XC6209/XC6212 Series ETR0306_006 High Speed LDO Regulators Low ESR Cap.Compatible,Output ON/OFFControl GENERAL DESCRIPTION The XC6209/XC6212 series are highly precise, low noise, positive voltage LDO regulators manufactured using CMOS processes. The series achieves high ripple rejection and low dropout and consists of a voltage reference, an error amplifier, a current limiter and a phase compensation circuit plus a driver transistor. Output voltage is selectable in 0.05V increments within a range of 0.9V ~ 6.0V. The series is also compatible with low ESR ceramic capacitors which give added output stability. This stability can be maintained even during load fluctuations due to the excellent transient response of the series. The current limiter's foldback circuit also operates as a short protect for the output current limiter and the output pin. The CE function enables the output to be turned off, resulting in greatly reduced power consumption. APPLICATIONS FEATURES Mobile phones, Cordless phones Maximum Output Current Wireless communication equipment Portable games Cameras, Video recorders Portable AV equipment Reference voltage Dropout Voltage Maximum Operating Voltage Output Voltage Range Highly Accurate Battery powered equipment Low Power Consumption Standby Current High Ripple Rejection Operating Ambient Temperature Low ESR Capacitor Compatible Packages Environmentally Friendly TYPICAL APPLICATION CIRCUIT : 150mA (300mA=XC6209 E to H types) : 60mV @ 30mA : 200mV @ 100mA : 2.0V ~ 10V : 0.9V ~ 6.0V(0.05V increments) : 2% (VOUT>1.5V) 30mV (VOUT1.5V) : 25A (TYP.) : Less than 0.1A (TYP.) : 70dB (10kHz) : -40~ +85 : Ceramic capacitor : SOT-25 USP-6B (XC6209) SOT-89-5 (XC6209) : EU RoHS Compliant, Pb Free TYPICAL PERFORMANCE CHARACTERISTICS 1/31 XC6209/XC6212 Series PIN CONFIGURATION [XC6209] CE 6 1 VIN VSS 5 2 NC 3 VOUT NC 4 USP-6B (BOTTOM VIEW) *The dissipation pad for the USP-6B package should be solder-plated in recommended mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the VSS pin. [XC6212] PIN ASSIGNMENT SOT-25 1 2 3 PIN NUMBER XC6209 SOT-89-5 USP-6B 4 1 2 5 3 6 XC6212 SOT-25 3 2 4 PIN NAME FUNCTIONS VIN VSS CE Input Ground ON/OFF Control 4 1 2,4 5 NC No Connection 5 5 3 1 VOUT Output FUNCTIONS TYPE Type A, B, E, F Type C, D, G, H H=High Level L=Low Level 2/31 CE H L H L OPERATIONAL STATE ON OFF OFF ON XC6209/XC6212 Series PRODUCT CLASSIFICATION Ordering Information XC6209- XC6212- DESIGNATOR ITEM SYMBOL A B C Type of Regulator CE Pin Logic D E F G H Output Voltage 0960 3060 2 Output Voltage Accuracy 1 A B - (*4) Packages (Order Unit) MR MR-G PR PR-G DR DR-G DESCRIPTION (*2) 150mA, Active High, Pull-down resistor built-in (Semi-custom) 150mA, Active High, No pull-down resistor (Standard) (*2) 150mA, Active Low, Pull-up resistor built-in (Semi-custom) 150mA, Active Low, No pull-up resistor (Semi-custom) (*1) (*2) 300mA , Active High, Pull-down resistor built-in (Semi-custom) ( *1) 300mA , Active High, No pull-down resistor (Standard) (*1) (*2) 300mA , Active Low, Pull-up resistor built-in (Semi-custom) (*1) 300mA , Active Low, No pull-up resistor (Semi-custom) Output Voltage Range: 0.9V6.0V e.g. : 3.0V=3, =0 For 1% product, output voltage range is 3.0V6.0V. (*3) 0.1V increments, Accuracy: 2% e.g.: 2.80V=2, =8, =2 0.1V increments, Accuracy: 1% e.g.: 3.00V=3, =0, =1 (*3) 0.05V increments, Accuracy: 2% e.g.: 2.85V=2, =8, =A 0.05V increments, Accuracy: 1% e.g.: 3.05V=3, =0, =B SOT-25 (3,000/Reel) SOT-25 (3,000/Reel) SOT-89-5 (for XC6209 only) (1,000/Reel) SOT-89-5 (for XC6209 only) (1,000/Reel) USP-6B (for XC6209 only) (3,000/Reel) USP-6B (for XC6209 only) (3,000/Reel) (*1) The maximum output current of type EH depends on setting output voltage. With the pull-up resistor or pull-down resistor built-in types, the supply current during operation will increase by VIN / 2M (TYP.). (*3) The output voltage accuracy is 30mV at VOUT1.5V. (*4) The "-G" suffix denotes Halogen and Antimony free as well as being fully RoHS compliant. (*2) 3/31 XC6209/XC6212 Series BLOCK DIAGRAM XC6209, XC6212 Type A, E XC6209, XC6212 Type B, D, F, H XC6209, XC6212 Type C, G * Diodes inside the circuits are ESD protection diodes and parasitic diodes. 4/31 XC6209/XC6212 Series ABSOLUTE MAXIMUM RATINGS Ta=25 PARAMETER Input Voltage Output Current Output Voltage CE Input Voltage SYMBOL VIN IOUT VOUT VCE SOT-25 Power Dissipation SOT-89-5 Pd USP-6B Operating Ambient Temperature Storage Temperature Topr Tstg RATINGS 12.0 500 (*1) VSS - 0.3 ~ VIN + 0.3 VSS - 0.3 ~ VIN + 0.3 250 (*2) 600(PCB mounted) 500 (*2) 1300(PCB mounted) 120 (*2) 1000(PCB mounted) -40 ~ +85 -55 ~ +125 UNITS V mA V V mW All voltages are described based on the VSS. (*1) IOUTPd/(VIN-VOUT) (*2) This is a reference data taken by using the test board. Please refer to page 25 to 27 for details. 5/31 XC6209/XC6212 Series ELECTRICAL CHARACTERISTICS XC6209/XC6212 (Type A, B) PARAMETER SYMBOL Output Voltage (2)(*5) Output Voltage (1) (*6) VOUT(E) (*3) CONDITIONS IOUT=30mA Maximum Output Current IOUTMAX - Load Regulation VOUT 1mAIOUT100mA Dropout Voltage (*4) MIN. VOUT(T)(*2)x0.98 VOUT(T)(*2)x0.99 150 - TYP. VOUT(T) (*2) MAX. VOUT(T)(*2)x1.02 VOUT(T)(*2)x1.01 - - 15 50 Ta=25 UNITS CIRCUIT V mA mV Vdif1 IOUT=30mA E-1 mV Vdif2 IOUT=100mA E-2 mV Supply Current (Type A) Supply Current (Type B) IDD Stand-by Current ISTB Line Regulation VOUT/ (VINVOUT) VCE=VIN=VOUT(T)+1.0V When VOUT0.95V, VIN=VCE=2.0V VIN=VOUT(T)+1.0V,VCE=VSS When VOUT0.95V, VIN=2.0V VOUT(T)+1.0VVIN10V When VOUT0.95,2.0V=VIN10V IOUT=30mA When VOUT1.75V, IOUT=10mA - 28 55 A - 25 50 - 0.01 0.10 A - 0.01 0.20 /V 2 - 10 V - - 100 - ppm/ - 70 - dB - 300 - mA - 50 - mA Input Voltage VIN Output Voltage Temperature Characteristics VOUT/ (ToprVOUT) Power Supply Rejection Ratio PSRR Current Limit Ilim Short Current ISHORT CE "H" Level Voltage VCEH - 1.6 - VIN V - - 0.25 V 0.8 - 5.0 A A IOUT=30mA -40Topr85 VIN=[VOUT(T)+1.0]V+1.0Vp-pAC When VOUT1.5V, VIN=2.5V+1.0Vp-pAC IOUT=50mA, f=10kHz VIN=VOUT(T)+1.0V, VCE=VSS When VOUT1.75, VIN=VOUT(T)+2.0V