MJE181 - FAIRCHILD SEMICONDUCTOR

January, 2015 − Rev. 10 1Publication Order Number:

MC74AC00/D

MC74AC00, MC74ACT00

Quad 2-Input NAND Gate

High−Performance Silicon−Gate CMOS

Features

•Output Drive Capability: $24 mA

•Operating Voltage Range: 2 to 6 V AC00; 4.5 to 5.5 ACT00

•Low Input Current: 1.0 mA

•High Noise Immunity Characteristic of CMOS Devices

•In Compliance With the JEDEC Standard No. 7A Requirements

•Chip Complexity: 32 FETs

•These are Pb−Free Devices

3Y1

PIN 14 = VCC

PIN 7 = GND

Figure 1. Logic Diagram

6Y2

8Y3

11 Y4

Y = AB

Figure 2. Pinout: 14−Lead Packages (Top View)

1314 12 11 10 9 8

21 34567

VCC B4 A4 Y4 B3 A3 Y3

A1 B1 Y1 A2 B2 Y2 GND

MARKING

DIAGRAMS

xxx = AC or ACT

A = Assembly Location

WL or L = Wafer Lot

Y = Year

WW or W = Work Week

G or G= Pb−Free Package

TSSOP−14

DT SUFFIX

CASE 948G

xxx

ALYWG

SOIC−14

D SUFFIX

CASE 751A

See detailed ordering and shipping information in the package

dimensions section on page 5 of this data sheet.

ORDERING INFORMATION

FUNCTION TABLE

Inputs Output

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xxx00G

AWLYWW

(Note: Microdot may be in either location)

MC74AC00, MC74ACT00

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MAXIMUM RATINGS

Symbol Parameter Value Unit

VCC DC Supply Voltage *0.5 to )7.0 V

VIDC Input Voltage *0.5 v VI v VCC )0.5 V

VODC Output Voltage (Note 1) *0.5 v VO v VCC )0.5 V

IIK DC Input Diode Current $20 mA

IOK DC Output Diode Current $50 mA

IODC Output Sink/Source Current $50 mA

ICC DC Supply Current per Output Pin $50 mA

IGND DC Ground Current per Output Pin $50 mA

TSTG Storage Temperature Range *65 to )150 °C

TLLead temperature, 1 mm from Case for 10 Seconds 260 °C

TJJunction temperature under Bias )150 °C

qJA Ther mal Resistance (Note 2) SOIC

TSSOP 125

170 °C/W

PDPower Dissipation in Still Air at 85°C SOIC

TSSOP 125

170 mW

MSL Moisture Sensitivity Level 1

FRFlammability Rating Oxygen Index: 30% − 35% UL 94 V−0 @ 0.125 in

VESD ESD Withstand Voltage Human Body Model (Note 3)

Machine Model (Note 4)

Charged Device Model (Note 5)

> 2000

> 200

> 1000

ILatch−Up Latch−Up Performance Above VCC and Below GND at 85°C (Note 6) $100 mA

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be af fected.

1. IO absolute maximum rating must be observed.

2. The package thermal impedance is calculated in accordance with JESD51−7.

3. Tested to EIA/JESD22−A114−A.

4. Tested to EIA/JESD22−A115−A.

5. Tested to JESD22−C101−A.

6. Tested to EIA/JESD78.

RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Typ Max Unit

VCC Supply Voltage MC74AC00

MC74ACT00 2.0

4.5 5.0

5.0 6.0

5.5 V

Vin, Vout DC Input V oltage, Output Voltage (Ref. to GND) 0 − VCC V

tr, tfInput Rise and Fall Time (Note 7) VCC @ 3.0 V

MC74AC00 VCC @ 4.5 V

VCC @ 5.5 V

−

150

−

ns/V

tr, tfInput Rise and Fall Time (Note 8) VCC @ 4.5 V

MC74ACT00 VCC @ 5.5 V −

−10

8.0 −

−ns/V

TJJunction Temperature − − 150 °C

TAOperating Ambient Temperature Range −55 25 125 °C

IOH Output Current − High − − −24 mA

IOL Output Current − Low − − 24 mA

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.

