11
notice_e-01
Notice for TAIYO YUDEN products 
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product information in this catalog is as of October 2010. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-
fore practical application or usage of the Products.
Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo-
rating such products, which are caused under the conditions other than those specified in this catalog or individual
specification.
■ Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is
available.
■ Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
■ All electronic components or functional modules listed in this catalog are developed, designed and intended for
use in general electronics equipment.(for AV, office automation, household, office supply, information service,
telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any
equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal,
disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have
direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma-
rine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic equipment,
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil-
ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to
install a protective circuit is strongly recommended at customer's design stage.
■ The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-
tors (so called TAIYO YUDENs official sales channel).
It is only applicable to the products purchased from any of TAIYO YUDEN s official sales channel.
■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc-
cur in connection with a third party's intellectual property rights and other related rights arising from your usage of
products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.
■ Caution for export
Certain items in this catalog may require specific procedures for export according to Foreign Exchange and For-
eign Trade Control Law of Japan, U.S. Export Administration Regulations, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
96
11
mlci08_e-01
■ FEATURES
■ ORDERING CODE
■ EXTERNAL DIMENSIONS/STANDARD QUANTITY
■ AVAILABLE MATERIALS
■ APPLICATIONS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
❼Internal code
△Standard Products
△＝Blank Space
❷External Dimensions
（L×W）〔mm〕
0603（0201）0.6×0.3
1005（0402）1.0×0.5
1608（0603）1.6×0.8
2125（0805）2.0×1.25
❹Impedance 〔Ω〕
example
330 33
101 100
391 390
❺Characteristics
ーStandard Products
❶Type
BKP
Multilayer Ferrite Chip Beads
(For Power Supply Lines)
B K P 1 6 0 8 H S 1 8 1 －T○
❶ ❷ ❸ ❹ ❺ ❻ ❼
❻Packaging
T Tape & Reel
❸Material
HS Refer to impedance
Curves for material
differrences
HM
Type L W T e Standard Quantity ［pcs］
Paper Tape Embossed Tape
BKP0603
（0201）
0.6±0.03 0.3±0.03 0.3±0.03 0.15±0.05 15000 ー
（0.024±0.001） （0.012±0.001） （0.012±0.001）（0.006±0.002）
BKP1005
（0402）
1.00±0.05 0.50±0.05 0.50±0.05 0.25±0.10 10000 ー
（0.039±0.002） （0.020±0.002） （0.020±0.002） （0.010±0.004）
BKP1608
（0603）
1.6±0.15 0.8±0.15 0.8±0.15 0.3±0.2 4000 ー
（0.063±0.006） （0.031±0.006） （0.031±0.006） （0.012±0.008）
BKP2125
（0805）
2.0＋0.3
ー0.1 1.25±0.2 0.85±0.2 0.5±0.3 4000 ー
（0.079＋0.012
ー0.004 ）（0.049±0.008） （0.033±0.008） （0.020±0.012）
Unit：mm（inch）
◦ Low Rdc value can lower the power consumption and extend the life
of batteries. That stands on the high advanced green sheet and print-
ing technologies.
◦ No need for grounding provides greater flexibility in circuit design.
HS ： With low R-XL cross point frequency characteristics and large
resistance part working as damping function, suppresses un-
necessary resonance and keeps signal integrity.
HM ： Resistance part rising exceeding from 20MHz. For general usage.
TS : Low DC resistance HS version. For power supply lines.
TM ：Low DC resistance HM version.
◦High frequency noise debug on the DC power supply line in personal
computers and other information system products.
◦Noise suppression in USB and IEEE1394 interface.
◦Prevents interference between circuits in mobile systems
(PDC, PHS, PDA)
MULTILAYER FERRITE CHIP BEADS (BK SERIES P TYPE)
REFLOWWAVE＊
I max=1.0A
I max=1.5～4A
I max=1～3A
100
80
60
40
20
１
2
1 HS330
2 HS220
500
250
1
2
4
5
3
1 HS331
2 HS221
3 HS101
4 HS600
5 HS330
100
0
200
300
400
500
600
700
110 100 1000
11
2
2
4
4
3
3
5
5
6
6
7
7
7
8
2 HS391
1 HS471
3 HS271
4 HS181
6 HS101
5 HS121
7 HS600
8 HS330
500
400
300
200
100
1 HM221
2 HM121
1
2
500
250
1 TM121
1
1
2
3
1 121
2 680
3 330
500
400
300
200
100
I max=0.8～2.0A
500
400
300
200
100
１
2
3
5
1 HS221
2 HS121
3 HS680
4 HS330
5 HS100
4
■
BKP0603
■
BKP2125
■
BKP1608
■
BKP1005
HS type
HS type
HS type
HS type HM type TM type
TS type
I max=0.9～1.1A I max=1.3A
I max=1.3～1.7A
■ OPERATING TEMP.
