SPECIFICATION SPEC. No. DATE Customer CUSTOMER'S PRODUCT NAME TDK PRODUCT NAME MULTILAYER CERAMIC CHIP CAPACITORS C1005, C1608, C2012, C3216, C3225, C4532, C5750 Type / 100V to 630V C0G, X7R, X7S, X7T Characteristics Please sign and return this specification to your local TDK representatives. If orders are placed without this returned documentation, we must consider you found the specification acceptable. THIS SPECIFICATION IS RECEIVED DATE: YEAR MONTH DAY TDK-EPC Corporation 1-13-1,Nihonbashi,Chuo-ku, Tokyo 103-0027,Japan ENGINEERING ISSUED CHECKED APPROVED DATE DATE DATE Sales Office Sales Tel. PRODUCT CLASSIFICATION CODE 040320 REV 0.3 / 201012 1. SCOPE This specification is applicable to chip type multilayer ceramic capacitors with a priority over other relevant specifications. Production places defined in this specification shall be TDK-EPC Corporation Japan, TDK (Suzhou) Co., Ltd, TDK-EPC HONG KONG LIMITED, TDK (Malaysia) Sdn. Bhd, and TDK Components U.S.A. Inc. EXPLANATORY NOTE: This specification warrants the quality of the TDK ceramic chip capacitors. The product should be evaluated and confirmed in your product before use. If the use of the product exceeds the bounds of this specification, we can not guarantee its quality and reliability. 2. CODE CONSTRUCTION (Example) C2012 (1) X7R (2) 2E (3) 472 (4) M (5) T (6) (1) Type Terminal electrode B L G W B T Internal electrode Ceramic dielectric Please refer to product list for the dimension of each product. and material. See Section 9 for inside structure (2) Temperature Characteristics (Details are shown in Section 8, No.7 and No.8) (3) Rated Voltage Symbol Rated Voltage 2J DC 630 V 2W DC 450 V 2E DC 250 V 2A DC 100 V (4) Rated Capacitance Stated in three digits and in units of pico farads (pF). The first and second digits identify the first and second significant figures of the capacitance: the third digit identifies the multiplier. R is designated for a decimal point. Example 472 4,700pF 1 of 31 (5) Capacitance tolerance (6) Packaging Symbol Tolerance J 5% K 10 % M 20 % Symbol Packaging B Bulk T Taping 2 of 31 3. RATED CAPACITANCE AND CAPACITANCE TOLERANCE 1. Standard combination of rated capacitance and tolerances Class Temperature Characteristics 1 Capacitance tolerance 10,000pF and under C0G Over 10,000pF X7R X7S X7T 2 Rated capacitance E - 12 series J ( 5 %) K ( 10 %) E - 6 series K ( 10 %) M ( 20 %) E - 6 series 2. Capacitance Step in E series Capacitance Step E series E- 6 E-12 1.0 1.0 1.5 1.2 1.5 2.2 1.8 2.2 3.3 2.7 3.3 4.7 3.9 4.7 6.8 5.6 6.8 8.2 4. OPERATING TEMPERATURE RANGE T.C. Min. operating Temperature Max. operating Temperature Reference Temperature C0G, X7R, X7S, X7T -55C 125C 25C 5. STORING CONDITION AND TERM 5 to 40C at 20 to 70%RH 6 months Max. 6. P.C. BOARD When mounting on an aluminum substrate, large case sizes such as C3225, C4532 and C5750 types are more likely to be affected by heat stress from the substrate. Please inquire separate specification for the large case sizes when mounted on the substrate. 7. INDUSTRIAL WASTE DISPOSAL Dispose this product as industrial waste in accordance with the local Industrial Waste Laws. 3 of 31 8. PERFORMANCE No. Item 1 External Appearance No defects which may affect performance. Inspect with magnifying glass (3x). 2 Insulation Resistance 10,000M or 500M*F min. Apply rated voltage for 60s. whichever smaller. As for the rated voltage 630V DC, apply 500V DC. 3 Voltage Proof Performance Test or inspection method Withstand test voltage without insulation breakdown or other damage. Class Class 1 Class 2 Rated voltage Apply voltage 100V 3 x rated voltage Over 100V 1.5 x rated voltage 100V 2.5 x rated voltage Over 100V 1.5 x rated voltage Above DC voltage shall be applied for 1 to 5s. Charge / discharge current shall not exceed 50mA. 4 Capacitance Within the specified capacitance. Class Rated Capacitanc 1000pF Class 1 and under Over 1000pF 10uF and Class 2 under Measuring Measuring frequency voltage 1MHz10% 0.5 - 5 Vrms. 1kHz10% 1kHz10% 1.00.2Vrms. Over 10uF 120Hz20% 0.50.2Vrms. 5 Q (Class 1) 6 Dissipation Factor (Class 2) 1,000 min. See No.4 in this table for measuring condition. T.C. D.F. X7R 0.03 max. X7R 0.05 max. X7T 0.025 max. See No.4 in this table for measuring condition. 