TLP2118E(TP,F) - Toshiba America Electronic Components, Inc.

TLP2118E

2012-08-30

TOSHIBA PHOTOCOUPLER GaAℓAs Ired & PHOTO-IC

TLP2118E

PDP (Plasma Display Panel)

FA (Factory Automation)

Interfaces of measuring and control instruments

The Toshiba TLP2118E provides superior cost performance. The TLP2118E

consists of GaAℓAs infrared light emitting diodes and integrated high-gain,

high-speed photodetectors.

Since the TLP2118E contains two photocouplers in the SO8 package, it

saves board space.

The photodetector has an internal Faraday shield that provides a guaranteed

common-mode transient immunity of ±15 kV/μs.

z Inverter logic type (Open collector output)

z Package: SO8

z Guaranteed performance over -40 to 100°C

z Power supply voltage: 4.5 to 5.5 V

z Input threshold current: IFH = 5.0 mA (max)

z Propagation delay time tpHL/tpLH: 75 ns (max)

z Common-mode transient immunity: ±15 kV/μs (min)

z Isolation voltage: 2500 Vrms (min)

z UL recognized

UL1577, File No.E67349

z cUL recognized

CSA Component Acceptance Service No. 5A, File No.E67349

z VDE-approved: Option (V4) EN60747-5-2 (Note)

Note: When an EN60747-5-2 approved type is needed, please designate the Option (V4).

Schematic

0.305 min

2.5 ± 0.2

0.38

1.27 ± 0.15

3.95 ± 0.25

12 3 4

8 6 5

5.1 ± 0.2 6.0 ± 0.2

11- 5K1

0.1 ± 0.1

JEDEC ―

JEITA ―

TOSHIBA 11−5K1

Weight: 0.11 g (Typ.)

Input LED1(2) Output 1(2)

H ON L

L OFF H

Unit: mm

VCC

VO-1

IO1 8

2−

IF-1

VO-2

GND

IO2

3−

IF-2

SHIELD

VF-1

VF-2

ICC

1: ANODE 1

2: CATHODE 1

3: CATHODE 2

4: ANODE 2

5: GND

6: VO2 (Output 2)

7: VO1 (Output 1)

8: VCC

VCC

GND

SHIELD

Truth Table

Pin Configuration (Top View)

TLP2118E

2012-08-30

Absolute Maximum Ratings (Ta=25°C)

CHARACTERISTIC SYMBOL RATING UNIT

Forward Current (Note 1) IF 20 mA

Forward Current Derating (Ta ≥ 90°C) ΔIF /°C -0.6 mA/°C

Peak Transient Forward Current (Note 1, 2) IFPT 40 mA

Peak Transient Forward Current Derating (Ta ≥ 85°C) ΔIFPT /°C -1.0 mA/°C

LED

Reverse Voltage (Note 1) VR 5 V

Output Current (Ta ≤ 100°C) (Note 1) IO 25 mA

Output Voltage (Note 1) VO 6 V

Supply Voltage VCC 6 V

Output Power Dissipation (Note 1) PO 40 mW

DETECTOR

Output Power Dissipation Derating (Ta ≥ 25°C) ΔPO /°C -0.2 mW/°C

Operating Temperature Range Topr -40 to 100 °C

Storage Temperature Range Tstg -55 to 125 °C

Lead Soldering Temperature (10 s) Tsol 260 °C

Isolation Voltage (AC,1 min.,R.H.≤ 60%,Ta=25°C) (Note 3) BVs 2500 Vrms

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Note 1: Each channel.

Note 2: Pulse width ≤ 1 ms, duty = 50%.

Note 3: This device is regarded as a two terminal device: pins 1, 2, 3 and 4 are shorted together,

as are pins 5, 6, 7 and 8.

Recommended Operating Conditions

CHARACTERISTIC SYMBOL MIN TYP. MAX UNIT

Input Current , High Level IFH 7.5 - 14 mA

Input Voltage , Low Level VFL 0 - 0.8 V

Supply Voltage* VCC 4.5 - 5.5 V

Operating Temperature Topr -40 - 100 °C

* This item denotes operating range, not meaning of recommended operating conditions.

Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the

device. Additionally, each item is an independent guideline respectively. In developing designs using this

product, please confirm specified characteristics shown in this document.