◦ ー55℃～85℃
＊Except for BKP0603, BKP1005
FERRITE PRODUCTS
97
11
mlci08_e-01
■ PART NUMBERS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Ordering code
EHS（
Environmental
Hazardous
Substances
）
Impedance
〔Ω〕
Measuring
frequency
〔MHz〕
DC resistance
〔mΩ〕 （max.）
Rated current
〔A〕 （max.）
Thickness
〔mm〕 （inch）
BKP0603 HS 220 RoHS 22±25％100 65 1.0 0.30±0.03
（0.012±0.001）
BKP0603 HS 330 RoHS 33±25％70 1.0
●BKP0603
●BKP1005
●BKP1608
●BKP2125
Ordering code
EHS（
Environmental
Hazardous
Substances
）
Impedance
〔Ω〕
Measuring
frequency
〔MHz〕
DC resistance
〔mΩ〕 （max.）
Rated current
〔A〕 （max.）
Thickness
〔mm〕 （inch）
BKP10 05 HS 100 RoHS 10±5
100
30 2.0
0.50±0.05
（0.02±0.002）
BKP10 05 HS 330 RoHS 33±25％50 1.7
BKP10 05 HS 680 RoHS 68±25％75 1.5
BKP10 05 HS 121 RoHS 120±25％140 1.0
BKP10 05 HS 221 RoHS 220±25％200 0.8
BKP10 05 HM 121 RoHS 120±25％120 1.1
BKP10 05 HM 221 RoHS 220±25％180 0.9
BKP10 05 TS 330 RoHS 33±25％39±30% 1.7
BKP10 05 TS 680 RoHS 68±25％55±30% 1.5
BKP10 05 TS 121 RoHS 120±25％70±30% 1.3
BKP10 05 TM 121 RoHS 120±25％100 1.3
Ordering code
EHS（
Environmental
Hazardous
Substances
）
Impedance
〔Ω〕
Measuring
frequency
〔MHz〕
DC resistance
〔mΩ〕 （max.）
Rated current
〔A〕 （max.）
Thickness
〔mm〕 （inch）
BKP1608 HS 330 RoHS 33±25％
100
25 3.0
0.80±0.15
（0.031±0.006）
BKP1608 HS 600 RoHS 60±25％40 2.5
BKP1608 HS 101 RoHS 100±25％50 1.7
BKP1608 HS 121 RoHS 120±25％35 2.7
BKP1608 HS 181 RoHS 180±25％75 1.5
BKP1608 HS 271 RoHS 270±25％110 1.2
BKP1608 HS 391 RoHS 390±25％140 1.0
BKP1608 HS 471 RoHS 470±25％180 1.0
Ordering code
EHS（
Environmental
Hazardous
Substances
）
Impedance
〔Ω〕
Measuring
frequency
〔MHz〕
DC resistance
〔mΩ〕 （max.）
Rated current
〔A〕 （max.）
Thickness
〔mm〕 （inch）
BKP2125 HS 330 RoHS 33±25％
100
20 4.0
0.85±0.2
（0.033±0.008）
BKP2125 HS 600 RoHS 60±25％25 3.0
BKP2125 HS 101 RoHS 100±25％40 2.5
BKP2125 HS 221 RoHS 220±25％50 2.0
BKP2125 HS 331 RoHS 330±25％75 1.5
98
11
mlci08_e-01
■ ELECTRICAL CHARACTERISTICS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
100
80
60
40
20
0
110 100 1000
BKP1005 HS100
100
80
60
40
20
0
110 100 1000
BKP0603 HS220
100
80
60
40
20
0
110 100 100001000
BKP0603 HS330
100
80
60
40
20
0
110 100 100001000
BKP1005 HS330
250
200
150
100
50
0
110 100 100001000
BKP1005 HS680
250
200
150
100
50
0
110 100 100001000
BKP1005 HM121
250
200
150
100
50
0
110 100 100001000
BKP1005 TS121
500
400
300
200
100
0
110 100 100001000
BKP1005 HS221
250
200
150
100
50
0
110 100 100001000
BKP1005 TS680
250
200
150
100
50
0
110 100 100001000
BKP1608 HS101
BKP1608 HS121
250
200
150
100
50
0
110 100 100001000
100
80
60
40
20
0
110 100 1000 10000
BKP1608 HS600
500
400
300
200
100
0
110 100 100001000
BKP1005 HM221
500
400
300
200
100
0
110 100 100001000
BKP1005 TM121
700
400
500
600
300
200
100
0
110 100 1000
BKP1608 HS471
100
80
60
40
20
0
110 100 100001000
BKP1005 TS330
500
400
300
200
100
0
110 100 1000
BKP1608 HS181
BKP1005 HS121
250
200
150
100
50
0
110 100 100001000
100
80
60
40
20
0
110 100 10000
1000
BKP1608 HS330
500
400
300
200
100
0
110 100 1000
BKP1608 HS271
■
BKP0603
■
BKP1005
500
250
0
110 100 1000
BKP1608 HS391
100
50
0
110 100 1000
BKP2125 HS330
■
BKP2125
100
50
0
110 100 1000
BKP2125 HS600
500
250
0
110 100 1000
BKP2125 HS101
■
BKP1608
FERRITE PRODUCTS
99
11
mlci08_e-01
■ ELECTRICAL CHARACTERISTICS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
500
250
0
110 100 1000
BKP2125 HS221
500
250
0
110 100 1000
BKP2125 HS331
11
mlci0109_reli-PRP1 mlci0109_reli_e-01
■ PACKAGING
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
◦Tape & Reel Packaging
①Minimum Quantity ②Taping material
◦Paper tape (0.315 inches wide)
③Taping Dimensions
Unit : mm （inch）
To next page
Type Thickness
［mm］ （inch）
Standard Quantity ［pcs］
Paper Tape Embossed Tape
CK1608（0603）0.8 4000 ー
（0.031）
CK2125（0805）
0.854000 ー
（0.033）
1.25 ー2000
（0.049）
CKS2125（0805）
0.85 4000 ー
（0.033）
1.25 ー2000
（0.049）
CKP2012（0805）0.9 ー3000
（0.035）
CKP2016（0806）0.9 ー3000
（0.035）
CKP2520（1008）
0.7 ー3000
（0.028）
0.9 ー3000
（0.035）
1.1 ー2000
（0.043）
NM2012（0805）0.9 ー3000
（0.035）
NM2520（1008）1.1 ー2000
（0.043）
LK1005（0402）0.5 10000 ー
（0.020）
LK1608（0603）0.8 4000 ー
（0.031）
LK2125（0805）
0.854000 ー
（0.033）
1.25 ー2000
（0.049）
HK0603（0201）0.3 15000 ー
（0.012）
HK1005（0402）0.5 10000 ー
（0.020）
HK1608（0603）0.8 4000 ー
（0.031）
HK2125（0805）
0.85ー4000
（0.033）
1.0 ー3000
（0.039）
HKQ0603S（0201）0.3 15000 ー
（0.012）
AQ105（0402）0.5 10000 ー
（0.020）
BK0402（01005）0.2 20000 ー
（0.008）
BK0603（0201）0.3 15000 ー
（0.012）
BK1005（0402）0.5 10000 ー
（0.020）
BK1608（0603）0.8 4000 ー
（0.031）
BK2125（0805）
0.854000 ー
（0.033）
1.25 ー2000
（0.049）
BK2010（0804）0.454000 ー
（0.018）
BK3216（1206）0.8 ー4000
（0.031）
BKP0603（0201）0.3 15000 ー
（0.012）
BKP1005（0402）0.5 10000 ー
（0.020）
BKP1608（0603）0.8 4000 ー
（0.031）
BKP2125（0805）0.85 4000 ー
（0.033）
C K 16 0 8
C K 2 125
C K S 2125
L K 10 0 5
L K 16 0 8
L K 2 125
H K 06 0 3
H K 10 0 5
H K 16 0 8