7. Vin from 30% to 70% VCC.

8. Vin from 0.8 V to 2.0 V.

MC74AC00, MC74ACT00

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DC CHARACTERISTICS

Symbo

Parameter VCC

(V)

MC74AC00

Unit Conditions

TA = +255C TA = − 405C to +855CTA = −555C + 1255C

Typ Guaranteed Limits

VIH Minimum High Level

Input Voltage 3.0

4.5

5.5

1.5

2.25

2.75

2.1

3.15

3.85

2.1

3.15

3.85

2.1

3.15

3.85

V VOUT = 0.1 V

or VCC − 0.1 V

VIL Maximum Low Level

Input Voltage 3.0

4.5

5.5

1.5

2.25

2.75

0.9

1.35

1.65

0.9

1.35

1.65

0.9

1.35

1.65

V VOUT = 0.1 V

or VCC − 0.1 V

VOH Minimum High Level

Output Voltage 3.0

4.5

5.5

2.99

4.49

5.49

2.9

4.4

5.4

2.9

4.4

5.4

2.9

4.4

5.4

VIOUT = −50 mA

3.0

4.5

5.5

−

2.56

3.86

4.86

2.46

3.76

4.76

2.4

3.7

4.7

V *VIN = VIL or VIH

−12 mA

IOH −24 mA

−24 mA

VOL Maximum Low Level

Output Voltage 3.0

4.5

5.5

0.002

0.001

0.1

VIOUT = 50 mA

3.0

4.5

5.5

−

0.36

0.44

0.5

V *VIN = VIL or VIH

12 mA

IOL 24 mA

24 mA

IIN Maximum Input

Leakage Current 5.5 − $0.

1$1.0 $1.0 mAVI = VCC, GND

IOLD †Minimum Dynamic

Output Current 5.5 − − 75 50 mA VOLD = 1.65 V Max

IOHD 5.5 − − −75 −50 mA VOHD = 3.85 V Min

ICC Maximum Quiescent

Supply Current 5.5 − 4.0 40 40 mAVIN = VCC or GND

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

*All outputs loaded; thresholds on input associated with output under test.

†Maximum test duration 2.0 ms, one output loaded at a time.

NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC.

AC CHARACTERISTICS (tr = tf = 3.0 nS; CL = 50 pF; see Figures 3 and 4 for Waveforms)

Symbo

Parameter VCC*

(V)

MC74AC00

Unit

TA = +255C TA = −405C to +855C TA = −555C to + 1255C

Min Typ Max Min Max Min Max

tPLH Propagation Delay 3.3

5.0 2.0

1.5 7.0

6.0 9.5

8.0 2.0

1.5 10.0

8.5 1.0

1.0 11.0

8.5 ns

tPHL Propagation Delay 3.3

5.0 1.5

1.5 5.5

4.5 8.0

6.5 1.0

1.0 8.5

7.0 1.0

1.0 9.0

7.0 ns

*Voltage Range 3.3 V is 3.3 V $0.3 V.

Voltage Range 5.0 V is 5.0 V $0.5 V.

MC74AC00, MC74ACT00

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DC CHARACTERISTICS

Symbo

Parameter VCC

(V)

MC74ACT00

Uni

Conditions

TA = +255C TA = − 405C to +855C TA = −555C to + 1255C

Typ Guaranteed Limits

VIH Minimum High Level

Input Voltage 4.5

5.5 1.5

1.5 2.0

2.0 2.0

2.0 V VOUT = 0.1 V

or VCC − 0.1 V

VIL Maximum Low Level

Input Voltage 4.5

5.5 1.5

1.5 0.8

0.8 0.8

0.8 V VOUT = 0.1 V

or VCC − 0.1 V

VOH Minimum High Level

Output Voltage 4.5

5.5 4.49

5.49 4.4

5.4 4.4

5.4 VIOUT = −50 mA

4.5

5.5 −

−3.86

4.86 3.76

4.76 3.7

4.7

V *VIN = VIL or VIH

IOH −24 mA

−24 mA

VOL Maximum Low Level

Output Voltage 4.5

5.5 0.001

0.001 0.1

0.1 0.1

0.1 VIOUT = 50 mA

4.5

5.5 −

−0.36

0.36 0.44

0.44 0.5

0.5

V *VIN = VIL or VIH

IOL 24 mA

24 mA

IIN Maximum Input

Leakage Current 5.5 − $0.1 $1.0 $1.0 mAVI = VCC, GND

DICCT Additional Max. ICC/Input 5.5 0.6 − 1.5 1.6 mA VI = VCC − 2.1 V

IOLD †Minimum Dynamic

Output Current 5.5 − − 75 50 mA VOLD = 1.65 V Max

IOHD 5.5 − − −75 −50 mA VOHD = 3.85 V Min

ICC Maximum Quiescent

Supply Current 5.5 − 4.0 40 40 mAVIN = VCC or GND

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

*All outputs loaded; thresholds on input associated with output under test.

†Maximum test duration 2.0 ms, one output loaded at a time.

