TEF6721HL/V1S,518 - NXP Semiconductors

DATA SH EET

Preliminary speciﬁcation 2003 Oct 21

INTEGRATED CIRCUITS

TEF6721HL

Car radio tuner front-end

for digital IF

2003 Oct 21 2

Philips Semiconductors Preliminary speciﬁcation

Car radio tuner front-end for digital IF TEF6721HL

CONTENTS

1 FEATURES

2 GENERAL DESCRIPTION

3 ORDERING INFORMATION

4 QUICK REFERENCE DATA

5 BLOCK DIAGRAM

6 PINNING

7 FUNCTIONAL DESCRIPTION

7.1 FM I/Q-mixer

7.2 Buffer output for weather band flag

7.3 VCO

7.4 Crystal oscillator

7.5 PLL

7.6 DAA

7.7 FM keyed AGC

7.8 AM mixer

7.9 AM RF AGC

7.10 FM/AM RF AGC buffer

8 LIMITING VALUES

9 THERMAL CHARACTERISTICS

10 DC CHARACTERISTICS

11 AC CHARACTERISTICS

12 I2C-BUS PROTOCOL

12.1 I2C-bus specification

12.2 I2C-bus protocol

13 TEST AND APPLICATION INFORMATION

13.1 Test information

13.2 Application information

14 INTERNAL CIRCUITRY

15 PACKAGE OUTLINE

16 SOLDERING

16.1 Introduction to soldering surface mount

packages

16.2 Reflow soldering

16.3 Wave soldering

16.4 Manual soldering

16.5 Suitability of surface mount IC packages for

wave and reflow soldering methods

17 DATA SHEET STATUS

18 DEFINITIONS

19 DISCLAIMERS

20 PURCHASE OF PHILIPS I2C COMPONENTS

2003 Oct 21 3

Philips Semiconductors Preliminary speciﬁcation

Car radio tuner front-end for digital IF TEF6721HL

1 FEATURES

•FM mixer for conversion of FM RF (64 to 108 MHz and

US weather band) to IF of 10.7 MHz; the mixer provides

inherent image rejection and can be switched from ‘low’

injection to ‘high’ injection Local Oscillator (LO) via the

I2C-bus; two different mixer conversion gains can be

selected via the I2C-bus

•AGC PIN diode drive circuit for FM RF AGC; AGC

detection at FM mixer input and IF AGC amplifier input;

AGC threshold for detection at FM mixer input is a

programmable and keyed function switchable via the

I2C-bus; the AGC PIN diode drive can be activated via

the I2C-bus as a local function for search tuning; in

AM mode the AGC PIN diode drive can be activated via

the I2C-bus if required

•Digital alignment circuit for bus controlled matching of

oscillator tuning voltage to FM antenna tank circuit

tuning voltage

•Buffer output for weather band flag

•Combined AM and FM IF AGC amplifier with high

dynamic input range; one of the four gain settings is

selected automatically via two control signals from

IF DSP; combined differential AM and FM IF output

signal to analog-to-digital converter of IF DSP

•AM mixer for conversion of AM RF to AM IF 10.7 MHz

•AM RF PIN diode drive circuit and RF JFET

conductancecontrolbyAGCcascodedrivecircuit;AGC

threshold detection at AM mixer and IF AGC input;

threshold for detection at AM mixer is programmable via

the I2C-bus

•AM and FM RF AGC monitor output intended for gain

control of active antennas

•LC tuner oscillator providing mixer frequencies for FM

and AM mixers

•Crystal oscillator providing reference frequencies for

synthesizerPLLandtimingforAlternateFrequency(AF)

updating

•Optional crystal oscillator frequency pulling possibility

via I2C-bus

•FastsynthesizerPLLtuning system with localcontrolfor

inaudible AF updating

•Timing function for AF updating algorithm and control

signal output for interfacing with IF DSP

•Three hardware programmable I2C-bus addresses; pin

BUSENABLE; two software controlled flag outputs

•Several test modes for fast IC tests.

2 GENERAL DESCRIPTION

The TEF6721HL is a single chip car radio tuner for AM,

FM standard, FM IBOC DAB and weather band providing

combined AM and FM gain controlled differential IF output

for the SAF7730H including the following functions:

•AM upconversion tuner to an IF frequency of 10.7 MHz

for LW/MW/SW (31 m, 41 m and 49 m bands)

•FM single conversion tuner to an IF frequency of

10.7 MHz with integrated image rejection for US FM,

Europe FM, Japan FM, East Europe FM and weather

band reception; all bands can be selected using high

side or low side Local Oscillator (LO) injection

•Tuning system includes VCO, crystal oscillator and

PLL synthesizer on one chip.

3 ORDERING INFORMATION

TYPE NUMBER PACKAGE

NAME DESCRIPTION VERSION

TEF6721HL LQFP64 plastic low proﬁle quad ﬂat package; 64 leads; body 10 ×10 ×1.4 mm SOT314-2

2003 Oct 21 4

Philips Semiconductors Preliminary speciﬁcation

Car radio tuner front-end for digital IF TEF6721HL

4 QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VDDA(n) analog supply voltages 1 to 5 8 8.5 9 V

VDDA6 analog supply voltage 6 4.75 5 5.25 V

VDDD digital supply voltage 4.75 5 5.25 V

IDDA(n) sum of analog supply

currents 1 to 5 FM Japan mode 35 44 55 mA

AM mode 28 38 48 mA

IDDA6 analog supply current 6 FM Japan mode 2.2 3.2 4.3 mA

AM mode 10 14 18 mA

IDDD digital supply current FM Japan mode 23 30 39 mA

AM mode 17 23 30 mA

fAM(ant) AM input frequency LW 0.144 −0.288 MHz

MW 0.522 −1.710 MHz

SW 5.73 −9.99 MHz

fFM(ant) FM input frequency 64 −108 MHz

fFM(WB)(ant) FM weather band input frequency 162.4 −162.55 MHz

Tamb ambient temperature −40 −+85 °C

AM overall system parameters (based on 15 pF/60 pF dummy aerial; m = 0.3; 2.5 kHz audio bandwidth in

IF DSP; voltages in RMS value at input of dummy aerial); see Fig.7

Vi(RF) RF input voltage for start of

IFAGC ﬁrst step −5.5 −mV

second step −11 −mV

third step −22 −mV

RF input voltage for start of

RFAGC in-band; m = 0 −31 −mV

wideband; m = 0

AGC[1:0] = 00 −92 −mV

AGC[1:0] = 01 −126 −mV

AGC[1:0] = 10 −168 −mV

AGC[1:0] = 11 −210 −mV

α26dB sensitivity f = 990 kHz −42 −µV

IP3 3rd-order input intercept point ∆fundesired = 50 kHz −130 −dBµV

∆fundesired = 300 kHz −135 −dBµV

IP2 2nd-order input intercept point −140 −dBµV

2003 Oct 21 5

Philips Semiconductors Preliminary speciﬁcation

Car radio tuner front-end for digital IF TEF6721HL

FM overall system parameters (based on 75 Ω dummy aerial; ∆f = 22.5 kHz; de-emphasis is 50 µs in IF DSP;

voltages in RMS value at input of dummy aerial); see Fig.7

Vi(RF) RF input voltage for start of

IFAGC ﬁrst step −0.57 −mV

second step −1.1 −mV

third step −2.3 −mV

RF input voltage for start of

wideband AGC in-band −4.5 −mV

wideband

AGC[1:0] = 11 −8−mV

AGC[1:0] = 10 −12 −mV

AGC[1:0] = 01 −17 −mV

AGC[1:0] = 00 −21 −mV

α26dB sensitivity f = 97 MHz −1.4 −µV

IP3 3rd-order input intercept point ∆fundesired = 400 kHz −117 −dBµV

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

2003 Oct 21 6

Philips Semiconductors Preliminary speciﬁcation

Car radio tuner front-end for digital IF TEF6721HL

5 BLOCK DIAGRAM

handbook, full pagewidth

MIXER

AGC

I/Q-MIXER

BUFFER

XTAL

OSC

POWER

SUPPLY

I2C-

BUS

± 90°

:1 / :2 / :3

:5 / :10

RF AGC

MONITOR VCO

12 10

7 6 5 432

45 46

CRYSTAL

DAA 60

1, 8,

25, 62

TEF6721HL

MDB410

SEQUENTIAL

CIRCUIT FOR

AF UPDATING

TUNING

SYSTEM

ANTENNA

DAA

373634 35 47 48 38 39 40

IFOUT2

VAMCAS

VAMCASFB

IAMAGC

TAFAMAGC

TRFAMAGC

AGCBUF

FMMIXOUT1

FMMIXOUT2

VREFFMMIX

FMMIXIN1

RFGND

IFMAGC

FMMIXIN2

TFMAGC

KAGC

DAAOUT

KAGCADJ

IFOUT1

IFAGCMSB

IFAGCLSB

XTALGND

XTAL2

XTAL1

VCOGND

OSCFDB

OSCTNK

VDDA4

IREF

VDDA6

GND

VDDA5

VDAC

SWPORT1

i.c.

AMMIXDEC

AMMIXOUT2 WBFLAG IFGND FMIFIN VDDA1

AMMIXOUT1 IFAGCBIAS IFDEC AMIFINVDDA2

AMMIXIN

DAATD AFSAMPLE VTUNE VDDA3 VDDD BUSENABLE

DAAIN AFHOLD CPOUT ADDRSELDGND

SWPORT2

SCL

SDA

Fig.1 Block diagram.