H K Q 0 6 0 3
A Q 10 5
B K 04 0 2
B K 06 0 3
B K 10 0 5
B K 16 0 8
B K 2 125
B K 2 010
B K P 0 6 0 3
B K P 10 0 5
B K P 16 0 8
B K P 2125
C K 2125
C K S 2125
C K P 2012
C K P 2016
C K P 2 520
N M 2012
N M 25 20
L K 2 125
H K 2125
B K 2125
B K 3 216
Type
Thickness
〔mm〕
（inch）
Chip cavity Insertion
Pitch
Tape
Thickness
A B F T
CK1608（0603）0.8
（0.031）
1.0±0.2
（0.039±0.008）
1.8±0.2
（0.071±0.008）
4.0±0.1
（0.157±0.004）
1.1ｍａｘ
（0.043max）
CK2125（0805）0.85
（0.033）
1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.1ｍａｘ
（0.043max）
CKS2125（0805）
0.85
（0.033）
1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.1ｍａｘ
（0.043max）
LK1005（0402）0.5
（0.020）
0.65±0.1
（0.026±0.004）
1.15±0.1
（0.045±0.004）
2.0±0.05
（0.079±0.002）
0.8ｍａｘ
（0.031max）
LK1608（0603）0.8
（0.031）
1.0±0.2
（0.039±0.008）
1.8±0.2
（0.071±0.008）
4.0±0.1
（0.157±0.004）
1.1ｍａｘ
（0.043max）
LK2125（0805）0.85
（0.033）
1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.1ｍａｘ
（0.043max）
HK0603（0201）0.3
（0.012）
0.40±0.06
（0.016±0.002）
0.70±0.06
（0.028±0.002）
2.0±0.05
（0.079±0.002）
0.45ｍａｘ
（0.018max）
HK1005（0402）0.5
（0.020）
0.65±0.1
（0.026±0.004）
1.15±0.1
（0.045±0.004）
2.0±0.05
（0.079±0.002）
0.8ｍａｘ
（0.031max）
HK1608（0603）0.8
（0.031）
1.0±0.2
（0.039±0.008）
1.8±0.2
（0.071±0.008）
4.0±0.1
（0.157±0.004）
1.1ｍａｘ
（0.043max）
HKQ0603S（0201）
0.3
（0.012）
0.40±0.06
（0.016±0.002）
0.70±0.06
（0.028±0.002）
2.0±0.05
（0.079±0.002）
0.45ｍａｘ
（0.018max）
AQ105（0402）0.5
（0.020）
0.75±0.1
（0.030±0.004）
1.15±0.1
（0.045±0.004）
2.0±0.05
（0.079±0.002）
0.8ｍａｘ
（0.031max）
BK0402（01005）0.2
（0.008）
0.25±0.04
（0.010±0.002）
0.45±0.04
（0.018±0.002）
2.0±0.05
（0.079±0.002）
0.36ｍａｘ
（0.014max）
BK0603（0201）0.3
（0.012）
0.40±0.06
（0.016±0.002）
0.70±0.06
（0.028±0.002）
2.0±0.05
（0.079±0.002）
0.45ｍａｘ
（0.018max）
11
mlci0109_reli-PRP2
mlci0109_reli_e-01
■ PACKAGING
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Unit : mm （inch）
◦Embossed Tape (0.315 inches wide)
④LEADER AND BLANK PORTION
160mm or more
（
6.3inches or more
）
Direction of tape feed
100mm or more
（3.94inches or more）
400mm ore more
（15.7inches or more）
⑤Reel Size
2.0±0.5
（0.079±0.031）
φ13.0±0.2
（φ0.512±0.020）
⑥Top tape strength
The top tape requires a peel-off force of 0.1～0.7N in the direction of the arrow as
illustrated below.
Type
Thickness
〔mm〕
（inch）
Chip cavity Insertion
Pitch
Tape
Thickness
A B F T
BK1005（0402）0.5
（0.020）
0.65±0.1
（0.026±0.004）
1.15±0.1
（0.045±0.004）
2.0±0.05
（0.079±0.002）
0.8ｍａｘ
（0.031max）
BK1608（0603）0.8
（0.031）
1.0±0.2
（0.039±0.008）
1.8±0.2
（0.071±0.008）
4.0±0.1
（0.157±0.004）
1.1ｍａｘ
（0.043max）
BK2125（0805）0.85
（0.033）
1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.1ｍａｘ
（0.043max）
BK2010（0804）0.45
（0.018）
1.2±0.1
（0.047±0.004）
2.17±0.1
（0.085±0.004）
4.0±0.1
（0.157±0.004）
0.8ｍａｘ
（0.031max）
BKP0603（0201）0.3
（0.012）
0.40±0.06
（0.016±0.002）
0.70±0.06
（0.028±0.002）
2.0±0.05
（0.079±0.002）
0.45ｍａｘ
（0.018max）
BKP1005（0402）0.5
（0.020）
0.65±0.1
（0.026±0.004）
1.15±0.1
（0.045±0.004）
2.0±0.05
（0.079±0.002）
0.8ｍａｘ
（0.031max）
BKP1608（0603）0.8
（0.031）
1.0±0.2
（0.039±0.008）
1.8±0.2
（0.071±0.008）
4.0±0.1
（0.157±0.004）
1.1ｍａｘ
（0.043max）
BKP2125（0805）0.85
（0.033）
1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.1ｍａｘ
（0.043max）
Unit : mm （inch）
Type
Thickness
〔mm〕
（inch）
Chip cavity Insertion
Pitch
Tape
Thickness
A B F K T
CK2125（0805）
1.25
（0.049）
1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
2.0
（0.079）
0.3
（0.012）
CKS2125（0805）
1.25
（0.049）
1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
2.0
（0.079）
0.3
（0.012）
CKP2012（0805）
0.9
（0.035）
1.55±0.2
（0.061±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.3
（0.051）
0.3
（0.012）
CKP2016（0806）
0.9
（0.035）
1.8±0.1
（0.071±0.004）
2.2±0.1
（0.087±0.004）
4.0±0.1
（0.157±0.004）
1.3
（0.051）
0.25
（0.01）
CKP2520（1008）
0.7
（0.028）
2.3±0.1
（0.091±0.004）
2.8±0.1
（0.110±0.004）
4.0±0.1
（0.157±0.004）
1.4
（0.055）
0.3
（0.012）
0.9
（0.035）
1.4
（0.055）
1.1
（0.043）
1.7
（0.067）
NM2012（0805）
0.9
（0.035）
1.55±0.2
（0.061±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.3
（0.051）
0.3
（0.012）
NM2520（1008）
1.1
（0.043）
2.3±0.1
（0.091±0.004）
2.8±0.1
（0.110±0.004）
4.0±0.1
（0.157±0.004）
1.7
（0.067）
0.3
（0.012）
LK2125（0805）
1.25
（0.049）
1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
2.0
（0.079）
0.3
（0.012）
HK2125（0805）
0.85
（0.033）1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.5
（0.059）0.3
（0.012）
1.0
（0.039）
2.0
（0.079）
BK2125（0805）
1.25
（0.049）
1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
2.0
（0.079）
0.3
（0.012）
BK3216（1206）
0.8
（0.031）
1.9±0.1
（0.075±0.004）
3.5±0.1
（0.138±0.004）
4.0±0.1
（0.157±0.004）
1.4
（0.055）
0.3
（0.012）
11
mlci0109_reli-PRP3 mlci0109_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
1. Operating Temperature Range
BK0402
－55～＋125℃
BK0603
BK1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
－55～＋85℃
BKP1005
BKP1608
BKP2125
CK1608
－40～＋85℃