4 of 31 (8. Performance, continued) No. 7 Item Temperature Characteristics of Capacitance (Class 1) Performance T.C. Temperature Coefficient (ppm/C) C0G 0 30 Test or inspection method Temperature coefficient shall be calculated based on values at 25C and 85C temperature. Measuring temperature below 20C shall be -10C and -25C. Capacitance drift within 0.2% 8 Temperature Characteristics of Capacitance (Class 2) Capacitance Change (%) No voltage applied X7R : 15% X7S : 22% X7T : +22%, -33% 9 Robustness of Terminations No sign of termination coming off, breakage of ceramic, or other abnormal signs. Capacitance shall be measured by the steps shown in the following table after thermal equilibrium is obtained for each step. C be calculated ref. STEP3 reading Step Temperature(C) 1 Reference temp. 2 2 Min. operating temp. 2 3 Reference temp. 2 4 Max. operating temp. 2 Reflow solder the capacitors on P.C. board (shown in Appendix 1a or Appendix 1b) and apply a pushing force of 2N (C1005) or 5N (C1608, C2012, C3216, C3225, C4532, C5750) with 101s. Pushing force P.C. board Capacitor 10 Bending No mechanical damage. Reflow solder the capacitors on P.C. board (shown in Appendix 2a or Appendix 2b) and bend 1mm. 20 50 F R230 45 1 45 (Unit: mm) 5 of 31 (8. Performance, continued) No. 11 Item Solderability Performance Test or inspection method New solder to cover over 75% of termination. 25% may have pin holes or rough spots but not concentrated in one spot. Completely soak both terminations in solder at 2355C for 20.5s. Ceramic surface of A sections shall not be exposed due to melting or shifting of termination material. Flux : Isopropyl alcohol (JIS K 8839) Rosin(JIS K 5902) 25% solid solution. Solder : H63A (JIS Z 3282) A section 12 Resistance to solder heat External appearance No cracks are allowed and terminations shall be covered at least 60% with new solder. Capacitance Characteristics Class1 Change from the value before test C0G 2.5% X7R Class2 X7S 7.5 % X7T Q (Class 1) 1,000 min. D.F. (Class 2) Meet the initial spec. Insulation Resistance Meet the initial spec. Voltage proof No insulation breakdown or other damage. Completely soak both terminations in solder at 2605C for 51s. Preheating condition Temp. : 15010C Time : 1 to 2min. Flux : Isopropyl alcohol (JIS K 8839) Rosin (JIS K 5902) 25% solid solution. Solder : H63A (JIS Z 3282) Leave the capacitor in ambient conditions for 6 to 24h (Class 1) or 242h (Class 2) before measurement. 6 of 31 (Performance, continued) No. 13 Item Vibration External appearance Performance No mechanical damage. Characteristics Class 1 Change from the value before test C0G 2.5 % X7R Class 2 X7S 7.5 % X7T Q (Class 1) 1,000 min. D.F. (Class 2) Meet the initial spec. Temperature External cycle Reflow solder the capacitor on a P.C. board (shown in Appendix 1a or Appendix 1b) before testing. Capacitance 14 Test or inspection method No mechanical damage. appearance Vibrate the capacitor with amplitude of1.5mm P-P changing the frequencies from 10Hz to 55Hz and back to 10Hz in about 1min. Repeat this for 2h each in 3 perpendicular directions. Reflow solder the capacitors on a P.C. board (shown in Appendix 1a or Appendix 1b) before testing. Capacitance Characteristics Class 1 Change from the value before test C0G 2.5 % Expose the capacitor in the condition step1 through step 4, and repeat 5 times consecutively. X7R Class 2 X7S 7.5 % X7T Q (Class 1) 1,000 min. D.F. Leave the capacitor in ambient conditions for 6 to 24h (Class 1) or 242h (Class 2) before measurement. Step Temperature(C) Time (min.) Meet the initial spec. 1 Min. operating temp. 3 30 3 Insulation Resistance Meet the initial spec. 2 Reference Temp. 2-5 Voltage proof No insulation breakdown or other damage. 