DATASHEET
Automotive Surface-Mount Devices
miniASMD/microASMD/nanoASMD/AHS/ASMD Series
Since the 1980’s we have provided PPTC resettable
devices for the automotive industry. In vehicle electronic
equipment, our PolySwitch PTC surface-mount devices are
rapidly becoming the preferred circuit protection solution.
Our automotive surface-mount device offering is constantly
increasing with smaller size, higher current and higher
temperature devices. We are proud to offer the specifi c
automotive surface-mount device families: nanoASMD,
microASMD, miniASMD, ASMD, AHS.
These specifi c devices are qualifi ed and sold under our
PS400 specifi cation which is derived from the AEC-Q200
standard for electronic components used in the automotive
industry. The key difference between these automotive
devices and other surface-mount devices from the circuit
protection product portfolio is their qualifi cation according
to a series of rigorous tests related to the automotive
environment. As a result, they are characterized by some
specifi c additional values determined after stringent
testing.
Benefi ts:
• Products meet applicable automotive industry standards
• Compatible with high-volume electronics assembly
• Small sizes help save board space and cost
• Many product choices give design engineers more
design fl exibility
•
Low resistance allows for low voltage drop
Features:
• Qualifi ed per AEC-Q200 specifi cation
• RoHS compliant and halogen free
• Footprints from 1206 to 3425
• Current ratings from 0.05 to 3.0A
• Voltage ratings from 16 to 60V
• Fast time-to-trip
• Low resistance
Applications:
• Electronic Control Unit (ECU) I/O and trace protection
• Telematics, infotainment and navigations systems
• USB port protection
• Motor and motor control circuit protection:
power door-locks, mirrors, lumbar pumps, headlight position adjustment, seat, sunroofs and windows
• Heating Ventilation and Cooling (HVAC) control circuit and I/O protection
• Liquid Crystal Display backlight heaters
IHOLD ITr i p VMAX IMAX PD max Maximum
Time-to-Trip RMIN R1MAX
Part Number Marking (A) (A) (VDC) (A) (W) Current
(A)
Time
(s) ΩΩ
nanoASMDC012F P 0.12 0.39 48 10 0.50 1.00 0.20 1.40 6.50
nanoASMDC016F N 0.16 0.45 48 10 0.50 1.00 0.30 1.10 5.00
nanoASMDC020F 02 0.20 0.42 24 100 0.60 8.00 0.10 0.65 3.10
nanoASMDC035F 03 0.35 0.75 16 20 0.60 3.50 0.10 0.45 1.35
microASMD005F 05 0.05 0.15 30 10 1.00 0.25 1.50 3.60 50.00
microASMD010F 10 0.10 0.25 30 10 0.80 0.50 1.00 2.10 15.00
miniASMDC010F 10 0.10 0.30 60 40 0.75 0.50 5.00 0.70 12.70
miniASMDC014F 14 0.14 0.28 60 10 0.75 8.00 0.008 1.50 6.00
miniASMDC020F 2 0.20 0.40 30 10 0.80 8.00 0.02 0.60 3.30
miniASMDC030F 3 0.30 0.60 30 40 0.80 8.00 0.10 0.20 1.75
miniASMDC050F 5 0.50 1.00 24 100 0.80 8.00 0.15 0.15 1.00
miniASMDC075F/24 075F24V 0.75 1.50 24 40 0.80 8.00 0.30 0.09 0.29
miniASMDC110F/16 110F16V 1.10 2.20 16 100 0.80 8.00 0.30 0.06 0.18
miniASMDC110F/24 110F24V 1.10 2.20 24 20 0.80 8.00 0.50 0.06 0.18
miniASMDC125F/16 125F16V 1.25 2.50 16 100 0.80 8.00 0.40 0.05 0.14
miniASMDC150F/16 15016V 1.50 2.80 16 100 0.80 8.00 0.50 0.04 0.11
miniASMDC150F/24 150F24V 1.50 3.00 24 20 1.00 8.00 1.50 0.04 0.12
miniASMDC260F/16 260F16V 2.60 5.00 16 100 1.20 8.00 5.00 0.015 0.05
AHS080-2018 H08 0.80 2.00 16 70 1.50 8.00 9.00 0.13 0.55
AHS160 160 1.60 3.20 16 70 2.20 8.00 15.00 0.05 0.15
AHS200 H200 2.00 4.00 16 70 2.30 8.00 13.40 0.05 0.14
AHS300 H300 3.00 6.00 16 70 3.00 15.00 8.00 0.024 0.083
ASMD030F 030F 0.23 0.59 60 10 1.10 1.15 12.00 0.98 4.80
ASMD050F 050F 0.37 0.94 60 10 1.70 1.95 20.00 0.29 1.40
ASMD075F 075F 0.60 1.48 30 40 1.10 3.00 20.00 0.29 1.00
ASMD100F 100F 0.90 2.16 30 40 1.10 4.50 20.00 0.098 0.48
ASMD125F 125F 1.04 2.46 16 40 1.10 5.20 20.00 0.057 0.25
ASMD150F 150F 1.27 2.95 16 40 1.20 6.35 25.00 0.049 0.25
ASMD185F 185A 1.85 3.70 16 40 1.50 9.25 11.30 0.032 0.126
ASMD200F 200F 1.73 3.93 16 40 1.20 8.65 30.00 0.05 0.12
ASMD250F 250F 1.97 5.00 16 40 1.20 9.85 30.00 0.035 0.085
Note : Operation Temperature for nanoASMD, microASMD, miniASMD and ASMD devices is -40~85°C.
Operation Temperature for AHS devices is -40~125°C.
Electrical Characteristics
2
Typical Thermal Derating Curve
nanoASMD Devices
A = nanoASMDC012F
B = nanoASMDC016F
C = nanoASMDC020F
D = nanoASMDC035F
microASMD Devices
A = microASMD005F
B = microASMD010F
miniASMD Devices
A = miniASMDC010F
B = miniASMDC014F
C = miniASMDC020F
D = miniASMDC030F
E = miniASMDC050F
F = miniASMDC075F/24
G = miniASMDC110F/16
H = miniASMDC110F/24
I = miniASMDC125F/16
J = miniASMDC150F/16
K = miniASMDC150F/24
L = miniASMDC260F/16
A
B
B
A
D
C
C
D
% of Rated Hold and Trip Current
Ambient Temperature (˚C)
170
160
150
140
130
120
110
100
90
80
70
60
50
40
30
-50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
A
B
B
A
% of Rated Hold and Trip Current
Ambient Temperature (˚C)
190
180
170
160
150
140
130
120
110
100
90
80
70
60
50
40
30
-50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
F
H
B
J
I
A
GC
K
L
E
D
B
H
F
CG
K
D
L
E
I
J
A
% of Rated Hold and Trip Current
Ambient Temperature (˚C)
170
160
150
140
130
120
110
100
90
80
70
60
50
40
30
-50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
3
Typical Thermal Derating Curve Cont’d
ASMD and AHS Devices
A = ASMD
B = AHS A
B
B
A
% of Rated Hold and Trip Current
Ambient Temperature (˚C)
160
150
140
130
120
110
100
90
80
70
60
50
40
-40 -20 0 20 40 60 80 100 120
Typical Time-to-trip Curve at 20°C
nanoASMD Devices
A = nanoASMDC012F
B = nanoASMDC016F
C = nanoASMDC020F
D = nanoASMDC035F
microASMD Devices
A = microASMD005F
B = microASMD010F
B
B
C
C
D
D
A
A
Time-to-Trip (s)
Fault Current (A)
10
1
0.1
0.01
0.001
0.1 1 10
B
B
A
A
Time-to-Trip (s)
Fault Current (A)
100
10
1
0.1
0.01
0.001
0.1 1 10
4
Typical Time-to-trip Curve at 20°C Cont’d
miniASMD Devices
A = miniASMDC010F,
miniASMDC014F
B = miniASMDC020F
C = miniASMDC030F
D = miniASMDC050F
E = miniASMDC075F/24
F = miniASMDC110F/16
G = miniASMDC110F/24
H = miniASMDC125F/16
I = miniASMDC150F/16
J = miniASMDC150F/24
K = miniASMDC260F/16
AHS Devices
A = AHS080-2018
B = AHS160
C = AHS200
D = AHS300
ASMD Devices
A = ASMD030F
B = ASMD050F
C = ASMD075F
D = ASMD100F
E = ASMD125F
F = ASMD150F
G = ASMD185F
H = ASMD200F
I = ASMD250F
B
B
C
C
D
D
E
E
F
F
G
G
H
H
I
I
J
J
K
K
A
A
Time-to-Trip (s)
Fault Current (A)
100
10
1
0.1
0.01
0.001
0.1 1 10 100
B
BC
C
D
D
A
A
Time-to-Trip (s)
Fault Current (A)
100
10
1
0.1
0.01 110100
B
BC
C
D
D
E
E
F
F
G
G
H
H
I
I
A
A
Time-to-Trip (s)
Fault Current (A)
100
10
1
0.1
0.01
0.1 1 10 100
5
Dimensions in Millimeters (Inches)
Unit: mm (inch) A B C D E F G H
Part Number Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min Figure
nanoASMDC012F 3.00 3.40 0.62 1.00 1.37 1.80 0.25 0.75 0.076 - - - - - - S1
(1206 mils) (0.118) (0.134) (0.024) (0.039) (0.054) (0.071) (0.010) (0.030) (0.003) - - - - - -
nanoASMDC016F 3.00 3.40 0.62 1.00 1.37 1.80 0.25 0.75 0.076 - - - - - - S1
(1206 mils) (0.118) (0.134) (0.024) (0.039) (0.054) (0.071) (0.010) (0.030) (0.003) - - - - - -
nanoASMDC020F 3.00 3.40 0.58 0.82 1.37 1.80 0.25 0.75 0.076 - - - - - - S1
(1206 mils) (0.118) (0.134) (0.023) (0.032) (0.054) (0.071) (0.010) (0.030) (0.003) - - - - - -
nanoASMDC035F 3.00 3.40 0.58 0.82 1.37 1.80 0.25 0.75 0.076 - - - - - - S1
(1206 mils) (0.118) (0.134) (0.023) (0.032) (0.054) (0.071) (0.010) (0.030) (0.003) - - - - - -
microASMD005F 3.00 3.43 0.50 0.85 2.35 2.80 0.25 0.75 0.076 - - - - - - S1
(1210 mils) (0.118) (0.135) (0.019) (0.034) (0.092) (0.110) (0.010) (0.030) (0.003) - - - - - -
microASMD010F 3.00 3.43 0.50 0.85 2.35 2.80 0.25 0.75 0.076 - - - - - - S1
(1210 mils) (0.118) (0.135) (0.019) (0.034) (0.092) (0.110) (0.010) (0.030) (0.003) - - - - - -
miniASMDC010F 4.37 4.73 0.635 0.89 3.07 3.41 0.25 0.95 0.20 - - - - - - S1
(1812 mils) (0.172) (0.186) (0.025) (0.035) (0.121) (0.134) (0.010) (0.040) (0.008) - - - - - -
miniASMDC014F 4.37 4.73 0.635 0.89 3.07 3.41 0.25 0.95 0.20 - - - - - - S1
(1812 mils) (0.172) (0.186) (0.025) (0.035) (0.121) (0.134) (0.010) (0.040) (0.008) - - - - - -
miniASMDC020F 4.37 4.73 0.635 0.89 3.07 3.41 0.25 0.95 0.20 - - - - - - S1
(1812 mils) (0.172) (0.186) (0.025) (0.035) (0.121) (0.134) (0.010) (0.040) (0.008) - - - - - -
miniASMDC030F 4.37 4.73 0.635 0.89 3.07 3.41 0.25 0.95 0.20 - - - - - - S1
(1812 mils) (0.172) (0.186) (0.025) (0.035) (0.121) (0.134) (0.010) (0.040) (0.008) - - - - - -
miniASMDC050F 4.37 4.73 0.38 0.62 3.07 3.41 0.25 0.95 0.20 - - - - - - S1
(1812 mils) (0.172) (0.186) (0.015) (0.025) (0.121) (0.134) (0.010) (0.040) (0.008) - - - - - -
miniASMDC075F/24 4.37 4.83 0.81 1.46 3.07 3.41 0.25 0.95 0.20 - - - - - - S1