TLP2118E

2012-08-30

Electrical Characteristics

(Unless otherwise specified, Ta=-40 to 100°C, VCC=4.5 to 5.5 V)

CHARACTERISTIC SYMBOL

TEST

CIRCUIT Test Condition MIN TYP. MAX UNIT

Input Forward Voltage VF - IF = 10 mA, Ta = 25°C 1.4 1.57 1.8 V

Temperature Coefficient

of Forward Voltage ΔVF/ΔTa - I F = 10 mA - -2.0 - mV/°C

Input Reverse Current IR - VR = 5V, Ta = 25°C - - 10 μA

Input Capacitance CT - V = 0V, f = 1 MHz, Ta = 25°C - 60 - pF

VF = 0.8 V, VO = 5.5 V - - 250

Logic High Output Current IOH 1

Ta=25°C - 0.5 10

μA

Logic Low Output Voltage VOL 2 IF = 10 mA, IO = 13 mA (Sinking) - 0.25 0.6 V

Logic Low Supply Current ICCL 3 IF1 = IF2 = 10 mA - 3 10 mA

Logic High Supply Current ICCH 4 IF = 0 mA - 3 10 mA

“H Level Output to L Level

Output” Input Current IFH - IO = 13mA (Sinking), VO < 0.6V - 1.0 5.0 mA

*All typical values are at Ta = 25°C, VCC = 5V unless otherwise specified

Isolation Characteristics (Ta = 25°C)

Characteristic Symbol Test Condition Min Typ. Max Unit

Capacitance input to output CS V

S = 0V, f = 1 MHz (Note 3) ― 0.8 ― pF

Isolation resistance RS R.H. ≤ 60%,VS = 500 V (Note 3) 1×1012 1014 ― Ω

AC,1 minute 2500 ― ―

AC,1 second,in oil ― 5000 ―

Vrms

Isolation voltage BVS

DC,1 minute,in oil ― 5000 ― V

TLP2118E

2012-08-30

Switching Characteristics

(Unless otherwise specified, Ta=-40 to 100°C, VCC=4.5 ~ 5.5 V)(Each Channel)

CHARACTERISTIC SYMBOL

TEST

CIRCUIT Test Condition MIN. TYP. MAX. UNIT

Propagation Delay Time

to Logic Low output tpHL I

F = 0→7.5 mA - 35 75 ns

Propagation Delay Time

to Logic High output tpLH I

F = 7.5→0 mA

RL=350Ω

CL=15pF

(Note 4) - 35 75 ns

Switching Time Dispersion

between ON and OFF

|tpHL-

tpLH| - - 35 ns

Propagation Delay Skew (Note 5) tpsk

IF = 0↔7.5 mA

RL=350Ω,

CL=15pF

(Note 4) -50 - 50 ns

Fall Time (90 – 10 %) tf IF = 0→7.5 mA - 30 - ns

Rise Time (10 – 90 %) tr

IF = 7.5→0 mA

RL=350Ω

CL=15pF

(Note 4) - 30 - ns

Common Mode transient

Immunity at High Level Output CMH VCM=1000 Vp-p, IF=0 mA,

VCC=5 V , Ta=25°C 15 - - kV/μs

Common Mode transient

Immunity at Low Level Output CML

6 VCM=1000 Vp-p, IF=10 mA,

VCC=5 V , Ta=25°C -15 - - kV/μs

*All typical values are at Ta=25°C

Note: A ceramic capacitor (0.1 μF) should be connected from pin 8 (VCC) to pin 5 (GND) to stabilize the operation

of the high gain linear amplifier. Failure to provide the bypass may impair the switching property.

The total lead length between capacitor and coupler should not exceed 1 cm.

Note4: f = 5MHz, duty = 50%, input current tr = tf = 5ns,

CL is approximately 15pF which includes probe and Jig/stray wiring capacitance.

Note 5: Propagation delay skew is defined as the difference between the largest and smallest propagation delay

times (i.e. tpHL or tpLH) of multiple samples. Evaluations of these samples are conducted under identical

test conditions (supply voltage, input current, temperature, etc).

TEST CIRCUIT 1: IOH Test Circuit TEST CIRCUIT 2: VOL Test Circuit

TEST CIRCUIT 3: ICCL Test Circuit TEST CIRCUIT 4: ICCH Test Circuit

VCC

GND

SHIELD

0.1 μF

IOH

3 6

VCC

GND

SHIELD

5 4

IF1

IF2

VCC

0.1 μF

ICCL 1

3 6

VCC

GND

SHIELD

VCC

0.1 μF

ICCH

VCC

GND

SHIELD

VCC

0.1 μF

IO VOL

TLP2118E

2012-08-30

TEST CIRCUIT 5: Switching Time Test Circuit

TEST CIRCUIT 6: Common-Mode Transient Immunity Test Circuit

VOL

tpLH

tpHL

1.5 V

50%

tf tr

90%

10%

VCM

10%

90% 1000 V

・SW B : IF=0 mA

・SW A : IF=10 mA

0.8 V

CML

CMH

VCC

GND

SHIELD

2 0.1uF

RIN=100Ω

*CL=15pF

RL=350Ω

IF=7.5mA(P.G)

(f=5MHz , duty=50%, tr=tf= less than 5ns)

IF monitor VO

CL includes probe and stray capacitance.