VIN=VOUT(T)+1.0V, VCE=VSS When VOUT1.75, VIN=VOUT(T)+2.0V CE "L" Level Voltage VCEL - CE "H" Level Current (Type A) CE "H" Level Current (Type B) ICEH VIN=VCE=VOUT(T)+1.0V, When VOUT0.95V, VIN=VCE=2.0V CE "L" Level Current ICEL VIN=VOUT(T)+1.0V,VCE=VSS When VOUT0.95V, VIN=2.0V *1: Unless otherwise stated, VIN=VOUT(T)+1.0V. -0.1 -0.1 0.1 - 0.1 If VOUT is less than 0.95V, VIN= 2.0V. *2: VOUT(T) is Nominal output voltage *3: VOUT(E) is Effective output voltage (I.e. the output voltage when "VOUT(T)+1.0V" is provided at the VIN pin while maintaining a certain IOUT value). *4: Vdif={VIN1-VOUT1} VOUT1 is the voltage equal to 98% of the output voltage whenever an amply stabilized VOUT(T)+1.0V is input for every IOUT. VIN1 is the input voltage when VOUT1 appears while input voltage is gradually decreased. *5: If VOUT(T) is less than 1.45V, VOUT(T) -30mV (MIN.), VOUT(T) + 30mV (MAX.) *6: Only for the VOUT(T) is more than 3.0V products. 6/31 XC6209/XC6212 Series ELECTRICAL CHARACTERISTICS Ta=25 XC6209/XC6212 (Type C, D) PARAMETER Output Voltage SYMBOL CONDITIONS (*5) (2%) Output Voltage (*6)(1%) VOUT(E) (*3) Maximum Output Current IOUTMAX Load Regulation VOUT Vdif1 Vdif2 Dropout Voltage (*4) Supply Current (Type C) Supply Current (Type D) IDD Stand-by Current ISTB Line Regulation VOUT/ (VINVOUT) IOUT=30mA MIN. VOUT(T)(*2)x0.98 VOUT(T)(*2)x0.99 - TYP. VOUT(T)(*2) MAX. CIRCUIT V - mA 50 mV mV A VOUT(T)(*2)x1.02 VOUT(T)(*2)x1.01 150 - 1mAIOUT100mA - 15 IOUT=30mA - E-1 IOUT=100mA - E-2 VIN=VOUT(T)+1.0V When VOUT0.95V, VIN=2.0V VCE=VSS - 28 UNITS 55 - 25 50 VIN=VOUT(T)+1.0V, VCE=VIN When VOUT0.95V, VIN=VCE=2.0V - 0.01 0.10 A VOUT(T)+1.0VVIN10 VOUT0.95V is 2.0VVIN10V IOUT=30mA When VOUT1.75V, IOUT=10mA - 0.01 0.20 %/V - 2 - 10 V - IOUT=30mA -40Topr85 - 100 - ppm/ VIN=[VOUT(T)+1.0]V+1.0Vp-pAC When VOUT1.5V, VIN=2.5V+1.0Vp-pAC IOUT=50mA, f=10kHz - 70 - dB Input Voltage VIN Output Voltage Temperature Characteristics VOUT/ (ToprVOUT) Power Supply Rejection Ratio PSRR Current Limit Ilim VIN=VOUT(T)+1.0V, VCE=VSS When VOUT1.75V, VIN=VOUT(T)+2.0V - 300 - mA Short Current ISHORT VIN=VOUT(T)+1.0V, VCE=VSS When VOUT1.75V, VIN=VOUT(T)+2.0V - 50 - mA CE "H" Level Voltage VCEH - 1.6 - VIN V CE "L" Level Voltage VCEL - - - 0.25 V CE "H" Level Current ICEH VCE=VIN=VOUT(T)+1.0V When VOUT0.95V, VCE=VIN=2.0V -0.1 - 0.1 A -5.0 - -0.8 ICEL VIN=VOUT(T)+1.0V, VCE=VSS When VOUT0.95V, VIN=2.0V A -0.1 - 0.1 CE "L" Level Current (Type C) CE "L" Level Current (Type D) *1: Unless otherwise stated, VIN=VOUT(T)+1.0V. If VOUT is less than 0.95V, VIN= 2.0V. *2: VOUT(T) is Nominal output voltage *3: VOUT(E) is Effective output voltage (I.e. the output voltage when "VOUT(T)+1.0V" is provided at the VIN pin while maintaining a certain IOUT value). *4: Vdif={VIN1-VOUT1} VOUT1 is the voltage equal to 98% of the output voltage whenever an amply stabilized VOUT(T)+1.0V is input for every IOUT. VIN1 is the input voltage when VOUT1 appears while input voltage is gradually decreased. *5: If VOUT(T) is less than 1.45V, VOUT(T) -30mV (MIN.), VOUT(T) + 30mV (MAX.) *6: Only for the VOUT(T) is more than 3.0V products. 