWIDE SALES AND SERVICE

10/31/05