3 Max. operating temp. 2 30 2 4 Reference Temp. 2-5 (Class 2) 7 of 31 (8. Performance, continued) No. 15 Item Performance Moisture External No mechanical damage. Resistance appearance (Steady Capacitance State) Test or inspection method Reflow solder the capacitor on P.C. board (shown in Appendix 1a or Appendix 1b) before testing. Change from Characteristics the value before test Class 1 C0G 5% X7R Class 2 X7S 12.5 % X7T 16 Moisture Resistance Q (Class 1) 350 min. D.F. (Class 2) Characteristics X7R/X7S/X7T : 200% of initial spec. max. Insulation Resistance 1,000M or 50M*F min. whichever smaller. External appearance No mechanical damage. Characteristics Class 1 Class 2 C0G X7S X7T D.F. (Class 2) Insulation Resistance Reflow solder the capacitors on P.C. board (shown in Appendix 1a or Change from the value before test 7.5 % X7R (Class 1) Leave the capacitor in ambient condition for 6 to 24h (Class1) or 242h (Class 2) before measurement. Appendix 1b) before testing. Capacitance Q Leave at temperature 402C, 90 to 95%RH for 500 +24,0h. 200 min. Apply the rated voltage at temperature 402C and 90 to 95%RH for 500 +24,0h. 12.5 % Charge/discharge current shall not exceed 50mA. Leave the capacitor in ambient conditions for 6 to 24h (Class 1) or Characteristics 242h (Class 2) before measurement. X7R/X7S/X7T : 200% of initial spec. max. Voltage conditioning (only for class 500M or 25M*F min. 2)Voltage treat the capacitors under whichever smaller. testing temperature and voltage for 1 hour. Leave the capacitors in ambient condition for 242h before measurement. Use this measurement for initial value. 8 of 31 (8. Performance, continued) No. 17 Item Life External Performance No mechanical damage. appearance Test or inspection method Reflow solder the capacitor on P.C. board (shown in Appendix 1a or Appendix 1b) before testing. Capacitance Characteristics Class 1 C0G Change from the value before test 3% Below the voltage shall be applied at 1252C for 1,000 +48, 0h. X7R Class 2 X7S X7T 15 % Applied voltage is 1xRV. Some items may be tested at higher voltage (1.2x, 1.5x or 2xRV). Q (Class 1) 350 min. D.F. (Class 2) Charge/discharge current shall not Characteristics exceed 50mA. X7R/X7S/X7T : 200% of initial spec. max. Leave the capacitors in ambient 1,000M or 50M*F min. condition for 6 to 24h (Class 1) or whichever smaller. 242h (Class 2) before measurement. Insulation Resistance Voltage conditioning (only for class 2) Voltage treat the capacitor under testing temperature and voltage for 1 hour. Leave the capacitor in ambient conditions for 242h before measurement. Use this measurement for initial value. *As for the initial measurement of capacitors (Class 2) on number 8, 12, 13, 14 and 15, leave capacitor at 150 -10, 0C for 1 hour and measure the value after leaving capacitor for 242h in ambient condition. 9 of 31 Appendix - 1a Appendix - 1b P.C. Board for reliability test P.C. Board for reliability test Applied for C1005, C1608, C2012, C3216 Applied for C3225, C4532, C5750 100 100 a b 40 a Copper Solder resist Solder resist Slit Copper (Unit: mm) (Unit mm) Appendix - 2b Appendix - 2a P.C. Board for bending test P.C. Board for bending test Applied for C1005 Applied for C1608, C2012, C3216, C3225, C4532, C5750 100 100 b b 40 40 c 1.0 a 1.0 Solder resist Solder resist Copper a c b 40 c c (Unit: mm) (Unit: mm) b Copper Material : Glass Epoxy ( As per JIS C6484 GE4 ) P.C. Board thickness : Appendix-2a Appendix-1a, 1b, 2b Copper ( thickness 0.035mm ) Solder resist 0.8mm 1.6mm TDK (EIA style) C1005 (CC0402) C1608 (CC0603) C2012 (CC0805) C3216 (CC1206) C3225 (CC1210) C4532 (CC1812) C5750 (CC2220) Dimensions (mm) a b c 0.4 1.5 0.5 1.0 3.0 1.2 1.2 4.0 1.65 2.2 5.0 2.0 2.2 5.0 2.9 3.5 7.0 3.7 4.5 8.0 5.6 10 of 31 9. INSIDE STRUCTURE AND MATERIAL 3 4 5 2 1 MATERIAL No. NAME 1 Dielectric 2 Electrode 3 4 Class 1 Class 2 CaZrO 3 BaTiO 3 Nickel (Ni) Copper (Cu) Termination 5 Nickel (Ni) Tin (Sn) 10. RECOMMENDATION As for C3225, C4532 and C5750 types, it is recommended to provide a slit (about 1mm wide) in the board under the components to improve washing flux. Please make sure to completely remove all cleaning solvents. 