7/31 XC6209/XC6212 Series ELECTRICAL CHARACTERISTICS (Continued) XC6209/XC6212 (Type E,F) PARAMETER Output Voltage (2)(*5) SYMBOL CONDITIONS VOUT(E) (*3) IOUT=30mA IOUTMAX VIN=E-3(*7) Load Regulation VOUT Load Regulation 2 VOUT2 Output Voltage (1)(*6) Maximum Output Current Dropout Voltage (*4) MIN. VOUT(T)(*2)x0.98 VOUT(T)(*2)x0.99 TYP. VOUT(T)(*2) MAX. VOUT(T)(*2)x1.02 V - mA (*2) VOUT(T) x1.01 E-4 - 1mA< IOUT <100mA - 15 50 mV 1mA< IOUT <300mA - - 100 mV Vdif1 IOUT=30mA E-1 mV Vdif2 IOUT=100mA E-2 mV Supply Current (Type E) Supply Current (Type F) IDD Stand-by Current ISTB Line Regulation VOUT / (VINVOUT) Input Voltage VIN Output Voltage Temperature Characteristics VOUT / (ToprVOUT) Power Supply Rejection Ratio PSRR Current Limit Ilim Short Current ISHORT CE "H" Level Voltage VCEH - 1.6 CE "L" Level Voltage VCEL - - CE "H" Level Current (Type E) CE "H" Level Current (Type F) 0.8 - 5.0 ICEH VIN=VCE=VOUT(T)+1.0V When VOUT0.95V, VIN=VCE=2.0V -0.1 - 0.1 CE "L" Level Current ICEL -0.1 - 0.1 28 55 25 50 - 0.01 - IOUT=30mA -40 With the XC6209/XC6212 series, a stable output voltage is achievable even if used with low ESR capacitors as a phase compensation circuit is built-in. In order to ensure the effectiveness of the phase compensation, we suggest that an output capacitor (CL) is connected as close as possible to the output pin (VOUT) and the VSS pin. Please use an output capacitor with a capacitance value of at least 1F. Also, please connect an input capacitor (CIN) of 0.1F between the VIN pin and the VSS pin in order to ensure a stable power input. Stable phase compensation may not be ensured if the capacitor runs out capacitance when depending on bias and temperature. In case the capacitor depends on the bias and temperature, please make sure the capacitor can ensure the actual capacitance. The XC6209/XC6212 series includes a combination of a fixed current limiter circuit & a foldback circuit, which aid the operations of the current limiter and circuit protection. When the load current reaches the current limit level, the fixed current limiter circuit operates and output voltage drops. As a result of this drop in output voltage, the foldback circuit operates, output voltage drops further and output current decreases. When the output pin is shorted, a current of about 50mA flows. The IC's internal circuitry can be shutdown via the signal from the CE pin with the XC6209/XC6212 series. In shutdown mode, output at the VOUT pin will be pulled down to the VSS level via R1 & R2. The operational logic of the IC's CE pin is selectable (please refer to the selection guide). Note that as the standard XC6209/XC6212B type is ' Active High /No Pull Down', operations will become unstable with the CE pin open. Although the CE pin is equal to an inverter input with CMOS hysteresis, with either the pull-up or pull-down options, the CE pin input current will increase when the IC's in operation. We suggest that you use this IC with either a VIN voltage or a VSS voltage input at the CE pin. If this IC is used with the correct specifications for the CE pin, the IC will operate normally. However, supply current may increase as a result of through current in the IC's internal circuitry NOTES ON USE 1. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be exceeded. 2. Where wiring impedance is high, operations may become unstable due to noise and/or phase lag depending on output current. Please strengthen VIN and VSS wiring in particular. 3. Please wire the input capacitor (CIN) and the output capacitor (CL) as close to the IC as possible. 4. The IC is controlled with constant current start-up. Start-up sequence control is requested to draw a load current after even nominal output voltage rising up the output voltage. 5. Torex places an importance on improving our products and their reliability. We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their systems. 13/31 XC6209/XC6212 Series TEST CIRCUITS Circuit Circuit Circuit Circuit * Each Test Circuit, VCE (CE pin Voltage) Active XC6209/XC6212, Type A, B, E, F: VCE=VIN XC6209/XC6212, Type C, D, G, H: VCE=VSS Stand-by XC6209/XC6212, Type A, B, E, F: VCE=VSS XC6209/XC6212, Type C, D, G, H: VCE=VIN 14/31 XC6209/XC6212 Series TYPICAL PERFORMANCE CHARACTERISTICS (1) Output Voltage vs. Output Current XC6209/12 B302 XC6209/12 B302 XC6209/12 F302 XC6209/12 F302 XC6209/12 B122 XC6209/12 B122 15/31 XC6209/XC6212 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (1) Output Voltage vs. Output Current (Continued) XC6209/12 F122 XC6209/12 F122 (2) Output Voltage vs. Input Voltage 16/31 XC6209/12 F302 XC6209/12 F302 XC6209/12 F122 XC6209/12 F122 XC6209/XC6212 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (3) Dropout Voltage vs. Output Current XC6209/12 B302 XC6209/12 F302 XC6209/12 B122 XC6209/12 F122 (4) Supply Current vs. Input Voltage XC6209/12 F122 Supply Current ISS (A) Supply Current ISS (A) XC6209/12 F302 17/31 XC6209/XC6212 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (5) Output Voltage vs. Ambient Temperature Ambient Temperature Topr () Ambient Temperature Topr () Supply Current ISS (A) Supply Current ISS (A) (6) Supply Current vs. Ambient Temperature Ambient Temperature Topr () (7) P-ch Driver Transistor Characteristics 18/31 Ambient Temperature Topr () XC6209/XC6212 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (8) Input Transient Response 19/31 XC6209/XC6212 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (9) Load Transient Response 20/31 XC6209/XC6212 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (9) Load Transient Response (Continued) 21/31 XC6209/XC6212 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (10) Ripple Rejection Rate XC6209/12 B/F302 VIN=4VDC+1Vp-pAC, IOUT=30mA, CL=1F (ceramic) 22/31 XC6209/12 B/F122 VIN=2.5VDC+1Vp-pAC, IOUT=30mA, CL=1F (ceramic) XC6209/XC6212 Series PACKAGING INFORMATION SOT-89-5 (unit:mm) 4.35 MAX 0.8 MIN 2.50.1 0.4) 0.3) USP-6B (unit:mm) 1.8) 0.4) 1.50.1 (0.1) 1.3MAX 1.10.1 0.8 MIN 0.2MIN +0.2 1.6 -0.1 2.80.2 SOT-25 (unit:mm) 23/31 XC6209/XC6212 Series PACKAGING INFORMATION (Continued) USP-6B Reference Pattern Layout (unit:mm) 24/31 USP-6B Reference Metal Mask Design (unit:mm) XC6209/XC6212 Series SOT-25 Power Dissipation Power dissipation data for the SOT-25 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition. 