2003 Oct 21 7

Philips Semiconductors Preliminary speciﬁcation

Car radio tuner front-end for digital IF TEF6721HL

6 PINNING

SYMBOL PIN DESCRIPTION

i.c. 1 internal connected for test purposes; leave open-circuit

VDDA1 2 analog supply voltage 1 (8.5 V) for IFAGC ampliﬁer

AMIFIN 3 IFAGC ampliﬁer AM input (10.7 MHz)

FMIFIN 4 IFAGC ampliﬁer FM input (10.7 MHz)

IFDEC 5 IFAGC ampliﬁer AM and FM decoupling

IFGND 6 IFAGC ampliﬁer ground

IFAGCBIAS 7 bias voltage for IFAGC ampliﬁer decoupling

i.c. 8 internal connected for test purposes; connect to ground

FMMIXOUT1 9 FM mixer IF output 1 (10.7 MHz)

AMMIXOUT1 10 AM mixer IF output 1 (10.7 MHz)

FMMIXOUT2 11 FM mixer IF output 2 (10.7 MHz)

AMMIXOUT2 12 AM mixer IF output 2 (10.7 MHz)

VDDA2 13 analog supply voltage 2 (8.5 V) for FM and AM RF

SWPORT1 14 software programmable port 1

AMMIXDEC 15 AM mixer decoupling

AMMIXIN 16 AM mixer input

VAMCAS 17 output for AM RF cascode AGC

VAMCASFB 18 feedback input for AM RF cascode AGC

IAMAGC 19 PIN diode drive current output of AM front-end AGC

TAFAMAGC 20 AF time constant of AM front-end AGC

TRFAMAGC 21 RF time constant of AM front-end AGC

VREFFMMIX 22 reference voltage for FM RF mixer

FMMIXIN1 23 FM mixer input 1

RFGND 24 RF ground

i.c. 25 internal connected; connect to ground

FMMIXIN2 26 FM mixer input 2

WBFLAG 27 buffered weather band ﬂag output

IFMAGC 28 PIN diode drive current output of FM front-end AGC

AGCBUF 29 monitor current output of FM and AM front-end AGC

DAAOUT 30 output of digital auto alignment circuit for antenna tank circuit

KAGCADJ 31 adjustment for FM keyed AGC function

TFMAGC 32 time constant of FM front-end AGC

KAGC 33 level input for FM keyed AGC function from IF DSP

DAATD 34 temperature compensation diode of digital auto alignment circuit for antenna tank circuit

DAAIN 35 input of digital auto alignment circuit for antenna tank circuit

VTUNE 36 VCO tuning voltage

CPOUT 37 charge pump output

VDDA3 38 analog supply voltage 3 (8.5 V) for tuning PLL

DGND 39 digital ground

VDDD 40 digital supply voltage (5 V)

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Philips Semiconductors Preliminary speciﬁcation

Car radio tuner front-end for digital IF TEF6721HL

VCOGND 41 VCO ground

OSCFDB 42 VCO feedback input

OSCTNK 43 VCO tank circuit

VDDA4 44 analog supply voltage 4 (8.5 V) for VCO

ADDRSEL 45 hardware address select for I2C-bus

BUSENABLE 46 enable input for I2C-bus

AFSAMPLE 47 AF sample ﬂag output for IF DSP

AFHOLD 48 AF hold ﬂag output for IF DSP

SDA 49 I2C-bus data line input and output

SCL 50 I2C-bus clock line input

IFAGCLSB 51 LSB input for IFAGC ampliﬁer gain setting from IF DSP

IFAGCMSB 52 MSB input for IFAGC ampliﬁer gain setting from IF DSP

SWPORT2 53 software programmable port 2

VDDA5 54 analog supply voltage 5 (8.5 V) for on-chip power supply

GND 55 ground

VDDA6 56 analog supply voltage 6 (5 V) for on-chip power supply

XTAL1 57 crystal oscillator 1

XTAL2 58 crystal oscillator 2

XTALGND 59 crystal oscillator ground

VDAC 60 DAC output voltage for crystal oscillator frequency pulling

IREF 61 reference current for power supply

i.c. 62 internal connected; connect to ground

IFOUT1 63 IFAGC ampliﬁer output 1

IFOUT2 64 IFAGC ampliﬁer output 2

SYMBOL PIN DESCRIPTION

2003 Oct 21 9

Philips Semiconductors Preliminary speciﬁcation

Car radio tuner front-end for digital IF TEF6721HL

handbook, full pagewidth

TEF6721HL

MDB412

IFOUT2

IFOUT1

i.c.

IREF

VDAC

XTALGND

XTAL2

XTAL1

VDDA6

GND

VDDA5

SWPORT2

IFAGCMSB

IFAGCLSB

SCL

SDA

VAMCAS

VAMCASFB

IAMAGC

TAFAMAGC

TRFAMAGC

VREFFMMIX

FMMIXIN1

RFGND

i.c.

FMMIXIN2

WBFLAG

IFMAGC

AGCBUF

DAAOUT

KAGCADJ

TFMAGC

i.c.

VDDA1

AMIFIN

FMIFIN

IFDEC

IFGND

IFAGCBIAS

i.c.

FMMIXOUT1

AMMIXOUT1

FMMIXOUT2

AMMIXOUT2

VDDA2

SWPORT1

AMMIXDEC

AMMIXIN

AFHOLD

AFSAMPLE

BUSENABLE

ADDRSEL

VDDA4

OSCTNK

OSCFDB

VCOGND

VDDD

DGND

VDDA3

CPOUT

VTUNE

DAAIN

DAATD

KAGC

Fig.2 Pin configuration.

2003 Oct 21 10

Philips Semiconductors Preliminary speciﬁcation

Car radio tuner front-end for digital IF TEF6721HL

7 FUNCTIONAL DESCRIPTION

7.1 FM I/Q-mixer

TheFMquadrature mixerconvertsFM RF (64 to 108 MHz

and 162.4 to 162.55 MHz) to an IF of 10.7 MHz.

It provides inherent image rejection and high dynamic

range. The image rejection can be switched from ‘low’

injection Local Oscillator (LO) to ‘high’ injection LO via the

I2C-bus. The mixer conversion gain can be increased by

6 dB via the I2C-bus. In this case the threshold of the FM

keyedAGChastobeloweredby6 dBtopreventthemixer

from being overloaded.

7.2 Buffer output for weather band ﬂag

Thebufferoutput(pinWBFLAG) is HIGH for weather band

mode.

7.3 VCO

The varactor tuned LC oscillator provides the local

oscillator signal for both FM and AM mixers. It has a

frequency range from 159.9 to 248.2 MHz.

7.4 Crystal oscillator

The crystal oscillator provides a 20.5 MHz signal that is

used for:

•Reference frequency for frequency synthesizer PLL

•Timing signal for the RDS update algorithm.

7.5 PLL

The fast synthesizer PLL tuning system with local control

is used for inaudible AF updating, combining fast PLL

jumps with low reference frequency breakthrough.

It is capable of tuning the following FM and AM bands:

•US FM and US IBOC DAB from 87.9 to 107.9 MHz

•US weather FM from 162.4 to 162.55 MHz

•Europe FM from 87.5 to 108 MHz

•Japan FM from 76 to 91 MHz

•East Europe FM from 64 to 74 MHz

•LW from 144 to 288 kHz

•MW from 522 to 1710 kHz (US AM band)

•SW from 5.73 to 9.99 MHz (including the 31 m, 41 m

and 49 m bands).

7.6 DAA

To reduce the number of manual alignments in production

the following I2C-bus controlled Digital Auto Alignment

(DAA) functions are included:

•FM RF DAA

– 7-bitDACto control the conversionoftheVCOtuning

voltage to FM antenna tank tuning voltage

– For cost reduction the diode at pin DAATD can be

omittedfromthisapplication.Inthiscase, pin DAATD

must be connected to ground, which reduces the

available alignment range (see Fig.7)

•Crystal frequency and general purpose DAA

– 5-bit DAC for adjustment of the crystal oscillator

frequency to align the actual IF frequency to the

centre frequency of IF selectivity inside the IF DSP. If

the IF DSP can be aligned to the actual IF frequency,

this DAA output can be used as general purpose

DAC. Figure 3 shows the application of the crystal

oscillator with frequency pulling.

handbook, halfpage

MDB413

CRYSTAL

OSCILLATOR

CRYSTAL

DAA

1 nF

20.5 MHz

BB201

100

kΩ100

kΩ

22 nF

2.7 pF

Fig.3 Crystal oscillator with frequency pulling.

2003 Oct 21 11

Philips Semiconductors Preliminary speciﬁcation

Car radio tuner front-end for digital IF TEF6721HL

7.7 FM keyed AGC

The AGC detects at the FM mixer input and the IF AGC

amplifier input. The AGC threshold for the FM mixer input

is programmable via the I2C-bus. When the threshold is

exceeded, the AGC sources a current to an external

PIN diode circuit, keeping the RF signal level at the FM

mixer input constant.

The keyed function shifts the threshold of the AGC if the

in-band signal is small. This reduces desensitization by

other strong transmitters. The amount of threshold shift is

limited to 10 dB. The keyed function can be activated via

the I2C-bus and is controlled by in-band level information

delivered from IF DSP via pin KAGC.

TheAGC canbeactivatedvia theI2C-busto sourceafixed

current as a local function for search tuning. In AM mode

the AGC can be activated to source a constant 10 mA

current into the FM PIN diode.

7.8 AM mixer

The AM mixer has a high dynamic range and converts

AM RF to an IF frequency of 10.7 MHz.

The outputs of the AM and FM mixers can be separated to

allow the use of different IF filters for AM and FM modes.

Figure 4 shows this optional application. By adding the

resistor R1 between pins AMIFIN and IFAGCBIAS the

input impedance of the IF AGC amplifier is matched to the

AM IF filter output impedance.

The input impedance of the AM IF filter is matched to

330 Ω with R2 and R3.