P.G.: Pulse generator

P. G.

3 6

VCC

GND

IELD

＋

－

→

VCC

VCM

0.1 μF

RL=350Ω

)(

)(800

)(

)(800

VCC

TLP2118E

2012-08-30

VCC = 5 V

ICCH: IF1 = IF2= 0 mA

ICCL: IF1 = IF2 = 10 mA

VCC = 5 V

IF = 10 mA

Ta = 100°C

80°C

50°C

25°C

0°C

−20°C

−40°C

This curve shows the

maximum limit to the input

CC = 5 V

a = 25°C

Threshold input current (H/L) IFHL (mA)

Low-level output voltage VOL (V)

High-level /Low-level supply current

ICCH /ICCL (mA) Output voltage VO (V)

Input forward current IF (mA)

IF – VF

IF – Ta

Input forward voltage VF (V) Ambient temperature Ta (°C)

Input forward current IF (mA)

VOL – Ta

VO – IF

Ambient temperature Ta (°C) Input forward current IF (mA)

IFHL – Ta

ICCH, ICCL – Ta

Ambient temperature Ta (°C) Ambient temperature Ta (°C)

IO = 16 mA IO = 12.8 mA

IO = 9.6 mA I

= 6.4 mA

RL = 4 k

RL = 1 kΩ

RL = 350 Ω

RL = 1 kΩ

RL = 4 kΩ

ICCL

ICCH

TLP2118E

2012-08-30

VCC = 5 V

IF = 7.5 mA

tpLH: RL = 350 Ω

VCC = 5 V

IF = 7.5 mA

tpLH, tpHL – Ta

|tpHL – tpLH| – Ta

Ambient temperature Ta (°C) Ambient temperature Ta (°C)

Pulse width distortion |tpHL – tpLH| (ns)

tpLH: RL = 1 kΩ

tpLH: RL = 4 kΩ

tpHL: RL = 350 Ω

RL = 1 kΩ

RL= 4 kΩ

RL = 4 kΩ

RL = 1 kΩ

RL = 350 Ω

CC = 5 V

a = 25°C

CC = 5 V

a = 25°C

tpLH, tpHL – IF

|tpHL – tpLH| – IF

Input forward current IF (mA)

Pulse width distortion |tpHL – tpLH| (ns)

tpLH: RL = 350 Ω

tpLH: RL = 1 kΩ

tpLH: RL = 4 kΩ

tpHL: RL = 350 Ω

RL = 1 kΩ

RL = 4 kΩ

tpLH: RL = 350 Ω

tpLH: RL = 1 kΩ

tpLH: RL = 4 kΩ

NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test,

unless otherwise noted.

Propagation delay time tpLH, tpHL (ns)

TLP2118E

2012-08-30

PRECAUTIONS OF SURFACE MOUNTING TYPE PHOTOCOUPLER SOLDERING &

GENERAL STORAGE

(1) Precautions for Soldering

1) When Using Soldering Reflow

z An example of a temperature profile when Sn-Pb eutectic solder is used:

example of a temperature profile when lead(Pb)-free

solder is used:

z Reflow soldering must be performed once or twice.

z The mounting should be completed with the interval from the first to the last mountings being 2 weeks.

2) When using soldering Flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)

z Apply preheating of 150 °C for 60 to 120 seconds.

z Mounting condition of 260 °C and within 10 seconds is recommended.

z Flow soldering must be performed once.

3) When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)

z Complete soldering within 10 seconds for lead temperature not exceeding 260 °C or within 3 seconds

not exceeding 350 °C.

z Heating by soldering iron must be only once per one lead.

This profile is based on the device’s

maximum heat resistance guaranteed

value.

Set the preheat temperature/heating

temperature to the optimum temperature

corresponding to the solder paste type

used by the customer within the

described profile.

This profile is based on the device’s

maximum heat resistance guaranteed

value.

Set the preheat temperature/heating

temperature to the optimum temperature

corresponding to the solder paste type

used by the customer within the

described profile.

°C

TLP2118E

2012-08-30

(2) Precautions for General Storage

1) Do not store devices at any place where they will be exposed to moisture or direct sunlight.

