DATA SH EET
Product specification
Supersedes data of 2002 Jan 14 2003 Oct 10
INTEGRATED CIRCUITS
SAA6581
RDS/RBDS demodulator
2003 Oct 10 2
Philips Semiconductors Product specification
RDS/RBDS demodulator SAA6581
FEATURES
•Integrated switched capacitor filter
•Demodulates European Radio Data System (RDS) or
the USA Radio Broadcast Data System (RBDS) signals
•Oscillator frequencies: 4.332 or 8.664 MHz
•Integrated ARI clamping
•CMOS device
•Single supply voltage: 5 V
•Extended temperature range: −40 to +85 °C
•Low number of external components.
GENERAL DESCRIPTION
The RDS/RBDS demodulator is a CMOS device with
integrated filtering and demodulating of RDS/RBDS
signals coming from a multiplexed input data stream. Data
signal RDDA and clock signal RDCL are provided as
outputs for further processing by a suitable
microcomputer, for example CCR921 and CCR922.
The SAA6581T replaces SAA6579 in function and
pin-compatibility.
APPLICATIONS
The RDS/RBDS system offers a large range of
applications from the many functions that can be
implemented. For car radios the most important are:
•Program Service (PS) name
•Traffic Program (TP) identification
•Traffic Announcement (TA) signal
•Alternative Frequency (AF) list
•Program Identification (PI)
•Enhanced Other Networks (EON) information.
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
VDDA analog supply voltage 4.0 5.0 5.5 V
VDDD digital supply voltage 4.0 5.0 5.5 V
IDD(tot) total supply current −6.0 −mA
Vi(MPX) RDS input sensitivity at pin MPX 1 −−mV
fi(xtal) crystal input frequency −4.332 −MHz
−8.664 −MHz
TYPE
NUMBER PACKAGE
NAME DESCRIPTION VERSION
SAA6581T SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1
SAA6581HN HVQFN32 plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 ×5×0.85 mm SOT617-1
2003 Oct 10 3
Philips Semiconductors Product specification
RDS/RBDS demodulator SAA6581
BLOCK DIAGRAM
handbook, full pagewidth
57 kHz
8th ORDER
BANDPASS FILTER
CLOCKED
COMPARATOR RDS/RBDS
DEMODULATOR
SIGNAL QUALITY
DETECTOR
POWER
SUPPLY
AND RESET TEST
CONTROL OSCILLATOR
AND CLOCK
MPX
multiplex
input
C1
C6
330 pF
560 pF
4 (12)
VDDA
VSSA Vref
+5 V
+5 V
C2
100 nF
C4
47 pF C5
56 pF
C7
100 nF
C3
2.2 µF
5 (13)
6 (16) VSSD
11 (27)3 (9) TCON
CINSCOUT
15 (2)
8 (20) 7 (18)
MODE
VDDD
9 (21) OSCI
Q1
OSCO
QUAL
RDDA
RDCL
SYNC
13 (29) 14 (32)
12 (28)
(4) 16
(23) 10
(6) 2
(5) 1
MHC651
SAA6581
Fig.1 Block diagram.
Pin numbers for the SAA6581HN are given in parenthesis.
2003 Oct 10 4
Philips Semiconductors Product specification
RDS/RBDS demodulator SAA6581
PINNING
SYMBOL PIN DESCRIPTION
SO16 HVQFN32
QUAL 1 5 signal quality indication
output
RDDA 2 6 RDS data output
n.c. −7 not connected
n.c. −8 not connected
Vref 3 9 reference voltage output
(1/2VDDA)
n.c. −10 not connected
n.c. −11 not connected
MPX 4 12 multiplex signal input
VDDA 5 13 analog supply voltage
(5 V)
n.c. −14 not connected
n.c. −15 not connected
VSSA 6 16 analog ground (0 V)
n.c. −17 not connected
CIN 7 18 comparator input
n.c. −19 not connected
SCOUT 8 20 switched capacitor filter
output
MODE 9 21 oscillator frequency
select input
n.c. −22 not connected
SYNC 10 23 ARI clamping control
input
n.c. −24 not connected
n.c. −25 not connected
n.c. −26 not connected
VSSD 11 27 digital ground (0 V)
VDDD 12 28 digital supply voltage
(5 V)
OSCI 13 29 oscillator input
n.c. −30 not connected
n.c. −31 not connected
OSCO 14 32 oscillator output
n.c. −1 not connected
TCON 15 2 test control input
n.c. −3 not connected
RDCL 16 4 RDS clock output
SYMBOL PIN DESCRIPTION
SO16 HVQFN32
handbook, halfpage
MHB900
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
QUAL
RDDA
Vref
MPX
VDDA
VSSA
CIN
SCOUT
RDCL
TCON
OSCO
OSCI
VDDD
VSSD
SYNC
MODE
SAA6581T
Fig.2 Pin configuration for SO16.
handbook, halfpage
Vref
VDDA
n.c.