7.9 AM RFAGC

The AM wideband AGC in front of the AM mixer is realized

first by a cascoded NPN transistor, which controls the

transconductance of the RF amplifier JFET with 10 dB of

AGC range. Second, an AM PIN diode stage with 30 dB of

AGC range is available. The minimum JFET drain source

voltage is controlled by a DC feedback loop (pin

VAMCASFB) in order to limit the cascode AGC range to

10 dB. If the cascode AGC is not required, a simple

RF AGC loop is possible by using only a PIN diode.

In some conditions, noise behaviour will increase. In this

case pins VAMCAS and VAMCASFB have to be left

open-circuit. In FM mode, the cascode switches off the

JFET bias current to reduce total power consumption.

The AGC detection points for AM RF AGC are at the AM

mixer input (threshold programmable via the I2C-bus) and

the AM and FM IF AGC amplifier input (fixed threshold).

In FM mode the AM AGC can be activated via the I2C-bus

to sink a constant current of 1 mA from the PIN diode.

7.10 FM/AM RFAGC buffer

This output current can be used to reduce the gain of

active antennas before start of RF AGC.

The output (open-collector) sinks a current which in

AM mode is proportional to the voltage at pin TRFAMAGC

and in FM mode proportional to the RF level detector

voltage (pin TFMAGC) inside the FM AGC.

handbook, halfpage

MDB414

MIXER FM

I/Q-MIXER IF

AGC

AM IF filter

FM IF filter

Ω

nF 22

8.5 V

12 10 11 9 7 6 5 4 3

TEF6721HL

Fig.4 Separate IF paths for AM and FM mode.

2003 Oct 21 12

Philips Semiconductors Preliminary speciﬁcation

Car radio tuner front-end for digital IF TEF6721HL

8 LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

Notes

1. To avoid damages and wrong operation it is necessary to keep all 8.5 V supply voltages at a higher level than any

5 V supply voltage. This is also necessary during power-on and power-down sequences. Precautions have to be

provided in such a way that interferences can not pull down the 8.5 V supply below the 5 V supply.

2. Machine model (R = 0 Ω, C = 200 pF).

3. Human body model (R = 1.5 kΩ, C = 100 pF).

9 THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VDDA1 analog supply voltage 1 for IFAGC ampliﬁer note 1 −0.3 +10 V

VDDA2 analog supply voltage 2 for FM and AM RF note 1 −0.3 +10 V

VDDA3 analog supply voltage 3 for tuning PLL note 1 −0.3 +10 V

VDDA4 analog supply voltage 4 for VCO note 1 −0.3 +10 V

VDDA5 analog supply voltage 5 for on-chip power supply note 1 −0.3 +10 V

VDDA6 analog supply voltage 6 for on-chip power supply −0.3 +6.5 V

VDDD digital supply voltage −0.3 +6.5 V

Tstg storage temperature −55 +150 °C

Tamb ambient temperature −40 +85 °C

Ves electrostatic handling voltage note 2 −200 +200 V

note 3 −2000 +2000 V

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth(j-a) thermal resistance from junction to ambient in free air 58 K/W

2003 Oct 21 13

Philips Semiconductors Preliminary speciﬁcation

Car radio tuner front-end for digital IF TEF6721HL

10 DC CHARACTERISTICS

VDDA1 =V

DDA2 =V

DDA3 =V

DDA4 =V

DDA5 = 8.5 V; VDDA6 =5V; V

DDD =5V; T

amb =25°C; unless otherwise speciﬁed.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply voltage

VDDA(n) analog supply voltages 1 to 5 8 8.5 9 V

VDDA6 analog supply voltage 6 4.75 5 5.25 V

VDDD digital supply voltage 4.75 5 5.25 V

Supply current in FM mode

IDDA1 analog supply current 1 for AM and

FM IFAGC ampliﬁer −20.5 −mA

IDDA2 analog supply current 2 for RF −5.5 −mA

IDDA3 analog supply current 3 for tuning PLL −4.3 −mA

IDDA4 analog supply current 4 for VCO 5.2 6.5 7.8 mA

IDDA5 analog supply current 5 for on-chip

power supply −7.8 −mA

IDDA6 analog supply current 6 for on-chip

power supply Europe/US band −3−mA

Japan/East Europe band −3.2 −mA

IDDD digital supply current Europe/US band −23 −mA

Japan/East Europe band −30 −mA

IFMMIXOUT1 bias current of FM mixer output 1 4.8 6 7.2 mA

IFMMIXOUT2 bias current of FM mixer output 2 4.8 6 7.2 mA

Supply current in AM mode

IDDA1 analog supply current 1 for AM and

FM IFAGC ampliﬁer −19.5 −mA

IDDA2 analog supply current 2 for RF −2−mA

IDDA3 analog supply current 3 for tuning PLL 1.7 2.2 2.9 mA

IDDA4 analog supply current 4 for VCO 5 6.5 8 mA

IDDA5 analog supply current 5 for on-chip

power supply −7.5 −mA

IDDA6 analog supply current 6 for on-chip

power supply −14 −mA

IDDD digital supply current 17 23 30 mA

IAMMIXOUT1 bias current of AM mixer output 1 4.8 6 7.2 mA

IAMMIXOUT2 bias current of AM mixer output 2 4.8 6 7.2 mA

On-chip power supply reference current generator: pin IREF

Vo(ref) output reference voltage 4 4.25 4.5 V

Rooutput resistance −10 −kΩ

Io(source)(max) maximum output source current −100 −+100 nA

2003 Oct 21 14

Philips Semiconductors Preliminary speciﬁcation

Car radio tuner front-end for digital IF TEF6721HL

11 AC CHARACTERISTICS

VFMMIXOUT1 =V

AMMIXOUT1 =V

FMMIXOUT2 =V

AMMIXOUT2 =V

DDA1 =V

DDA2 =V

DDA3 =V

DDA4 =V

DDA5 = 8.5 V; VDDA6 =5V;

DDD =5V; T

amb =25°C; see Fig.7; all AC values are given in RMS; unless otherwise speciﬁed.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Voltage controlled oscillator

fosc oscillator frequency 159.9 −248.2 MHz

C/N carrier-to-noise ratio fosc = 200 MHz; ∆f = 10 kHz;

B=1Hz −97 −dBc

RR ripple rejection fripple = 100 Hz;

VDDA4(ripple) = 100 mV;

fosc = 200 MHz

92 99 −dB

Crystal oscillator

fxtal crystal frequency −20.5 −MHz

C/N carrier-to-noise ratio fxtal = 20.5 MHz; ∆f=10kHz −112 −

CIRCUIT INPUTS:PINS XTAL1, XTAL2 AND XTALGND; note 1

Vxtal crystal voltage 80 100 160 mV

VXTAL1,

VXTAL2

DC bias voltage 1.7 2.1 2.5 V

Rireal part of input

impedance VXTAL1 −VXTAL2 =1mV −250 −− Ω

iinput capacitance 8 10 12 pF

Synthesizer

PROGRAMMABLE DIVIDER

Nprog programmable divider

ratio 512 −32767

∆Nstep programmable divider

step size −1−

CHARGE PUMP:PIN CPOUT

Isink(cp1)l low charge pump 1 peak

sink current FM weather band mode;

0.4V<V

CPOUT < 7.6 V;

fVCO >f

ref ×Nprog

−300 −µA

source(cp1)l low charge pump 1 peak

source current FM weather band mode;

0.4V<V

CPOUT < 7.6 V;

fVCO <f

ref ×Nprog

−−300 −µA

sink(cp1)h high charge pump 1 peak

sink current 0.4V<V

CPOUT < 7.6 V;

fVCO >f

ref ×Nprog

AM mode −1−mA

FM East Europe band −1−mA

Isource(cp1)h high charge pump 1 peak

source current 0.4V<V

CPOUT < 7.6 V;

fVCO <f

ref ×Nprog

AM mode −−1−mA

FM East Europe band −−1−mA

fosc

∆

fosc

------------

dBc

------------

2003 Oct 21 15

Philips Semiconductors Preliminary speciﬁcation

Car radio tuner front-end for digital IF TEF6721HL

Isink(cp2) charge pump 2 peak sink

current FM standard or FM Japan

mode; fVCO >f

ref ×Nprog;

0.3V<V

CPOUT < 7.1 V

−130 −µA

source(cp2) charge pump 2 peak

source current FM standard or FM Japan

mode; fVCO <f

ref ×Nprog;

0.3V<V

CPOUT < 7.1 V

−−130 −µA

CHARGE PUMP:PIN VTUNE

Isink(cp3) charge pump 3 peak sink

current FM standard or FM Japan

mode; fVCO >f

ref ×Nprog;

0.4V<V

VTUNE < 7.6 V

−3−mA

Isource(cp3) charge pump 3 peak

source current FM standard or FM Japan

mode; fVCO <f

ref ×Nprog;

0.4V<V

VTUNE < 7.6 V

−−3−mA

Antenna Digital Auto Alignment (DAA)

DAA INPUT:PIN DAAIN

Ibias(cp) charge pump buffer input

bias current VDAAIN = 0.4 to 8 V −10 −+10 nA

Vi(cp) charge pump buffer input

voltage 0−8.5 V

DAA OUTPUT:PIN DAAOUT

Vo(AM) DAA output voltage in

AM mode IDAAOUT < 100 µA−−0.3 V

Vo(FM) DAA output voltage in

FM mode VDAATD = 0.45 V

minimum value;

data byte 2 = 10000000

(n = 0); VDAAIN = 0.5 V

−−0.5 V

data byte 2 = 10101010

(n = 42); VDAAIN =2V 1.2 1.4 1.6 V

data byte 2 = 11010101

(n = 85); VDAAIN =2V;

note 2

2.3 2.6 2.9 V

data byte 2 = 10000000

(n = 0); VDAAIN = 4 V; note 2 −0.65 −V

data byte 2 = 11000000

(n = 64); VDAAIN =4V 3.8 4 4.2 V

maximum value;

data byte 2 = 11111111

(n = 127); VDAAIN = 4.7 V

8−8.5 V

Vo(n) DAA output noise voltage data byte 2 = 11000000

(n = 64); FM mode;

