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IS900
DD93241
DESCRIPTION
The IS900 consists of a GaAs infrared emitting diode
optically coupled to a high speed output integrated
Microprocessor Compatible Schmitt trigger detector,
which provides hysteresis for noise immunity and pulse
shaping.
FEATURES
• High Data Rate, 1MHz typical (NRZ)
• Free from Latch Up and Oscillation
• Microprocessor Compatible Drive
• Logical Compatible Output sinks 16mA
at 0.4V maximum
• Guaranteed On/Off Threshold Hysteresis
• Wide Supply Voltage Capability, compatible with
all popular Logic Systems
• Operating Voltage Range
VCC 3V to 16V
• Operating Temperature Range
- 55°C to +100°C
• High AC Isolation voltage 5000VRMS
• Lead Free and RoHS Compliant
APPLICATIONS
• Logic to Logic isolator
• Line Receiver - eliminate noise and transient
problems
• Programmable Current Level Sensor
• AC to TTL Conversion - Square Wave Shaping
• Power Supply Digital Programming
• Computer Peripherals Interface
ORDER INFORMATION
• Add G after PN for 10mm lead spacing
• Add SM after PN for Surface Mount
• Add SMT&R after PN for Surface Mount
Tape & Reel
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Stresses exceeding the absolute maximum ratings can cause
permanent damage to the device.
Exposure to absolute maximum ratings for long periods of time
can adversely affect reliability.
ISOCOM COMPONENTS 2004 LTD
Unit 25B, Park View Road West, Park View Industrial Estate
Hartlepool, Cleveland, TS25 1PE, United Kingdom
Tel : +44 (0)1429 863 609 Fax : +44 (0)1429 863 581
e-mail : sales@isocom.co.uk
http://www.isocom.com
ISOCOM COMPONENTS ASIA LTD
Hong Kong Office
Block A, 8/F, Wah Hing Industrial Mansions
36 Tai Yau Street, San Po Kong, Kowloon, Hong Kong
Tel : +852 2995 9217 Fax : +852 8161 6292
e-mail : sales@isocom.com.hk
1 Anode
2 Cathode
3 NC
4 VO
5 GND
6 VCC
Forward Current 60mA
Reverse Voltage 6V
Power Dissipation 120mW
Input
Output Current 50mA
Output Voltage 16V
Supply Voltage 16V
Power Dissipation 150mW
Output
Isolation Voltage 5000VRMS
Total Power Dissipation 250mW
Operating Temperature -55 to 100 °C
Storage Temperature -55 to 150 °C
Lead Soldering Temperature (10s) 260°C
Total Package
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IS900
DD93241
Truth Table
ELECTRICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified. Typical Values at TA = 25°C)
LED VO
ON LOW
OFF HIGH
Parameter Symbol Test Condition Min Typ. Max Unit
Forward Voltage VF IF = 10mA 1.15 1.5 V
Reverse Current IR V
R = 5V 10 µA
Terminal Capacitance CIN V = 0V, f = 1MHz 33 pF
INPUT
Parameter Symbol Test Condition Min Typ. Max Unit
Operating Voltage VCC 3 15 V
Supply Current ICC(off) V
CC = 5V, IF = 0mA 1.6 5 mA
High Level
Output Current
IOH I
F = 0mA, VCC = VO = 15V 100 µA
OUTPUT
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IS900
DD93241
ELECTRICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified, Typical Values at TA = 25°C)
Parameter Symbol Test Condition Min Typ. Max Unit
Supply Current ICC(on) VCC = 5V, IF = 10mA 1.6 5 mA
Low Level
Output Voltage
VOL V
CC = 5V, IF = IF(on) (max),
RL = 270Ω
0.4 V
Turn-On
Threshold Current
IF(on) VCC = 5V, RL = 270Ω
1.6 mA
Turn-Off
Threshold Current
IF(off) VCC = 5V, RL = 270Ω 1 mA
Hysteresis Rtio
IF(off)/IF(on)
VCC = 5V, RL = 270Ω 0.5 0.9
Turn-On Time t(on) V
CC = 5V,
IF = IF(on) (max),
RL = 270Ω
4 µs
Fall Time tf 0.1
Turn-Off Time t(off) 4
Rise Time tr 0.1
COUPLED
ISOLATION
Parameter Symbol Test Condition Min Typ. Max Unit
Isolation Voltage VISO R.H. ≤ 50%,
t = 1 min
5000 VRMS
Input - Output
Resistance
RI-O V
I-O = 500VDC,
1011 Ω
Device is considered a two terminal device : pins 1, 2 and 3 are shorted together and pins 4, 5 and 6 are shorted together.
