SFH 400
SFH 401
GaAs-IR-Lumineszenzdiode
GaAs Infrared Emitter
Lead (Pb) Free Product - RoHS Compliant
SFH 400 SFH 401
2007-12-07 1
Wesentliche Merkmale
• Kathode galvanisch mit dem Gehäuseboden
verbunden
• Hohe Zuverlässigkeit
• Gute spektrale Anpassung an
Si-Fotoempfänger
• Hermetisch dichtes Metallgehäuse
•SFH 401: Gehäusegleich mit BPX 43, BPY 62
Anwendungen
• Lichtschranken für Gleich- und
Wechsellichtbetrieb
• IR-Gerätefernsteuerungen
• Sensorik
• Lichtgitter
Typ
Type
Bestellnummer
Ordering Code
Gehäuse
Package
SFH 400 Q62702P0096 18 A3 DIN 41876 (TO-18), Glaslinse, hermetisch dichtes
Gehäuse, Anschlüsse im 2.54-mm-Raster (1/10’’)
18 A3 DIN 41876 (TO-18) glass lens, hermetically sealed
package, solder tabs lead spacing 2.54 mm (1/10’’)
SFH 401 Q62702P0097
Features
• Cathode is electrically connected to the case
• High reliability
• Matches all Si-Photodetectors
• Hermetically sealed package
•SFH 401: Same package as BPX 43, BPY 62
Applications
• Photointerrupters
• IR remote control
• Sensor technology
• Light curtains
2007-12-07 2
SFH 400, SFH 401
Grenzwerte (TC = 25 °C)
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebs- und Lagertemperatur
Operating and storage temperature range
SFH 400
Top; Tstg – 40 … + 125 °C
Betriebs- und Lagertemperatur
Operating and storage temperature range
SFH 401
Top; Tstg – 40 … + 100 °C
Sperrspannung
Reverse voltage
VR5 V
Durchlassstrom
Forward current
IF300 mA
Stoßstrom, tp = 10 µs, D = 0
Surge current
IFSM 3 A
Verlustleistung
Power dissipation
Ptot 470 mW
Wärmewiderstand
Thermal resistance
RthJA
RthJC
450
160
K/W
K/W
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 100 mA, tp= 20ms
λpeak 950 nm
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF = 100 mA, tp= 20ms
∆λ 55 nm
Abstrahlwinkel
Half angle
SFH 400
SFH 401
ϕ
ϕ
± 6
± 15
Grad
deg.
Aktive Chipfläche
Active chip area
A0.25 mm2
Abmessungen der aktiven Chipfläche
Dimension of the active chip area
L × B
L × W
0.5 × 0.5 mm2
SFH 400, SFH 401
2007-12-07 3
Abstand Chipoberfläche bis Linsenscheitel
Distance chip front to lens top
SFH 400
SFH 401
H
H
4.0 … 4.8
2.8 … 3.7
mm
mm
Schaltzeiten, Ie von 10% auf 90% und von 90%
auf 10%, bei IF = 100 mA, RL = 50 Ω
Switching times, Ιe from 10% to 90% and from
90% to 10%, IF = 100 mA, RL = 50 Ω
tr, tf1µs
Kapazität
Capacitance
VR = 0 V, f = 1 MHz
Co40 pF
Durchlassspannung
Forward voltage
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 µs
VF
VF
1.30 (≤ 1.5)
1.90 (≤ 2.5)
V
V
Sperrstrom
Reverse current
VR = 5 V
IR0.01 (≤ 1) µA
Gesamtstrahlungsfluss
Total radiant flux
IF = 100 mA, tp = 20 ms
Φe8mW
Temperaturkoeffizient von Ie bzw. Φe,
IF = 100 mA
Temperature coefficient of Ie or Φe,
IF = 100 mA
TCI– 0.55 %/K
Temperaturkoeffizient von VF, IF = 100 mA
Temperature coefficient of VF, IF = 100 mA
TCV– 1.5 mV/K
Temperaturkoeffizient von λ, IF = 100 mA
Temperature coefficient of λ, IF = 100 mA
TCλ+ 0.3 nm/K
Kennwerte (TA = 25 °C)
Characteristics (cont’d)
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
2007-12-07 4
SFH 400, SFH 401
Gruppierung der Strahlstärke Ie in Achsrichtung
gemessen bei einem Raumwinkel Ω = 0.01 sr
Grouping of Radiant Intensity Ie in Axial Direction
at a solid angle of Ω = 0.01 sr
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
SFH 400-2 SFH 400-3 SFH 401-2 SFH 401-3
Strahlstärke
Radiant intensity
IF = 100 mA, tp = 20 ms
Ie min
Ie max
20
40
> 32
–
10
20
>16
–
mW/sr
mW/sr
Strahlstärke
Radiant intensity
IF = 1 A, tp = 100 µs
Ie typ.