VDAAIN =4V;V

DAATD = 0.45 V;

B = 300 Hz to 22 kHz

−30 100 µV

∆Vo(T) DAA output voltage

variation with

temperature

Tamb =−40 to +85 °C;

data byte 2 = 11000000

(n = 64)

−8−+8 mV

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

2003 Oct 21 16

Philips Semiconductors Preliminary speciﬁcation

Car radio tuner front-end for digital IF TEF6721HL

∆Vo(step) DAA step accuracy FM mode; n=0to127;

VDAAOUT = 0.5 to 8 V;

VDAAIN =2V;V

DAATD = 0.45 V;

note 3

0.5VLSB VLSB 1.5VLSB mV

∆Vo(sink) DAA output voltage

variation caused by sink

current

VDAAIN =4V;I

DAAOUT =50µA;

note 3 −VLSB −+VLSB mV

∆Vo(source) DAA output voltage

variation caused by

source current

VDAAIN =4V;

DAAOUT =−50 µA; note 3 −VLSB −+VLSB mV

tst DAA output settling time VDAAOUT = 0.2 to 8.25 V;

CL= 270 pF −20 30 µs

RR ripple rejection data byte 2 = 10101011

(n = 43); FM mode;

VDAAIN =4V;V

DAATD = 0.45 V;

fripple = 100 Hz;

VDDA3(ripple) = 100 mV

−65 −dB

CLDAA output load

capacitance −−270 pF

DAA TEMPERATURE COMPENSATION:PIN DAATD

Isource compensation diode

source current VDAATD = 0.2 to 1.2 V −50 −40 −30 µA

TCsource temperature coefﬁcient of

compensation diode

source current

VDAATD = 0.2 to 1.2 V;

Tamb =−40 to +85 °C−300 −+300

I2C-bus address select: pin ADDRSEL

RLload resistance to ground 1st I2C-bus address 1 −− MΩ

2nd I2C-bus address 108 120 132 kΩ

3rd I2C-bus address 29.7 33 36.3 kΩ

I2C-bus enable: pin BUSENABLE

VIL LOW-level input voltage −0.3 −+1 V

VIH HIGH-level input voltage 2 −VDDD + 0.3 V

Software programmable ports: pins SWPORT1 and SWPORT2

Isink(max) maximum sink current SWPORT1 = 1 1 −1.6 mA

SWPORT2 = 1 1 −1.6 mA

Weather band ﬂag: pin WBFLAG

Isource(max) maximum source current R = 560 Ω−−5−mA

Ri(shunt) internal shunt resistance

to ground −50 −kΩ

Vo(FM)(max) maximum output voltage

for FM mode measured with respect to

pin RFGND 0−0.2 V

Vo(WB) output voltage for

weather band mode measured with respect to

pin RFGND 4−5V

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VDAAOUT

VDDA3

-----------------------

10 6–

-----------

2003 Oct 21 17

Philips Semiconductors Preliminary speciﬁcation

Car radio tuner front-end for digital IF TEF6721HL

AM signal channel

AM RFAGC: PINS AMMIXIN AND AMMIXDEC

Vi(RF)(p) RF input voltage for

wideband AGC start level

(peak value)

m = 0.3; fAF = 1 kHz

AGC[1:0] = 00 −275 −mV

AGC[1:0] = 01 −375 −mV

AGC[1:0] = 10 −500 −mV

AGC[1:0] = 11 −625 −mV

AM RFAGC IF STAGE:PINS AMIFIN AND IFDEC

Vi(IF) IF input voltage AGC start level

m=0 42 60 85 mV

m = 0.8 35 50 71 mV

AM RFAGC PIN DIODE DRIVE:PIN IAMAGC

Isink(max) maximum AGC sink

current VIAMAGC = 2.8 V 11 15 19 mA

Isink AGC sink current FM mode; AGCSW = 1 0.8 −− mA

Rooutput resistance IIAMAGC =1µA 0.5 −− MΩ

ooutput capacitance −57 pF

AM RFAGC CASCODE STAGE:PIN VAMCAS

Vcas cascode voltage VAMMIXIN-AMMIXDEC below

threshold; maximum gain −5−V

Icas cascode transistor base

current capability 100 −− µA

cas(off) AM cascode off current FM mode −−100 nA

AM RFAGC CASCODE STAGE:PIN VAMCASFB

Vcas(FB) cascode voltage VAMMIXIN-AMMIXDEC above

threshold; minimum gain −0.26 −V

Icas(FB) cascode feedback sense

current 0−1µA

AM RFAGC TRANSCONDUCTANCE BUFFER:PIN AGCBUF; note 4

gm(buf) buffer transconductance AM mode;

∆VTRFAMAGC = 50 mV to 0.4 V 0.85 1.1 1.35 mS

Isink(max) maximum sink current AM mode; open-collector;

∆VTRFAMAGC = 0.8 V 450 500 560 µA

Isource(max) maximum source current AM mode;

∆VTRFAMAGC <50mV −−−30 µA

Vo(n) buffer output noise

voltage AM mode;

VDDA2 −VAGCBUF =1V

(voltage across external

pull-up resistor);

B = 400 Hz to 20 kHz

−10 15 µV

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

IAGCBUF

∆

VTRFAMAGC

∆

---------------------------------

2003 Oct 21 18

Philips Semiconductors Preliminary speciﬁcation

Car radio tuner front-end for digital IF TEF6721HL

AM MIXER (IF = 10.7 MHz)

Mixer inputs: pins AMMIXIN and AMMIXDEC

Riinput resistance 15 25 40 kΩ

Ciinput capacitance 2.5 5 7.5 pF

VIDC input voltage 2.3 2.7 3.1 V

Vi(max) maximum input voltage 1 dB compression point of

AM mixer output; m = 0 500 −− mV

Mixer outputs: pins AMMIXOUT1 and AMMIXOUT2

Rooutput resistance 100 −− kΩ

ooutput capacitance −47 pF

o(max)(p-p) maximum output voltage

(peak-to-peak value) 12 15 −V

Ibias mixer bias current AM mode 4.8 6 7.2 mA

Mixer

gm(conv) conversion

transconductance

1.9 2.6 3.4

gm(conv)(T) conversion

transconductance

variation with

temperature

−−9×10−4−K−1

IP3 3rd-order input intercept

point RL= 2.6 kΩ(AC load between

output pins); ∆f = 300 kHz 135 138 −dBµV

IP2 2nd-order input intercept

point RL= 2.6 kΩ(AC load between

output pins) −170 −dBµV

Vi(n)(eq) equivalent input noise

voltage Rgen = 750 Ω; RL= 2.6 kΩ

(AC load between output pins) −5.8 8

F noise ﬁgure of AM mixer −4.5 7.1 dB

FM signal channel

FM RFAGC (FM DISTANCE MODE;LODX=0)

RF input: pins FMMIXIN1 and FMMIXIN2; KAGC = 0

Vi(RF) RF input voltage for start

of wideband AGC AGC[1:0] = 11 −8−mV

AGC[1:0] = 10 −12 −mV

AGC[1:0] = 01 −16 −mV

AGC[1:0] = 00 −20 −mV

IF input: pins FMIFIN and IFDEC

Vi(IF) IF input voltage for start

of wideband AGC −27.2 −mV

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

IIF

VRF

----------

---------

∆gm(conv)

gm(conv) ∆T×

---------------------------------

------------

2003 Oct 21 19

Philips Semiconductors Preliminary speciﬁcation

Car radio tuner front-end for digital IF TEF6721HL

FM RFAGC time constant: pin TFMAGC

Rsource source resistance 4 5 6 kΩ

VO(ref) DC output reference

voltage AGC[1:0] = 00; KAGC = 0;

VFMMIXIN1-FMMIXIN2 =0V 3.9 4.4 4.9 V

FM RFAGC PIN diode drive output: pin IFMAGC

Isink(max) maximum AGC sink

current VIFMAGC = 2.5 V;

VTFMAGC =V

O(ref) −0.5 V;

AGC[1:0] = 00; KAGC = 0

8 11.5 15 mA

Isource(max) maximum AGC source

current VIFMAGC = 2.5 V;

VTFMAGC =V

O(ref) + 0.5 V;

AGC[1:0] = 00; KAGC = 0

−15 −11.5 −8mA

source(AGC) AGC source current AM mode; AGCSW = 1 −15 −11.5 −8mA

IFMAGC = 2.5 V; LODX = 1 −0.65 −0.5 −0.35 mA

FM keyed AGC: pin KAGC

Vth threshold voltage for

narrow-band AGC KAGC = 1;

VTFMAGC =V

O(ref) +0.3 V 0.5 0.95 1.4 V

FM RFAGC TRANSCONDUCTANCE BUFFER:PIN AGCBUF

gm(buf) buffer transconductance FMmode;VTFMAGC =V

O(ref) to

VO(ref) +80mV 4.2 5.3 6.4 mS

Isink(max) maximum sink current FM mode; open-collector;

VTFMAGC =V

O(ref) + 0.15 V 450 500 560 µA

Isource(max) maximum source current FM mode; VTFMAGC =V

O(ref) −−−30 µA

Vo(n) buffer output noise

voltage FM mode;

VVDDA2-AGCBUF = 1 V (voltage

across external pull-up

resistor);