11. SOLDERING CONDITION For C1608 (CC0603) ~ C3216 (CC1206) case size, TDK recommends reflow or wave soldering. Smaller case sizes, C0603 (CC0201) ~ C1005 (CC0402), and larger case sizes, C3225 (CC1210) ~ C5750 (CC2220), should use reflow solder only. See "Caution" Section No.5 for details. 11 of 31 12. Caution No. 1 Process Operating Condition (Storage, Transportation) Condition 1.1 Storage 1. The capacitor must be stored in an ambient temperature of 5 to 40C with a relative humidity of 20 to 70%RH. The products should be used within 6 months upon receipt. 2. The capacitor must be operated and stored in an environment free of condensation and corrosive gases such as hydrogen sulphide, hydrogen sulphate, chlorine, ammonia and sulfur. 3. Avoid storing in sun light and falling of dew. 4. Do not use capacitors under high humidity and high and low atmospheric pressure which may affect capacitors reliability. 2 Circuit design 5. Capacitors should be tested for the solderability when they are stored for long time. 1.2 Handling in transportation In case of the transportation, the performance of the capacitor may be deteriorated depending on the transportation condition. (Refer to JEITA RCR-2335B 9.2 "Handling in Transportation") 2.1 Operating temperature Operating temperature should be followed strictly within this specification. 1. Do not use capacitors above the maximum allowable operating temperature. 2. Surface temperature including self heating should be below maximum operating temperature. (Due to dielectric loss, capacitors will heat itself when AC is applied. Especially at high frequencies around its SRF, the heat might be so extreme that it may damage itself or the product its mounted on. Please design the circuit so that the maximum temperature of the capacitors (including the self heating) will be below the maximum allowable operating temperature. Temperature rise at capacitor surface shall be below 20C) 3. The electrical characteristics of the capacitors will vary depending on the temperature. The capacitors should be selected and designed in taking the temperature into consideration. 2.2 Operating voltage 1. Operating voltage across the terminals should be below the rated voltage. When AC and DC are super imposed, V0-P must be below the rated voltage. Reference figures 1 and 2 below. AC or pulse with overshooting, VP-P must be below the rated voltage. Reference: figures 3, 4, and 5 below. When the voltage is started/stopped to the circuit An irregular voltage may be generated for a transit period because of resonance or switching. Be sure to use the capacitor within rated voltage containing these Irregular voltage periods. Voltage (1) DC voltage (2) DC+AC voltage (3) AC voltage Positional Measurement V0-P (Rated voltage) 0 Voltage V0-P VP-P 0 0 (4) Pulse voltage (A) (5) Pulse voltage (B) Positional Measurement VP-P (Rated voltage) 0 VP-P 0 12 of 31 (12. Caution, continued) No. 2 Process Circuit design Condition 2.2 Operating Voltage (continued) 2. Even below the rated voltage, if repetitive high frequency AC or pulse is applied, the reliability of the capacitors may be reduced. 3. The effective capacitance will vary depending on applied DC and AC voltages. The capacitors should be selected and designed in taking the voltages into consideration. 2.3 Frequency When Class 2 capacitors are used in AC and/or pulsed voltages, the capacitors may self vibrate and generate audible sound (piezoelectric affect) 3 Designing P.C. Board The amount of solder at the terminations has a direct effect on the reliability of the capacitors. 1. The greater the amount of solder, the higher the stress on the chip capacitor, and the more likely that it will break. When designing a P.C.board, determine the shape and size of the solder lands to have proper amount of solder on the terminations. 2. Avoid using common solder land for multiple terminations and provide individual solder land for each terminations instead. 