SFH4510E9548 - OSRAM Opto Semiconductors

SFH 4510

SFH 4515

GaAs-IR-Lumineszenzdioden (950 nm) in SMR® Gehäuse

GaAs Infrared Emitters (950 nm) in SMR® Package

Lead (Pb) Free Product - RoHS Compliant

SFH 4510 SFH 4515

2009-08-21 1

Wesentliche Merkmale

• GaAs-LED mit sehr hohem Wirkungsgrad

•SMR

® (Surface Mount Radial) Gehäuse

• Für Oberflächenmontage geeignet

• Gehäusegleich mit Fotodiode SFH 2500/

SFH 2505

• Hohe Zuverlässigkeit

• UL Version erhältlich

• Gute spektrale Anpassung an

Si-Fotoempfänger

Anwendungen

• IR-Fernsteuerungen

• Rauchmelder

• Sensorik

• Diskrete Lichtschranken

• Diskrete Optokoppler

Typ

Type Bestellnummer

Ordering Code Gehäuse

Package

SFH 4510 Q65110A2630 5-mm-SMR®-Gehäuse (T 1 3/4), schwarzes Epoxy-

Gießharz, Anschlüsse (SFH 4510 gebogen, SFH 4515

gerade) im 2.54-mm-Raster (1/10’’),

Kathodenkennzeichnung: siehe Maßzeichnung.

5 mm SMR® package (T 1 3/4), black-colored epoxy resin,

solder tabs (SFH 4510 bent, SFH 4515 straight) lead

spacing 2.54 mm (1/10’’), cathode marking: see package

outline.

SFH 4510 E9548 (UL) Q65110A5375

SFH 4515 Q65110A2633

Features

• Very highly efficient GaAs-LED

•SMR

® (Surface Mount Radial) package

• Suitable for surface mounting (SMT)

• Same package as photodiode SFH 2500/

SFH 2505

• High reliability

• UL version available

• Spectral match with silicon photodetectors

Applications

• IR remote controls

• Smoke detectors

• Sensor technol ogy

• Discrete interrupters

• Discrete optocouplers

2009-08-21 2

SFH 4510, SFH 4515

Grenzwerte (TA = 25 °C)

Maximum Ratings

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

Betriebs- und Lagertemperatur

Operating and storage temperature range Top; Tstg – 40 … + 100 °C

Sperrspannung

Reverse voltage VR5 V

Durchlassstrom

Forward current IF (DC) 100 mA

Stoßstrom, tp = 10 μs, D = 0

Surge current IFSM 3 A

Verlustleistung

Power dissipation Ptot 150 mW

Wärmewiderstand Sperrschicht - Umgebung bei

Montage auf FR4 Platine, Padgröße je 20 mm2

Thermal resistance junction - ambient mounted

on PC-board (FR4), padsize 20 mm2 each

RthJA 300 K/W

Kennwerte (TA = 25 °C)

Characteristics

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

Wellenlänge der Strahlung

Wavelength at peak emission

IF = 100 mA

λpeak 950 nm

Spektrale Bandbreite bei 50% von Ιmax

Spectral bandwidth at 50% of Ιmax

IF = 100 mA

Δλ 55 nm

Abstrahlwinkel

Half angle ϕ± 14 Grad

deg.

Aktive Chipfläche

Active chip area A0.09 mm2

Abmessungen der aktiven Chipfläche

Dimension of the active chip area L × B

L × W0.3 × 0.3 mm²

Schaltzeiten, Ie von 10% auf 90% und von 90% auf

10%, bei IF = 100 mA, RL = 50 Ω

Switching times, Ιe from 10% to 90% and from 90%

to 10%, IF = 100 mA, RL = 50 Ω

tr, tf0.5 μs

SFH 4510, SFH 4515

2009-08-21 3

Kapazität

Capacitance

VR = 0 V, f = 1 MHz

Co25 pF

Durchlassspannung

Forward voltage

IF = 100 mA, tp = 20 ms

IF = 1 A, tp = 100 μs

1.30 (≤ 1.5)

2.30 (≤ 2.8)

Sperrstrom

Reverse current

VR = 5 V

IR0.01 (≤ 1) μA

Gesamtstrahlungsfluss

Total radiant flux

IF = 100 mA, tp = 20 ms

Φe22 mW

Temperaturkoeffizient von Ie bzw. Φe, IF = 100 mA

Temperature coefficient of Ie or Φe, IF = 100 mA TCI– 0.5 %/K

Temperaturkoeffizient von VF, IF = 100 mA

Temperature coefficient of VF, IF = 100 mA TCV– 2 mV/K

Temperaturkoeffizient von λ, IF = 100 mA

Temperature coefficient of λ, IF = 100 mA TCλ0.3 nm/K

Kennwerte (TA = 25 °C)

Characteristics (cont’d)

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

2009-08-21 4

SFH 4510, SFH 4515

Strahlstärke Ie in Achsrichtung

gemessen bei einem Raumwinkel Ω = 0.01 sr

Radiant Intensity Ie in Axial Direction

at a solid angle of Ω = 0.01 sr

Bezeichnung

Parameter Symbol Werte

Values Einheit

Unit

Strahlstärke

Radiant intensity

IF = 100 mA, tp = 20 ms

Ie typ

Ie min

≥ 25 mW/sr

mW/sr

Strahlstärke

Radiant intensity

IF = 1 A, tp = 100 μs

Ie typ 450 mW/sr

SFH 4510, SFH 4515

2009-08-21 5

Relative Spectral Emission

Irel = f (λ)

Forward Current

IF = f (VF), single pu lse, tp = 20 μs

Radiation Characteristics Ιrel = f (ϕ)

OHRD1938

rel

0880 920 960 1000

1060

100

OHR01554

-3

-2

-1

0123456V8

OHF00265

02040 60 80 100 1200.40.60.81.0

100

10203040

0.2

0.4

0.6

0.8

1.0

Radiant Intensity

Single pulse, tp = 20 μs

Permissible Pulse Handling

Capability IF = f (τ), TA = 25 °C,

duty cycle D = parameter

Ιe

Ιe 100 mA = f (IF)

OHR01551

-3

-2

-1

e 100 mA

-2

-1

10A

OHR00860

-5

0.2

0.5

0.1

0.005

0.01

0.02

0.05

-4

-3

-2

-1

10s

Max. Permissible Forward Current

IF = f (TA)

OHF01534

100

125

10 20 30 40 50 60 70 80 ˚C 100

2009-08-21 6

SFH 4510, SFH 4515

Maßzeichnung

Package Outlines

Maße in mm (inch) / Dimensions in mm (inch).

SFH 4510

GEOY6968

3.9 (0.154)

4.5 (0.177)

Cathode/

7.1 (0.280)

7.7 (0.303)

2.54 (0.100)

spacing

13.1 (0.516)

14.7 (0.579)

5.5 (0.217)

7.5 (0.295)

1.95 (0.077)

2.05 (0.081)

R((3.2) (0.126))

5.4 (0.213)

6.0 (0.236)

((3.2) (0.126))

2.7 (0.106)

2.4 (0.094)

4.4 (0.173)

4.8 (0.189)

((R2.8 (0.110))

(-0.004...0.008)

3.7 (0.146)

3.3 (0.130)

2.8 (0.110)

2.4 (0.094)

4.5 (0.177)

3.9 (0.154)

Chip position

Collector

-0.1...0.2

GEOY6969

3.9 (0.154)

4.5 (0.177)

7.1 (0.280)

7.7 (0.303)

2.54 (0.100)

spacing

14.7 (0.579)

15.5 (0.610)

7.4 (0.291)

8.0 (0.315) ((3.2) (0.126))

5.4 (0.213)

6.0 (0.236)

((3.2) (0.126))

2.7 (0.106)

2.4 (0.094)

4.4 (0.173)

4.8 (0.189)

((R2.8 (0.110))

R2.05 (0.081)

1.95 (0.077)

Cathode/

4.5 (0.177)

3.9 (0.154)

Chip position

(-0.006...0.006)

Collector

-0.15...0.15

SFH 4515

SFH 4510, SFH 4515

2009-08-21 7

Empfohlenes Lötpaddesign

Recommended Solder Pad

Maße in mm (inch) / Dimensions in mm (inch).

SFH 4510

OHFY2449

5.3 (0.209)

1.3 (0.051)

2.54 (0.100)

7 (0.276)

3 (0.118)

Lötpad

Cu-Fläche > 20 mm

Cu-area > 20 mm22

Paddesign for

verbesserte Wärmeableitung

improved heat dissipation

Padgeometrie für

Lötstopplack

Solder resist

Bauteil positioniert

Component Location on Pad

SFH 4515

OHF02450

5.9 (0.232)

1.3 (0.051)

2.54 (0.100)

7 (0.276)

3 (0.118)

Cu-Fläche > 20 mm

Cu-area > 20 mm2

Paddesign for

verbesserte Wärmeableitung

improved heat dissipation

Padgeometrie für

Lötstopplack

Solder resist

Component Location on Pad

Bauteil positioniert

Aussparung 4.85 (0.191)

5.2 (0.205)

Lötpad (1 (0.039))

1.5 (0.059)

±0.05 (0.002)

2009-08-21 8

SFH 4510, SFH 4515

Lötbedingungen Vorbehandlung nach JEDEC Level 3

Soldering Conditions Preconditioning acc. to JEDEC Level 3

Reflow Lötprofil für bleifreies Löten (nach J-STD-020C)

Reflow Soldering Profile for lead free soldering (acc. to J-STD-020C)

Published by

OSRAM Opto Semiconductors GmbH

Leibnizstrasse 4, D-93055 Regensburg

www.osram-os.com

The information describes the type of component and shall not be considered as assure d characteristics.

Terms of delivery and rights to change design reserved. Due to technical requirements components may contain

dangerous substances. For information on the types in question plea se contact our Sales Organization.

Packing

Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.

By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing

material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs

incurred.

Components used in life-support devices or systems must be expressly authorized for such purpose! Critical

components 1 , may only be used in life-support devices or systems 2 with the express written app roval of OSRAM OS.

1 A critical componen t is a component usedin a life-support device or syste m whose failure can reasonably be expected

to cause the failure of that life-support devic e or system, or to a ffect its safety or e ffectiveness of that device or system.

2 Life support devices or systems are inte nded (a) to be implanted in the human body, or (b) to support and /or maintain

and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.

OHLA0687

˚C

120 s max

100

150

200

250

300

Ramp Up

100 s max

50 100 150 200 250 300

Ramp Down

6 K/s (max)

3 K/s (max)

25 ˚C

30 s max

260 ˚C

+0 ˚C

-5 ˚C

245 ˚C

±5 ˚C

240 ˚C

255 ˚C

217 ˚C

Maximum Solder Profile

Recommended Solder Profile

235 ˚C

-0 ˚C

+5 ˚C

Minimum Solder Profile

10 s min

min. condition for IR Reflow Soldering:

solder point temperature ≥ 235 °C for at least 10 sec.