LM1036
www.ti.com
SNAS525C JAN 1995REVISED APRIL 2013
LM1036 Dual DC Operated Tone/Volume/Balance Circuit
Check for Samples: LM1036
1FEATURES DESCRIPTION
The LM1036 is a DC controlled tone (bass/treble),
2 Wide Supply Voltage Range, 9V to 16V volume and balance circuit for stereo applications in
Large Volume Control Range, 75 dB Typical car radio, TV and audio systems. An additional
Tone Control, ±15 dB Typical control input allows loudness compensation to be
simply effected.
Channel Separation, 75 dB Typical
Low Distortion, 0.06% Typical for An Input Four control inputs provide control of the bass, treble,
balance and volume functions through application of
Level of 0.3 Vrms DC voltages from a remote control system or,
High Signal to Noise, 80 dB Typical for an alternatively, from four potentiometers which may be
Input Level of 0.3 Vrms biased from a zener regulated supply provided on the
Few External Components Required circuit.
Each tone response is defined by a single capacitor
chosen to give the desired characteristic.
Block and Connection Diagram
Figure 1. PDIP and SOIC Packages
See Package Numbers NFH0020A or DW0020B
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 1995–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM1036
SNAS525C JAN 1995REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Supply Voltage 16V
Control Pin Voltage (Pins 4, 7, 9, 12, 14) VCC
Operating Temperature Range 0°C to +70°C
Storage Temperature Range 65°C to +150°C
Power Dissipation 1W
Lead Temp. (Soldering, 10 seconds) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
Electrical Characteristics(1)
VCC=12V, TA=25°C (unless otherwise stated)
Parameter Conditions Min Typ Max Units
Supply Voltage Range Pin 11 9 16 V
Supply Current 35 45 mA
Zener Regulated Output Pin 17
Voltage 5.4 V
Current 5 mA
Maximum Output Voltage Pins 8, 13; f=1 kHz
VCC=9V, Maximum Gain 0.8 Vrms
VCC=12V 0.8 1.0 Vrms
Maximum Input Voltage Pins 2, 19; f=1 kHz, VCC 2V 1.3 1.6 Vrms
Gain=10 dB
Input Resistance Pins 2, 19; f=1 kHz 20 30 kΩ
Output Resistance Pins 8, 13; f=1 kHz 20 Ω
Maximum Gain V(Pin 12)=V(Pin 17); f=1 kHz 2 0 2 dB
Volume Control Range f=1 kHz 70 75 dB
Gain Tracking f=1 kHz
Channel 1–Channel 2 0 dB through 40 dB 1 3 dB
40 dB through 60 dB 2 dB
Balance Control Range Pins 8, 13; f=1 kHz 1 dB
26 20 dB
Bass Control Range(2) f=40 Hz, Cb=0.39 μF
V(Pin 14)=V(Pin 17) 12 15 18 dB
V(Pin 14)=0V 12 15 18 dB
Treble Control Range(2) f= 16 kHz, Ct,=0.01 μF
V(Pin 4)=V(Pin 17) 12 15 18 dB
V(Pin 4)=0V 12 15 18 dB
Total Harmonic Distortion f=1 kHz, VIN=0.3 Vrms
Gain=0 dB 0.06 0.3 %
Gain=30 dB 0.03 %
Channel Separation f=1 kHz, Maximum Gain 60 75 dB
(1) The maximum permissible input level is dependent on tone and volume settings. See Application Notes.
(2) The tone control range is defined by capacitors Cband Ct. See Application Notes.
2Submit Documentation Feedback Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: LM1036
LM1036
www.ti.com
SNAS525C JAN 1995REVISED APRIL 2013
Electrical Characteristics(1) (continued)
VCC=12V, TA=25°C (unless otherwise stated)
Parameter Conditions Min Typ Max Units
Signal/Noise Ratio Unweighted 100 Hz–20 kHz 80 dB
Maximum Gain, 0 dB=0.3 Vrms
CCIR/ARM(3)
Gain=0 dB, VIN=0.3 Vrms 75 79 dB
Gain=20 dB, VIN=1.0 Vrms 72 dB
Output Noise Voltage at Minimum Gain CCIR/ARM(3) 10 16 μV
Supply Ripple Rejection 200 mVrms, 1 kHz Ripple 35 50 dB
Control Input Currents Pins 4, 7, 9, 12, 14 (V=0V) 0.6 2.5 μA
Frequency Response 1 dB (Flat Response 250 kHz
20 Hz–16 kHz)
(3) Gaussian noise, measured over a period of 50 ms per channel, with a CCIR filter referenced to 2 kHz and an average-responding
meter.