300
320
120
190
mW/sr
SFH 400, SFH 401
2007-12-07 5
Radiation Characteristics, SFH 400, Irel = f (ϕ)
Radiation Characteristics, SFH 401, Irel = f (ϕ)
OHR01883
02040 60 80 100 1200.40.60.81.0
100
90
80
70
60
50
0
10203040
0
0.2
0.4
0.6
0.8
1.0
ϕ
OHR01884
02040 60 80 100 1200.40.60.81.0
100
90
80
70
60
50
0
10203040
0
0.2
0.4
0.6
0.8
1.0
ϕ
SFH 400, SFH 401
2007-12-07 6
Relative Spectral Emission
Irel = f (λ)
Forward Current
IF = f (VF)
OHRD1938
λ
rel
Ι
0880 920 960 1000
nm
1060
20
40
60
80
%
100
V
OHR01040
F
F
Ι
1
1
10
0
10
-1
10
10
-2
A
1.5 2 2.5 3 3.5 4 4.5
typ. max.
V
Radiant Intensity
Single pulse, tp = 20 µs
Permissible Pulse Handling
Capability IF = f (τ), TC = 25 °C,
RthJC = 160 K/W,duty cycle D =
parameter
Ie
Ie 100 mA = f (IF)
Ι
OHR01037
F
-1
10
10
0
1
10
2
10
10
-2 -1
10
0
10 A 10
1
Ι
e
Ι
e
(100 mA)
τ
OHR01937
10
-5
s
10
2
Ι
F
mA
10
-4
10
-3
10
-2
10
0
10
3
10
4
5
5
DC
0.5
0.05
0.02
0.01
0.005
D =
0.1
F
Ι
T
P
t
=D
P
t
T
0.2
Max. Permissible Forward Current
SFH 401, IF = f (TA)
Max. Permissible Forward Current
SFH 400, IF = f (TA)
T
OHR00486
A
0
F
Ι
0 20 40 60 80 100˚C
50
100
150
200
250
300
mA
350
,
C
T
= 160 K/W
thJC
R
R
thJA
= 450 K/W
T
OHR00395
A
0
F
Ι
0˚C
50
100
150
200
250
300
mA
350
,
C
T
= 160 K/W
thJC
R
R
thJA
= 450 K/W
20 40 60 80 100 130
SFH 400, SFH 401
2007-12-07 7
Maßzeichnung
Package Outlines
Maße in mm (inch) / Dimensions in mm (inch).
0.9 (0.035)
14.5 (0.571)
12.5 (0.492)
5.0 (0.197)
5.3 (0.209)
lens
glass
6.6 (0.260)
7.4 (0.291)
ø0.45 (0.018)
2.54 (0.100)
(2.7 (0.106))
welded
spacing
Chip position
ø4.8 (0.189)
ø4.6 (0.181)
ø5.6 (0.220)
ø5.3 (0.209)
GEOY6314
Cathode
Anode
0.9 (0.035)
1.1 (0.043)
1.1 (0.043)
(package)
= SFH 216, SFH 400
= SFH 480
SFH 400
5.3 (0.209)
5.0 (0.197)
6.4 (0.252)
5.6 (0.220)
ø4.8 (0.189)
glass
lens
welded
Anode
Cathode
= SFH 481
= SFH 401
GETY6091
(package)
ø4.6 (0.181)
1.1 (0.043)
0.9 (0.035)
0.9 (0.035)
1.1 (0.043)
ø5.3 (0.209)
ø5.6 (0.220)
spacing
2.54 (0.100)
ø0.45 (0.018)
(2.7 (0.106)) Chip position
12.5 (0.492)
14.5 (0.571)
SFH 401
2007-12-07 8
SFH 400, SFH 401
Lötbedingungen
Soldering Conditions
Wellenlöten (TTW) (nach CECC 00802)
TTW Soldering (acc. to CECC 00802)
Published by
OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
OHLY0598
0
0
50 100 150 200 250
50
100
150
200
250
300
T
t
C
s
235 C
10 s
C... 260
1. Welle
1. wave
2. Welle
2. wave
5 K/s 2 K/s
ca 200 K/s
CC... 130100
2 K/s Zwangskühlung
forced cooling
Normalkurve
standard curve
Grenzkurven
limit curves
