• All specifications are subject to change without notice.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
Chip Beads
For power line
ACC series
Type:
Issue date:
HFxxACC2012 [0805 inch]*
HFxxACC3216 [1206 inch]
HFxxACC3225 [1210 inch]
HFxxACC4532 [1812 inch]
* Dimensions Code [EIA]
September 2012
(1/3)
001-03 / 20110929 / e9413_acc.fm
• All specifications are subject to change without notice.
Chip Beads
For Power Line
ACC Series
HFxxACC2012, HFxxACC3216, HFxxACC3225, HFxxACC4532
FEATURES
• With 4 types rated at 1.5A and 3 types rated at 3A, and with a
range of frequency characteristics available for each type, the
ACC series facilitates selection of the most appropriate part for
any given application.
• Effective EMC suppression over a broad band can be achieved
simply be inserting this product into the DC power line on the cir-
cuit board.
• Available reflow soldering.
• It is a product conforming to RoHS directive.
PRODUCT IDENTIFICATION
(1) Material name
(2) Series name
(3) Dimension code
(4) Packaging style
T: ø180mm reel taping
TL: ø330mm reel taping
SPECIFICATIONS
PACKAGING STYLE AND QUANTITIES
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
SHAPES AND DIMENSIONS/CIRCUIT DIAGRAM
Dimensions in mm
• Dimension without tolerance is reference value.
RECOMMENDED PC BOARD PATTERN
REFLOW SOLDERING
Dimensions in mm
Conformity to RoHS Directive
HF70 ACC 201209 - T
(1) (2) (3) (4)
Operating temperature range –40 to +125°C
Storage temperature range –40 to +125°C(After mount)
Packaging style Type Quantity
Taping
201209 2000 pieces/reel
321611 2000 pieces/reel
322513 2000 pieces/reel
453215 1000 pieces/reel
Ty p e L W T D
201209 2.0±0.2 1.25±0.2 0.9±0.2 0.3±0.2
321611 3.2±0.2 1.6±0.2 1.1±0.2 0.3±0.2
322513 3.2±0.2 2.5±0.2 1.3±0.2 0.3±0.2
453215 4.5±0.25 3.2±0.25 1.5±0.25 0.3±0.2
Ty p e a b c
201209 1.0 1.0 1.0
321611 1.1 2.2 1.4
322513 1.1 2.2 2.3
453215 1.5 3.0 3.0
L
W
D
T
Terminal electrode
Ferrite
Insulation resin
No polarity
aba
c
Resist
Land pattern
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
(2/3)
001-03 / 20110929 / e9413_acc.fm
• All specifications are subject to change without notice.
ELECTRICAL CHARACTERISTICS RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
HF70ACC201209 HF50ACC201209 HF30ACC201209
HF70ACC321611 HF50ACC321611 HF30ACC321611
HF70ACC322513 HF50ACC322513 HF30ACC322513
• TEST EQUIPMENT:RF IMPEDANCE ANALYZER YHP4191A
Shape Part No. Impedance
()[100MHz]
DC
resistance
()max.
Rated
current
(A)max.
201209
HF70ACC201209 10±25% 0.03 1.5
HF50ACC201209 11±25% 0.03 1.5
HF30ACC201209 7±25% 0.03 1.5
321611
HF70ACC321611 26±25% 0.04 1.5
HF50ACC321611 31±25% 0.04 1.5
HF30ACC321611 19±25% 0.04 1.5
322513
HF70ACC322513 52±25% 0.05 1.5
HF50ACC322513 60±25% 0.05 1.5
HF30ACC322513 31±25% 0.05 1.5
453215
HF70ACC453215 120±25% 0.05 1.5
HF50ACC453215 125±25% 0.05 1.5
HF30ACC453215 70±25% 0.05 1.5
Natural
cooling
10s max.
Preheating
60 to 120s
Soldering
30 to 60s
230˚C
250 to 260˚C
180˚C
150˚C
Time(s)
R
X
Z
1000
Frequency(MHz)
100
10
11 10 100 1000
Z, X, R(Ω)
R
X
Z
1000
Frequency(MHz)
100
10
11 10 100 1000
Z, X, R(Ω)
R
X
Z
1000
Frequency(MHz)
100
10
11 10 100 1000
Z, X, R(Ω)
R
X
Z
1000
Frequency(MHz)
100
10
11 10 100 1000
Z, X, R(Ω)
R
X
Z
1000
Frequency(MHz)
100
10
11 10 100 1000
Z, X, R(Ω)
R
X
Z
1000
Frequency(MHz)
100
10
11 10 100 1000
Z, X, R(Ω)
R
X
Z
1000
Frequency(MHz)
100
10
11 10 100 1000
Z, X, R(Ω)
R
X
Z
1000
Frequency(MHz)
100
10
11 10 100 1000
Z, X, R(Ω)
R
X
Z
1000
Frequency(MHz)
100
10
11 10 100 1000
Z, X, R(Ω)
(3/3)
001-03 / 20110929 / e9413_acc.fm
• All specifications are subject to change without notice.
TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
HF70ACC453215 HF50ACC453215 HF30ACC453215
• TEST EQUIPMENT:RF IMPEDANCE ANALYZER YHP4191A
PACKAGING STYLES
201209 TO 322513 TYPES
REEL DIMENSIONS
TAPE DIMENSIONS
453215 TYPE
REEL DIMENSIONS
TAPE DIMENSIONS
RX
Z
1000
Frequency(MHz)
100
10
11 10 100 1000
Z, X, R(Ω)
RX
Z
1000
Frequency(MHz)
100
10
11 10 100 1000
Z, X, R(Ω)
RX
Z
1000
Frequency(MHz)
100
10
11 10 100 1000
Z, X, R(Ω)
Type ABCDT
201209 1.4±0.1 2.25±0.1 4.0±0.1 2.0±0.05 1.25max.
321611 1.75±0.1 3.45±0.1 4.0±0.1 2.0±0.05 1.4max.
322513 2.6±0.1 3.45±0.1 4.0±0.1 2.0±0.05 1.6max.
1.0
ø180±2.0
2.0±0.5
ø13±0.2
ø21±0.8
ø60min.
14.4max.
Dimensions in mm
8.4 +2.0
–0.0
8.0±0.3 3.5±0.05
B
1.75±0.1
TA4.0±0.1 CD
Sprocket
hole 1.5
+0.1
–0.0
Dimensions in mm
0.2 to 0.35 Cavity
40 to 80 Taping 200min.
300min.
Drawing direction
Dimensions in mm
TypeABCDT
453215 3.37±0.1 4.75±0.1 8.0±0.1 2.0±0.05 1.8max.
1.0
ø180±2.0
2.0±0.5
ø13±0.2
ø21±0.8
ø60min.
17.0±1.4
13.0±0.3
Dimensions in mm
12.0±0.3 5.5±0.05
B
1.75±0.1
TA
4.0±0.1
D
C
Sprocket
hole 1.5
+0.1
–0.0
Dimensions in mm
0.3 to 0.5 Cavity
40 to 80 Taping 200min.
300min.
Drawing direction
Dimensions in mm
