1. Product profile
1.1 General description
The devices are a family of RC low pass filters. They are designed to provide filtering of
undesired RF signals on the I/O ports of portable communication or computing devices.
The devices incorporate diodes to provide protection to downstre am components from
ElectroStatic Discharge (ESD) voltages up to 25 kV.
The devices are fabricated using monolithic silicon technology in lead-free plastic
packages.
1.2 Features and benefits
Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen
and antimony (Dark Green compliant)
Integrated 1-, 2-, 4-, 6- and 8-channel -type RC filter network
ESD protection up to 25 kV contact discharge according to IEC 61000-4-2,
far exceeding level 4
1.3 Applications
General-purpose ElectroMagnetic Interference (EMI) and Radio-Frequency
Interference (RFI) filtering and downstream ESD protection for:
Cellular phone and Personal Communication Systems (PCS) mobile handsets
Cordless telephones
Wireless data (WAN/LAN) systems
PEMIxQFN; PEMI2STD family
Integrated 1-, 2-, 4-, 6- and 8-channel passive filter network
with ESD protection
Rev. 2 — 3 November 2011 Product data sheet
Ta ble 1. Product overview
Type number Package Number of
channels Package
pitch (mm) Package configuration
PEMI1QFN SOT883 1 - 3-pin MicroPak (QFN compatible)
PEMI2QFN SOT886 2 0.5 6-pin MicroPak (QFN compatible)
PEMI2STD SOT665 1 - 5-pin microlea d
PEMI4QFN SOT1157-1 4 0.4 8-pin extremely thin leadless
PEMI6QFN SOT1158 -1 6 0.4 12-pin extremely thin leadle ss
PEMI8QFN SOT1159 -1 8 0.4 16-pin extremely thin leadle ss
PEMIXQFN_PEMI2STD_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 2 of 29
NXP Semiconductors PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
1.4 Quick reference data
2. Pinning information
Ta ble 2. Quick reference data
Symbol Parameter Conditions Typ Unit
Rs(ch) channel series resistance
PEMIxxxx/Cx 20
PEMIxxxx/Hx 45
PEMIxxxx/Lx 65
PEMIxxxx/Rx 100
PEMIxxxx/Wx 200
Cch channel capacitance for the total channel;
f=100kHz; V
bias(DC) =0V
PEMIxxxx/xE 15 pF
PEMIxxxx/xG 19 pF
PEMIxxxx/xK 23 pF
PEMIxxxx/xM 28 pF
PEMIxxxx/xP 32 pF
PEMIxxxx/xR 36 pF
PEMIxxxx/xT 40 pF
Ta ble 3. Pinning
Pin Description Simplified outline Graphic symbol
PEMI1QFN (SOT883)
1 and 2 filter channel
3 ground (GND)
PEMI2QFN (SOT886)
1 and 6 filter channel 1
2 and 5 ground (GND)
3 and 4 filter channel 2
3
1
2
Transparent
top view
018aaa042
Rs(ch)
Cch
2
3
1
2Cch
2
Transparent
top view
456
321
018aaa044
Rs(ch)
Cch
4,6
2,5
1,3
2Cch
2
PEMIXQFN_PEMI2STD_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 3 of 29
NXP Semiconductors PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
PEMI2STD (SOT665)
1 and 5 filter channel 1
2 ground (GND)
3 and 4 filter channel 2
PEMI4QFN (SOT1157-1)
1 and 8 filter channel 1
2 and 7 filter channel 2
3 and 6 filter channel 3
4 and 5 filter channel 4
ground
pad ground (GND)
PEMI6QFN (SOT1158-1)
1 and 12 filter channel 1
2 and 11 filter channel 2
3 and 10 filter channel 3
4 and 9 filter channel 4
5 and 8 filter channel 5
6 and 7 filter channel 6
ground
pad ground (GND)
PEMI8QFN (SOT1159-1)
1 and 16 filter channel 1
2 and 15 filter channel 2
3 and 14 filter channel 3
4 and 13 filter channel 4
5 and 12 filter channel 5
6 and 11 filter channel 6
7 and 10 filter channel 7
8 and 9 filter channel 8
ground
pad ground (GND)
Ta ble 3. Pinning …continued
Pin Description Simplified outline Graphic symbol
123
45
018aaa043
Rs(ch)
Cch
4,5
2
1,3
2Cch
2
14
85
Transparent
top view
018aaa071
Rs(ch)
Cch
5 to 81 to 4
GND
2Cch
2
16
12 7
Transparent
top view
018aaa072
Rs(ch)
7 to 121 to 6
GND
Cch
2Cch
2
018aaa073
Rs(ch)
9 to 161 to 8
GND
Cch
2Cch
2
PEMIXQFN_PEMI2STD_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 4 of 29
NXP Semiconductors PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
3. Ordering information
4. Limiting values
Table 4. Ordering info rmation
Type number Package
Name Description Version
PEMI1QFN SC-101 leadless ultra small plastic package; 3 solder lands; body 1.0 0.6 0.5 mm SOT883
PEMI2QFN XSON6 plastic extremely thin small outline package; no leads; 6 terminals;
body 1 1.45 0.5 mm SOT886
PEMI2STD - plastic surface-mounted package; 5 leads SOT665
PEMI4QFN HXSON8 plastic thermal enhanced extremely thin small outline package; no leads;
8 terminals; body 1.2 1.7 0.5 mm SOT1157-1
PEMI6QFN HXSON12 plastic thermal enhanced extremely thin small outline package; no leads;
12 terminals; body 1.2 2.5 0.5 mm SOT1158-1
PEMI8QFN HXSON16 plastic thermal enhanced extremely thin small outline package; no leads;
16 terminals; body 1.2 3.3 0.5 mm SOT1159-1
Ta ble 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage 0.5 +5.6 V
VESD electrostatic discharge
voltage IEC 61000-4-2, level 4
all pins to ground
contact discharge - 15 kV
air discharge - 15 kV
PEMIxxxx/xM;
PEMIxxxx/xP contact discharge - 20 kV
air discharge - 20 kV
PEMIxxxx/xR;
PEMIxxxx/xT contact discharge - 25 kV
air discharge - 25 kV
Pch channel power dissipation continuous power;
Tamb =85C-60mW
Ptot total power dissipation continuous power;
Tamb =85C-120mW
Tstg storage temperature 55 +150 C
Tamb ambient temperature 40 +85 C
PEMIXQFN_PEMI2STD_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 5 of 29
NXP Semiconductors PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
5. Characteristics
Ta ble 6. Channel characteristics
Tamb =25
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Rs(ch) channel series resistance
PEMIxxxx/Cx 18 20 22
PEMIxxxx/Hx 40 45 50
PEMIxxxx/Lx 58 65 72
PEMIxxxx/Rx 90 100 110
PEMIxxxx/Wx 180 200 220
Cch channel capacitance for the total channel;
f = 100 kHz
PEMIxxxx/xE Vbias(DC) =0V - 15 - pF
Vbias(DC) = 2.5 V - 8.5 - pF
PEMIxxxx/xG Vbias(DC) =0V - 19 - pF
Vbias(DC) =2.5V - 11 - pF
PEMIxxxx/xK Vbias(DC) =0V - 23 - pF
Vbias(DC) = 2.5 V - 13.5 - pF
PEMIxxxx/xM Vbias(DC) =0V - 28 - pF
Vbias(DC) =2.5V - 16 - pF
PEMIxxxx/xP Vbias(DC) =0V - 32 - pF
Vbias(DC) = 2.5 V - 18.5 - pF
PEMIxxxx/xR Vbias(DC) =0V - 36 - pF
Vbias(DC) =2.5V - 21 - pF
PEMIxxxx/xT Vbias(DC) =0V - 40 - pF
Vbias(DC) =2.5V - 23 - pF
VBR breakdown voltage positive clamp; II=1mA 5.8 - 9 V
VFforward voltage negative clamp; IF=1mA 1.5 - 0.4 V
ILR reverse leakage current per channel; VI= 3.5 V - - 0.1 A
PEMIXQFN_PEMI2STD_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 6 of 29
NXP Semiconductors PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Ta ble 7. Frequency chara cteristics
Tamb =25
C; unless otherwise specified; Rsource =50
; RL=50
.
Symbol Parameter Conditions Min Typ Max Unit
il insertion loss Cch =15pF
PEMIxxxx/CE Rs(ch) =20
800MHz<f<3GHz 7 - - dB
f=5GHz - 30 - dB
PEMIxxxx/HE Rs(ch) =45
800MHz<f<3GHz 9 - - dB
f=4GHz - 31 - dB
PEMIxxxx/LE Rs(ch) =65
800MHz<f<3GHz 11 - - dB
f=3.5GHz - 32 - dB
PEMIxxxx/RE Rs(ch) = 100
800MHz<f<3GHz 13 - - dB
f=3GHz - 33 - dB
PEMIxxxx/WE Rs(ch) = 200
800MHz<f<3GHz 18 - - dB
f=2.2GHz - 34 - dB
il insertion loss Cch =19pF
PEMIxxxx/CG Rs(ch) =20
800MHz<f<3GHz 9 - - dB
f=4GHz - 32 - dB
PEMIxxxx/HG Rs(ch) =45
800MHz<f<3GHz 11 - - dB
f=3.2GHz - 33 - dB
PEMIxxxx/LG Rs(ch) =65
800MHz<f<3GHz 13 - - dB
f = 2.8 GHz - 33.5 - dB
PEMIxxxx/RG Rs(ch) = 100
800MHz<f<3GHz 15 - - dB
f=2.5GHz - 34 - dB
PEMIxxxx/WG Rs(ch) = 200
800MHz<f<3GHz 21 - - dB
f = 1.9 GHz - 35.5 - dB
PEMIXQFN_PEMI2STD_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 7 of 29
NXP Semiconductors PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
il insertion loss Cch =23pF
PEMIxxxx/CK Rs(ch) =20
800MHz<f<3GHz 10 - - dB
f=3.6GHz - 33 - dB
PEMIxxxx/HK Rs(ch) =45
800MHz<f<3GHz 13 - - dB
f=2.8GHz - 34 - dB
PEMIxxxx/LK Rs(ch) =65
800MHz<f<3GHz 15 - - dB
f=2.5GHz - 35 - dB
PEMIxxxx/RK Rs(ch) = 100
800MHz<f<3GHz 18 - - dB
f=2.1GHz - 36 - dB
PEMIxxxx/WK Rs(ch) = 200
800MHz<f<3GHz 24 - - dB
f=1.6GHz - 37 - dB
il insertion loss Cch =28pF
PEMIxxxx/CM Rs(ch) =20
800MHz<f<3GHz 12 - - dB
f=3.2GHz - 34 - dB
PEMIxxxx/HM Rs(ch) =45
800MHz<f<3GHz 15 - - dB
f=2.5GHz - 35 - dB
PEMIxxxx/LM Rs(ch) =65
800MHz<f<3GHz 17 - - dB
f=2.1GHz - 36 - dB
PEMIxxxx/RM Rs(ch) = 100
800MHz<f<3GHz 21 - - dB
f=1.8GHz - 37 - dB
PEMIxxxx/WM Rs(ch) = 200
800MHz<f<3GHz 27 - - dB
f=1.4GHz - 38 - dB
Ta ble 7. Frequency chara cteristics …continued
Tamb =25
C; unless otherwise specified; Rsource =50
; RL=50
.
Symbol Parameter Conditions Min Typ Max Unit
PEMIXQFN_PEMI2STD_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 8 of 29
NXP Semiconductors PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
il insertion loss Cch =32pF
PEMIxxxx/CP Rs(ch) =20
800MHz<f<3GHz 13 - - dB
f=2.9GHz - 36 - dB
PEMIxxxx/HP Rs(ch) =45
800MHz<f<3GHz 17 - - dB
f=2.2GHz - 36 - dB
PEMIxxxx/LP Rs(ch) =65
800MHz<f<3GHz 19 - - dB
f=1.9GHz - 37 - dB
PEMIxxxx/RP Rs(ch) = 100
800MHz<f<3GHz 23 - - dB
f=1.6GHz - 38 - dB
PEMIxxxx/WP Rs(ch) = 200
800MHz<f<3GHz 30 - - dB
f=1.2GHz - 39 - dB
il insertion loss Cch =36pF
PEMIxxxx/CR Rs(ch) =20
800MHz<f<3GHz 14 - - dB
f=2.6GHz - 36 - dB
PEMIxxxx/HR Rs(ch) =45
800MHz<f<3GHz 18 - - dB
f=2.0GHz - 37 - dB
PEMIxxxx/LR Rs(ch) =65
800MHz<f<3GHz 21 - - dB
f=1.8GHz - 38 - dB
PEMIxxxx/RR Rs(ch) = 100
800MHz<f<3GHz 25 - - dB
f=1.6GHz - 39 - dB
PEMIxxxx/WR Rs(ch) = 200
800MHz<f<3GHz 32 - - dB
f=1.2GHz - 40 - dB
Ta ble 7. Frequency chara cteristics …continued
Tamb =25
C; unless otherwise specified; Rsource =50
; RL=50
.
Symbol Parameter Conditions Min Typ Max Unit
PEMIXQFN_PEMI2STD_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 9 of 29
NXP Semiconductors PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
6. Application information
6.1 Use cases
The selection of one of the filter devices has to be performed in dependence of the
maximum clock frequency, the driver strength, the capacitive load of the sink and the
maximum applicable rise and fall times.
6.2 LCD interfaces, medium-speed interfaces
For digital interfaces such as Liquid Crystal Display (LCD) interfaces running at clock
speeds between 10 MHz and 25 MHz or more, the devices can b e used in depe ndence of
the sink load, the clock speed, the driver strength and the rise and fall time requirements.
The minimum EMI filter requirements may be an important factor, too.
6.3 Keypad, low-speed interfaces
Especially for lower-speed interfaces such as keypads, low-speed serial interfaces and
low-speed control signals, the devices offer a very robust ESD protection and strong
suppression of unwanted frequencies (EMI filtering). Due to their small size the devices
can easily be spread on a Printed-Circuit Boa rd (PCB) in order to move the ESD and EMI
protection close to the part of the design which shall be protected.
il insertion loss Cch =40pF
PEMIxxxx/CT Rs(ch) =20
800MHz<f<3GHz 16 - - dB
f=2.5GHz - 36 - dB
PEMIxxxx/HT Rs(ch) =45
800MHz<f<3GHz 20 - - dB
f=1.9GHz - 38 - dB
PEMIxxxx/LT Rs(ch) =65
800MHz<f<3GHz 23 - - dB
f=1.6GHz - 39 - dB
PEMIxxxx/RT Rs(ch) = 100
800MHz<f<3GHz 27 - - dB
f=1.4GHz - 40 - dB
PEMIxxxx/WT Rs(ch) = 200
800MHz<f<3GHz 32 - - dB
f=1.0GHz - 41 - dB
Ta ble 7. Frequency chara cteristics …continued
Tamb =25
C; unless otherwise specified; Rsource =50
; RL=50
.
Symbol Parameter Conditions Min Typ Max Unit
PEMIXQFN_PEMI2STD_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 10 of 29
NXP Semiconductors PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
6.4 Insertion loss
The devices are designed as EMI/RFI filters for multichannel interfaces.
All measurements were performed in a typical 50 Net Work Analyzer (NWA) setup as
shown in Figure 1. The insertion loss was measured with a test Printed-Circuit
Board (PCB) utilizing laser-drilled micro-via holes which connect the PCB ground plane to
the devices grou n d pins .
Fig 1. Frequency response setu p
018aaa074
50 Ω
Vgen
50 Ω
DUT OUTIN
Rs(ch) =20
(1) PEMIxxxx/CE
(2) PEMIxxxx/CG
(3) PEMIxxxx/CK
(4) PEMIxxxx/CM
(5) PEMIxxxx/CP
(6) PEMIxxxx/CR
(7) PEMIxxxx/CT
Rs(ch) =45
(1) PEMIxxxx/HE
(2) PEMIxxxx/HG
(3) PEMIxxxx/HK
(4) PEMIxxxx/HM
(5) PEMIxxxx/HP
(6) PEMIxxxx/HR
(7) PEMIxxxx/HT
Fig 2. PEMIxxxx/Cx: Frequency response curves Fig 3. PEMIxxxx/Hx: Frequency response curves
018aaa161
–30
–20
–40
–10
0
S21
(dB)
–50
f (MHz)
110
4
103
10 102
(1)
(2)
(3)
(4)
(5)
(6)
(7)
018aaa162
–30
–20
–40
–10
0
S21
(dB)
–50
f (MHz)
110
4
103
10 102
(1)
(2)
(3)
(4)
(5)
(6)
(7)
PEMIXQFN_PEMI2STD_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 11 of 29
NXP Semiconductors PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Rs(ch) =65
(1) PEMIxxxx/LE
(2) PEMIxxxx/LG
(3) PEMIxxxx/LK
(4) PEMIxxxx/LM
(5) PEMIxxxx/LP
(6) PEMIxxxx/LR
(7) PEMIxxxx/LT
Rs(ch) = 100
(1) PEMIxxxx/RE
(2) PEMIxxxx/RG
(3) PEMIxxxx/RK
(4) PEMIxxxx/RM
(5) PEMIxxxx/RP
(6) PEMIxxxx/RR
(7) PEMIxxxx/RT
Fig 4. PEMIxxxx/Lx: Frequency response curves Fig 5. PEMIxxxx/Rx: Frequency response curves
018aaa163
–30
–20
–40
–10
0
S21
(dB)
–50
f (MHz)
110
4
103
10 102
(1)
(2)
(3)
(4)
(5)
(6)
(7)
018aaa164
–30
–20
–40
–10
0
S21
(dB)
–50
f (MHz)
110
4
103
10 102
(1)
(2)
(3)
(4)
(5)
(6)
(7)
PEMIXQFN_PEMI2STD_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 12 of 29
NXP Semiconductors PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
All important values of the RF behavior such as relative 3dB frequency, insertion loss at
800 MHz and above and also the DC attenuation in an NWA environment can be derived
from the insertion loss response curves depicted in Figure 2 to 6.
Note: insertion loss at low frequencies (1 MHz) is nearly independent from the channel
capacitance values available within the PEMI family.
6.4.1 Relative 3dB frequency (-filter structure)
Rs(ch) =200
(1) PEMIxxxx/WE
(2) PEMIxxxx/WG
(3) PEMIxxxx/WK
(4) PEMIxxxx/WM
(5) PEMIxxxx/WP
(6) PEMIxxxx/WR
(7) PEMIxxxx/WT
Fig 6. PEMIxxxx/Wx: Frequency response curves
018aaa165
–30
–20
–40
–10
0
S21
(dB)
–50
f (MHz)
110
4
103
10 102
(1)
(2)
(3)
(4)
(5)
(6)
(7)
Ta ble 8. Relative 3dB frequency (MHz) per RC combination; typical values
Tamb =25
C; unless otherwise specified.
PEMIxxxx/ xE xG xK xM xP xR xT
Cch (pF) 15 19 23 28 32 36 40
PEMIxxxx/ Rs(ch)
Cx 20 397 MHz 317 MHz 264 MHz 218 MHz 194 MHz 170 MHz 153 MHz
Hx 45 376 MHz 300 MHz 249 MHz 206 MHz 185 MHz 161 MHz 145 MHz
Lx 65 361 MHz 288 MHz 239 MHz 197 MHz 176 MHz 155 MHz 139 MHz
Rx 100 343 MHz 272 MHz 227 MHz 187 MHz 166 MHz 145 MHz 131 MHz
Wx 200 311 MHz 247 MHz 205 MHz 169 MHz 150 MHz 132 MHz 119 MHz
PEMIXQFN_PEMI2STD_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 13 of 29
NXP Semiconductors PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
6.4.2 Insertion loss (dB) at 800 MHz (-filter structure)
6.4.3 Insertion loss (dB) at frequencies lower than 1 MHz (-filter structure)
7. Marking
Ta ble 9. Insertion loss (dB) at 800 M Hz per RC combination; typical values
Tamb =25
C; unless otherwise specified.
PEMIxxxx/ xE xG xK xM xP xR xT
Cch (pF) 15 19 23 28 32 36 40
PEMIxxxx/ Rs(ch)
Cx 20 9dB 11 dB 13 dB 15 dB 16 dB 18 dB 19 dB
Hx 45 12 dB 14 dB 17 dB 19 dB 21 dB 23 dB 25 dB
Lx 65 14 dB 17 dB 19 dB 22 dB 25 dB 27 dB 29 dB
Rx 100 17 dB 20 dB 23 dB 26 dB 29 dB 32 dB 35 dB
Wx 200 22 dB 26 dB 29 dB 34 dB 36 dB 39 dB 41 dB
Ta ble 10. Insertion loss (dB) at 1 M Hz per RC combination; typical values
Tamb =25
C; unless otherwise specified.
PEMIxxxx/ xE xG xK xM xP xR xT
Cch (pF) 15 19 23 28 32 36 40
PEMIxxxx/ Rs(ch)
Cx 20 1.6 dB 1.6 dB 1.6 dB 1.6 dB 1.6 dB 1.6 dB 1.6 dB
Hx 45 3.2 dB 3.2 dB 3.2 dB 3.2 dB 3.2 dB 3.2 dB 3.2 dB
Lx 65 4.3 dB 4.3 dB 4.3 dB 4.3 dB 4.3 dB 4.3 dB 4.3 dB
Rx 100 6.0 dB 6.0 dB 6.0 dB 6.0 dB 6.0 dB 6.0 dB 6.0 dB
Wx 200 9.5 dB 9.5 dB 9.5 dB 9.5 dB 9.5 dB 9.5 dB 9.5 dB
Table 11. Marking codes
Type number Marking
code Type number Marking
code Type number Marking
code Type number Marking
code
PEMI1QFN/CE CE PEMI2QFN/LP LP PEMI4QFN/CE CE PEMI6QFN/LP LP
PEMI1QFN/CG CG PEMI2QFN/LR LR PEMI4QFN/CG CG PEMI6QFN/LR LR
PEMI1QFN/CK CK PEMI2QFN/LT LT PEMI4QFN/CK CK PEMI6QFN/LT LT
PEMI1QFN/CM CM PEMI2QFN/RE RE PEMI4QFN/CM CM PEMI6QFN/RE RE
PEMI1QFN/CP CP PEMI2QFN/RG RG PEMI4QFN/CP CP PEMI6QFN/RG RG
PEMI1QFN/CR CR PEMI2QFN/RK RK PEMI4QFN/CR CR PEMI6QFN/RK RK
PEMI1QFN/CT CT PEMI2QFN/RM RM PEMI4QFN/CT CT PEMI6QFN/RM RM
PEMI1QFN/HE HE PEMI2QFN/RP RP PEMI4QFN/HE HE PEMI6QFN/RP RP
PEMI1QFN/HG HG PEMI2QFN/RR RR PEMI4QFN/HG HG PEMI6QFN/RR RR
PEMI1QFN/HK HK PEMI2QFN/RT RT PEMI4QFN/HK HK PEMI6QFN/RT RT
PEMI1QFN/HM HM PEMI2QFN/WE WE PEMI4QFN/HM HM PEMI6QFN/WE WE
PEMI1QFN/HP HP PEMI2QFN/WG WG PEMI4QFN/HP HP PEMI6QFN/WG WG
PEMI1QFN/HR HR PEMI2QFN/WK WK PEMI4QFN/HR HR PEMI6QFN/WK WK
PEMI1QFN/HT HT PEMI2QFN/WM WM PEMI4QFN/HT HT PEMI6QFN/WM WM
PEMIXQFN_PEMI2STD_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 14 of 29
NXP Semiconductors PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
PEMI1QFN/LE LE PEMI2QFN/WP WP PEMI4QFN/LE LE PEMI6QFN/WP WP
PEMI1QFN/LG LG PEMI2QFN/WR WR PEMI4QFN/LG LG PEMI6QFN/WR WR
PEMI1QFN/LK LK PEMI2QFN/WT WT PEMI4QFN/LK LK PEMI6QFN/WT WT
PEMI1QFN/LM LM PEMI2STD/CE CE PEMI4QFN/LM LM PEMI8QFN/CE CE
PEMI1QFN/LP LP PEMI2STD/CG CG PEMI4QFN/LP LP PEMI8QFN/CG CG
PEMI1QFN/LR LR PEMI2STD/CK CK PEMI4QFN/LR LR PEMI8QFN/CK CK
PEMI1QFN/LT LT PEMI2STD/CM CM PEMI4QFN/LT LT PEMI8QFN/CM CM
PEMI1QFN/RE RE PEMI2STD/CP CP PEMI4QFN/RE RE PEMI8QFN/CP CP
PEMI1QFN/RG RG PEMI2STD/CR CR PEMI4QFN/RG RG PEMI8QFN/CR CR
PEMI1QFN/RK RK PEMI2STD/CT CT PEMI4QFN/RK RK PEMI8QFN/CT CT
PEMI1QFN/RM RM PEMI2STD/HE HE PEMI4QFN/RM RM PEMI8QFN/HE HE
PEMI1QFN/RP RP PEMI2STD/HG HG PEMI4QFN/RP RP PEMI8QFN/HG HG
PEMI1QFN/RR RR PEMI2STD/HK HK PEMI4QFN/RR RR PEMI8QFN/HK HK
PEMI1QFN/RT RT PEMI2STD/HM HM PEMI4QFN/RT RT PEMI8QFN/HM HM
PEMI1QFN/WE WE PEMI2STD/HP HP PEMI4QFN/WE WE PEMI8QFN/HP HP
PEMI1QFN/WG WG PEMI2STD/HR HR PEMI4QFN/WG WG PEMI8QFN/HR HR
PEMI1QFN/WK WK PEMI2STD/HT HT PEMI4QFN/WK WK PEMI8QFN/HT HT
PEMI1QFN/WM WM PEMI2STD/LE LE PEMI4QFN/WM WM PEMI8QFN/LE LE
PEMI1QFN/WP WP PEMI2STD/LG LG PEMI4QFN/WP WP PEMI8QFN/LG LG
PEMI1QFN/WR WR PEMI2STD/LK LK PEMI4QFN/WR WR PEMI8QFN/LK LK
PEMI1QFN/WT WT PEMI2STD/LM LM PEMI4QFN/WT WT PEMI8QFN/LM LM
PEMI2QFN/CE CE PEMI2STD/LP LP PEMI6QFN/CE CE PEMI8QFN/LP LP
PEMI2QFN/CG CG PEMI2STD/LR LR PEMI6QFN/CG CG PEMI8QFN/LR LR
PEMI2QFN/CK CK PEMI2STD/LT LT PEMI6QFN/CK CK PEMI8QFN/LT LT
PEMI2QFN/CM CM PEMI2STD/RE RE PEMI6QFN/CM CM PEMI8QFN/RE RE
PEMI2QFN/CP CP PEMI2STD/RG RG PEMI6QFN/CP CP PEMI8QFN/RG RG
PEMI2QFN/CR CR PEMI2STD/RK RK PEMI6QFN/CR CR PEMI8QFN/RK RK
PEMI2QFN/CT CT PEMI2STD/RM RM PEMI6QFN/CT CT PEMI8QFN/RM RM
PEMI2QFN/HE HE PEMI2STD/RP RP PEMI6QFN/HE HE PEMI8QFN/RP RP
PEMI2QFN/HG HG PEMI2STD/RR RR PEMI6QFN/HG HG PEMI8QFN/RR RR
PEMI2QFN/HK HK PEMI2STD/RT RT PEMI6QFN/HK HK PEMI8QFN/RT RT
PEMI2QFN/HM HM PEMI2STD/WE WE PEMI6QFN/HM HM PEMI8QFN/WE WE
PEMI2QFN/HP HP PEMI2STD/WG WG PEMI6QFN/HP HP PEMI8QFN/WG WG
PEMI2QFN/HR HR PEMI2STD/WK WK PEMI6QFN/HR HR PEMI8QFN/WK WK
PEMI2QFN/HT HT PEMI2STD/WM WM PEMI6QFN/HT HT PEMI8QFN/WM WM
PEMI2QFN/LE LE PEMI2STD/WP WP PEMI6QFN/LE LE PEMI8QFN/WP WP
PEMI2QFN/LG LG PEMI2STD/WR WR PEMI6QFN/LG LG PEMI8QFN/WR WR
PEMI2QFN/LK LK PEMI2STD/WT WT PEMI6QFN/LK LK PEMI8QFN/WT WT
PEMI2QFN/LM LM - - PEMI6QFN/LM LM - -
Table 11. Marking codes …continued
Type number Marking
code Type number Marking
code Type number Marking
code Type number Marking
code
PEMIXQFN_PEMI2STD_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 15 of 29
NXP Semiconductors PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
8. Package outline
Fig 7. Package outline PEMI1QFN (SOT883/SC-101)
UNIT A1
max.
A(1) bb
1e1
eLL
1
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.50
0.46 0.20
0.12 0.55
0.47
0.03 0.62
0.55 0.35 0.65
DIMENSIONS (mm are the original dimensions)
Note
1. Including plating thickness
0.30
0.22
0.30
0.22
SOT883 SC-101 03-02-05
03-04-03
DE
1.02
0.95
L
E
2
3
1
b
b1
A1
A
D
L1
0 0.5 1 mm
scale
Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm SOT883
e
e1
PEMIXQFN_PEMI2STD_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 16 of 29
NXP Semiconductors PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Fig 8. Package outline PEMI2QFN (SOT886/XSON6)
terminal 1
index area
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
SOT886 MO-252
SOT886
04-07-15
04-07-22
DIMENSIONS (mm are the original dimensions)
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm
D
E
e1
e
A1
b
L
L1
e1
0 1 2 mm
scale
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
UNIT
mm 0.25
0.17 1.5
1.4 0.35
0.27
A1
max b E
1.05
0.95
Dee
1L
0.40
0.32
L1
0.50.6
A(1)
max
0.5 0.04
1
6
2
5
3
4
6×
(2)
4×
(2)
A
PEMIXQFN_PEMI2STD_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 17 of 29
NXP Semiconductors PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Fig 9. Package outline PEMI2STD (SOT665)
UNIT bpcDE e1HELpw
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
04-11-08
06-03-16
IEC JEDEC JEITA
mm 0.27
0.17 0.18
0.08 1.7
1.5 1.3
1.1 0.5
e
1.0 1.7
1.5 0.1
y
0.1
DIMENSIONS (mm are the original dimensions)
0.3
0.1
SOT665
bp
D
e1
e
A
Lp
detail X
HE
E
wMA
A
S
0 1 2 mm
scale
A
0.6
0.5
c
X
123
45
Plastic surface-mounted package; 5 leads SOT665
YS
PEMIXQFN_PEMI2STD_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 18 of 29
NXP Semiconductors PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Fig 10. Package outline PEMI4QFN (SOT1 157-1/HXSON8)
References
Outline
version European
projection Issue date
IEC JEDEC JEITA
SOT1157-1 - - -
- - -
- - -
sot1157-1_po
09-12-16
09-12-17
HXSON8: plastic thermal enhanced extremely thin small outline package; no leads;
8 terminals; body 1.2 x 1.7 x 0.5 mm SOT1157-1
Unit(1)
mm max
nom
min
0.5 0.05
0.00
0.25
0.20
0.15
1.8
1.7
1.6
1.25
1.20
1.15
1.3
1.2
1.1 0.4 1.2 0.30
0.25
0.20 0.05
A
Dimensions
Note
1. Plastic or metal protrusions of 0.075 maximum per side are not included.
A1A3
0.127
bDD
2EE
2
0.35
0.30
0.25
ee
1k
0.2
Lv
0.1
w
0.05
y
0.05
y1
0 1 2 mm
scale
X
C
y
C
y1
b
e1
eAC B
vCw
terminal 1
index area
D2
E2
L
k
8 5
1 4
BA
terminal 1
index area
D
E
detail X
AA1A3
PEMIXQFN_PEMI2STD_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 19 of 29
NXP Semiconductors PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Fig 11. Package outline PEMI6QFN (SOT1158-1/HXSON12)
References
Outline
version European
projection Issue date
IEC JEDEC JEITA
SOT1158-1 - - -
- - -
- - -
sot1158-1_po
09-12-16
09-12-17
HXSON12: plastic thermal enhanced extremely thin small outline package; no leads;
12 terminals; body 1.2 x 2.5 x 0.5 mm SOT1158-1
Unit(1)
mm max
nom
min
0.5 0.05
0.00
0.25
0.20
0.15
2.6
2.5
2.4
2.1
2.0
1.9
1.3
1.2
1.1 0.4 2 0.30
0.25
0.20 0.05
A
Dimensions
Note
1. Plastic or metal protrusions of 0.075 maximum per side are not included.
A1A3
0.127
bDD
2EE
2
0.35
0.30
0.25
ee
1k
0.2
Lv
0.1
w
0.05
y
0.05
y1
0 1 2 mm
scale
X
C
y
C
y1
b
e1
eAC B
vCw
terminal 1
index area
D2
E2
L
k
12 7
1 6
BA
terminal 1
index area
D
E
detail X
AA1A3
PEMIXQFN_PEMI2STD_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 20 of 29
NXP Semiconductors PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Fig 12. Package outline PEMI8QFN (SOT1 159-1/HXSON16)
References
Outline
version European
projection Issue date
IEC JEDEC JEITA
SOT1159-1 - - -
- - -
- - -
sot1159-1_po
09-12-16
09-12-17
Unit(1)
mm max
nom
min
0.5 0.05
0.00
0.25
0.20
0.15
3.4
3.3
3.2
2.9
2.8
2.7
1.3
1.2
1.1 0.4 2.8 0.30
0.25
0.20 0.05
A
Dimensions
Note
1. Plastic or metal protrusions of 0.075 maximum per side are not included.
HXSON16: plastic thermal enhanced extremely thin small outline package; no leads;
16 terminals; body 1.2 x 3.3 x 0.5 mm SOT1159-1
A1A3
0.127
bDD
2EE
2
0.35
0.30
0.25
ee
1k
0.2
Lv
0.1
w
0.05
y
0.05
y1
0 1 2 mm
scale
X
C
y
C
y1
b
e1
eAC B
vCw
terminal 1
index area
D2
E2
L
k
16 9
1 8
BA
terminal 1
index area
D
E
detail X
AA1A3
PEMIXQFN_PEMI2STD_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 21 of 29
NXP Semiconductors PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
9. Soldering
Reflow soldering is the only recommended soldering method.
Fig 13. Reflow soldering PEMI1QFN (SOT883/SC-101)
Reflow soldering is the only recommended soldering method.
Fig 14. Reflow sol de r ing PEMI2QFN (SOT886/XSON6)
solder lands
solder resist
occupied area
solder paste
sot883_fr
1.3
0.3
0.6 0.7
0.4
0.9
0.3
(2×)
0.4
(2×)
0.25
(2×)
R0.05 (12×)
0.7
Dimensions in mm
sot886_fr
solder resist
occupied area
solder paste = solderland
Dimensions in mm
0.425
(6×)
1.250
0.675
1.700
0.325
(6×)
0.270
(6×)
0.370
(6×)
0.500
0.500
PEMIXQFN_PEMI2STD_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 22 of 29
NXP Semiconductors PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Reflow soldering is the only recommended soldering method.
Fig 15. Reflow soldering PEMI2STD (SOT665)
2.45
2.1
1.6
20.25 0.3
0.6
0.65
0.55
0.325
(2×)
0.45
(4×)
0.4
(2×)
0.45
(2×)
0.7
(2×)
0.5
(4×)
0.375
(2×)
0.4
(5×)
1.7
1
0.538
solder lands
placement area
occupied area
solder paste
sot665_fr
Dimensions in mm
PEMIXQFN_PEMI2STD_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 23 of 29
NXP Semiconductors PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Reflow soldering is the only recommended soldering method.
Fig 16. Reflow soldering PEMI4QFN (SOT1157-1/HXSON8)
SOT1157-1
DIMENSIONS in mm
Footprint information for reflow soldering of HXSON8 package
Generic footprint pattern
Refer to the package outline drawing for actual layout
By D Slx Sly Gx Gy Hx Hy
0.75 0.22 1.25 0.35
P
0.40
Ay
1.75 1.65 1.45 1.95 2.0
SPx SPy
0.6 0.2
solder land plus solder paste
occupied area
solder land
solder paste deposit
solder resist
DP
Gx
Gy
Hx
Hy SPy SLyByAy
nSPy
nSPx
SPx
SLx
0.025
0.025
sot1157-1_fr
Issue date 11-06-27
11-07-06
PEMIXQFN_PEMI2STD_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 24 of 29
NXP Semiconductors PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Reflow soldering is the only recommended soldering method.
Fig 17. Reflow soldering PEMI6QFN (SOT 1158-1/HXSON12)
SOT1158-1
DIMENSIONS in mm
Footprint information for reflow soldering of HXSON12 package
By D Slx Sly Gx Gy Hx Hy
0.75 0.22 2.1 0.35
P
0.40
Ay
1.75 2.45 1.45 2.75 2.0
SPx SPy
0.9 0.2
solder land plus solder paste
occupied area
solder land
solder paste deposit
solder resist
sot1158-1_fr
Generic footprint pattern
Refer to the package outline drawing for actual layout
DP
Gx
Gy
Hx
Hy SPy SPy tot SLyByAy
nSPy
nSPx
SPx
SLx
0.025
0.025
Issue date 11-06-27
11-07-06
PEMIXQFN_PEMI2STD_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 25 of 29
NXP Semiconductors PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Reflow soldering is the only recommended soldering method.
Fig 18. Reflow soldering PEMI8QFN (SOT 1159-1/HXSON16)
SOT1159-1
DIMENSIONS in mm
Footprint information for reflow soldering of HXSON16 package
By D Slx Sly Gx Gy Hx Hy
0.75 0.21 2.9 0.35
P
0.40
Ay
2.15 3.25 1.45 3.55 2.4
SPx SPy
1.3 0.2
solder land plus solder paste
occupied area
solder land
solder paste deposit
solder resist
sot1159-1_fr
Generic footprint pattern
Refer to the package outline drawing for actual layout
DP
Gx
Gy
Hx
Hy SPy SPy tot SLyByAy
nSPy
nSPx
SPx
SLx
0.025
0.025
Issue date 11-06-27
11-07-06
PEMIXQFN_PEMI2STD_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 26 of 29
NXP Semiconductors PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
10. Revision history
Table 12. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PEMIXQFN_PEMI2STD_
FAM v.2 20111103 Product data sheet - PEMIXQFN_PEMI2STD_
FAM v.1
Modifications: •Table 3 “Pinning”: corrected pinning description for PEMI8QFN (SOT1159-1); updated
simplified outline of SOT886
•Section 11 “Legal information”: updated
PEMIXQFN_PEMI2STD_
FAM v.1 20110729 Product data sheet - -
PEMIXQFN_PEMI2STD_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 27 of 29
NXP Semiconductors PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
11. Legal information
11.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] Th e product status o f device(s ) described in this docu ment may have change d since this d ocument was p ublished and may dif fer in case of multiple devices. The latest product statu s
information is available on the Internet at URL http://www.nxp.com.
11.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full informatio n see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre vail.
Product specificatio n — The information and data provided in a Product
data sheet shall define the specification of the product as agr eed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those described in the
Product data sheet.
11.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequ ential damages (including - wit hout limitatio n - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ ag gregate and cumulative l iability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconduct ors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suit able for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with t heir
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for th e customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter ms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or t he grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property right s.
Export control — This document as well as the item(s) described herein
may be subject to export control regulatio ns. Export might require a prior
authorization from competent authorities.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document contains the product specification.
PEMIXQFN_PEMI2STD_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 28 of 29
NXP Semiconductors PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for aut omo tive use. It is neither qua lif ied nor test ed
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in au tomotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automot ive specifications and standard s, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting f rom customer design an d
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
11.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
© NXP B.V. 2011. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 3 November 2011
Document identifier: PEMIXQFN_PEMI2STD_FAM
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
13. Contents
1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 2
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 4
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
5 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
6 Application information. . . . . . . . . . . . . . . . . . . 9
6.1 Use cases. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
6.2 LCD interfaces, medium-speed interfaces . . . . 9
6.3 Keypad, low-speed interfaces. . . . . . . . . . . . . . 9
6.4 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . 10
6.4.1 Relative -3dB frequency (p-filter structure). . . 12
6.4.2 Insertion loss (dB) at 800 MHz (p-filter
structure) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.4.3 Insertion loss (dB) at frequencies lower than
1 MHz (p-filter structure). . . . . . . . . . . . . . . . . 13
7 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
9 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 26
11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 27
11.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 27
11.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
11.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 27
11.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 28
12 Contact information. . . . . . . . . . . . . . . . . . . . . 28
13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29