MPX
n.c.
n.c.
VSSA
n.c.
OSCO
VDDD
n.c.
OSCI
n.c.
VSSD
n.c.
n.c.
SAA6581HN
n.c.
RDDA
n.c.
QUAL
RDCL
n.c.
TCON
n.c.
MHC652
CIN
n.c.
SCOUT
n.c.
MODE
n.c.
SYNC
n.c.
2
1
3
4
5
6
7
16
14
12
15
13
11
10
9
25
28
26
27
29
30
31
32
8
24
23
21
22
20
19
18
17
Fig.3 Pin configuration for HVQFN32.
Bottom view.
2003 Oct 10 5
Philips Semiconductors Product specification
RDS/RBDS demodulator SAA6581
FUNCTIONAL DESCRIPTION
RDS/RBDS signal demodulation
BANDPASS FILTER
The bandpass filter has a centre frequency of 57 kHz. It
selects the RDS/RBDS sub-band from the multiplex signal
MPX and suppresses the audio signal components. The
filter block contains an analog anti-aliasing filter at the
input followed by an 8th order switched capacitor
bandpass filter and a reconstruction filter at the output.
CLOCKED COMPARATOR
Thecomparatordigitizestheoutputsignalfromthe57 kHz
bandpass filter for further processing by the digital
RDS/RBDS demodulator. To attain high sensitivity and to
avoid phase distortion, the comparator input stage has
automatic offset compensation.
DEMODULATOR
The demodulator provides all functions of the SAA6579
and improves performance under weak signal conditions.
Demodulator functions include:
•57 kHz carrier regeneration from the two sidebands
(Costas loop)
•Symbol integration over one RDS clock period
•Bi-phase symbol decoding
•Differential decoding
•Synchronization of RDS/RBDS output data.
The RDS/RBDS demodulator recovers and regenerates
the continuously transmitted RDS/RBDS data stream in
the MPX signal and provides clock RDCL for the output
signalsand data output RDDAfor further processing byan
RDS/RBDS decoder, for example CCR921 or CCR922.
ARI CLAMP
The demodulator checks the input signal for presence of
RDS only, or RDS plus ARI transmissions. After a fixed
test period, if the SYNC input is set HIGH the demodulator
locksinthe‘verified’condition (seeTable 1).If SYNCisset
LOW, the ARI clamping is reset (disabled). After SYNC
returns to HIGH, the demodulator resumes checking the
input signal.
Table 1 Control pin SYNC
SIGNAL QUALITY DETECTION
Output QUAL indicates the safety of the regenerated RDS
data (HIGH = ‘good’ data; LOW = ‘unsafe’ data).
Oscillator and system clock generator
For good performance of the bandpass and demodulator
stages, the demodulator requires a crystal oscillator with a
frequency of 4.332 or 8.664 MHz. The demodulator can
operatewitheitherfrequency (see Table 2), so that a radio
set with a microcontroller can run, in this case, with one
crystal only. The demodulator oscillator can drive the
microcontroller, or vice versa.
Table 2 Control pins TCON and MODE
The clock generator generates the internal 4.332 MHz
system clock and timing signal derivatives.
Power supply and internal reset
Thedemodulator has separate powersupplyinputs for the
digital and analog parts of the device. For the analog
functions an additional reference voltage (1⁄2VDDA) is
internally generated and available via the output pin Vref.
The demodulator requires a defined reset condition. The
demodulator generates automatically a reset signal after
the power supply VDDA is switched on, or at a voltage-drop.