(1812 mils) (0.172) (0.190) (0.032) (0.057) (0.121) (0.134) (0.010) (0.040) (0.008) - - - - - -
miniASMDC110F/16 4.37 4.83 0.28 0.48 3.07 3.41 0.25 0.95 0.20 - - - - - - S1
(1812 mils) (0.172) (0.190) (0.011) (0.019) (0.121) (0.134) (0.010) (0.040) (0.008) - - - - - -
miniASMDC110F/24 4.37 4.83 0.81 1.46 3.07 3.41 0.25 0.95 0.20 - - - - - - S1
(1812 mils) (0.172) (0.190) (0.032) (0.057) (0.121) (0.134) (0.010) (0.040) (0.008) - - - - - -
miniASMDC125F/16 4.37 4.83 0.28 0.48 3.07 3.41 0.25 0.95 0.20 - - - - - - S1
(1812 mils) (0.172) (0.190) (0.011) (0.019) (0.121) (0.134) (0.010) (0.040) (0.008) - - - - - -
miniASMDC150F/16 4.37 4.83 0.28 0.48 3.07 3.41 0.25 0.95 0.20 - - - - - - S1
(1812 mils) (0.172) (0.190) (0.011) (0.019) (0.121) (0.134) (0.010) (0.040) (0.008) - - - - - -
miniASMDC150F/24 4.37 4.83 1.00 1.94 3.07 3.41 0.25 0.95 0.20 - - - - - - S1
(1812 mils) (0.172) (0.190) (0.040) (0.077) (0.121) (0.134) (0.010) (0.040) (0.008) - - - - - -
miniASMDC260F/16 4.37 4.83 1.02 1.52 3.07 3.41 0.25 0.95 0.20 - - - - - - S1
(1812 mils) (0.172) (0.190) (0.042) (0.060) (0.121) (0.134) (0.010) (0.040) (0.008) - - - - - -
6
Dimension Figures
Dimensions in Millimeters (Inches) Cont’d
Unit: mm (inch) A B C D E F G H
Part Number Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min Figure
AHS080-2018 4.72 5.44 - 1.52 4.22 4.93 0.25 0.36 0.25 0.36 0.30 0.46 - - - S2
(2018 mils) (0.186) (0.214) - (0.060) (0.166) (0.194) (0.010) (0.014) (0.010) (0.014) (0.012) (0.018) - - -
AHS160 8.00 9.40 - 3.00 6.00 6.71 0.56 0.71 0.56 0.71 3.68 3.94 0.66 1.37 0.43 S3
(3425 mils) (0.315) (0.370) - (0.118) (0.24) (0.264) (0.022) (0.028) (0.022) (0.028) (0.145) (0.155) (0.026) (0.054) (0.017)
AHS200 8.00 9.40 - 3.00 6.00 6.71 0.56 0.71 0.56 0.71 3.68 3.94 0.66 1.37 0.43 S3
(3425 mils) (0.315) (0.370) - (0.118) (0.24) (0.264) (0.022) (0.028) (0.022) (0.028) (0.145) (0.155) (0.026) (0.054) (0.017)
AHS300 8.00 9.40 - 3.00 6.00 6.71 0.56 0.71 0.56 0.71 3.68 3.94 0.66 1.37 0.43 S3
(3425 mils) (0.315) (0.370) - (0.118) (0.24) (0.264) (0.022) (0.028) (0.022) (0.028) (0.145) (0.155) (0.026) (0.054) (0.017)
ASMD030F 6.73 7.98 - 3.18 4.80 5.44 0.56 0.71 0.56 0.71 2.16 2.41 0.66 1.37 0.43 S3
(2920 mils) (0.265) (0.314) - (0.125) (0.19) (0.214) (0.022) (0.028) (0.022) (0.028) (0.085) (0.095) (0.026) (0.054) (0.017)
ASMD050F 6.73 7.98 - 3.18 4.80 5.44 0.56 0.71 0.56 0.71 2.16 2.41 0.66 1.37 0.43 S3
(2920 mils) (0.265) (0.314) - (0.125) (0.19) (0.214) (0.022) (0.028) (0.022) (0.028) (0.085) (0.095) (0.026) (0.054) (0.017)
ASMD075F 6.73 7.98 - 3.18 4.80 5.44 0.56 0.71 0.56 0.71 2.16 2.41 0.66 1.37 0.43 S3
(2920 mils) (0.265) (0.314) - (0.125) (0.19) (0.214) (0.022) (0.028) (0.022) (0.028) (0.085) (0.095) (0.026) (0.054) (0.017)
ASMD100F 6.73 7.98 - 3.00 4.80 5.44 0.56 0.71 0.56 0.71 2.16 2.41 0.66 1.37 0.43 S3
(2920 mils) (0.265) (0.314) - (0.118) (0.19) (0.214) (0.022) (0.028) (0.022) (0.028) (0.085) (0.095) (0.026) (0.054) (0.017)