Copyright © 1995–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LM1036
LM1036
SNAS525C JAN 1995REVISED APRIL 2013
www.ti.com
Typical Performance Characteristics
Volume Control Characteristics Balance Control Characteristic
Figure 2. Figure 3.
Tone Control Characteristic Tone Characteristic (Gain vs Frequency)
Figure 4. Figure 5.
Tone Characteristic (Gain vs Frequency) Loudness Compensated Volume Characteristic
Figure 6. Figure 7.
4Submit Documentation Feedback Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: LM1036
LM1036
www.ti.com
SNAS525C JAN 1995REVISED APRIL 2013
Typical Performance Characteristics (continued)
Input Signal Handling vs Supply Voltage THD vs Gain
Figure 8. Figure 9.
Channel Separation vs Frequency Loudness Control Characteristic
Figure 10. Figure 11.
Output Noise Voltage vs Gain THD vs Input Voltage
Figure 12. Figure 13.
Copyright © 1995–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: LM1036
LM1036
SNAS525C JAN 1995REVISED APRIL 2013
www.ti.com
Application Notes
TONE RESPONSE
The maximum boost and cut can be optimized for individual applications by selection of the appropriate values of
Ct(treble) and Cb(bass).
The tone responses are defined by the relationships:
where
ab=at=0 for maximum bass and treble boost respectively
ab=at=1 for maximum cut (1)
For the values of Cband Ctof 0.39 μF and 0.01 μF as shown in the Application Circuit, 15 dB of boost or cut is
obtained at 40 Hz and 16 kHz.
ZENER VOLTAGE
A zener voltage (pin 17=5.4V) is provided which may be used to bias the control potentiometers. Setting a DC
level of one half of the zener voltage on the control inputs, pins 4, 9, and 14, results in the balanced gain and flat
response condition. Typical spread on the zener voltage is ±100 mV and this must be taken into account if
control signals are used which are not referenced to the zener voltage. If this is the case, then they will need to
be derived with similar accuracy.
LOUDNESS COMPENSATION
A simple loudness compensation may be effected by applying a DC control voltage to pin 7. This operates on the
tone control stages to produce an additional boost limited by the maximum boost defined by Cband Ct. There is
no loudness compensation when pin 7 is connected to pin 17. Pin 7 can be connected to pin 12 to give the
loudness compensated volume characteristic as illustrated without the addition of further external components.
(Tone settings are for flat response, Cband Ctas given in Application Circuit.) Modification to the loudness
characteristic is possible by changing the capacitors Cband Ctfor a different basic response or, by a resistor
network between pins 7 and 12 for a different threshold and slope.
SIGNAL HANDLING
The volume control function of the LM1036 is carried out in two stages, controlled by the DC voltage on pin 12,
to improve signal handling capability and provide a reduction of output noise level at reduced gain. The first
stage is before the tone control processing and provides an initial 15 dB of gain reduction, so ensuring that the
tone sections are not overdriven by large input levels when operating with a low volume setting. Any combination
of tone and volume settings may be used provided the output level does not exceed 1 Vrms, VCC=12V (0.8 Vrms,
VCC=9V). At reduced gain (<6 dB) the input stage will overload if the input level exceeds 1.6 Vrms, VCC=12V(1.1
Vrms, VCC=9V). As there is volume control on the input stages, the inputs may be operated with a lower overload
margin than would otherwise be acceptable, allowing a possible improvement in signal to noise ratio.
6Submit Documentation Feedback Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: LM1036
LM1036
www.ti.com
SNAS525C JAN 1995REVISED APRIL 2013
Application Circuit
Copyright © 1995–2013, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: LM1036
LM1036
SNAS525C JAN 1995REVISED APRIL 2013
www.ti.com
APPLICATIONS INFORMATION
OBTAINING MODIFIED RESPONSE CURVES
The LM1036 is a dual DC controlled bass, treble, balance and volume integrated circuit ideal for stereo audio
systems.