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IS900
DD93241
Fig 1 Forward Current vs Forward Voltage Fig 2 Transfer Characteristics
Fig 3 Normalized Turn-On Current vs
Supply Voltage
Fig 4 Normalized Turn-On Current vs
Ambient temperature
Fig 5 Low Level Output Voltage vs Load Current
Fig 6 Supply Current vs Supply Voltage
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IS900
DD93241
Switching Time Test Circuit and Waveform
0.1µF
Vo Monitor
VIN
tr = tf = 0.01µs
Z = 50Ω
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IS900
DD93241
ORDER INFORMATION
After PN Description Packing quantity
None Standard DIP6 65 pcs per tube
G 10mm Lead Spacing 65 pcs per tube
SM Surface Mount 65 pcs per tube
SMT&R Surface Mount Tape & Reel 1000 pcs per reel
IS900 (UL Approval)
PN
IS900
IS900G
IS900SM
IS900SMT&R
After PN Description Packing quantity
None Standard DIP6 65 pcs per tube
G 10mm Lead Spacing 65 pcs per tube
SM Surface Mount 65 pcs per tube
SMT&R Surface Mount Tape & Reel 1000 pcs per reel
IS900V (UL Approval and VDE Approvals)
PN
IS900V
IS900VG
IS900VSM
IS900VSMT&R
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IS900
DD93241
DEVICE MARKING
IS900 denotes Device Part Number (IS900 as example)
I denotes Isocom
Y denotes 1 digit Year code
WW denotes 2 digit Week code
IS900
IYWW
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IS900
DD93241
DIP
G Form
SMD
PACKAGE DIMENSIONS in mm (inch)
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IS900
DD93241
RECOMMENDED PAD LAYPUT FOR SMD (mm)
TAPE AND REEL PACKAGING
Direction of feed from reel
Dimension No. A B Do D1 E F
Dimension( mm) 10.4±0.1 7.5±0.1 1.5±0.1 1.5+0.1/-0 1.75±0.1 7.5±0.1
Dimension No. Po P1 P2 t W K
Dimension (mm) 4.0±0.15 12.0±0.1 2.0±0.1 0.35±0.03 16.0±0.2 4.5±0.1
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IS900
DD93241
IR REFLOW SOLDERING TEMPERATURE PROFILE
(One Time Reflow Soldering is Recommended)
TIME (s)
TEMP (°C)
25°C
ts Preheat
60s – 120s
Tsmin
Tsmax
260°C
TL 217°C
Time 25°C to Peak Temperature
tP
TP - 5°C
TP
Max Ramp Up Rate
3°C/s
Max Ramp Down Rate
6°C/s
TL
200°C
150°C
Profile Details Conditions
Preheat
- Min Temperature (TSMIN)
- Max Temperature (TSMAX)
- Time TSMIN to TSMAX (ts)
150°C
200°C
60s - 120s
Soldering Zone
- Peak Temperature (TP)
- Time at Peak Temperature
- Liquidous Temperature (TL)
- Time within 5°C of Actual Peak Temperature (TP 5°C)
- Time maintained above TL (tL)
- Ramp Up Rate (TL to TP)
- Ramp Down Rate (TP to TL)
260°C
10s max
217°C
30s max
60s - 100s
3°C/s max
6°C/s max
Average Ramp Up Rate (Tsmax to TP) 3°C/s max
Time 25°C to Peak Temperature 8 minutes max
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DISCLAIMER
DD93241
Isocom Components is continually working to improve the quality and reliability of its products.
Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent
electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer,
when utilizing Isocom Components products, to comply with the standards of safety in making
a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such Isocom Components products could cause loss of human life, bodily injury or damage to
property.
In developing your designs, please ensure that Isocom Components products are used within
specified operating ranges as set forth in the most recent Isocom Components products
specifications.
The Isocom Components products listed in this document are intended for usage in general
electronics applications (computer, personal equipment, office equipment, measuring
equipment, industrial robotics, domestic appliances, etc.). These Isocom Components
products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss
of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy
control instruments, airplane or spaceship instruments, transportation Instruments, traffic
signal instruments, combustion control instruments, medical Instruments, all types of safety
devices, etc... Unintended Usage of Isocom Components products listed in this document
shall be made at the customer’s own risk.
Gallium arsenide (GaAs) is a substance used in the products described in this document.
GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to
dissolve them. When disposing of the products, follow the appropriate regulations. Do not
dispose of the products with other industrial waste or with domestic garbage.
The products described in this document are subject to the foreign exchange and foreign trade
laws.
The information contained herein is presented only as a guide for the applications of our
products. No responsibility is assumed by Isocom Components for any infringements of
intellectual property or other rights of the third parties which may result from its use. No license
is granted by implication or otherwise under any intellectual property or other rights of Isocom
Components or others.
The information contained herein is subject to change without notice.