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0603 －55～＋125℃
HK1005
HK1608 －40～＋85℃
HK2125
HKQ0603S －55～＋125℃
AQ105
2. Storage Temperature Range
BK0402
－55～＋125℃
BK0603
BK1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
－55～＋85℃
BKP1005
BKP1608
BKP2125
CK1608
－40～＋85℃
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0603 －55～＋125℃
HK1005
HK1608 －40～＋85℃
HK2125
HKQ0603S －55～＋125℃
AQ105
11
mlci0109_reli-PRP4
mlci0109_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
3. Rated Current
BK0402 240～540mA DC
BK0603 100～500mA ＤＣ
BK1005 120～1000mA ＤＣ
BK1608 150～1500mA ＤＣ
BK2125 200～1200mA ＤＣ
ARRAY BK2010 100mA ＤＣ
BK3216 100～200mA ＤＣ
BKP0603 1.0A ＤＣ
BKP1005 800～2000mA DC
BKP1608 1.0～3.0A ＤＣ
BKP2125 1.5～4.0A ＤＣ
CK1608 50～60mA DC
CK2125 60～500mA DC
CKS2125 110～280mA DC
CKP2012 0.7～1.2A DC
CKP2016 0.9～1.6A DC
CKP2520 1.1～1.8A DC
NM2012 0.8～1.5A DC
NM2520 0.9～1.1A DC
LK1005 20～25mA DC
LK1608 1～150mA DC
LK2125 5～300mA DC
HK0603 60～470mA DC
HK1005 110～300mA DC
HK1608 150～300mA DC
HK2125 300mA DC
HKQ0603S 130～600mA DC
AQ105 280～710mA DC
Definition of rated current：
・In the CK, CKS and BK Series, the rated current is the value of current at which the temperature of the element is increased within 20℃.
・In the BK Series P type and CK Series P type, NM Series the rated current is the value of current at which the temperature of the element is increased within 40℃.
・In the LK,HK,HKQ,and AQ Series, the rated current is either the DC value at which the internal L value is decreased within 5% with the application of DC bias, or the value of current
at which the temperature of the element is increased within 20℃.
4. Impedance
BK0402 10～120Ω ±25%
BK0603 10～600Ω ±25%
BK1005 10～1800Ω ±25%
BK1608 22～2500Ω ±25%
BK2125 15～2500Ω ±25%
ARRAY BK2010 5～1000Ω ±25%
BK3216 68～1000Ω ±25%
BKP0603 22～33Ω ±25%
BKP1005 10～220Ω ±25%
BKP1608 33～470Ω ±25%
BKP2125 33～330Ω ±25%
CK1608
——
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0603
HK1005
HK1608
HK2125
HKQ0603S
AQ105
【Test Methods and Remarks】
BK0402 Series
Measuring frequency：100±1MHz
Measuring equipment：HP4991A（or its equivalent）
Measuring jig：16196D（or its equivalent）
BK0603 Series, BKP0603 Series
Measuring frequency：100±1MHz
Measuring equipment：HP4291A（or its equivalent）
Measuring jig：16193A（or its equivalent）
BK1005 Series, BKP1005 Series
Measuring frequency：100±1MHz
Measuring equipment：HP4291A（or its equivalent）
Measuring jig：16192A（or its equivalent）, 16193A（or its equivalent）
BK1608・2125 Series, BKP1608・2125 Series
Measuring frequency：100±1MHz
Measuring equipment：HP4291A（or its equivalent）, HP4195A（or its equivalent）
Measuring jig：16092A（or its equivalent） or 16192A（or its equivalent）/HW
BK2010・3216 Series
Measuring frequency：100±1MHz
Measuring equipment：HP4291A（or its equivalent） , HP4195A（or its equivalent）
Measuring jig：16192A（or its equivalent）
11
mlci0109_reli-PRP5 mlci0109_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
5. Inductance
BK0402
——
BK0603
BK1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608 4.7～10.0μH：±20%
CK2125 0.1～10.0μH：±20%
CKS2125 1.0～10.0μH：±20%
CKP2012 0.47～4.7μH：±20%
CKP2016 0.47～4.7μH：±20%
CKP2520 0.47～4.7μH：±20%
NM2012 0.82～1.0μH：±20%
NM2520 1.0～2.2μH：±20%
LK1005 0.12～2.2μH：±10%　Q 0.12～2.2μH：±30%
LK1608 0.047～33.0μH：±20%　0.10～12.0μH：±10%　Q 0.12～2.2μH：±30%
LK2125 0.047～33.0μH：±20%　0.10～12.0μH：±10%　Q 0.12～2.2μH：±30%
HK0603 1.0～6.2nH：±0.3nH　6.8～100nH：±5%
HK1005 1.0～6.2nH：±0.3nH　6.8～270nH：±5%
HK1608 1.0～5.6nH：±0.3nH　6.8～470nH：±5%
HK2125 1.5～5.6nH：±0.3nH　6.8～470nH：±5%
HKQ0603S 0.6～6.2nH：±0.3nH　6.8～22nH：±5%
AQ105 1.0～6.2nH：±0.3nH　6.8～15nH：±5%
【Test Methods and Remarks】
CK Series：
Measuring frequency：2 to 4MHz （CK1608）
Measuring frequency：2 to 25MHz （CK2125）
Measuring frequency：2 to 10MHz （CKS2125）
LK Series：
Measuring frequency：10 to 25MHz （LK1005）
Measuring frequency：1 to 50MHz （LK1608）
Measuring frequency：0.4 to 50MHz （LK2125）
CKP Series, NM Series：
Measuring frequency：1MHz（CKP2012, CKP2016, CKP2520, NM2012・NM2520）
Measuring equipment, jig：・HP4194A＋16085B＋16092A（or its equivalent）
・HP4195A＋41951＋16092A（or its equivalent）
・HP4294A＋16192A（or its equivalent）
・HP4291A＋16193A（or its equivalent）/LK1005
・HP4285A＋42841A＋42842C＋42851－61100（CKP2012・CKP2016・CKP2520・NM2012・NM2520）
Measuring current：・1mA rms（0.047 to 4.7μH）　・0.1mA rms（5.6 to 33μH）
HK、HKQ、AQ Series：
Measuring frequency：100MHz（HK0603・HK1005・AQ105）
Measuring frequency：50/100MHz（HK1608・HK2125）
Measuring frequency：500MHz（HKQ0603S）
Measuring equipment, jig：・HP4291A＋16197A（or its equivalent）/HK0603・AQ105
・HP4291A＋16193A（or its equivalent）/HK1005
・E4991A＋16197A（or its equivalent）/HKQ0603S
・HP4291A＋16092＋in-house made jig（or its equivalent）/HK1608・HK2125
11
mlci0109_reli-PRP6
mlci0109_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
6. Q
BK0402
——
BK0603
BK1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608 20 min.