In the various applications where the LM1036 can be used, there may be requirements for responses different to
those of the standard application circuit given in the data sheet. This application section details some of the
simple variations possible on the standard responses, to assist the choice of optimum characteristics for
particular applications.
TONE CONTROLS
Summarizing the relationship given in the data sheet, basically for an increase in the treble control range Ctmust
be increased, and for increased bass range Cbmust be reduced.
Figure 14 shows the typical tone response obtained in the standard application circuit. (Ct=0.01 μF, Cb=0.39 μF).
Response curves are given for various amounts of boost and cut.
Figure 14. Tone Characteristic (Gain vs Frequency)
Figure 15 and Figure 16 show the effect of changing the response defining capacitors Ctand Cbto 2Ct, Cb/2 and
4Ct, Cb/4 respectively, giving increased tone control ranges. The values of the bypass capacitors may become
significant and affect the lower frequencies in the bass response curves.
Figure 15. Tone Characteristic (Gain vs Frequency)
8Submit Documentation Feedback Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: LM1036
LM1036
www.ti.com
SNAS525C JAN 1995REVISED APRIL 2013
Figure 16. Tone Characteristic (Gain vs Frequency)
Figure 17 shows the effect of changing Ctand Cbin the opposite direction to Ct/2, 2Cbrespectively giving
reduced control ranges. The various results corresponding to the different Ctand Cbvalues may be mixed if it is
required to give a particular emphasis to, for example, the bass control. The particular case with Cb/2, Ctis
illustrated in Figure 18.
Restriction of Tone Control Action at High or Low Frequencies
It may be desired in some applications to level off the tone responses above or below certain frequencies for
example to reduce high frequence noise.
This may be achieved for the treble response by including a resistor in series with Ct. The treble boost and cut
will be 3 dB less than the standard circuit when R=XC.
A similar effect may be obtained for the bass response by reducing the value of the AC bypass capacitors on
pins 5 (channel 1) and 16 (channel 2). The internal resistance at these pins is 1.3 kΩand the bass boost/cut will
be approximately 3 dB less with XCat this value. An example of such modified response curves is shown in
Figure 19. The input coupling capacitors may also modify the low frequency response.
It will be seen from Figure 15 and Figure 16 that modifying Ctand Cbfor greater control range also has the effect
of flattening the tone control extremes and this may be utilized, with or without additional modification as outlined
above, for the most suitable tone control range and response shape.
Other Advantages of DC Controls
The DC controls make the addition of other features easy to arrange. For example, the negative-going peaks of
the output amplifiers may be detected below a certain level, and used to bias back the bass control from a high
boost condition, to prevent overloading the speaker with low frequency components.
LOUDNESS CONTROL
The loudness control is achieved through control of the tone sections by the voltage applied to pin 7; therefore,
the tone and loudness functions are not independent. There is normally 1 dB more bass than treble boost (40
Hz–16 kHz) with loudness control in the standard circuit. If a greater difference is desired, it is necessary to
introduce an offset by means of Ctor Cbor by changing the nominal control voltage ranges.
Figure 20 shows the typical loudness curves obtained in the standard application circuit at various volume levels
(Cb=0.39 μF).
Copyright © 1995–2013, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Links: LM1036
LM1036
SNAS525C JAN 1995REVISED APRIL 2013
www.ti.com
Figure 17. Tone Characteristic (Gain vs Frequency) Figure 18. Tone Characteristic (Gain vs Frequency)
Figure 19. Tone Characteristic (Gain vs Frequency) Figure 20. Loudness Compensated Volume
Characteristic
Figure 21 and Figure 22 illustrate the loudness characteristics obtained with Cbchanged to Cb/2 and Cb/4
respectively, Ctbeing kept at the nominal 0.01 μF. These values naturally modify the bass tone response as in
Figure 15 and Figure 16.
With pins 7 (loudness) and 12 (volume) directly connected, loudness control starts at typically 8 dB volume, with
most of the control action complete by 30 dB.
Figure 23 and Figure 24 show the effect of resistively offsetting the voltage applied to pin 7 towards the control
reference voltage (pin 17). Because the control inputs are high impedance, this is easily done and high value
resistors may be used for minimal additional loading. It is possible to reduce the rate of onset of control to extend
the active range to 50 dB volume control and below.
