microGiGaCN™ FCN- 260 (D) Series
Dimensions are in millimeters (inches) www.fcai.fujitsu.com
Specifications
subject to change 3
Fujitsu Components has designed the
mechanical features of the connector to provide space
saving footprint that will allow for 3 4x I/O connectors to
mount onto a PCI form, or 2 12x. As RFI/EMI are
critical elements in high performance cable assemblies,
Fujitsu Components provides the surface mount
sockets with an EMI Ground Spring on the face of the
connector, to insure that the metal surface of the
connector makes sufficient contact with the metal face
of the card bracket.
The latching mechanism of the backshell offers
a lanyard system for ease of un-mating the I/O plug
connector/cable assembly from the SMT I/O socket.
The die cast backshell offers excellent RFI/EMI
characteristics. The backshell uses a ferrule and
Connector Internal Struture
unique ground spring system to provide 360 degree
contact of the cable shield to the backshell, which,
combined with the solid interconnect of the socket to
faceplate, offers low AC coupling termination.
The current version of the I/O plug comes
with an attached paddlecard for wire termination.
Fujitsu will offer the paddlecard in either an
equalized or un-equalized version (see factory for
details of the equalized version). Standard product
offering will be un-equalized. As there are multiple
applications for the paddlecard, with industry and
customer specific wire termination, Fujitsu
Components offers options to customers of providing
the I/O plug connector with custom paddlecards
(consult factory).
Basic Concept for Differential Transfer
+
-
+
-
1.27 mm
+
-
0.75 mm 1.5 mm
Patent pending
Ground/Power contact
Differential pair contact
Virtual ground
plane
Sectional View (Connection area)
Basic Concept for Differential Transfer
Outer shield
Product Specification are
subject to change, please
check our website
(www.fcai.fujitsu.com) for
the latest specifications.