2) When transportation or storage of devices, follow the cautions indicated on the carton box.

3) The storage area temperature should be kept within a temperature range of 5 °C

to 35 °C, and relative humidity should be maintained at between 45% and 75%.

4) Do not store devices in the presence of harmful (especially corrosive) gases, or in dusty conditions.

5) Use storage areas where there is minimal temperature fluctuation. Because rapid temperature

changes can cause condensation to occur on stored devices, resulting in lead oxidation or corrosion,

as a result, the solderability of the leads will be degraded.

6) When repacking devices, use anti-static containers.

7) Do not apply any external force or load directly to devices while they are in storage.

8) If devices have been stored for more than two years, even though the above conditions have been

followed, it is recommended that solderability of them should be tested before they are used.

TLP2118E

2012-08-30

Specification for Embossed–Tape Packing (TP) for SO8 Coupler

1. Applicable Package

Package Product Type

SO8 Photocoupler

2. Product Naming System

Type of package used for shipment is denoted by a symbol suffix after a product number. The method of

classification is as below.

(Example)

3. Tape Dimensions

3.1 Orientation of Device in Relation to Direction of Tape Movement

Device orientation in the recesses is as shown in Figure 1.

Figure 1 Device Orientation

3.2 Tape Packing Quantity: 2500 devices per reel

3.3 Empty Device Recesses Are as Shown in Table 1.

Table 1 Empty Device Recesses

Standard Remarks

Occurrences of 2 or more

successive empty device

recesses

0 Within any given 40-mm section of

tape, not including leader and trailer

Single empty device

recesses 6 devices (max) per reel Not including leader and trailer

3.4 Start and End of Tape

The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two

empty turns only for a cover tape.

TLP2118E (TP, F)

Device name

Tape type

Tape feed

[[G]]/RoHS COMPATIBLE (Note 6)

TLP2118E

2012-08-30

3.5 Tape Specification

(1) Tape material: Plastic (protection against electrostatics)

(2) Dimensions: The tape dimensions are as shown in Figure 2 and table 2.

Figure 2 Tape Forms

Table 2 Tape Dimensions

Unit: mm

Unless otherwise specified: ±0.1

Symbol Dimension Remark

A 6.5 ―

B 5.6 ―

D 5.5 Center line of indented square hole and sprocket hole

E 1.75 Distance between tape edge and hole center

F 8.0 Cumulative error (max) per 10 feed holes

G 4.0 Cumulative error (max) per 10 feed holes

K0 3.1 Internal space

+0.1

-0.3

+0.1

-0.3

φ1.6 ± 0.1

0.3 ± 0.05

3.3 ± 0.1

12.0 ± 0.3

φ1.5

+0.1

−0

TLP2118E

2012-08-30

3.6 Reel

(1) Material: Plastic

(2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 3.

Figure 3 Reel Form

4. Packing

Either one reel or five reels of photocoupler are packed in a shipping carton.

5. Label Indication

The carton bears a label indicating the product number, the symbol representing classification of

standard, the quantity, the lot number and the Toshiba company name.

6. Ordering Method

When placing an order, please specify the product number, the tape type and the quantity as shown in the

following example.

(Example)

Note6 :Please contact your TOSHIBA sales representative for details as to environmental matters such as the

RoHS compatibility of Product.

RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on

the restriction of the use of certain hazardous substances in electrical and electronics equipment.

Symbol Dimension

A Φ330 ±2

B Φ80 ±1

C Φ13 ±0.5

E 2.0 ±0.5

U 4.0 ±0.5

W1 13.5 ±0.5

W2 17.5 ±1.0

TLP2118E (TP, F) 2500 pcs

Device name

Tape type

Quantity (must be a multiple of 2500)

Table 3 Reel Dimensions

Unit: mm

[[G]]/RoHS COMPATIBLE (Note6)

TLP2118E

2012-08-30

RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information

in this document, and related hardware, software and systems (collectively "Product") without notice.

• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with

TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.

• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are

responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and

systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily

injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the

Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of

all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes

for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the

instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their

own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such

design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,

diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating

parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR

APPLICATIONS.

• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE

EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH

MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT

("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without

limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for

automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,

safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE

PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your

TOSHIBA sales representative.

• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

applicable laws or regulations.

• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to

any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY

WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR

LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND

LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO

SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS

FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or

vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without

limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile

technology products (mass destruction weapons). Product and related software and technology may be controlled under the

applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the

U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited

except in compliance with all applicable export laws and regulations.

• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES

OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.