AC CHARACTERISTICS (tr = tf = 3.0 nS; CL = 50 pF; see Figures 3 and 4 for Waveforms)

Symbo

Parameter VCC*

(V)

MC74ACT00

Unit

TA = +255C TA = −405C to +855CTA = −555C to +1255C

Min Typ Max Min Max Min Max

tPLH Propagation Delay 5.0 1.5 5.5 9.0 1.0 9.5 1.0 9.5 ns

tPHL Propagation Delay 5.0 1.5 4.0 7.0 1.0 8.0 1.0 8.0 ns

*Voltage Range 5.0 V is 5.0 V $0.5 V.

CAPACITANCE

Symbol Parameter Value

Typ Test Conditions Unit

CIN Input Capacitance 4.5 VCC = 5.0 V pF

CPD Power Dissipation Capacitance 30 VCC = 5.0 V pF

MC74AC00, MC74ACT00

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Figure 3. Switching Waveforms

GND

VCC

OUTPUT Y

INPUT

A OR B

CL*

*Includes all probe and jig capacitance

50%

DEVICE

UNDER

TEST

OUTPUT

Figure 4. Test Circuit

90%

Vmi

10%

tPLH tPHL

tftr

50 W Scope

Test Point

450 W

INPUT

Vmi = 50% for MC74AC00

= 1.5 V for MC74ACT00

ORDER INFORMATION

Device Package Shipping†

MC74AC00DG SOIC−14

(Pb−Free) 55 Units / Rail

MC74AC00DR2G SOIC−14

(Pb−Free) 2500 / Tape and Reel

MC74AC00DTR2G TSSOP−14

(Pb−Free)

MC74ACT00DG SOIC−14

(Pb−Free) 55 Units / Rail

MC74ACT00DR2G SOIC−14

(Pb−Free) 2500 / Tape and Reel

MC74ACT00DTR2G TSSOP−14

(Pb−Free)

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

MC74AC00, MC74ACT00

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PACKAGE DIMENSIONS

SOIC−14 NB

CASE 751A−03

ISSUE K

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE PROTRUSION

SHALL BE 0.13 TOTAL IN EXCESS OF AT

MAXIMUM MATERIAL CONDITION.

4. DIMENSIONS D AND E DO NOT INCLUDE

MOLD PROTRUSIONS.

5. MAXIMUM MOLD PROTRUSION 0.15 PER

SIDE.

14 8

0.25 B M

X 45

SEATING

PLANE

0.25 B S

13X

DET AIL A

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

D8.55 8.75 0.337 0.344

E3.80 4.00 0.150 0.157

A1.35 1.75 0.054 0.068

b0.35 0.49 0.014 0.019

L0.40 1.25 0.016 0.049

e1.27 BSC 0.050 BSC

A3 0.19 0.25 0.008 0.010

A1 0.10 0.25 0.004 0.010

M0 7 0 7

H5.80 6.20 0.228 0.244

h0.25 0.50 0.010 0.019

__ __

6.50

14X

0.58

14X

1.18

1.27

DIMENSIONS: MILLIMETERS

PITCH

SOLDERING FOOTPRINT*

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

MC74AC00, MC74ACT00

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PACKAGE DIMENSIONS

TSSOP−14

CASE 948G

ISSUE B

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A4.90 5.10 0.193 0.200

B4.30 4.50 0.169 0.177

C−−− 1.20 −−− 0.047

D0.05 0.15 0.002 0.006

F0.50 0.75 0.020 0.030

G0.65 BSC 0.026 BSC

H0.50 0.60 0.020 0.024

J0.09 0.20 0.004 0.008

J1 0.09 0.16 0.004 0.006

K0.19 0.30 0.007 0.012

K1 0.19 0.25 0.007 0.010

L6.40 BSC 0.252 BSC

M0 8 0 8

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD

FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH OR GATE BURRS SHALL NOT

EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE

INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION SHALL

NOT EXCEED 0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN

EXCESS OF THE K DIMENSION AT MAXIMUM

MATERIAL CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE

DETERMINED AT DATUM PLANE −W−.

____

U0.15 (0.006) T

2X L/2

0.10 (0.004) V S

L−U−

SEATING

PLANE

0.10 (0.004)

−T−

ÇÇÇ

SECTION N−N

DETAIL E

JJ1

ÉÉÉ

DETAIL E

−W−

0.25 (0.010)

PIN 1

IDENT.

U0.15 (0.006) T

−V−

14X REFK

7.06

14X

0.36 14X

1.26

0.65

DIMENSIONS: MILLIMETERS

PITCH

SOLDERING FOOTPRINT*

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

MC74AC00, MC74ACT00

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UBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

MC74AC00/D

LITERATURE FULFILLMENT:

Literature Distribution Center for ON Semiconductor

P.O. Box 5163, Denver, Colorado 80217 USA

Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

For additional information, please contact your loc

Sales Representative

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