B = 400 Hz to 20 kHz

−10 15 µV

FM RF MIXER

Reference voltage: pin VREFFMMIX

Vref reference voltage FM mode 6.6 7.3 8 V

AM mode 2.7 3.1 3.4 V

Inputs: pins FMMIXIN1 and FMMIXIN2

Riinput resistance MIXGAIN = 0 −3.5 −kΩ

MIXGAIN = 1 −1.8 −kΩ

Ciinput capacitance −57 pF

BIAS DC bias voltage FM mode 2.2 2.7 3.2 V

Vi(RF)(p) RF input voltage

(peak value) 1 dB compression point of

FM mixer output

MIXGAIN = 0 70 100 −mV

MIXGAIN = 1 35 50 −mV

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

2003 Oct 21 20

Philips Semiconductors Preliminary speciﬁcation

Car radio tuner front-end for digital IF TEF6721HL

Outputs: pins FMMIXOUT1 and FMMIXOUT2

Rooutput resistance 100 −− kΩ

ooutput capacitance 2 3.5 5 pF

Vo(max)(p-p) maximum output voltage

(peak-to-peak value) 3−− V

bias mixer bias current FM mode 4.8 6 7.2 mA

FM mixer

gm(conv) conversion

transconductance

MIXGAIN = 0 8.5 12.5 18

MIXGAIN = 1 17 25 36

gm(conv)(T) conversion

transconductance

variation with

temperature

MIXGAIN = 0 −−1×10−3−K−1

F noise ﬁgure MIXGAIN = 0 −3.5 4.6 dB

MIXGAIN = 1 −2.4 −dB

IP3 3rd-order input intercept

point MIXGAIN = 0 113 117 −dBµV

MIXGAIN = 1 −108 −dBµV

IRR image rejection ratio FMINJ = 1; note 5

fRFwanted = 87.5 MHz;

fRFimage = 108.9 MHz 25 30 −dB

data byte 3 = X010X110;

fRFwanted = 162.475 MHz;

fRFimage = 183.875 MHz

22 30 −dB

Vi(n)(eq) equivalent input noise

voltage (pin FMMIXIN1 to

FMMIXIN2)

Rgen = 200 Ω; RL= 2.6 kΩ

MIXGAIN = 0 −2.9 3.1

MIXGAIN = 1 −2.6 −

Rgen(opt) optimum generator

resistance −200 −Ω

IFAGC ampliﬁer

OUTPUTS:PINS IFOUT1 AND IFOUT2

Vo(max)(p) maximum output voltage

(peak value) −1.4 −V

Rooutput resistance −500 −Ω

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

IIF

VRF

----------

---------

∆gm(conv)

gm(conv) ∆T×

---------------------------------

------------

2003 Oct 21 21

Philips Semiconductors Preliminary speciﬁcation

Car radio tuner front-end for digital IF TEF6721HL

FM MODE

Inputs: pins FMIFIN and IFDEC

Riinput resistance 270 330 390 Ω

Ciinput capacitance −57 pF

G gain VIFAGCMSB = 0.2 V;

VIFAGCLSB = 0.2 V; CL= 0.5 pF −37.3 −dB

VIFAGCMSB = 0.2 V;

VIFAGCLSB = 2.8 V; CL= 0.5 pF −31.3 −dB

VIFAGCMSB = 2.8 V;

VIFAGCLSB = 2.8 V; CL= 0.5 pF −25.3 −dB

VIFAGCMSB = 2.8 V;

VIFAGCLSB = 0.2 V; CL= 0.5 pF −19.3 −dB

F noise ﬁgure Rgen = 330 Ω−8.5 −dB

IP3 3rd-order input intercept

point −117 −dBµV

Vi(max)(p) maximum input voltage

(peak value) 1 dB compression point of

IFAGC ampliﬁer output

voltage

VIFAGCMSB = 0.2 V;

VIFAGCLSB = 0.2 V 40 −− mV

VIFAGCMSB = 0.2 V;

VIFAGCLSB = 2.8 V 70 −− mV

VIFAGCMSB = 2.8 V;

VIFAGCLSB = 2.8 V 134 −− mV

VIFAGCMSB = 2.8 V;

VIFAGCLSB = 0.2 V 60 −− mV

AM MODE

Inputs: pins AMIFIN and IFDEC

Riinput resistance 270 330 390 Ω

Ciinput capacitance −57 pF

G gain VIFAGCMSB = 0.2 V;

VIFAGCLSB = 0.2 V; CL= 0.5 pF −27.4 −dB

VIFAGCMSB = 0.2 V;

VIFAGCLSB = 2.8 V; CL= 0.5 pF −21.4 −dB

VIFAGCMSB = 2.8 V;

VIFAGCLSB = 2.8 V; CL= 0.5 pF −15.4 −dB

VIFAGCMSB = 2.8 V;

VIFAGCLSB = 0.2 V; CL= 0.5 pF −9.4 −dB

F noise ﬁgure Rgen = 330 Ω−14.6 −dB

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

2003 Oct 21 22

Philips Semiconductors Preliminary speciﬁcation

Car radio tuner front-end for digital IF TEF6721HL

Notes

1. Measured between pins XTAL1 and XTAL2.

2. DAA conversion gain formula: ; where

n=0to127.

3. VLSB =V

DAAOUT(n+1) −VDAAOUT(n)

4. The AM AGC transconductance buffer delivers a sink current which is proportional to the voltage change at

pin TRFAMAGC.

5. Image rejection ratio:

IP3 3rd-order input intercept

point VIFAGCMSB = 0.2 V;

VIFAGCLSB = 0.2 V −127 −dBµV

VIFAGCMSB = 0.2 V;

VIFAGCLSB = 2.8 V −132 −dBµV

VIFAGCMSB = 2.8 V;

VIFAGCLSB = 2.8 V −135 −dBµV

VIFAGCMSB = 2.8 V;

VIFAGCLSB = 0.2 V −136 −dBµV

Vi(max)(p) maximum input voltage

(peak value) 1 dB compression point of

IFAGC ampliﬁer output

voltage

VIFAGCMSB = 0.2 V;

VIFAGCLSB = 0.2 V 120 −− mV

VIFAGCMSB = 0.2 V;

VIFAGCLSB = 2.8 V 220 −− mV

VIFAGCMSB = 2.8 V;

VIFAGCLSB = 2.8 V 440 −− mV

VIFAGCMSB = 2.8 V;

VIFAGCLSB = 0.2 V 600 −− mV

Crystal frequency Digital Auto Alignment (DAA)

OUTPUT:PIN VDAC

Vo(max) maximum output voltage data byte 5 = XXX00000

(n = 0) 7.4 −− V

o(min) minimum output voltage data byte 5 = XXX11111

(n = 31) −−1.7 V

∆Vo(step) DAA step accuracy n = 0 to 31 100 200 300 mV

Vo(n) DAA output noise voltage B = 300 Hz to 22 kHz −100 130 µV

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VDAAOUT 2 0.75 n

128

---------- 0.125+×





×V

DAAIN VDAATD

+()× V

DAATD

–=

∆VTRFAMAGC VTRFAMAGC VTRFAMAGC VAMMIXIN VAMMIXDEC

–()10 mV<

–=

IRR VFMMIXOUT1 FMMIXOUT2–()wanted

VFMMIXOUT1 FMMIXOUT2–()eimag

---------------------------------------------------------------------------------------

2003 Oct 21 23

Philips Semiconductors Preliminary speciﬁcation

Car radio tuner front-end for digital IF TEF6721HL

handbook, full pagewidth

AF = 1

AF channel AF = 1

main channel

MDB415

t2t3

I2C-bus

AFHOLD

load PLL

AFSAMPLE

audio output

of IF DSP t4

quality test

012 t (ms)

345678

Fig.5 Inaudible AF update timing diagram.

AFHOLD signal is used to hold the quality information for signal processing of the main channel during the alternative frequency jumps. PLL registers

are loaded during load PLL = 1, but actual frequency jumps take place at the falling edge of this signal. IF counting is carried out during AFSAMPLE = 1.

10 µs after falling edge of AFSAMPLE result is valid for AF and remains valid until read by microcontroller. Quality tests in IF DSP should take place

during the HIGH phase of AFSAMPLE.

t1 is the internal TEF6721HL clock related logic delay: 100 µs.

t2 should be >1.1 ms to ensure correct loading of PLL for the main channel.

t3 should be >0 to ensure inaudible update.

t4= 500 µs.

2003 Oct 21 24

Philips Semiconductors Preliminary speciﬁcation

Car radio tuner front-end for digital IF TEF6721HL

handbook, full pagewidth

MDB416

audio output of

IF DSP

t1t2

AF = 0, PRESET = 1 AF = 0, PRESET = 0

I2C-bus

AFHOLD

AFSAMPLE

load PLL

quality test

0 1 n + 1 t (ms)

continuous mode

PLL jump

Fig.6 Preset mode timing diagram.

t1 is the internal TEF6721HL clock related logic delay: 100 µs.

t2 should be greater than the required PLL tuning time for the given band (FM: t2> 1 ms; AM: t2> 20 ms).

2003 Oct 21 25

Philips Semiconductors Preliminary speciﬁcation

Car radio tuner front-end for digital IF TEF6721HL

12 I2C-BUS PROTOCOL

12.1 I2C-bus speciﬁcation

SDA and SCL HIGH and LOW levels are specified

according to a 3.3 V I2C-bus. The bus pins tolerate also

thresholds of a 5 V bus.

The standard I2C-bus specification is expanded by the

following definitions.

IC addresses:

•1st IC address C2H: 1100001 R/W

•2nd IC address C0H: 1100000 R/W

•3rd IC address C4H: 1100010 R/W.