CK2125 15～20 min.
CKS2125
——
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005 10～20 min.
LK1608 10～35 min.
LK2125 15～50 min.
HK0603 4～5 min.
HK1005 8 min.
HK1608 8～12 min.
HK2125 10～18 min.
HKQ0603S 10～13 min.
AQ105 8 min.
【Test Methods and Remarks】
CK Series：
Measuring frequency：2 to 4MHz（CK1608）
Measuring frequency：2 to 25MHz（CK2125）
LK Series：
Measuring frequency：10 to 25MHz（LK1005）
Measuring frequency：1 to 50MHz（LK1608）
Measuring frequency：0.4 to 50MHz（LK2125）
Measuring equipment, jig：・HP4194A＋16085B＋16092A（or its equivalent）
・HP4195A＋41951＋16092A（or its equivalent）
・HP4294A＋16192A（or its equivalent）
・HP4291A＋16193A（or its equivalent）/LK1005
Measuring current：・1mA rms（0.047 to 4.7μH）　・0.1mA rms（5.6 to 33μH）
HK、HKQ、AQ Series：
Measuring frequency：100MHz（HK0603・HK1005・AQ105）
Measuring frequency：50/100MHz（HK1608・HK2125）
Measuring frequency：500MHz（HKQ0603S）
Measuring equipment, jig：・HP4291A＋16197A（or its equivalent）/HK0603・AQ105
・HP4291A＋16193A（or its equivalent）/HK1005
・E4991A＋16197A（or its equivalent）/HKQ0603S
・HP4291A＋16092A＋ in-house made jig（or its equivalent）/HK1608・HK2125
7. DC Resistance
BK0402 0.10～0.53Ω max.
BK0603 0.065～1.50Ω max.
BK1005 0.03～0.80Ω max.
BK1608 0.05～1.10Ω max.
BK2125 0.05～0.75Ω max.
ARRAY BK2010 0.10～0.90Ω max.
BK3216 0.15～0.80Ω max.
BKP0603 0.065～0.070Ω max.
BKP1005 0.030～0.20Ω max.
BKP1608 0.025～0.18Ω max.
BKP2125 0.020～0.075Ω max.
CK1608 0.45～0.85Ω （±30%）
CK2125 0.16～0.65Ω max.
CKS2125 0.09～0.40Ω typ.
0.12～0.52Ω max.
CKP2012 0.10～0.28Ω max.
CKP2016 0.08～0.20Ω max.
CKP2520 0.05～0.16Ω max.
NM2012 0.10～0.19Ω max.
NM2520 0.13～0.22Ω max.
LK1005 0.41～1.16Ω max.
LK1608 0.2～2.2Ω max.
LK2125 0.1～1.1Ω max.
HK0603 0.11～3.74Ω max.
HK1005 0.08～4.8Ω max.
HK1608 0.05～2.6Ω max.
HK2125 0.10～1.5Ω max.
HKQ0603S 0.06～1.29Ω max.
AQ105 0.07～0.45Ω max.
【Test Methods and Remarks】
Measuring equipment：VOAC-7412（made by Iwasaki Tsushinki）　VOAC-7512（made by Iwasaki Tsushinki）
11
mlci0109_reli-PRP7 mlci0109_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
8. Self Resonance Frequency（SRF）
BK0402
——
BK0603
BK1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608 17～25MHz min.
CK2125 24～235MHz min.
CKS2125
——
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005 40～180MHz min.
LK1608 9～260MHz min.
LK2125 13～320MHz min.
HK0603 900～10000MHz min.
HK1005 400～10000MHz min.
HK1608 300～10000MHz min.
HK2125 200～4000MHz min.
HKQ0603S 1900～10000MHｚ min.
AQ105 2300～10000MHz min.
【Test Methods and Remarks】
LK Series：
Measuring equipment：HP4195A（or its equivalent）
Measuring jig：41951＋16092A（or its equivalent）
HK、HKQ、AQ Series：
Measuring equipment：HP8719C（or its equivalent）・HP8753D（or its equivalent）/HK2125
9. Temperature Characteristic
BK0402
——
BK0603
BK1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0603
Inductance change：Within ±10％
HK1005
HK1608
HK2125
HKQ0603S
AQ105
【Test Methods and Remarks】
HK、HKQ、AQ Series：Temperature range：－30 to ＋85℃
Reference temperature：＋20℃
11
mlci0109_reli-PRP8
mlci0109_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
10. Resistance to Flexure of Substrate
BK0402
No mechanical damage.
BK0603
BK1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0603
HK1005
HK1608
HK2125
HKQ0603S
AQ105
【Test Methods and Remarks】
Warp：2mm（BK Series without 0402size, BKP, CK, CKS, CKP, NM, LK, HK, HKQ, AQ Series）
：1mm（BK0402 Series）
Testing board：glass epoxy-resin substrate
Thickness：0.8mm
11. Solderability
BK0402
At least 75％ of terminal electrode is covered by new solder.
