1-DH1 F-219 QSE-028-01-F-D-DP-A (R) QSE-060-01-F-D-A QSE-020-01-L-D-A (0.80 mm) .0315" QSE SERIES HIGH-SPEED GROUND PLANE SOCKET Board Mates: QTE SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?QSE Cable Mates: EQCD, EQDP (See Also Available Note) Insulator Material: Liquid Crystal Polymer Terminal Material: Phosphor Bronze Plating: Au or Sn over 50 " (1.27 m) Ni Current Rating: Contacts: 2 A per pin (2 pins powered) Ground Plane: 23 A per ground plane (1 ground plane powered) Operating Temp Range: -55 C to +125 C Voltage Rating: 225 VAC (5 mm Stack Height) Max Cycles: 100 RoHS Compliant: Yes Integral metal plane for power or ground Blade & Beam Design Standoffs: SO POWER/SIGNAL APPLICATION 10 YEAR MFG WITH 50 " GOLD EXTENDED LIFE PRODUCT Compatible with UMPT/UMPS for flexible two-piece power/signal solutions PROCESSING Lead-Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max (020-060) Board Stacking: For applications requiring more than two connectors per board contact ipg@samtec.com QTE-D/QSE-D or QTE-DP/QSE-DP @ 5 mm Mated Stack Height Rating based on Samtec reference channel.For full SI performance data visit Samtec.comor contact SIG@samtec.com PINS PER ROW NO. OF PAIRS QSE 01 -014, -028, -042 -D-DP = (No. of Positions per Row/14) x (20.00) .7875 + (1.27) .050 -D = (No. of Positions per Row/20) x (20.00) .7875 + (1.27) .050 02 (7.24) .285 (0.80) .0315 (3.05) .120 Note: Some lengths, styles and options are non-standard, non-returnable. (0.15) .006 (0.76) .030 (0.89) .035 DIA PLATING OPTION G b p s (0.64) .025 -D = SingleEnded -D-DP = Differential Pair (-01 only) -L OTHER OPTION -GP = Guide Post (-020 only) -K = (8.25 mm) .325" DIA Polyimide Film Pick & Place Pad -TR = Tape & Reel Packaging -L = Latching Option (N/A on -042 & -060 positions) QTE MATED HEIGHT LEAD STYLE WITH QSE* -01 -02 -03 -04 -05 -07 -09 (5.00) .197 (8.00) .315 (11.00) .433 (16.00) .630 (19.00) .748 (25.00) .984 (14.00) .551 *Processing conditions will affect mated height. See SO Series for board space tolerances Due to technical progress, all designs, specifications and components are subject to change without notice. WWW.SAMTEC.COM A TYPE -C* = Electro-Polished Selective 50 " (1.27 m) min Au over 150 " (7.49) (3.81 m) Ni on Signal Pins in contact area, .295 10 " (0.25 m) min Au over 50 " (1.27 m) Ni on Ground Plane in contact area, Matte Tin over 50 " (1.27 m) min Ni on (3.25) all solder tails .128 *Note: -C Plating passes 10 year MFG testing (20.00) .7875 01 G b p s = 10 " (0.25 m) Gold on Signal Pins and Ground Plane, Matte Tin on tails FILE NO. E111594 (MOQ Required) 14 28 -L (14 pairs per bank = -D-DP) ALSO AVAILABLE QSE-DP/QTE-DP -F (40 total pins per bank = -D) For complete scope of recognitions see www.samtec.com/quality QSE-D/QTE-D = Gold Flash on Signal Pins and Ground Plane, Matte Tin on tails -020, -040, -060 RECOGNITIONS * 15 mm, 22 mm and 30 mm stack height * 30 " (0.76 m) Gold (Specify -H plating for Data Rate cable mating applications.) * Edge Mount * 56 (-DP), 80, 100 positions per row * Retention, Guide Posts and Friction Lock options. HIGH MATING CYCLES HIGH-SPEED CHANNEL PERFORMANCE All parts within this catalog are built to Samtec's specifications. Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.