Structure of the I2C-bus logic: slave transceiver with auto

increment.

Subaddresses are not used.

The second I2C-bus address can be selected by

connecting pin ADDRSEL via a 120 kΩ resistor to GND.

The third I2C-bus address can be selected by connecting

pin ADDRSEL via a 33 kΩ resistor to GND.

The maximum bit rate for this device is 100 kbits/s.

TheI2C-businterface is extended withanenableinput(pin

BUSENABLE). If pin BUSENABLE is HIGH the

communication with the device is active; if pin

BUSENABLE is LOW the signals on the I2C-bus are

ignored so that higher bit rates (>100 kbits/s) can be used

to communicate with other devices on the same I2C-bus.

The enable signal must not change while bus

communication takes place.

No default settings at power-on reset. I2C-bus

transmission is required to program the IC.

12.1.1 DATA TRANSFER

Data sequence: address, byte 0, byte 1, byte 2, byte 3,

byte 4 and byte 5.

The data transfer has to be in this order. The LSB of the

address being logic 0 indicates a write operation.

Bit 7 of each byte is considered the MSB and has to be

transferred as the first bit of the byte.

The data becomes valid at the output of the internal

latches with the acknowledge of each byte. A STOP

condition after any byte can shorten transmission times.

When writing to the transceiver by using the STOP

condition before completion of the whole transfer:

•The remaining bytes will contain the old information

•If the transfer of a byte is not completed, this byte is lost

and the previous information is available.

12.1.2 FREQUENCY SETTING

For new frequency setting, in both AM and FM mode, the

programmable divider is enabled by setting bit PRESET to

logic 1. To select a frequency, two I2C-bus transmissions

are necessary:

•First: bit PRESET = 1

•Second: bit PRESET = 0.

12.2 I2C-bus protocol

12.2.1 DATA TRANSFER MODE AND IC ADDRESS

Table 1 Write mode

Table 2 Read mode

Notes

1. S = START condition.

2. A = acknowledge.

3. P = STOP condition.

4. NA = no acknowledge.

Table 3 IC address byte

Notes

1. Pin ADDRSEL left open-circuit activates 1st

IC address; Rext = 120 kΩat pin ADDRSEL to ground

activates 2nd IC address; Rext =33kΩ at

pin ADDRSEL to ground activates 3rd IC address.

2. Read or write bit:

0 = write operation to TEF6721HL

1 = read operation from TEF6721HL.

S(1) address (write) A(2) data byte(s) A(2) P(3)

S(1) address (read) A(2) data byte 0 NA(4) P(3)

ADDRESS IC ADDRESS(1) MODE(2)

1 1100001 R/W

2 1100000 R/

3 1100010 R/

2003 Oct 21 26

Philips Semiconductors Preliminary speciﬁcation

Car radio tuner front-end for digital IF TEF6721HL

12.2.2 WRITE MODE:DATA BYTE 0

Table 4 Format of data byte 0

Table 5 Description of data byte 0 bits

12.2.3 WRITE MODE:DATA BYTE 1

Table 6 Format of data byte 1

Table 7 Description of data byte 1 bits

12.2.4 WRITE MODE:DATA BYTE 2

Table 8 Format of data byte 2

Table 9 Description of data byte 2 bits

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

AF PLL14 PLL13 PLL12 PLL11 PLL10 PLL9 PLL8

BIT SYMBOL DESCRIPTION

7AFAlternative frequency. If AF = 0, then normal operation. If AF = 1, then AF (RDS)

update mode.

6 to 0 PLL[14:8] Setting of programmable counter of synthesizer PLL. Upper byte of PLL divider

word.

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

PLL7 PLL6 PLL5 PLL4 PLL3 PLL2 PLL1 PLL0

BIT SYMBOL DESCRIPTION

7 to 0 PLL[7:0] Setting of programmable counter of synthesizer PLL. Lower byte of PLL divider

word.

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

PRESET DAA6 DAA5 DAA4 DAA3 DAA2 DAA1 DAA0

BIT SYMBOL DESCRIPTION

7 PRESET Preset. If PRESET = 0, then programmable divider and antenna DAA locked.

If PRESET = 1, then writing to programmable divider and antenna DAA enabled.

6 to 0 DAA[6:0] Setting of antenna digital auto alignment.

2003 Oct 21 27

Philips Semiconductors Preliminary speciﬁcation

Car radio tuner front-end for digital IF TEF6721HL

12.2.5 WRITE MODE:DATA BYTE 3

Table 10 Format of data byte 3

Table 11 Description of data byte 3 bits

Table 12 Reference frequency setting

Table 13 FM band selection bits

Table 14 AM band selection bits; note 1

Note

1. X = don’t care.

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

−FREF2 FREF1 FREF0 −BND1 BND0 AMFM

BIT SYMBOL DESCRIPTION

7−This bit is not used and should be set to logic 0.

6 to 4 FREF[2:0] Reference frequency for synthesizer. These 3 bits determine the reference frequency,

see Table 12.

3−This bit is not used and should be set to logic 0.

2 and 1 BND[1:0] Band switch. These 2 bits select the frequency in AM and FM mode, see Tables 13

and 14.

0 AMFM AM or FM switch. If AMFM = 0, then FM mode. If AMFM = 1, then AM mode.

FREF2 FREF1 FREF0 fref (kHz)

000100

100 50

010 25

110 20

001 10

101 10

011 10

111 10

BND1 BND0 FREQUENCY

BAND VCO

DIVIDER CHARGE PUMP CURRENT

0 0 FM standard 2 130 µA+3mA

0 1 FM Japan 3 130 µA+3mA

1 0 FM East Europe 3 1 mA

1 1 FM weather 1 300 µA

BND1 BND0 FREQUENCY

BAND VCO

DIVIDER CHARGE PUMP CURRENT (mA)

0 X AM SW 10 1

1 X AM LW/MW 20 1

2003 Oct 21 28

Philips Semiconductors Preliminary speciﬁcation

Car radio tuner front-end for digital IF TEF6721HL

12.2.6 WRITE MODE:DATA BYTE 4

Table 15 Format of data byte 4

Table 16 Description of data byte 4 bits

Table 17 Setting of wideband AGC for AM (m = 0.3)

Table 18 Setting of wideband AGC for FM

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

KAGC AGC1 AGC0 LODX FMINJ −AGCSW MIXGAIN

BIT SYMBOL DESCRIPTION

7KAGCKeyed FM AGC. If KAGC = 0, then keyed FM AGC is off. If KAGC = 1, then keyed

FM AGC is on.

6 and 5 AGC[1:0] Wideband AGC. These 2 bits set the start value of wideband AGC. For AM, see

Table 17 and for FM, see Table 18.

4 LODX Local or distance. If LODX = 0, then distance mode is on. If LODX = 1, then local

mode is on.

3 FMINJ FM mixer image rejection. If FMINJ = 0, then low injection. If FMINJ = 1, then high

injection.

2−This bit is not used and should be set to logic 0.

1 AGCSW AGC switch. If AGCSW = 0, then AM AGC in FM mode and FM AGC in AM mode is off.

If AGCSW = 1, then AM AGC PIN diode drive is active in FM mode and FM AGC PIN

diode drive is active in AM mode.

0 MIXGAIN FM mixer gain. If MIXGAIN = 0, then the FM mixer gain is nominal. If MIXGAIN = 1,

then the FM mixer gain is +6 dB.

AGC1 AGC0 AM MIXER INPUT VOLTAGE (PEAK VALUE)

(mV)

0 0 275

0 1 375

1 0 500

1 1 625

AGC1 AGC0 FM RF MIXER INPUT VOLTAGE (RMS VALUE)

(mV)

11 8

10 12

01 16

00 20

2003 Oct 21 29

Philips Semiconductors Preliminary speciﬁcation

Car radio tuner front-end for digital IF TEF6721HL

WRITE MODE:DATA BYTE 5

Table 19 Format of data byte 5

Table 20 Description of data byte 5 bits

12.2.7 READ MODE:DATA BYTE 0

Table 21 Format of 1st data byte

Table 22 Description of data byte 0 bits

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

SWPORT2 SWPORT1 −DAC4 DAC3 DAC2 DAC1 DAC0

BIT SYMBOL DESCRIPTION

7 SWPORT2 Software programmable port 2. If SWPORT2 = 0, then pin SWPORT2 is inactive

(high-impedance). If SWPORT2 = 1, then pin SWPORT2 is active (pull down to ground).

6 SWPORT1 Software programmable port 1. If SWPORT1 = 0, then pin SWPORT1 is inactive

(high-impedance). If SWPORT1 = 1, then pin SWPORT1 is active (pull down to ground).

5−This bit is not used and should be set to logic 0.

4 to 0 DAC[4:0] Setting of crystal frequency DAA. These 5 bits determine the crystal frequency

alignment output voltage.

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

ID7 ID6 ID5 ID4 ID3 ID2 ID1 ID0

BIT SYMBOL DESCRIPTION

7 to 0 ID[7:0] Chip ID. These bits contain a constant value (0010 0001 = 21H) for chip identiﬁcation

purposes.