1. Measurement Condition Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40x40mm (1600mm in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces 40.0 28.9 2 Package heat-sink is tied to the copper traces (Board of SOT-26 is used) Glass Epoxy (FR-4) Thickness: 1.6mm Through-hole: 4 x 0.8 Diameter 2.5 Material: Evaluation Board (unit: mm) 2. Power Dissipation vs. Ambient Temperature Board Mount (Tjmax=125) Ambient Temperature () Power Dissipation Pd (mW) 25 600 85 240 Thermal Resistance (/W) 166.67 PdmW Power Dissipation: Pd (mW) Pd vs. Ta Pd-Ta 700 600 500 400 300 200 100 0 25 45 65 85 105 Ta Ambient Temperature: Ta () 125 25/31 XC6209/XC6212 Series SOT-89-5 Power Dissipation Power dissipation data for the SOT-89-5 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition. 1. Measurement Condition Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm in one side) 2 Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 5 x 0.8 Diameter Evaluation Board (unit: mm) 2. Power Dissipation vs. Ambient Temperature Board Mount (Tjmax=125) Ambient Temperature () Power Dissipation Pd (mW) 25 1300 85 520 Thermal Resistance (/W) 76.92 PdmW Power Dissipation: Pd (mW) Pd vs. Ta Pd-Ta 1400 1200 1000 800 600 400 200 0 25 26/31 45 65 85 Ta Ambient Temperature: Ta () 105 125 XC6209/XC6212 Series USP-6B Power Dissipation Power dissipation data for the USP-6B is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition. 1. Measurement Condition Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40x40mm (1600mm in one side) 2 Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6mm Through-hole: 4 x 0.8 Diameter Evaluation Board (unit: mm) 2. Power Dissipation vs. Ambient Temperature Board Mount (Tjmax=125) Ambient Temperature () Power Dissipation Pd (mW) 25 1000 85 400 Thermal Resistance (/W) 100.00 Power Dissipation: Pd (mW) PdmW Pd vs. Ta Pd-Ta 1200 1000 800 600 400 200 0 25 45 65 85 105 Ta Ambient Temperature: Ta () 125 27/31 XC6209/XC6212 Series MARKING RULE [XC6209] SOT-25 & SOT-89-5 5 1 4 represents product series MARK PRODUCT SERIES 9 XC6209xxxxxx 2 3 represents type of regulator MARK VOUT 0.1V INCREMENTS VOUT 0.05V INCREMENTS PRODUCT SERIES VOLTAGE= 0.13.0V VOLTAGE= 3.16.0V VOLTAGE= 0.153.05V VOLTAGE= 3.156.05V V A E L XC6209Axxxxx X B F M XC6209Bxxxxx Y C H N XC6209Cxxxxx Z D K P XC6209Dxxxxx V A E L XC6209Exxxxx X B F M XC6209Fxxxxx Y C H N XC6209Gxxxxx Z D K P XC6209Hxxxxx represents integer of the output voltage MARK 0 1 2 3 4 5 6 7 8 9 A B C D E OUTPUT VOLTAGE (V) 0.9 1.0 1.1 1.2 1.3 1.4 1.5 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 4.5 0.95 1.05 1.15 1.25 1.35 1.45 1.55 3.15 3.25 3.35 3.45 3.55 3.65 .3.75 3.85 3.95 4.05 4.15 4.25 4.35 4.45 4.55 MARK F H K L M N P R S T U V X Y Z represents production lot number 0 to 9, A to Z reversed character of 0 to 9 and A to Z repeated (G, I, J, O, Q, W excluded) 28/31 OUTPUT VOLTAGE (V) 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 4.6 4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5 5.6 5.7 5.8 5.9 6.0 1.65 1.75 1.85 1.95 2.05 2.15 2.25 2.35 2.45 2.55 2.65 2.75 2.85 2.95 3.05 4.65 4.75 4.85 4.95 5.05 5.15 5.25 5.35 5.45 5.55 5.65 5.75 5.85 5.95 - XC6209/XC6212 Series MARKING RULE (Continued) USP-6B , represents product series MARK 0 9 PRODUCT SERIES XC6209AxxxDx USP-6B (TOP VIEW) represents type of regulator MARK TYPE PRODUCT SERIES A CE pin, Active High pull-down resistor built in XC6209AxxxDx B CE pin, Active High no pull-down resistor built in XC6209BxxxDx C CE pin, Active Low pull-up resistor built in XC6209CxxxDx D CE pin, Active Low no pull-up resistor built in XC6209DxxxDx represents integer of output voltage MARK VOLTAGE (V) PRODUCT SERIES 3 3.X XC6209x3xxDx 5 5.X XC6209x5xxDx represents decimal number of output voltage MARK VOLTAGE (V) PRODUCT SERIES MARK VOLTAGE (V) PRODUCT SERIES 0 X.0 XC6209xx0xDx A X.05 XC6209xx0ADx 1 X.1 XC6209xx1xDx B X.15 XC6209xx1ADx 2 3 4 5 X.2 X.3 X.4 X.5 XC6209xx2xDx XC6209xx3xDx XC6209xx4xDx XC6209xx5xDx C D E F X.25 X.35 X.45 X.55 XC6209xx2ADx XC6209xx3ADx XC6209xx4ADx XC6209xx5ADx 6 X.6 XC6209xx6xDx H X.65 XC6209xx6ADx 7 8 9 X.7 X.8 X.9 XC6209xx7xDx XC6209xx8xDx XC6209xx9xDx K L M X.75 X.85 X.95 XC6209xx7ADx XC6209xx8ADx XC6209xx9ADx Represents production lot number 0 to 9, A to Z repeated (G, I, J, O, Q, W excluded) Note: No character inversion used. 29/31 XC6209/XC6212 Series MARKING RULE (Continued) [XC6212] SOT-25 (SOT-23-5) 5 1 4 represents product series 2 3 SOT-25 (SOT-23-5) (TOP VIEW) MARK PRODUCT SERIES 9 XC6212xxxMx represents type of regulator MARK VOUT 0.1V INCREMENTS PRODUCT SERIES VOUT 0.05V INCREMENTS VOUT=0.1~3.0V VOUT=3.1~6.0V VOUT=0.15~3.05V VOUT=3.15~6.05V V A E L XC6209AxxxMx X B F M XC6209BxxxMx Y C H N XC6209CxxxMx Z D K P XC6209DxxxMx represents output voltage MARK 0 1 2 3 4 5 6 7 8 9 A B C D E OUTPUT VOLTAGE (V) 0.90 1.00 1.10 1.20 1.30 1.40 1.50 3.10 3.20 3.30 3.40 3.50 3.60 3.70 3.80 3.90 4.00 4.10 4.20 4.30 4.40 4.50 0.95 1.05 1.15 1.25 1.35 1.45 1.55 3.15 3.25 3.35 3.45 3.55 3.65 .3.75 3.85 3.95 4.05 4.15 4.25 4.35 4.45 4.55 MARK F H K L M N P R S T U V X Y Z OUTPUT VOLTAGE (V) 1.60 1.70 1.80 1.90 2.00 2.10 2.20 2.30 2.40 2.50 2.60 2.70 2.80 2.90 3.00 4.60 4.70 4.80 4.90 5.00 5.10 5.20 5.30 5.40 5.50 5.60 5.70 5.80 5.90 6.00 1.65 1.75 1.85 1.95 2.05 2.15 2.25 2.35 2.45 2.55 2.65 2.75 2.85 2.95 3.05 represents production lot number 0 to 9, A to Z, reversed character of 0 to 9 and A to Z repeated (G, I, J, O, Q, W excluded) 30/31 4.65 4.75 4.85 4.95 5.05 5.15 5.25 5.35 5.45 5.55 5.65 5.75 5.85 5.95 - XC6209/XC6212 Series 1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD. 31/31