SYNC ARI CLAMPING
LOW internal ARI clamping disabled
HIGH ARI clamping allowed to be logged
TCON MODE OSCILLATOR FREQUENCY
HIGH LOW 4.332 MHz
HIGH HIGH 8.664 MHz
2003 Oct 10 6
Philips Semiconductors Product specification
RDS/RBDS demodulator SAA6581
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Notes
1. Without latching in the entire temperature range.
2. Human body model (equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor).
3. Machine model (equivalent to discharging a 200 pF capacitor through a 0 Ωseries resistor and 0.75 µH inductance).
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VDD supply voltage 0 6.5 V
Vnvoltage at pins QUAL, RDDA, Vref, MPX,
CIN, SCOUT, MODE, SYNC, OSCI, OSCO,
TCON and RDCL with respect to pins VSSA
and VSSD
pins VDDA and VDDD are
connected to VDD
−0.5 VDD + 0.5 ≤6.5 V
Vi(MPX)(p-p) input voltage at pin MPX (peak-to-peak
value) note 1 −6V
I
i
input current at pins QUAL, RDDA, Vref,
MPX, VDDA, CIN, SCOUT, MODE, SYNC,
VDDD, OSCI, OSCO, TCON and RDCL
pins VSSA and VSSD are
connected to ground −10 +10 mA
Ilu(prot) latch-up protection current in pulsed mode Tamb =−40 to +85 °C with
voltage limiting −2 to +10 V −100 +100 mA
Tamb =25°C with voltage
limiting −2 to +12 V −200 +200 mA
Tamb =−40 to +85 °C
without voltage limiting −10 +10 mA
Tamb ambient temperature −40 +85 °C
Tstg storage temperature −65 +150 °C
Ves electrostatic handling voltage note 2 −3000 +3000 V
note 3 −400 +400 V
SYMBOL PARAMETER CONDITIONS VALUE UNIT
Rth(j-a) thermal resistance from junction to ambient in free air
SAA6581T (SO16) 104 K/W
SAA6581HN (HVQFN32) with soldered heatsink 100 K/W
2003 Oct 10 7
Philips Semiconductors Product specification
RDS/RBDS demodulator SAA6581
CHARACTERISTICS: DIGITAL PART
VDDA =V
DDD =5V; T
amb =25°C; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
VDDD digital supply voltage 4.0 5.0 5.5 V
IDDD digital supply current −1.5 −mA
Ptot total power dissipation −30 −mW
Inputs
VIL LOW-level input voltage at
pins TCON, OSCI, SYNC and MODE −−0.3VDDD V
VIH HIGH-level input voltage at
pins TCON, OSCI, SYNC and MODE 0.7VDDD −− V
I
i(pu) input pull-up current at pins TCON
and MODE VIH = 3.5 V −10 −20 −µA
Outputs
VOL LOW-level output voltage at
pins QUAL, RDDA and RDCL IOL =2mA −−0.4 V
VOH HIGH-level output voltage at
pins QUAL, RDDA and RDCL IOH =−0.02 mA 4.0 −− V
Crystal parameters
fi(xtal) crystal input frequency TCON = HIGH;
MODE = LOW −4.332 −MHz
TCON = HIGH;
MODE = HIGH −8.664 −MHz
∆foscadjustment tolerance of oscillator
frequency −−30 ×10−6
∆fosc(T)temperature drift of oscillator
frequency Tamb =−40 to +85 °C−−30 ×10−6
CLload capacitance −30 −pF
Rxtal crystal resonance resistance −−120 Ω
2003 Oct 10 8
Philips Semiconductors Product specification
RDS/RBDS demodulator SAA6581
CHARACTERISTICS: ANALOG PART
VDDA =V
DDD =5V; T
amb =25°C; measurements taken in Fig.1; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
VDDA analog supply voltage 4.0 5.0 5.5 V
VDDA −VDDD difference between analog and
digital supply voltages −0 0.5 V
IDD(tot) total supply current −6.0 −mA
Vref reference voltage VDDA = 5 V 2.25 2.5 2.75 V
Zo(Vref) output impedance at pin Vref −25 −kΩ
MPX input (signal before the capacitor on pin MPX)
Vi(MPX)(rms) RDS amplitude (RMS value) ∆f=±1.2 kHz RDS-signal;
∆f=±3.2 kHz ARI-signal 1−−mV
Vi(max)(p-p) maximum input signal capability
(peak-to-peak value) f=57±2 kHz 200 −−mV
f < 50 kHz 1.4 −−V
f < 15 kHz 2.8 −−V
f > 70 kHz 3.5 −−V
R
i(MPX) input resistance f = 0 to 100 kHz 40 −−kΩ
57 kHz bandpass filter
fccentre frequency Tamb =−40 to +85 °C 56.5 57.0 57.5 kHz
B−3dB −3 dB bandwidth 2.5 3.0 3.5 kHz
GSCOUT-MPX signal gain f = 57 kHz 17 20 23 dB
αsb stop band attenuation ∆f=±7 kHz 31 −−dB
f < 45 kHz 40 −−dB
f < 20 kHz 50 −−dB
f > 70 kHz 40 −−dB
Ro(SCOUT) output resistance at pin SCOUT f = 57 kHz −30 60 Ω
Comparator input (pin CIN)
Vi(min)(rms) minimum input level
(RMS value) f = 57 kHz −110mV
R
iinput resistance 70 110 150 kΩ
2003 Oct 10 9
Philips Semiconductors Product specification
RDS/RBDS demodulator SAA6581
TIMING DATA
handbook, full pagewidth
tCLKH
TCLK
Tbit(slipped)
td(clk)
MHB901
RDDA
RDCL
td(clk)
Fig.4 RDS timing diagram including a phase change.