2003 Oct 21 30

Philips Semiconductors Preliminary speciﬁcation

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13 TEST AND APPLICATION INFORMATION

13.1 Test information

Table 23 DC operating points

SYMBOL PIN

UNLOADED DC VOLTAGE (V)(1)

AM MODE FM MODE

MIN. TYP. MAX. MIN. TYP. MAX.

i.c. 1 −5.6 −− 5.6 −

VDDA1 2−8.1 −− 8.1 −

AMIFIN 3 −2.1 −− 2.1 −

FMIFIN 4 −2.1 −− 2.1 −

IFDEC 5 −2.1 −− 2.1 −

IFGND 6 external 0 external 0

IFAGCBIAS 7 −2.1 −− 2.1 −

i.c. 8 −6.1 −− 6.1 −

FMMIXOUT1 9 −8.2 −− 8.2 −

AMMIXOUT1 10 −8.2 −− 8.2 −

FMMIXOUT2 11 −8.2 −− 8.2 −

AMMIXOUT2 12 −8.2 −− 8.2 −

VDDA2 13 −8.4 −− 8.2 −

SWPORT1 14 external biasing (open-collector) external biasing (open-collector)

AMMIXDEC 15 −2.8 −ﬂoating

AMMIXIN 16 2.8 (external biasing) ﬂoating

VAMCAS 17 −4.8 −0 0.1 0.2

VAMCASFB 18 −4.1 −0 0.1 1

IAMAGC 19 6.9 (external biasing) 4.1 (external biasing)

TAFAMAGC 20 −0.3 −0 0.3 0.5

TRFAMAGC 21 −2.9 −ﬂoating

VREFFMMIX 22 −3.2 −− 7.3 −

FMMIXIN1 23 −1.65 −− 2.75 −

RFGND 24 external 0 external 0

i.c. 25 external 0 external 0

FMMIXIN2 26 −1.65 −− 2.75 −

WBFLAG 27 0 0 −0.5

IFMAGC 28 4 (external biasing) 0.1 (external

biasing) −4 (external

biasing)

AGCBUF 29 8.5 (external biasing) 8.5 (external biasing)

DAAOUT 30 −0.2 0.3 0.2 −8.25

KAGCADJ 31 −8.4 −− 8−

TFMAGC 32 −7.9 −− 4.4 −

KAGC 33 0 to 3.3 (external biasing) 0 to 3.3 (external biasing)

DAATD 34 ﬂoating 1.5 0.2 0.45 1.5

2003 Oct 21 31

Philips Semiconductors Preliminary speciﬁcation

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Note

1. After initialization via I2C-bus using settings shown in Table 24.

DAAIN 35 0 −8.5 0 −8.5

VTUNE 36 0 −8.5 0 −8.5

CPOUT 37 0 −8.5 0 −8.5

VDDA3 38 −8.44 −− 8.4 −

DGND 39 external 0 external 0

VDDD 40 5 (external biasing) 5 (external biasing)

VCOGND 41 external 0 external 0

OSCFDB 42 2.2 2.8 3.4 2.2 2.8 3.4

OSCTNK 43 5 5.8 7.2 5 5.8 7.2

VDDA4 44 −8.35 −− 8.35 −

ADDRSEL 45 −3.7 −− 3.7 −

BUSENABLE 46 3.3 (external biasing) 3.3 (external biasing)

AFSAMPLE 47 open-collector open-collector

AFHOLD 48 open-collector open-collector

SDA 49 0 to 5 (external biasing) 5 (external biasing)

SCL 50 0 to 5 (external biasing) 5 (external biasing)

IFAGCLSB 51 0 to 3.3 (external biasing) 0 to 3.3 (external biasing)

IFAGCMSB 52 0 to 3.3 (external biasing) 0 to 3.3 (external biasing)

SWPORT2 53 −−0.3 −−0.3

VDDA5 54 external 8.5 external 8.5

GND 55 external 0 external 0

VDDA6 56 external 5 external 5

XTAL1 57 1.7 2.1 2.5 1.7 2.1 2.5

XTAL2 58 1.7 2.1 2.5 1.7 2.1 2.5

XTALGND 59 external 0 external 0

VDAC 60 2 4.8 7.8 2 4.64 7.8

IREF 61 4 4.25 4.5 4 4.25 4.5

i.c. 62 external 0 external 0

IFOUT1 63 −6.7 −− 6.7 −

IFOUT2 64 −6.7 −− 6.7 −

SYMBOL PIN

UNLOADED DC VOLTAGE (V)(1)

AM MODE FM MODE

MIN. TYP. MAX. MIN. TYP. MAX.

2003 Oct 21 32

Philips Semiconductors Preliminary speciﬁcation

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Table 24 Default settings of I2C-bus transmission to 1st IC address (C2H) for AM and FM mode

FUNCTION AM FM

Alternative frequency AF = 0 (no start of RDS update) 2D

B4 AF = 0 (no start of RDS update) 0F

Programmable counter

PLL PLL[14:0] = 11700 (fRF = 1 MHz) PLL[14:0] = 3918 (fRF = 76 MHz)

Preset PRESET = 1 (writing to programmable

divider and antenna DAA enabled) C0 PRESET = 1 (writing to programmable

divider and antenna DAA enabled) C0

Setting antenna DAA DAA[6:0] = 64 DAA[6:0] = 64

Reference frequency

for synthesizer FREF[2:0] = 110 (fref = 20 kHz;

fVCO = 234 MHz) 65 FREF[2:0] = 100 (fref = 50 kHz;

fVCO = 195.9 MHz) 42

Band select BND[1:0] = 10; AMFM = 1

(VCO divider = 20; Icp = 1 mA) BND[1:0] = 01; AMFM = 0

(VCO divider = 3; Icp = 130 µA+3mA)

Keyed FM AGC KAGC = 0 (off) 22 KAGC = 1 (on) B2

Wideband AGC AGC[1:0] = 01 (375 mV) AGC[1:0] = 01 (16 mV)

Local or distance LODX = 0 (distance) LODX = 1 (local)

FM mixer image

rejection FMINJ = 0 (low injection) FMINJ = 0 (low injection)

AGC switch AGCSW = 1 (FM RFAGC PIN diode

drive sources 10 mA) AGCSW = 1 (FM RFAGC PIN diode

drive sinks 1 mA)

FM mixer gain MIXGAIN = 0 (nominal) MIXGAIN = 0 (nominal)

Software

programmable port 2 SWPORT2 = 1 (LOW) 8F SWPORT2 = 1 (LOW) 90

Software

programmable port 1 SWPORT1 = 0 (open-collector) SWPORT1 = 0 (open-collector)

Setting of crystal

frequency DAA DAC[4:0] = 15 (4.8 V) DAC[4:0] = 16 (4.64 V)

I2C-bus transmission C2 2D B4 C0 65 22 8F C2 0F 4E C0 42 B2 90

2003 Oct 21 33

Philips Semiconductors Preliminary speciﬁcation

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13.2 Application information

handbook, full pagewidth

MDB411

pF 3.9

1 pF

3.9

3.3 pF

18 pF

4:6

22 kΩ

kΩ

1 µF

(optional)

BAS16

2.2

kΩ

100

kΩ

3.3

270

3.3

µH

2.2

MΩ

2.2 nF

RFGND

10 nF

10 nF 1 nF

270

Ω1.8

MΩ2.2

MΩ

22 Ω

47 Ω

47 µF

(16 V)

22 Ω

5 V

8.5 V 22 Ω

8.5 V

22 nF

8.5 V

nF 22

Ω

220 nF

120 kΩ

100 nF

100 nF 47

µF

8.5 V

5 V

8.5 V 8.5 V

330

Ω

BAP70-02BAP70-02

BB207

BC847C

BF862C

BAQ806

BAV99

220 nF

220

22 nF

100 nF

22 µF

8.5 V

nF 22

Ω

6.8 µH

820

µH150

pF 470

Ω

220

µF100

nF 22

470

µH

20.5 MHz

SFE

10.7MS3

270

56 µH

560 Ω

antenna

TEF6721HL

1516 1413121110987654321

33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

i.c.

WBFLAG

2.2

kΩ1.8

100

nF 3.3 nF L3

3.9 nF

4.7 kΩ

2.2 kΩ

10 kΩ

1.2 kΩ22

Ω22

Ω

nF 1

µF

2.7

BB208

AGCBUF

8.5 V

IFOUT2

SWPORT1

IFOUT1

i.c.

VDAC

SWPORT2

IFAGCMSB

IFAGCLSB

SCL

SDA

AFHOLD

AFSAMPLE

BUSENABLE

ADDRSEL

KAGC

Fig.7 Application diagram.

2003 Oct 21 34

Philips Semiconductors Preliminary speciﬁcation

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Table 25 List of components

SYMBOL PARAMETER TYPE MANUFACTURER

C1 capacitor for VCO tuning 270 pF; type NP0 −

L1 10.7 MHz IF coil P7 PSG P826RC 5134N=S TOKO

L2 AM input 388BN-1211Z TOKO

L3 oscillator coil E543SNAS-02010 TOKO

L4 FM image rejection 611SNS-1066Y TOKO

L5 FM input transformer 369INS-3076X TOKO

L6 FM antenna coil LQN1HR50; 215 nH MURATA

L7 PIN diode bias LQN1HR21; 500 nH MURATA

L8 connection image reject wire 10 mm/printed coil −

−crystal 20.5 MHz LN-G102-587 NDK

2003 Oct 21 35

Philips Semiconductors Preliminary speciﬁcation

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14 INTERNAL CIRCUITRY

Table 26 Equivalent pin circuits

PIN SYMBOL EQUIVALENT CIRCUIT

1 i.c.

DDA1

3 AMIFIN

4 FMIFIN

5 IFDEC

7 IFAGCBIAS

6 IFGND

8 i.c.

9 FMMIXOUT1

11 FMMIXOUT2

10 AMMIXOUT1

12 AMMIXOUT2

13 VDDA2

14 SWPORT1

330 Ω330 Ω

MDB417

MDB418

119

1210

MDB419

MDB420

2003 Oct 21 36

Philips Semiconductors Preliminary speciﬁcation

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15 AMMIXDEC

16 AMMIXIN

17 VAMCAS

18 VAMCASFB

19 IAMAGC

20 TAFAMAGC

PIN SYMBOL EQUIVALENT CIRCUIT

400 Ω

MDB421

17 10 kΩ

MDB422

18 1 kΩ

MDB423

MDB424

MDB425

2003 Oct 21 37

Philips Semiconductors Preliminary speciﬁcation

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21 TRFAMAGC

22 VREFFMMIX

23 FMMIXIN1

26 FMMIXIN2

24 RFGND

25 i.c.

