AMCA31-2R450G-S1F-T
Pb
3.2 x 1.6 x 1.2mm
RoHS / RoHS II Compliant
OUTLINE DIMENSIONS:
REFLOW PROFILE:
Surface Mount WLAN / Bluetooth Chip Antenna (2450MHz)
(Dimensions: mm)
Recommended Land Pattern
•Preheat condition: 150 ~200 /60~120ºC sec.
•Allowed time above 217ºC: 60~90sec.
•Max temp: 260ºC
•Max time at max temp: 10sec.
•Solder paste: Sn/3.0Ag/0.5Cu
•Allowed Reflow time: 2x max
[Note: The reflow profile in the above table is only for qualification and is not meant to specify board assembly
profiles. Actual board assembly profiles must be based on the customer's specific board design, solder paste and
process, and should not exceed the parameters as the Reflow profile shows.]
Pre-heating Temperature: 120ºC, 60 ºC ~ 300 sec.
•Iron soldering power: Max.30W.
•Pre-heating: 150 / 60 sec. ºC.
•Soldering Tip temperature: 350 Max. ºC.
•Soldering time: 3 sec Max.
•Solder paste: Sn/3.0Ag/0.5Cu.
•Max 1 times for iron soldering.
•Soldering Temperature: 340ºC±5ºC, 5sec max per each terminal.
[Note: Take care not to apply the tip of the soldering iron to the terminal electrodes.]
MANUAL SOLDERING
5101 Hidden Creek Lane Spicewood TX 78669
Phone: 512-371-6159 | Fax: 512-351-8858
For terms and conditions of sale visit:
www.abracon.com
ABRACON IS
ISO9001-2008
CERTIFIED
REVISED: 05.17.2017