Table 3 RDS timing (see Fig.4)
SYMBOL PARAMETER TYP. UNIT
td(clk) clock-data delay 4 µs
TCLK clock period 842 µs
tCLKH clock HIGH time 421 µs
Tbit(slipped) slipped data bit period 1263 µs
2003 Oct 10 10
Philips Semiconductors Product specification
RDS/RBDS demodulator SAA6581
PACKAGE OUTLINES
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
2.65 0.3
0.1 2.45
2.25 0.49
0.36 0.32
0.23 10.5
10.1 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.1
0.4
SOT162-1
8
16
wM
bp
D
detail X
Z
e
9
1
y
0.25
075E03 MS-013
pin 1 index
0.1 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.41
0.40 0.30
0.29 0.05
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
X
θ
A
A1
A2
HE
Lp
Q
E
c
L
vMA
(A )
3
A
0 5 10 mm
scale
SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1
99-12-27
03-02-19
2003 Oct 10 11
Philips Semiconductors Product specification
RDS/RBDS demodulator SAA6581
0.51
A1Eh
b
UNIT ye
0.2
c
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 5.1
4.9
Dh
3.25
2.95
y1
5.1
4.9 3.25
2.95
e1
3.5
e2
3.5
0.30
0.18
0.05
0.00 0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT617-1 MO-220- - - - - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT617-1
HVQFN32: plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 x 5 x 0.85 mm
A(1)
max.
AA1c
detail X
y
y1C
e
L
Eh
Dh
e
e1
b
916
32 25
24
17
8
1
X
D
E
C
BA
e2
terminal 1
index area
terminal 1
index area
01-08-08
02-10-18
1/2 e
1/2 e AC
CB
vM
wM
E(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D(1)
2003 Oct 10 12
Philips Semiconductors Product specification
RDS/RBDS demodulator SAA6581
SOLDERING
Introduction
Thistextgives averybriefinsightto a complextechnology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-holeandsurfacemountcomponentsaremixedon
one printed-circuit board. Wave soldering can still be used
for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is
recommended. Driven by legislation and environmental
forces the worldwide use of lead-free solder pastes is
increasing.
Through-hole mount packages
SOLDERING BY DIPPING OR BY SOLDER WAVE
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
Thetotal contacttimeofsuccessive solderwavesmustnot
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.
Surface mount packages
REFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
totheprinted-circuitboardbyscreenprinting,stencillingor
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 270 °C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
•below 220 °C (SnPb process) or below 245 °C (Pb-free
process)
– for all the BGA and SSOP-T packages
– for packages with a thickness ≥2.5 mm
– for packages with a thickness < 2.5 mm and a
volume ≥350 mm3 so called thick/large packages.
•below 235 °C (SnPb process) or below 260 °C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
WAVE SOLDERING
Conventional single wave soldering is not recommended
forsurface mountdevices(SMDs)or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
•Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
•For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
•Forpackages withleadsonfour sides,thefootprintmust
be placed at a 45°angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
2003 Oct 10 13
Philips Semiconductors Product specification
RDS/RBDS demodulator SAA6581
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
MANUAL SOLDERING
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C. When using a dedicated tool, all other leads can
be soldered in one operation within 2 to 5 seconds
between 270 and 320 °C.
Suitability of IC packages for wave, reflow and dipping soldering methods
Notes
1. FormoredetailedinformationontheBGApackagesrefertothe
“(LF)BGAApplicationNote
”(AN01026);orderacopy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
.
3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
4. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 °C±10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
5. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
6. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
7. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
8. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
9. Hot bar soldering or manual soldering is suitable for PMFP packages.
MOUNTING PACKAGE(1) SOLDERING METHOD
WAVE REFLOW(2) DIPPING
Through-hole mount DBS, DIP, HDIP, RDBS, SDIP, SIL suitable(3) −suitable
Through-hole-
surface mount PMFP(9) not suitable not suitable −
Surface mount BGA, LBGA, LFBGA, SQFP, SSOP-T(4),
TFBGA, VFBGA not suitable suitable −
DHVQFN, HBCC, HBGA, HLQFP, HSQFP,
HSOP, HTQFP, HTSSOP, HVQFN, HVSON,
SMS
not suitable(5) suitable −
PLCC(6), SO, SOJ suitable suitable −
LQFP, QFP, TQFP not recommended(6)(7) suitable −
SSOP, TSSOP, VSO, VSSOP not recommended(8) suitable −
2003 Oct 10 14
Philips Semiconductors Product specification
RDS/RBDS demodulator SAA6581
DATA SHEET STATUS
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
LEVEL DATA SHEET
STATUS(1) PRODUCT
STATUS(2)(3) DEFINITION
I Objective data Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III Product data Production This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
DEFINITIONS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseor at any otherconditionsabovethosegiveninthe
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationorwarrantythatsuchapplicationswillbe
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomersusingorsellingtheseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
© Koninklijke Philips Electronics N.V. 2003 SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
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Contact information
For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825
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Printed in The Netherlands R32/03/pp15 Date of release: 2003 Oct 10 Document order number: 9397 750 12035