BK0603
BK1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
At least 75％ of terminal electrode is covered by new solder.
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0603
HK1005
HK1608
HK2125
HKQ0603S
AQ105
【Test Methods and Remarks】
Solder temperature：230±5℃
Duration：4±1 sec.
11
mlci0109_reli-PRP9 mlci0109_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
12. Resistance to Soldering
BK0402
Appearance：No significant abnormality.
Impedance change：Within ±30％
BK0603
BK1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
No mechanical damage.
Remaining terminal electrode：70％ min.
Inductance change
R10～4R7 ： Within ±10％
6R8～100 ： Within ±15％
CKS2125 ： Within ±20％
CKP2012、CKP2016、CKP2520、NM2012、NM2520：Within ±30％
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005 No mechanical damage.　Remaining terminal electrode：70％ min.　Inductance change：Within ±15％
LK1608 No mechanical damage.
Remaining terminal electrode：70％ min.　Inductance change　47N～4R7：Within ±10％　5R6～330：Within ±15％
LK2125
HK0603
No mechanical damage.
Remaining terminal electrode：70％ min.　Inductance change：Within ±5％
HK1005
HK1608
HK2125
HKQ0603S
AQ105
【Test Methods and Remarks】
Solder temperature：260±5℃
Duration：10±0.5 sec.
Preheating temperature：150 to 180℃
Preheating time：3 min.
Flux：Immersion into methanol solution with colophony for 3 to 5 sec.
Recovery：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
13. Thermal Shock
BK0402
Appearance：No significant abnormality.
Impedance change：Within ±30％
BK0603
BK1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608 No mechanical damage.
Inductance change：Within ±20％　Q change：Within ±30％
Inductance change：Within ±20％（CKS2125）
CK2125
CKS2125
CKP2012
No mechanical damage.　Inductance change：Within ±30％
CKP2016
CKP2520
NM2012
NM2520
LK1005 No mechanical damage.
Inductance change：Within ±10％　Q change：Within ±30％
LK1608
LK2125
HK0603
No mechanical damage.
Inductance change：Within ±10％　Q change：Within ±20％
HK1005
HK1608
HK2125
HKQ0603S
AQ105
【Test Methods and Remarks】
Conditions for 1 cycle
Step 1：Minimum operating temperature
＋0
－3℃ 30±3 min.
Step 2：Room temperature 2 to 3 min.
Step 3：Maximum operating temperature
＋3
－0℃ 30±3 min.
Step 4：Room temperature 2 to 3 min.
Number of cycles：5
Recovery：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
(Note 1) When there are questions concerning mesurement result；measurement shall be made after 48±2 hrs of recovery under the standard condition.
11
mlci0109_reli-PRP10
mlci0109_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
14. Damp Heat （Steady state）
BK0402
Appearance：No significant abnormality.
Impedance change：Within ±30％
BK0603
BK1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608 No mechanical damage.
Inductance change：Within ±20％　Q change：Within ±30％
CK2125
CKS2125 Inductance change：Within ±20％
CKP2012
No mechanical damage.　Inductance change：Within ±30％
CKP2016
CKP2520
NM2012
NM2520
LK1005 No mechanical damage.
Inductance change：Within ±10％　Q change：Within ±30％
LK1608
LK2125 No mechanical damage.　Inductance change：Within ±20％　Q change：Within ±30％
HK0603
No mechanical damage.
Inductance change：Within ±10％　Q change：Within ±20％
HK1005
HK1608
HK2125
HKQ0603S
AQ105
【Test Methods and Remarks】
BK Series：
Temperature：40±2℃
Humidity：90 to 95％RH
Duration：500＋24
－0hrs
Recovery：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
LK、CK、CKS、CKP、NM、HK、HKQ、AQ Series：
Temperature：40±2℃（LK、CK、CKS、CKP、NM Series）
：60±2℃（HK、HKQ、AQ Series）
Humidity：90 to 95％RH
Duration：500±12 hrs
Recovery：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
11
mlci0109_reli-PRP11 mlci0109_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
15. Loading under Damp Heat
BK0402
Appearance：No significant abnormality.
Impedance change：Within ±30％
BK0603
BK1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608 No mechanical damage.
Inductance change：Within ±20％　Q change：Within ±30％
CK2125
CKS2125 No mechanical damage.　Inductance change：Within ±20％
CKP2012
No mechanical damage.　Inductance change：Within ±30％
CKP2016
CKP2520
NM2012
NM2520
LK1005 No mechanical damage.　Inductance change：Within ±10％　Q change：Within ±30％
LK1608 No mechanical damage.
Inductance change：0.047 to 12.0μH：Within ±10％　15.0 to 33.0μH：Within ±15％　Q change：Within ±30％
LK2125 No mechanical damage.　Inductance change：Within ±20％　Q change：Within ±30％
HK0603
No mechanical damage.
Inductance change：Within ±10％　Q change：Within ±20％
HK1005
HK1608
HK2125
HKQ0603S
AQ105
【Test Methods and Remarks】
BK Series：
Temperature：40±2℃
Humidity：90 to 95％RH
Applied current：Rated current
Duration：500＋24
－0hrs
Recovery：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
LK、CK、CKS、CKP、NM、HK、HKQ、AQ Series：
Temperature：40±2℃（LK、CK、CKS、CKP、NM Series）
：60±2℃（HK、HKQ、AQ Series）
Humidity：90 to 95％RH
Applied current：Rated current
Duration：500±12 hrs
Recovery：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition."
(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition.
11
mlci0109_reli-PRP12
mlci0109_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
16. Loading at High Temperature
BK0402
Appearance：No significant abnormality
Impedance change：Within ±30％
BK0603
BK1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608 No mechanical damage.
Inductance change：Within ±20％　Q change：Within ±30％
CK2125
CKS2125 No mechanical damage.　Inductance change：Within ±20％
CKP2012
No mechanical damage.　Inductance change：Within ±30％
CKP2016
CKP2520
NM2012
NM2520
LK1005 No mechanical damage.　Inductance change：Within ±10％　Q change：Within ±30％
LK1608 No mechanical damage.
Inductance change：0.047 to 12.0μH：Within ±10％　15.0 to 33.0μH：Within ±15％　Q change：Within ±30％
LK2125 No mechanical damage.　Inductance change：Within ±20％　Q change：Within ±30％
HK0603
No mechanical damage.
Inductance change：Within ±10％　Q change：Within ±20％
HK1005
HK1608
HK2125
HKQ0603S
AQ105
【Test Methods and Remarks】
BK Series：
Temperature：125±3℃
Applied current：Rated current
Duration：500＋24
－0hrs
Recovery：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
LK、CK、CKS、CKP、NM、HK、HKQ、AQ、BKP Series：
Temperature：85±2℃（LK、CK、CKS、CKP、NM、BKP Series）
：85±2℃（HK1608，2125）
：85±2℃（HK1005, AQ105 operating temperature range －55 to ＋85℃）
：125±2℃（HK0603, HK1005, HKQ0603S, AQ105 operating temperature range －55 to ＋125℃）
Applied current：Rated current
Duration：500±12 hrs
Recovery：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure. Unless other-
wise specified, all the tests are conducted under the "standard condition."
(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition.
11
mlci0109_reli-PRP13 mlci0109_reli_e-01
■ PRECAUTIONS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
1. Circuit Design
Precautions
◆Verification of operating environment, electrical rating and performance
1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social ramifications.
As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from
components used in general purpose applications.
◆Operating Current （Verification of Rated current）
1. The operating current for inductors must always be lower than their rated values.
2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect.
2. PCB Design
Precautions
◆Pattern configurations（Design of Land-patterns）
1. When inductors are mounted on a PCB, the size of land patterns and the amount of solder used（size of fillet）can directly affect inductor performance.
Therefore, the following items must be carefully considered in the design of solder land patterns:
（1） The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. Therefore, when
designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in turn determines the amount of
solder necessary to form the fillets.
（2） When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's soldering point is separated
by solder-resist.
（3） The larger size of land patterns and amount of solder, the smaller Q value after mounting on PCB. It makes higher the Q value to design land patterns
smaller than terminal electrode of chips.
◆Pattern configurations（Inductor layout on panelized ［breakaway］ PC boards）
1. After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing processes （PCB cutting,
board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered boards etc.）For this reason, planning pattern
configurations and the position of SMD inductors should be carefully performed to minimize stress.
Technical
consider-
ations
◆Pattern configurations（Design of Land-patterns）
1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts（larger fillets which extend above
the component end terminations）. Examples of improper pattern designs are also shown.
（1） Recommended land dimensions for a typical chip inductor land patterns for PCBs
Recommended land dimensions for wave-soldering
Recommended land dimensions for reflow-soldering
Type 1608 2125 3216
Size
L 1.6 2.0 3.2
W 0.8 1.25 1.6
A 0.8～1.0 1.0～1.4 1.8～2.5
B 0.5～0.8 0.8～1.5 0.8～1.7
C 0.6～0.8 0.9～1.2 1.2～1.6
（Unit：mm）
Type 0402 0603 1005 105 1608 2012 2125 2016 3216 2520
Size
L 0.4 0.6 1.0 1.0 1.6 2.0 2.0 2.0 3.2 2.5
W 0.2 0.3 0.5 0.6 0.8 1.25 1.25 1.6 1.6 2.0
A
0.15～0.25 0.20～0.30 0.45～0.55 0.50～0.55
0.8～1.0 0.8～1.2 0.8～1.2 0.8～1.2 1.8～2.5 1.0～1.4
B
0.10～0.20 0.20～0.30 0.40～0.50 0.30～0.40
0.6～0.8 0.8～1.2 0.8～1.2 0.8～1.2 0.6～1.5 0.6～1.0
C
0.15～0.30 0.25～0.40 0.45～0.55 0.60～0.70
0.6～0.8 0.9～1.6 0.9～1.6 1.2～2.0 1.2～2.0 1.8～2.2
（Unit：mm）
Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when designing land-patterns.
Recommended land dimension for Reflow-soldering
Type 3216 2010
Size
L 3.2 2.0
W 1.6 1.0
a 0.7～0.9 0.5～0.6
b 0.8～1.0 0.5～0.6
c 0.4～0.5 0.2～0.3
d 0.8 0.5
（Unit：mm）
（2） Examples of good and bad solder application
Item Not recommended Recommended
Mixed mounting of SMD
and leaded components
Component placement
close to the chassis
Hand-soldering of leaded
components near mounted
components
Horizontal component
placement
To next page
11
mlci0109_reli-PRP14
mlci0109_reli_e-01
■ PRECAUTIONS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
3. Considerations for automatic placement
Precautions
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the inductors when mounting onto the PC boards.
2. The maintenance and inspection of the mounter should be conducted periodically.
◆Selection of Adhesives
1. Mounting inductors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded inductor characteristics unless the following
factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, it is
imperative to consult the manufacturer of the adhesives on proper usage and amounts of adhesive to use.
Technical
consider-
ations
◆Adjustment of mounting machine
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. To avoid this, the following points should be
considered before lowering the pick-up nozzle:
（1） The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the board.
（2） The pick-up pressure should be adjusted between 1 and 3N static loads.
（3） To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be used under the PC
board. The following diagrams show some typical examples of good pick-up nozzle placement:
Item Improper method Proper method
Single-sided mounting
Double-sided mounting
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical impact on the
inductors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance, inspection and replacement of the
pin should be conducted periodically.
◆Selection of Adhesives
1. Some adhesives may cause reduced insulation resistance. The difference between the shrinkage percentage of the adhesive and that of the inductors may
result in stresses on the inductors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect component
placement, so the following precautions should be noted in the application of adhesives.
（1） Required adhesive characteristics
a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive should have sufficient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly.
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
（2） When using adhesives to mount inductors on a PCB, inappropriate amounts of adhesive on the board may adversely affect component placement. Too
little adhesive may cause the inductors to fall off the board during the solder process. Too much adhesive may cause defective soldering due excessive
flow of adhesive on to the land or solder pad.
［Recommended conditions］
Figure 0805 case sizes as examples
a 0.3mm min
b 100～120μm
c Area with no adhesive
2. PCB Design
Technical
consider-
ations
◆Pattern configurations（Inductor layout on panelized ［breakaway］ PC boards）
1-1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical stresses from board
warp or deflection.
Item Not recommended Recommended
Deflection of the board
1-2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary depending on inductor layout.
An example below should be counted for better design.
1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the method used. The following
methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, any ideal SMD inductor layout must
also consider the PCB splitting procedure.