The control on pin 7 may also be divided down towards ground bringing the control action on earlier. This is
illustrated in Figure 25, With a suitable level shifting network between pins 12 and 7, the onset of loudness
control and its rate of change may be readily modified.
10 Submit Documentation Feedback Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: LM1036
LM1036
www.ti.com
SNAS525C JAN 1995REVISED APRIL 2013
Figure 21. Loudness Compensated Volume Figure 22. Loudness Compensated Volume
Characteristic Characteristic
Figure 23. Loudness Compensated Volume Figure 24. Loudness Compensated Volume
Characteristic Characteristic
Figure 25. Loudness Compensated Volume Characteristic
When adjusted for maximum boost in the usual application circuit, the LM1036 cannot give additional boost from
the loudness control with reducing gain. If it is required, some additional boost can be obtained by restricting the
tone control range and modifying Ct, Cb, to compensate. A circuit illustrating this for the case of bass boost is
shown in Figure 26. The resulting responses are given in Figure 27 showing the continuing loudness control
action possible with bass boost previously applied.
Copyright © 1995–2013, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Links: LM1036
LM1036
SNAS525C JAN 1995REVISED APRIL 2013
www.ti.com
USE OF THE LM1036 ABOVE AUDIO FREQUENCIES
The LM1036 has a basic response typically 1 dB down at 250 kHz (tone controls flat) and therefore by scaling Cb
and Ct, it is possible to arrange for operation over a wide frequency range for possible use in wide band
equalization applications. As an example Figure 28 shows the responses obtained centered on 10 kHz with
Cb=0.039 μF and Ct=0.001 μF.
Figure 26. Modified Application Circuit for Additional Bass Boost with Loudness Control
Figure 27. Loudness Compensated Volume Figure 28. Tone Characteristic (Gain vs Frequency)
Characteristic
12 Submit Documentation Feedback Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: LM1036
LM1036
www.ti.com
SNAS525C JAN 1995REVISED APRIL 2013
Simplified Schematic Diagram
(One Channel)
*Connections reversed
Copyright © 1995–2013, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Links: LM1036
LM1036
SNAS525C JAN 1995REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 13
14 Submit Documentation Feedback Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: LM1036
PACKAGE OPTION ADDENDUM
www.ti.com 1-Oct-2016
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM1036M/NOPB OBSOLETE SOIC DW 20 TBD Call TI Call TI 0 to 70 LM1036M
LM1036MX/NOPB OBSOLETE SOIC DW 20 TBD Call TI Call TI 0 to 70 LM1036M
LM1036N/NOPB OBSOLETE PDIP NFH 20 TBD Call TI Call TI 0 to 70 LM1036N
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 1-Oct-2016
Addendum-Page 2
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
MECHANICAL DATA
N0020A
www.ti.com
N20A (Rev G)
NFH0020A
www.ti.com
PACKAGE OUTLINE
C
TYP
10.63
9.97
2.65 MAX
18X 1.27
20X 0.51
0.31
2X
11.43
TYP
0.33
0.10
0 - 8
0.3
0.1
0.25
GAGE PLANE
1.27
0.40
A
NOTE 3
13.0
12.6
B7.6
7.4
4220724/A 05/2016
SOIC - 2.65 mm max heightDW0020A
SOIC
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side.
5. Reference JEDEC registration MS-013.
120
0.25 C A B
11
10
PIN 1 ID
AREA
NOTE 4
SEATING PLANE
0.1 C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 1.200
www.ti.com
EXAMPLE BOARD LAYOUT
(9.3)
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
20X (2)
20X (0.6)
18X (1.27)
(R )
TYP
0.05
4220724/A 05/2016
SOIC - 2.65 mm max heightDW0020A
SOIC
SYMM
SYMM
LAND PATTERN EXAMPLE
SCALE:6X
1
10 11
20
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
www.ti.com
EXAMPLE STENCIL DESIGN
(9.3)
18X (1.27)
20X (0.6)
20X (2)
4220724/A 05/2016
SOIC - 2.65 mm max heightDW0020A
SOIC
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SYMM
SYMM
1
10 11
20
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:6X
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated