TLP155E TOSHIBA Photocoupler IRED + Photo IC TLP155E Plasma Display Panel (PDP) Industrial Inverter MOS FET / IGBT Gate Driver Unit: mm 6 5 4 4.55 0.15 The Toshiba TLP155E consists of an infrared emitting diodes and integrated high gain, high-speed photodetectors. The TLP155E is housed in the SO6 package. The photodetector has an internal Faraday shield that provides a guaranteed common-mode transient immunity of 15 kV/s. TLP155E is suitable for direct gate driving circuit for IGBTs or power MOSFETs. 3 1 3.7 0.15 Package type: Peak Output Current : IOP = 0.6 A (max) Guaranteed performance over temperature: Threshold Input Current: IFLH = 7.5 mA (max) Propagation delay time : tpLH / tpHL = 200 ns (max) Common mode transient immunity : 15 kV/s (min) Isolation voltage : 3750 Vrms (min) UL-recognized: UL 1577, File No.E67349 cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 VDE-approved: EN 60747-5-5, EN 62368-1 (Note 1) CQC-approved: GB4943.1, GB8898 Thailand Factory SO6 0.4 0.15 Buffer logic type (Totem pole output) 0.1 2.1 0.1 7.0 0.4 0.5 min 1.27 -40 to 100 C 2.54 JEDEC JEITA TOSHIBA 11-4L1 weight: 0.08 g (typ.) Pin Configuration (Top View) 1 1:ANODE 3:CATHODE 4:GND 5:VO (Output) 6:VCC 6 5 3 4 SHIELD Note 1: When a EN 60747-5-5 approved type is needed, please designate the Option(V4). Truth Table Schematic Input LED M1 M2 Output H ON ON OFF H L OFF OFF ON L (M1) IF 1+ VF 3- Construction Mechanical Ratings Creepage distance 5.0 mm (min) Clearance distance 5.0 mm (min) Insulation thickness 0.4 mm (min) ICC 6 VCC (M2) SHIELD IO 5 VO 4 GND Start of commercial production 2010-08 (c) 2019 Toshiba Electronic Devices & Storage Corporation 1 2019-05-27 TLP155E Absolute Maximum Ratings (Ta = 25 C) Characteristics Symbol Rating Unit IF 20 mA IF /C -0.63 mA/C Forward Current Forward Current Derating LED Pulse Forward Current (Ta 92C) (Note 1) IFPT 1 A Reverse Voltage VR 5 V Input Power Dissipation PD 40 mW PD/C -1.2 mW/C Input Power Dissipation Derating (Ta 92C) Tj 125 C "H" Peak Output Current (Note 2) IOPH -0.6 A "L" Peak Output Current (Note 2) IOPL 0.6 A Output Voltage VO 35 V Supply Voltage VCC 35 V PO 80 mW PO/C -2.0 mW/C Tj 125 C Operating frequency (Note 3) f 250 kHz Operating Temperature Range Topr -40 to 100 C Storage Temperature Range Tstg -55 to 125 C Lead Soldering Temperature (10 s) Tsol 260 C Isolation Voltage (AC, 60 s, R.H. 60 %) (Note 4) BVs 3750 Vrms DETECTOR Junction Temperature Output Power Dissipation Output Power Dissipation Derating (Ta 85C) Junction Temperature Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc.). Note 1: Pulse width 1 s, 300 pps. Note 2: Exponential waveform pulse width PW 2 s, f 10 kHz, VCC = 20 V, Ta = -40 to 100 C Note 3: Exponential waveform pulse width PW 80 ns, IOPH -0.25 A, IOPL 0.25 A, VCC = 20V, Ta = -40 to 100 C Note 4: This device is regarded as a two terminal device: pins 1 and 3 are shorted together, as are pins 4, 5 and 6. Recommended Operating Conditions Characteristics Symbol Min Typ. Max Unit Input Current, High Level (Note 1) IFLH 10 - 15 mA Input Voltage, Low Level VFHL 0 - 0.8 V Supply Voltage* Peak output current Operating Temperature VCC 10 - 30 V IOPH/ IOPL - - 0.2 A Topr -40 - 100 C * This item denotes operating range, not meaning of recommended operating conditions. Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. Note 1: Input signal rise time (fall time) < 0.5 s. (c) 2019 Toshiba Electronic Devices & Storage Corporation 2 2019-05-27 TLP155E Electrical Characteristics (Ta = -40 to 100 C, unless otherwise specified) Symbol Test Circuit VF IF = 10 mA, Ta = 25 C VF/Ta Input reverse current IR Input capacitance CT Characteristics Forward voltage Temperature coefficient of forward voltage "H" Level IOPH1 Test Condition Min Typ.* Max Unit 1.40 1.55 1.80 V IF = 10 mA -1.8 mV/C VR = 5 V, Ta = 25 C 10 A VF = 0 V, f = 1 MHz, Ta = 25 C 60 pF VCC = 15 V IF = 10 mA V6-5 = 4 V -0.5 -0.2 1 V6-5 = 10 V -0.4 V5-4 = 2 V 0.2 0.5 V5-4 = 10 V 0.4 IO = -100 mA, IF = 10 mA 6.0 8.4 IO = 100 mA, VF = 0.8 V 0.3 1.0 IF = 10 mA 1.5 3.0 IF = 0 mA 1.5 3.0 IOPH2 Output current (Note 1) "L" Level IOPL1 VCC = 15 V IF = 0 mA 2 IOPL2 "H" Level 3 VOH VCC = 10 V Output voltage A V "L" Level VOL 4 "H" Level ICCH 5 "L" Level ICCL 6 VCC = 10 to 20 V VO=Open Threshold input current L H IFLH VCC = 15 V, VO > 1 V 1.0 7.5 mA Threshold input voltage H L VFHL VCC = 15 V, VO < 1 V 0.8 V VCC 10 30 V Supply current Supply voltage mA *All typical values are at Ta=25C. Note: This product is more sensitive than conventional products to electrostatic discharge (ESD) owing to its low power consumption design. It is therefore all the more necessary to observe general precautions regarding ESD when handling this component. Note 1: Duration of IO time 50 s, 1 pulse Isolation Characteristics (Ta = 25 C) Characteristics Symbol Capacitance input to output Test Condition CS VS = 0 V , f = 1MHz Isolation resistance RS R.H. 60 %, VS = 500 V Isolation voltage BVS AC, 60 s Min Typ. Max Unit (Note 1) 0.8 pF (Note 1) 1x1012 1014 3750 Vrms Note 1: This device is regarded as a two terminal device: pins 1 and 3 are shorted together, as are pins 4, 5 and 6. (c) 2019 Toshiba Electronic Devices & Storage Corporation 3 2019-05-27 TLP155E Switching Characteristics (NOTE)(Ta = -40 to 100 C, unless otherwise specified) Characteristics Propagation delay time Symbol Test Circuit Test Condition Min Typ.* Max L H tpLH Ta = 25 C IF = 0 10 mA 120 170 H L tpHL Ta = 25 C IF = 10 0 mA 120 170 L H tpLH VCC = 20 V IF = 0 10 mA 50 120 200 H L tpHL Rg = 30 IF = 10 0 mA 50 120 200 IF = 0 10 mA -85 85 IF = 0 10 mA 5 50 7 Propagation delay skew (Note 1) Switching time dispersion tpsk Cg = 1 nF F = 250 kHz Duty = 50 % | tpHL-tpLH | ns Output rise time (10-90 %) tr IF = 0 10 mA 35 Output fall time (90-10 %) tf IF = 10 0 mA 15 -15 Common mode transient immunity at HIGH level output CMH 8 Common mode transient immunity at LOW level output CML VCM =1000 Vp-p VCC = 20 V Ta = 25 C IF = 10 mA VO (min) = 16 V Unit kV/s IF = 0 mA VO (max) = 1 V 15 ( * ): All typical values are at Ta = 25 C. Note: A ceramic capacitor (0.1 F) should be connected from pin 6 (VCC) to pin 4 (GND) to stabilize the operation of the high gain linear amplifier. Failure to provide the bypass may impair the switching property. The total lead length between capacitor and coupler should not exceed 1 cm. Note 1: Propagation delay skew is defined as the difference between the largest and smallest propagation delay time (i.e. tpHL or tpLH) of multiple samples. Evaluations of these samples are conducted under identical test conditions (supply voltage, input current, temperature, etc.). (c) 2019 Toshiba Electronic Devices & Storage Corporation 4 2019-05-27 TLP155E Test Circuit 1: IOPH 1 Test Circuit 2: IOPL 1 6 6 V6-5 A IF IOPH 5 0.1F 5 VCC 0.1F IOPL A VCC V5-4 3 3 4 Test Circuit 3: VOH 1 6 Test Circuit 4: VOL 1 VO V 6 0.1F VOL VF IF 5 0.1F 3 4 IO 5 VCC 3 4 V IO VCC 4 *VOH =VCC-VO Test Circuit 5: ICCH 6 IF Test Circuit 6: ICCL ICCH 6 ICCL A A 0.1F 0.1F 5 3 1 5 VCC 3 4 (c) 2019 Toshiba Electronic Devices & Storage Corporation 5 VCC 4 2019-05-27 TLP155E Test Circuit 7: tpLH, tpHL, tr, tf, |tpHL-tpLH| IF=10mA (P.G) (f=250kHz, duty=50%, tr=tf=5ns) 6 1 0.1 F IF 5 3 IF VO Rg = 30 tr VOH tf VCC Cg = 1 nF 90% 50% 10% VO 4 tpHL tpLH VOL Test Circuit 8: CMH, CML IF 1 6 VCM SW A B 5 1000 V 90% 0.1F VO 10% tr tf VCC * SW A: IF = 10 mA 4 3 VO VCM + - CMH 16V 1V CML * SW B: IF = 0 mA CML = CMH = - 800 V tr (s) 800 V tf (s) CML (CMH) is the maximum rate of rise (fall) of the common mode voltage that can be sustained with the output voltage in the LOW (HIGH) state. (c) 2019 Toshiba Electronic Devices & Storage Corporation 6 2019-05-27 TLP155E I F - Ta Input forward current IF Input forward current IF (mA) (mA) I F - VF Ta = 100C 80C 50C 25C 0C -20C -40C Input forward voltage VF (V) Ambient temperature Ta (C) IFLH - Ta VCC = 15 V VO > 1 V Threshold input current (L/H) IFLH (mA) Output power dissipation PO (mW) P O - Ta Ambient temperature Ta (C) Ambient temperature Ta (C) ICCL - Ta ICCH - Ta High-level supply current ICCH (mA) Low-level supply current ICCL (mA) This curve shows the maximum limit to the input forward current. IF = 0 mA VCC = 30 V Ambient temperature Ta (C) IF = 10 mA VCC = 30 V Ambient temperature Ta (C) NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. (c) 2019 Toshiba Electronic Devices & Storage Corporation 7 2019-05-27 TLP155E VOL - Ta VOH - Ta IF = 10 mA IO = -100 mA (V) High-level output voltage VOH Low-level output voltage VOL (V) VF = 0.8 V IO = 100mA VCC = 10 V VCC = 30 V Ambient temperature Ta (C) VCC= 30 V VCC = 10 V Ambient temperature Ta (C) (VOH - VCC) - IOPH VCC = 15 V IF = 10 mA High-level output voltage drop VOH - VCC (V) Low-level output voltage VOL (V) VOL - IOPL VCC = 15 V IF = 0 mA Ta = 100C Ta = 25C Ta = 100C Ta = 25C Ta = -40C Peak low-level output current IOPL (A) Peak high-level output current IOPH tpLH, tpHL, |tpHL - tpLH| - VCC (A) tpLH, tpHL, |tpHL - tpLH| - Ta Ta = 25C, f = 250 kHz, Duty = 50% Propagation delay time, Pulse width distortion tpLH, tpHL, |tpHL - tpLH| (ns) Propagation delay time, Pulse width distortion tpLH, tpHL, |tpHL - tpLH| (ns) Ta = -40C Rg = 30 , Cg = 1 nF, IF = 10 mA tpLH tpHL |tpHL tpLH| Supply voltage VCC (V) IF = 10 mA, f = 250 kHz, Duty = 50% Rg = 30 , Cg = 1 nF, VCC = 20 V tpLH tpHL |tpHL tpLH| Ambient temperature Ta (C) NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. (c) 2019 Toshiba Electronic Devices & Storage Corporation 8 2019-05-27 TLP155E Propagation delay time, Pulse width distortion tpLH, tpHL, |tpHL - tpLH| (ns) tpLH, tpHL, |tpHL - tpLH| - IF Ta = 25C, f = 250 kHz, Duty = 50% Rg = 30 , Cg = 1 nF, VCC = 20 V tpLH tpHL |tpHL tpLH| Input forward current IF (mA) NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. (c) 2019 Toshiba Electronic Devices & Storage Corporation 9 2019-05-27 TLP155E PRECAUTIONS OF SURFACE MOUNTING TYPE PHOTOCOUPLER SOLDERING & GENERAL STORAGE (1) Precautions for Soldering When soldering, please prevent the temperature rise of this product as much as possible within the following conditions for both soldering iron method and reflow method. The following profile is indicated as the maximum value of the heat resistance of this product. Depending on the type of solder paste to be used, please set the preheat temperature and thermal temperature to optimized temperature within the profile. 1) When Using Soldering Reflow An example of a temperature profile when lead(Pb)-free solder is used The soldering temperature profile is based on the package surface temperature (See the figure above.) Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. 2) When using soldering Flow Preheat the device at a temperature of 150 C (package surface temperature) for 60 to 120 seconds. Mounting condition of 260 C within 10 seconds is recommended Flow soldering must be performed once. 3) When using soldering Iron Complete soldering within 10 seconds for lead temperature not exceeding 260 C or within 3 seconds not exceeding 350 C Heating by soldering iron must be done only once per lead (c) 2019 Toshiba Electronic Devices & Storage Corporation 10 2019-05-27 TLP155E (2) Precautions for General Storage 1) Do not store devices at any place where they will be exposed to moisture or direct sunlight. 2) When transportation or storage of devices, follow the cautions indicated on the carton box. 3) The storage area temperature should be kept within a temperature range of 5 C to 35 C, and relative humidity should be maintained at between 45% and 75%. 4) Do not store devices in the presence of harmful (especially corrosive) gases, or in dusty conditions. 5) Use storage areas where there is minimal temperature fluctuation. Because rapid temperature changes can cause condensation to occur on stored devices, resulting in lead oxidation or corrosion, as a result, the solderability of the leads will be degraded. 6) When repacking devices, use anti-static containers. 7) Do not apply any external force or load directly to devices while they are in storage. 