11
mlci0109_reli-PRP15 mlci0109_reli_e-01
■ PRECAUTIONS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
4. Soldering
Precautions
◆Selection of Flux
1. Since flux may have a significant effect on the performance of inductors, it is necessary to verify the following conditions prior to use;
（1） Flux used should be with less than or equal to 0.1 wt% （Chlorine conversion method） of halogenated content. Flux having a strong acidity content should
not be applied.
（2） When soldering inductors on the board, the amount of flux applied should be controlled at the optimum level.
（3） When using water-soluble flux, special care should be taken to properly clean the boards.
◆Soldering
1. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions, and please contact us about peak tem-and please contact us about peak tem-
perature when you use lead-free paste.
Technical
consider-
ations
◆Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.）content is used to activate the flux, or highly acidic flux is used, an excessive amount of residue
after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the Inductor.
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may detrimentally affect
solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of Inductor in high humidity conditions may
cause a degradation of insulation resistance and therefore affect the reliability of the components. The cleaning methods and the capability of the machines
used should also be considered carefully when selecting water-soluble flux.
◆Soldering
1-1. Preheating when soldering
Heating: Chip inductor components should be preheated to within 100 to 130℃ of the soldering. Cooling: The temperature difference between the
components and cleaning process should not be greater than 100℃.
Chip inductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering process must be
conducted with a great care so as to prevent malfunction of the components due to excessive thermal shock.
Recommended conditions for soldering
［Reflow soldering］
Temperature profile
Caution
1. The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the thickness of the inductor, as shown below:
2. Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to recommended times as possible.
［Wave soldering］
Temperature profile
Peak 260℃ max
10 sec max
（Pb free soldering）
（Pb free soldering）
（Pb free soldering）
Peak 260℃ max
10 sec max
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be reflow soldering for 2 times.
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
（※⊿ＴT190℃ （3216Type max）, ⊿Ｔ≦ 130℃ （3225
Type ming）
※It is recommended to use 20W soldering iron and
the tip is 1φ or less.
※The soldering iron should not directly touch the
components.
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
Temperature（℃）
300
200
100
0
Temperature（℃）
300
200
100
0
Temperature（℃）
400
300
200
100
0
Preheating
150℃
60 sec min
Gradually
cooling
Gradually
cooling
Gradually
cooling
Heating above 230℃
40 sec max
Preheating
150℃
120 sec min
350℃ max
3 sec max
60 sec min
⊿Ｔ
Caution
1. Make sure the inductors are preheated sufficiently.
2. The temperature difference between the inductor and melted solder should not be greater than 100 to 130℃.
3. Cooling after soldering should be as gradual as possible.
4. Wave soldering must not be applied to the inductors designated as for reflow soldering only.
［Hand soldering］
Temperature profile
Peak 260℃ max
10 sec max
（Pb free soldering）
（Pb free soldering）
（Pb free soldering）
Peak 260℃ max
10 sec max
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be reflow soldering for 2 times.
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
（※⊿ＴT190℃ （3216Type max）, ⊿Ｔ≦ 130℃ （3225
Type ming）
※It is recommended to use 20W soldering iron and
the tip is 1φ or less.
※The soldering iron should not directly touch the
components.
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
Temperature（℃）
300
200
100
0
Temperature（℃）
300
200
100
0
Temperature（℃）
400
300
200
100
0
Preheating
150℃
60 sec min
Gradually
cooling
Gradually
cooling
Gradually
cooling
Heating above 230℃
40 sec max
Preheating
150℃
120 sec min
350℃ max
3 sec max
60 sec min
⊿Ｔ
Caution
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.
2. The soldering iron should not directly touch the inductor.
11
mlci0109_reli-PRP16
mlci0109_reli_e-01
■ PRECAUTIONS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
5. Cleaning
Precautions
◆Cleaning conditions
1. When cleaning the PC board after the Inductors are all mounted, select the appropriate cleaning solution according to the type of flux used and purpose of
the cleaning（e.g. to remove soldering flux or other materials from the production process.）
2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the inductor's characteristics.
Technical
consider-
ations
◆Cleaning conditions
1. The use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the inductor, resulting in a degradation of the inductor's
electrical properties（especially insulation resistance）.
2. Inappropriate cleaning conditions（insufficient or excessive cleaning）may detrimentally affect the performance of the inductors.
（1） Excessive cleaning
a. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the cracking of the inductor
or the soldered portion, or decrease the terminal electrodes' strength. Thus the following conditions should be carefully checked;
Ultrasonic output Below 20W/ℓ
Ultrasonic frequency Below 40kHz
Ultrasonic washing period 5 min. or less
6. Post cleaning processes
Precautions
◆Application of resin coatings, moldings, etc. to the PCB and components.
1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal
storage conditions resulting in the deterioration of the inductor's performance.
2. When a resin's hardening temperature is higher than the inductor's operating temperature, the stresses generated by the excess heat may lead to inductor
damage or destruction.
3. Stress caused by a resin's temperature generated expansion and contraction may damage inductors.
The use of such resins, molding materials etc. is not recommended.
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
7. Handling
Precautions
◆Breakaway PC boards（splitting along perforations）
1. When splitting the PC board after mounting inductors and other components, care is required so as not to give any stresses of deflection or twisting to the
board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆General handling precautions
1. Always wear static control bands to protect against ESD.
2. Keep the inductors away from all magnets and magnetic objects.
3. Use non-magnetic tweezers when handling inductors.
4. Any devices used with the inductors （soldering irons, measuring instruments） should be properly grounded.
5. Keep bare hands and metal products（i.e., metal desk）away from chip electrodes or conductive areas that lead to chip electrodes.
6. Keep inductors away from items that generate magnetic fields such as speakers or coils.
◆Mechanical considerations
1. Be careful not to subject the inductors to excessive mechanical shocks.
（1） If inductors are dropped on the floor or a hard surface they should not be used.
（2） When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components.
8. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and
humidity in the storage area. Humidity should especially be kept as low as possible.
Recommended conditions
Ambient temperature Below 40℃
Humidity Below 70% RH
The ambient temperature must be kept below 30℃. Even under ideal storage conditions inductor electrode solderability decreases as time passes, so
inductors should be used within 6 months from the time of delivery.
*The packaging material should be kept where no chlorine or sulfur exists in the air.
Technical
consider-
ations
◆Storage
1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place. For this reason, components should be used within 6 months from the time of delivery. If
exceeding the above period, please check solderability before using the inductors.