3. Size and recommended land dimensions provided below: . Chip capacitors Solder land C Flow soldering Symbol B C1608 [CC0603] A Type Solder resist (mm) A C2012 [CC0805] C3216 [CC1206] 0.7 - 1.0 1.0 - 1.3 2.1 - 2.5 B 0.8 - 1.0 1.0 - 1.2 1.1 - 1.3 C 0.6 - 0.8 0.8 - 1.1 1.0 - 1.3 Reflow soldering C1005 Type Symbol [CC0402] C1608 [C0603] C2012 [CC0805] (mm) C3216 [CC1206] A 0.3 - 0.5 0.6 - 0.8 0.9 - 1.2 2.0 - 2.4 B 0.35 - 0.45 0.6 - 0.8 0.7 - 0.9 1.0 - 1.2 C 0.4 - 0.6 0.6 - 0.8 0.9 - 1.2 1.1 - 1.6 Symbol C3225 [CC1210] C4532 [CC1812] C5750 [CC2220] A 2.0 - 2.4 3.1 - 3.7 4.1 - 4.8 B 1.0 - 1.2 1.2 - 1.4 1.2 - 1.4 C 1.9 - 2.5 2.4 - 3.2 4.0 - 5.0 Type 13 of 31 (12. Caution, continued) No. 3 Process Designing P.C. Board Condition 4. Recommended chip capacitor layout is provided below: Disadvantage against bending stress Advantage against bending stress Perforation or slit Perforation or slit Mounting face Break P.C. board with mounted side up. Mount perpendicularly to perforation or slit Perforation or slit Break P.C. board with mounted side down. Mount in parallel with perforation or slit Perforation or slit Chip arrangement (Direction) Closer to slit is higher stress 1 Away from slit is less stress 2 Distance from slit ( 1 < 2 ) ( 1 < 2 ) 14 of 31 (12. Caution, continued) No. 3 Process Designing P.C. Board Condition 5. Mechanical stress varies according to location of chip capacitors on the P.C.board. E Perforation D C B A Slit The relative stress applied to these capacitors during depaneling is in the following order: A>B=C>D>E 6. Layout recommendation Example Use of common solder land Soldering with chassis Use of common solder land with other SMD Lead wire Chassis Chip Solder land Excessive solder Solder Need to avoid Excessive solder PCB Adhesive Solder land 1 Lead wire Missing solder Solder land Solder resist Solder resist Recommendation Solder resist 2 2> 1 15 of 31 (12. Caution, continued) 4 Process Mounting Condition 4.1 Stress from mounting head If the mounting head is adjusted too low, it may induce excessive stress on the chip capacitor and result in cracking. Please take following precautions. 1. Adjust the bottom dead center of the mounting head to reach on the P.C. board surface but not contact it. 2. Adjust the mounting head pressure to be 1 to 3N of static weight. 3. To minimize the impact energy from mounting head, it is important to provide support from the bottom side of the P.C.board. See following examples. Not recommended Single sided mounting Recommended Crack Support pin Double-sided mounting Solder peeling Crack Support pin When the centering jaw is worn , it may give mechanical impact on the capacitor may occur and damage the product. Please control the closing dimension of the centering jaw and provide sufficient preventive maintenance and/or replacement if necessary. 4.2 Amount of adhesive a a c c b No. Example : C2012 (CC0805), C3216 (CC1206) a 0.2mm min. b 70 - 100m c Do not touch the solder land 16 of 31 (12. Caution, continued) 5.1 Flux selection Although highly-activated flux gives better solderability, substances which increase activity may also degrade the insulation of the chip capacitor. To avoid such degradation, the following is recommended. 1. Use a mildly activated rosin flux (less than 0.1wt% chlorine). 2. 3. Excessive flux must be avoided. Please provide proper amount of flux. When water-soluble flux is used, sufficient washing is necessary. 5.2 Recommended soldering profile by various methods Reflow soldering Wave soldering Soldering Preheating Natural cooling Peak Temp Peak Temp T 0 Soldering Natural cooling Preheating Temp.. (C) Soldering Condition Temp. (C) 5 Process Over 60 sec. Over 60 sec. T 0 Over 60 sec. Peak Temp time Peak Temp time Manual soldering (Solder iron) APPLICATION As for C1608 (CC0603), C2012 (CC0805) 300 and C3216 (CC1206), applied to wave soldering and reflow soldering. Temp.. (C) No. As for C1005 (CC0402), C3225 (CC1210), T C4532 (CC1812), C5750 (CC2220), applied only to reflow soldering. Preheating 0 3sec. (As short as possible) 5.3. Recommended soldering peak temp and duration Temp./Duration Wave soldering Reflow soldering Peak temp(C) Duration(sec.) Peak temp(C) Duration(sec.) Sn-Pb Solder 250 max. 3 max. 230 max. 20 max. Lead Free Solder 260 max. 5 max. 260 max. 10 max. Solder Recommended solder compositions Sn-37Pb (Sn-Pb solder) Sn-3.0Ag-0.5Cu (Lead Free Solder) 17 of 31 (12. Caution, continued) No. 5 Process Soldering (continued) Condition 5.4 Avoiding thermal shock 1. Preheating condition Soldering Wave soldering Reflow soldering Manual soldering 2. Type Temp. (C) C1608(CC0603), C2012(CC0805), C3216(CC1206) C1005(CC0402), C1608(CC0603), C2012(CC0805), C3216(CC1206) C3225(CC1210), C4532(CC1812), C5750(CC2220) C1005(CC0402), C1608(CC0603), C2012(CC0805), C3216(CC1206) C3225(CC1210), C4532(CC1812), C5750(CC2220) T 150 T 150 T 130 T 150 T 130 Cooling condition Natural cooling using air is recommended. If the chips are dipped into a solvent for cleaning, the temperature difference (T) must be less than 100C. 5.5 Amount of solder Excessive solder will induce higher tensile force on the chip capacitor during temperature changes and may result in chip cracking. Insufficient solder may detach the capacitor from the P.C. board. Higher tensile force on the chip capacitor may cause cracking Excessive solder Maximum amount Minimum amount Adequate Small solder fillet may cause contact failure or not hold the chip capacitor to the P.C. board. Insufficient solder 5.6 Solder repair by solder iron 1. Selection of the soldering iron tip Tip temperature of solder iron varies by its type, P.C. board material and solder land size. Higher temperatures, may provide the quicker operation, however, heat shock may cause a crack in the chip capacitor. Please confirm the tip temperature. before soldering and keep the peak temperature and time in accordance with following recommended condition. (Please preheat the chip capacitors with the condition in 5.4 to avoid the thermal shock.) Recommended solder iron condition (Sn-Pb Solder and Lead Free Solder) Temp. (C) Duration (sec.) Wattage (W) Shape (mm) 300 max. 3 max. 20 max. O 3.0 max. 18 of 31 (12. Caution, continued) No. 5 Process Soldering (continued) Condition 2. Direct contact of the soldering iron with ceramic dielectric of the chip capacitor may causing crack. Do not touch the ceramic dielectric and the terminations by solder iron. 5.7 Sn-Zn solder Sn-Zn solder affects product reliability. Please contact TDK in advance when utilize Sn-Zn solder. 5.8 Countermeasure for tombstone The misalignment between the mounted positions of the capacitors and the land patterns should be minimized. The tombstone phenomenon may occur especially the capacitors are mounted (in longitudinal direction) in the same direction of the reflow soldering. (Refer to JEITA RCR-2335B Annex 1 "Recommendations to prevent the tombstone phenomenon".) 6 Cleaning 1. If an unsuitable cleaning fluid is used, flux residue or some foreign articles may stick to this chip capacitor surface and deteriorate insulation resistance. 2. If cleaning condition is not suitable, it determined the chip capacitor's insulation resistance. 2.1. Insufficient washing 1. 2. 3. Terminal electrodes may be corroded by Halogen in the flux. Halogen in the flux may adhere on the surface of capacitor, and lower the insulation resistance. Water soluble flux has higher tendency to have above mentioned problems (1) and (2). 2.2 Excessive washing When ultrasonic cleaning is used, excessively high energy output can affect the connection between the ceramic chip capacitor's body and the terminal electrode. To avoid this, the following is recommended. Power: 20 W/ max. Frequency: 40 kHz max. Washing time: 5 minutes max. 2.3 If the cleaning fluid is contaminated, the Halogen concentration can increases and it may bring the same result as insufficient cleaning. 19 of 31 (12. Caution, continued) No. Process Condition 7 Coating and molding of the P.C. Board 1. When the P.C. board is coated, please verify the impact on the capacitor. 