8) If devices have been stored for more than two years, even though the above conditions have been followed, it is recommended that solderability of them should be tested before they are used. (c) 2019 Toshiba Electronic Devices & Storage Corporation 11 2019-05-27 TLP155E Specification for Embossed-Tape Packing (TPL)(TPR) for SO6 Coupler 1. Applicable Package Package Product Type SO6 Mini-flat coupler 2. Product Naming System Type of package used for shipment is denoted by a symbol suffix after a product number. The method of classification is as below. (Example) TLP155E (TPL,E) [[G]]/RoHS COMPATIBLE (Note) Tape type Device name 3. Tape Dimensions 3.1 Specification Classification Are as Shown in Table 1 Table 1 Tape Type Classification Tape type Classification Quantity (pcs / reel) TPL L direction 3000 TPR R direction 3000 3.2 Orientation of Device in Relation to Direction of Tape Movement Device orientation in the recesses is as shown in Figure 1. Direction of Tape L direction R direction Figure 1 (c) 2019 Toshiba Electronic Devices & Storage Corporation Device Orientation 12 2019-05-27 TLP155E 3.3 Empty Device Recesses Are as Shown in Table 2. Table 2 Empty Device Recesses Standard Occurrences of 2 or more successive empty device recesses Remarks Within any given 40mm section of tape, not including leader and trailer 0 device Single empty device recesses 6 devices (max) per reel Not including leader and trailer 3.4 Start and End of Tape The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two empty turns only for a cover tape. 3.5 Tape Specification (1) Tape material: Plastic (protection against electrostatics) (2) Dimensions: The tape dimensions are as shown in Figure 2 and Table 3. +0.1 1.5 -0 G A K0 12.0 0.3 B D E 0.3 0.05 F 1.6 0.1 2.95 0.2 Unit: mm Figure 2 Tape Forms Table 3 Tape Dimensions Unit: mm Unless otherwise specified: 0.1 Symbol Dimension Remark A 4.0 B 7.6 D 5.5 Center line of indented square hole and sprocket hole E 1.75 Distance between tape edge and hole center F 8.0 G 4.0 +0.1 Cumulative error -0.3 (max) per 10 feed holes +0.1 Cumulative error -0.3 (max) per 10 feed holes K0 2.6 (c) 2019 Toshiba Electronic Devices & Storage Corporation Internal space 13 2019-05-27 TLP155E 3.6 Reel A C U B (1) Material: Plastic (2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 4. E W1 W2 Figure 3 Table 4 Reel Form Reel Dimensions Unit: mm Symbol Dimension A 330 2 B 80 1 C 13 0.5 E 2.0 0.5 U 4.0 0.5 W1 13.5 0.5 W2 17.5 1.0 4. Packing Packed in a shipping carton. 5. Label Indication The carton bears a label indicating the product number, the symbol representing classification of standard, the quantity, the lot number and the Toshiba company name. 6. Ordering Method When placing an order, please specify the product number, the tape type and the quantity as shown in the following example. (Example) TLP155E (TPL,E) 3000 pcs Quantity (must be a multiple of 3000) [[G]]/RoHS COMPATIBLE (Note) Tape type Device name Note : Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. The RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. (c) 2019 Toshiba Electronic Devices & Storage Corporation 14 2019-05-27 TLP155E RESTRICTIONS ON PRODUCT USE Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as "TOSHIBA". Hardware, software and systems described in this document are collectively referred to as "Product". * TOSHIBA reserves the right to make changes to the information in this document and related Product without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. * PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, lifesaving and/or life supporting medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, and devices related to power plant. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative or contact us via our website. * Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. * Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. * The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. * ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. * GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. * Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. * Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. https://toshiba.semicon-storage.com/ (c) 2019 Toshiba Electronic Devices & Storage Corporation 15 2019-05-27