27 WBFLAG

PIN SYMBOL EQUIVALENT CIRCUIT

MDB426

MDB427

2623

kΩ

MDB428

27 200 Ω

50 kΩ

MDB429

2003 Oct 21 38

Philips Semiconductors Preliminary speciﬁcation

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28 IFMAGC

29 AGCBUF

30 DAAOUT

31 KAGCADJ

32 TFMAGC

PIN SYMBOL EQUIVALENT CIRCUIT

MDB430

MDB431

kΩ

MDB432

MDB433

MDB434

10 kΩ10 kΩ

2003 Oct 21 39

Philips Semiconductors Preliminary speciﬁcation

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33 KAGC

34 DAATD

35 DAAIN

36 VTUNE

PIN SYMBOL EQUIVALENT CIRCUIT

MDB435

MDB436

35 2.5 kΩ

MDB437

MDB438

2003 Oct 21 40

Philips Semiconductors Preliminary speciﬁcation

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37 CPOUT

38 VDDA3

39 DGND

40 VDDD

41 VCOGND

42 OSCFDB

43 OSCTNK

44 VDDA4

45 ADDRSEL

46 BUSENABLE

PIN SYMBOL EQUIVALENT CIRCUIT

MDB439

3 kΩ

MDB440

45 1 kΩ

MDB441

MDB442

2003 Oct 21 41

Philips Semiconductors Preliminary speciﬁcation

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47 AFSAMPLE

48 AFHOLD

49 SDA

50 SCL

51 IFAGCLSB

52 IFAGCMSB

PIN SYMBOL EQUIVALENT CIRCUIT

MDB443

MDB444

1 kΩ

MDB446

1 kΩ

MDB445

MDB447

1.5 V

51 52

2003 Oct 21 42

Philips Semiconductors Preliminary speciﬁcation

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53 SWPORT2

54 VDDA5

55 GND

56 VDDA6

57 XTAL1

58 XTAL2

59 XTALGND

60 VDAC

61 IREF

62 i.c.

PIN SYMBOL EQUIVALENT CIRCUIT

MDB448

27.6 pF

10 kΩ

20 kΩ

27.6 pF

20 kΩ

10 kΩ

MDB449

31 kΩ

MDB450

10 kΩ

MHC560

2003 Oct 21 43

Philips Semiconductors Preliminary speciﬁcation

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63 IFOUT1

64 IFOUT2

PIN SYMBOL EQUIVALENT CIRCUIT

MDB451

500

Ω500

Ω

2003 Oct 21 44

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15 PACKAGE OUTLINE

UNIT A

max. A1A2A3bpcE

(1) eH

pZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 1.6 0.20

0.05 1.45

1.35 0.25 0.27

0.17 0.18

0.12 10.1

9.9 0.5 12.15

11.85 1.45

1.05 7

0.12 0.11 0.2

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.75

0.45

SOT314-2 MS-026136E10 00-01-19

03-02-25

D(1) (1)(1)

10.1

9.9

12.15

11.85

1.45

1.05

EA1

detail X

(A )

HA2

vMB

vMA

48 33

pin 1 index

0 2.5 5 mm

scale

LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm SOT314-2

2003 Oct 21 45

Philips Semiconductors Preliminary speciﬁcation

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16 SOLDERING

16.1 Introduction to soldering surface mount

packages

Thistext givesaverybrief insighttoa complextechnology.

A more in-depth account of soldering ICs can be found in

our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering can still be used for

certainsurface mountICs,but itisnotsuitablefor finepitch

SMDs. In these situations reflow soldering is

recommended.

16.2 Reﬂow soldering

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

totheprinted-circuitboard by screen printing,stencillingor

pressure-syringe dispensing before package placement.

Driven by legislation and environmental forces the

worldwide use of lead-free solder pastes is increasing.

Several methods exist for reflowing; for example,

convection or convection/infrared heating in a conveyor

type oven. Throughput times (preheating, soldering and

cooling) vary between 100 and 200 seconds depending

on heating method.

Typical reflow peak temperatures range from

215 to 270 °C depending on solder paste material. The

top-surface temperature of the packages should

preferably be kept:

•below 220 °C (SnPb process) or below 245 °C (Pb-free

process)

– for all BGA and SSOP-T packages

– for packages with a thickness ≥2.5 mm

– for packages with a thickness < 2.5 mm and a

volume ≥350 mm3 so called thick/large packages.

•below 235 °C (SnPb process) or below 260 °C (Pb-free

process) for packages with a thickness < 2.5 mm and a

volume < 350 mm3 so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing,

must be respected at all times.

16.3 Wave soldering

Conventional single wave soldering is not recommended

forsurface mountdevices(SMDs) orprinted-circuitboards

with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering

method was specifically developed.

If wave soldering is used the following conditions must be

observed for optimal results:

•Use a double-wave soldering method comprising a

turbulent wave with high upward pressure followed by a

smooth laminar wave.

•For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the

transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board.

The footprint must incorporate solder thieves at the

downstream end.

•Forpackages withleadson foursides,thefootprintmust

be placed at a 45°angle to the transport direction of the

printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Typical dwell time of the leads in the wave ranges from

3 to 4 seconds at 250 °C or 265 °C, depending on solder

material applied, SnPb or Pb-free respectively.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

16.4 Manual soldering

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C.

When using a dedicated tool, all other leads can be

soldered in one operation within 2 to 5 seconds between

270 and 320 °C.

2003 Oct 21 46

Philips Semiconductors Preliminary speciﬁcation

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16.5 Suitability of surface mount IC packages for wave and reﬂow soldering methods

Notes

1. Formoredetailed information on theBGApackagesrefer to the

“(LF)BGAApplicationNote

”(AN01026);order a copy

from your Philips Semiconductors sales office.

2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account

be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature

exceeding 217 °C±10 °C measured in the atmosphere of the reflow oven. The package body peak temperature

must be kept as low as possible.

4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder

cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,

the solder might be deposited on the heatsink surface.

5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not

suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

8. Hot bar or manual soldering is suitable for PMFP packages.

PACKAGE(1) SOLDERING METHOD

WAVE REFLOW(2)

BGA, LBGA, LFBGA, SQFP, SSOP-T(3), TFBGA, VFBGA not suitable suitable

DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,

HTSSOP, HVQFN, HVSON, SMS not suitable(4) suitable

PLCC(5), SO, SOJ suitable suitable

LQFP, QFP, TQFP not recommended(5)(6) suitable

SSOP, TSSOP, VSO, VSSOP not recommended(7) suitable

PMFP(8) not suitable not suitable

2003 Oct 21 47

Philips Semiconductors Preliminary speciﬁcation

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17 DATA SHEET STATUS

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was

published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

LEVEL DATA SHEET

STATUS(1) PRODUCT

STATUS(2)(3) DEFINITION

I Objective data Development This data sheet contains data from the objective speciﬁcation for product

development. Philips Semiconductors reserves the right to change the

speciﬁcation in any manner without notice.

II Preliminary data Qualiﬁcation This data sheet contains data from the preliminary speciﬁcation.

Supplementary data will be published at a later date. Philips

Semiconductors reserves the right to change the speciﬁcation without

notice, in order to improve the design and supply the best possible

product.

III Product data Production This data sheet contains data from the product speciﬁcation. Philips

Semiconductors reserves the right to make changes at any time in order

to improve the design, manufacturing and supply. Relevant changes will

be communicated via a Customer Product/Process Change Notiﬁcation

(CPCN).

18 DEFINITIONS

Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the

same type number and title. For detailed information see

the relevant data sheet or data handbook.

Limiting values definition Limiting values given are in

accordance with the Absolute Maximum Rating System

(IEC 60134). Stress above one or more of the limiting

values may cause permanent damage to the device.

These are stress ratings only and operation of the device

attheseor atanyotherconditions abovethosegiven in the

Characteristics sections of the specification is not implied.

Exposure to limiting values for extended periods may

affect device reliability.

Application information  Applications that are

described herein for any of these products are for

illustrative purposes only. Philips Semiconductors make

norepresentationorwarranty thatsuch applicationswillbe

suitable for the specified use without further testing or

modification.

19 DISCLAIMERS

Life support applications  These products are not

designed for use in life support appliances, devices, or

systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips

Semiconductorscustomersusingorsellingtheseproducts

for use in such applications do so at their own risk and

agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

Right to make changes  Philips Semiconductors

reserves the right to make changes in the products -

including circuits, standard cells, and/or software -

described or contained herein in order to improve design

and/or performance. When the product is in full production

(status ‘Production’), relevant changes will be

communicated via a Customer Product/Process Change

Notification (CPCN). Philips Semiconductors assumes no

responsibility or liability for the use of any of these

products, conveys no licence or title under any patent,

makes no representations or warranties that these

products are free from patent, copyright, or mask work

right infringement, unless otherwise specified.

2003 Oct 21 48

Philips Semiconductors Preliminary speciﬁcation

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20 PURCHASE OF PHILIPS I2C COMPONENTS

Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the

components in the I2C system provided the system conforms to the I2C specification defined by

Philips. This specification can be ordered using the code 9398 393 40011.

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Philips Semiconductors – a world wide company

Contact information

For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825

For sales ofﬁces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

Printed in The Netherlands 753503/01/pp49 Date of release: 2003 Oct 21 Document order number: 9397 750 11379