2. Please carefully verify that there is no harmful decomposing or reaction gas emission during curing which may damage the chip capacitor. 3. Please verify the curing temperature. 8 Handling after chip mounted 1. Please pay attention not to bend or distort the P.C. board after soldering otherwise the chip capacitor may crack. Bend Twist 2. When functional check of the P.C. board is performed, high pin pressure tends used for fear of loose contact. But if the pressure is excessive and bends the P.C. board, it may crack the chip capacitor or peel the termination. Please adjust the pins accordingly to ensure the P.C. board is not flexed. Item Not recommended Termination peeling Recommended Support pin Board bending Check pin Check pin 20 of 31 (12. Caution, continued) No. 9 Process Handling of loose chip capacitors Condition 1. The chip capacitor may crack if dropped, especially large case sizes. Please handle with care and do not use if dropped. Crack Floor 2. When stacking the P.C. board for storage or handling after soldering, the corner of the P.C. board may hit the chip capacitor of neighboring board to cause a crack. P.C. Board Crack 10 Capacitance aging Class 2 capacitors have aging characteristic, which is a decrease in capacitance over time due to crystalline changes that occur in ferroelectric ceramics. Careful consideration should be done in case of a time constant circuit. 11 Estimated life and estimated failure The estimated life and (failure rate) depend on the temperature and voltage applied. This can be calculated by the equation described in JEITA RCR-2335B Annex 6 "Calculation of the estimated lifetime and failure rate". The risk can be decreased by reducing the temperature and the voltage but it will not be guaranteed. rate of capacitors 12 Others The products listed on this specification sheet are intended for use in general electronic equipment (AV equipment, telecommunications equipment, home appliances, amusement equipment, computer equipment, personal equipment, office equipment, measurement equipment, industrial robots) under a normal operation and use condition. The products are not designed or warranted to meet the requirements of the applications listed below, whose performance and/or quality require a more stringent level of safety or reliability, or whose failure, malfunction or trouble could cause serious damage to society, person or property. Please understand that TDK is not responsible for any damage or liability caused by use of this product in any of the applications below or for any other use exceeding the range or conditions set forth in this specification sheet: Aerospace/Aviation equipment. Transportation equipment (cars, electric trains, ships, etc.) Medical equipment. Power-generation control equipment. Atomic energy-related equipment. Seabed equipment. Transportation control equipment. Public information-processing equipment. Military equipment. Electric heating apparatus, burning equipment. Disaster prevention/crime prevention equipment. Safety equipment. Other applications that are not considered general-purpose applications. When using this product in general-purpose applications, you are kindly requested to take into consideration securing protection circuit/equipment or providing backup circuits, etc., to ensure higher safety. 21 of 31 13. Packaging label Packaging shall be done to protect the components from the damage during transportation and storing, and a label which has the following information shall be attached. 1) Inspection No. 2) TDK P/N 3) Customer's P/N 4) Quantity *Composition of Inspection No. Example M 0 A (a) (b) (c) - - (d) (e) a) Line code b) Last digit of the year c) Month and A for January and B for February and so on. (Skip I) d) Inspection Date of the month. e) Serial No. of the day 14. Bulk packaging quantity Total number of components in a plastic bag for bulk packaging: 1,000pcs. As for C1005 type, not available for bulk packaging. 22 of 31 15. TAPE PACKAGING SPECIFICATION 1. CONSTRUCTION AND DIMENSION OF TAPING 1-1. Dimensions of carrier tape Dimensions of paper tape shall be according to Appendix 3, 4. Dimensions of plastic tape shall be according to Appendix 5, 6. 1-2. Bulk part and leader of taping Bulk 160mm Chips Bulk 160mm min Leader Drawing direction 400mm min 1-3. Dimensions of reel Dimensions of O178 reel shall be according to Appendix 7, 8. Dimensions of O330 reel shall be according to Appendix 9, 10. 1-4. Structure of taping Top cover tape Top cover tape Pitch hole Bottom cover tape Paper carrier tape Pitch hole Plastic carrier tape 23 of 31 2. CHIP QUANTITY Type C1005 C1608 C2012 Thickness of chip Taping Material 0.50 mm 0.80 mm 0.60 mm 0.85 mm 1.25 mm 0.60 mm 0.85 mm C3216 C3225 C4532 C5750 1.15 mm 1.30 mm 1.60 mm 1.15 mm 1.25 mm 1.30 mm 1.60 mm 2.00 mm 2.30 mm 2.50 mm 1.60 mm 2.00 mm 2.30 mm 2.50 mm 2.80 mm 3.20 mm 1.60 mm 2.00 mm 2.30 mm 2.50 mm 2.80 mm Chip quantity (pcs.) 178mm reel 330mm reel Paper Paper Paper *Plastic Plastic Paper Paper *Plastic 10,000 4,000 50,000 10,000 20,000 Plastic 2,000 4,000 2,000 10,000 4,000 10,000 2,000 8,000 10,000 2,000 8,000 1,000 5,000 Plastic 1,000 3,000 Plastic 500 2,000 1,000 Plastic 3,000 500 2,000 24 of 31 3. PERFORMANCE SPECIFICATIONS 3.1 Peel back cover (top tape) 0.05-0.7N. (See the following figure.) Direction of cover tape pulling Carrier tape Top cover tape 0~15 Direction of pulling 3.2 Carrier tape shall be flexible enough to be wound around a minimum radius of 30mm with components in tape. 3.3 The missing of components shall be less than 0.1% 3.4 Components shall not stick to the cover tape. 3.5 The cover tapes shall not protrude beyond the edges of the carrier tape not shall cover the sprocket holes. 25 of 31 Appendix 3 Paper Tape Pitch hole J E A D C B G H T F (Unit: mm) Symbol Type A B C D E F C1005 (CC0402) ( 0.65 ) ( 1.15 ) 8.00 0.30 3.50 0.05 1.75 0.10 2.00 0.05 Symbol Type G H J T C1005 (CC0402) 2.00 0.05 4.00 0.10 +0.10 0 O 1.5 0.60 0.05 * The values in the parentheses ( ) are for reference Appendix 4 Paper Tape Pitch hole J E A D B T H G C F (Unit: mm) Symbol Type C1608 (CC0603) C2012 (CC0805) C3216 (CC1206) Symbol Type C1608 (CC0603) C2012 (CC0805) C3216 (CC1206) A B ( 1.10 ) ( 1.90 ) ( 1.50 ) ( 2.30 ) ( 1.90 ) ( 3.50 ) G H 2.00 0.05 4.00 0.10 C D E F 8.00 0.30 3.50 0.05 1.75 0.10 4.00 0.10 J T O 1.5 +0.10 0 1.10 max. * The values in the parentheses ( ) are for reference. 26 of 31 Appendix 5 Plastic Tape Pitch hole J E A D B t G H K C Q F (Unit: mm) Symbol Type C2012 (CC0805) C3216 (CC1206) C3225 (CC1210) Symbol Type C2012 (CC0805) C3216 (CC1206) C3225 (CC1210) A B ( 1.50 ) ( 2.30 ) ( 1.90 ) ( 3.50 ) ( 2.90 ) ( 3.60 ) G H 2.00 0.05 4.00 0.10 C D E F 8.00 0.30 3.50 0.05 1.75 0.10 4.00 0.10 J K t Q 2.50 max. 0.30 max. O 1.5 +0.10 0 O 0.50 min. 3.20 max. 0.60 max. * The values in the parentheses ( ) are for reference. 27 of 31 Appendix 6 Plastic Tape Pitch hole J E A D B t H G C Q F K (Unit: mm) Symbol Type C4532 (CC1812) C5750 (CC2220) Symbol Type C4532 (CC1812) C5750 (CC2220) A B ( 3.60 ) ( 4.90 ) ( 5.40 ) ( 6.10 ) G H 2.00 0.05 4.00 0.10 C D E F 12.0 0.30 5.50 0.05 1.75 0.10 8.00 0.10 J K t Q 6.50 max. 0.60 max. O 1.50 min. O 1.5 +0.10 0 * The values in the parentheses ( ) are for reference. 28 of 31 Appendix 7 C1005, C1608, C2012, C3216, C3225 (Material: Polystyrene) E W2 C B D r W1 A (Unit: mm) Symbol A B C D E W1 Dimension O178 2.0 O60 2.0 O13 0.5 O21 0.8 2.0 0.5 9.0 0.3 Symbol W2 r Dimension 13.0 1.4 1.0 Appendix 8 C4532, C5750 (Material: Polystyrene) E W2 C B D r W1 A (Unit: mm) Symbol A B C D E W1 Dimension O178 2.0 O60 2.0 O13 0.5 O21 0.8 2.0 0.5 13.0 0.3 Symbol W2 r Dimension 17.0 1.4 1.0 29 of 31 Appendix 9 C1005, C1608, C2012, C3216, C3225 (Material: Polystyrene) E C B D r t W A (Unit: mm) Symbol A B C D E W Dimension O382 max. (Nominal O330) O50 min. O13 0.5 O21 0.8 2.0 0.5 10.0 1.5 Symbol t r Dimension 2.0 0.5 1.0 Appendix 10 C4532, C5750 (Material: Polystyrene) E C B D r W A t (Unit: mm) Symbol A B C D E W Dimension O382 max. (Nominal O330) O50 min. O13 0.5 O21 0.8 2.0 0.5 14.0 1.5 Symbol t r Dimension 2.0 0.5 1.0 30 of 31 END PAGE 31 of 31