ASMD125F 6.73 7.98 - 3.00 4.80 5.44 0.56 0.71 0.56 0.71 2.16 2.41 0.66 1.37 0.43 S3
(2920 mils) (0.265) (0.314) - (0.118) (0.19) (0.214) (0.022) (0.028) (0.022) (0.028) (0.085) (0.095) (0.026) (0.054) (0.017)
ASMD150F 8.00 9.40 - 3.00 6.00 6.71 0.56 0.71 0.56 0.71 3.68 3.94 0.66 1.37 0.43 S3
(3425 mils) (0.315) (0.370) - (0.118) (0.24) (0.264) (0.022) (0.028) (0.022) (0.028) (0.145) (0.155) (0.026) (0.054) (0.017)
ASMD185F 8.00 9.40 - 3.00 6.00 6.71 0.56 0.71 0.56 0.71 3.68 3.94 0.66 1.37 0.43 S3
(3425 mils) (0.315) (0.370) - (0.118) (0.24) (0.264) (0.022) (0.028) (0.022) (0.028) (0.145) (0.155) (0.026) (0.054) (0.017)
ASMD200F 8.00 9.40 - 3.00 6.00 6.71 0.56 0.71 0.56 0.71 3.68 3.94 0.66 1.37 0.43 S3
(3425 mils) (0.315) (0.370) - (0.118) (0.24) (0.264) (0.022) (0.028) (0.022) (0.028) (0.145) (0.155) (0.026) (0.054) (0.017)
ASMD250F 8.00 9.40 - 3.00 6.00 6.71 0.56 0.71 0.56 0.71 3.68 3.94 0.66 1.37 0.43 S3
(3425 mils) (0.315) (0.370) - (0.118) (0.24) (0.264) (0.022) (0.028) (0.022) (0.028) (0.145) (0.155) (0.026) (0.054) (0.017)
Note : Terminal Material is 100% matte tin with nickel underplate.
C
AB
ED
B
F
A
DE
C
B
H
C
F
G
A
DE
Figure S1 Figure S2 Figure S3
7
Soldering Refl ow and Rework Recommendations
Profi le Feature Pb-Free Assembly
Average Ramp-Up Rate (TsMAX to Tp) 3°C/s max
Preheat
• Temperature Min (TsMIN)
• Temperature Max (TsMAX)
• Time (tsMIN to tsMAX)
150°C
200°C
60-120 s
Time maintained above:
• Temperature (TL)
• Time (tL)
217°C
60-150 s
Peak/Classifi cation Temperature (Tp) 260°C
Time within 5°C of actual Peak Temperature
Time (tp) 30 s max
Ramp-Down Rate 3°C/s max
Note : All temperatures refer to topside of the package, measured on the package body surface.
Solder Refl ow
• Recommended refl ow methods: IR, hot air and Nitrogen
• Recommended maximum paste thickness : 0.25mm (0.010 inch)
• Devices can be cleaned using standard methods and aqueous solvents.
• Tyco Electronics believes the optimum conditions for forming acceptable solder fi llets occur when a reasonable amount of solder paste is
placed underneath each device’s termination. As such, we request that customers comply with our recommended solder pad layouts.
• Tyco Electronics requests that customer board layouts refrain from placing raised features (e.g. vias, nomenclature, traces, etc.)
underneath PolySwitch devices. It is possible that raised features could negatively impact solderability performance of our devices.
Rework
• Standard industry practices. Please also avoid direct contact to the device.
Critical Zone
TL to Tp
Ramp up
t 25˚C to Peak
Reflow Profile Time
Ramp down
ts
Preheat
TsMAX
TL
Tp
tp
25
TsMIN
tL
Temperature
Classifi cation Refl ow Profi les Refl ow Profi le
Recommended Pad Layout
Recommended Pad Layout Figures [mm (In.)]
Part Number Dimension
A (Nom.)
Dimension
B (Nom.)
Dimension
C (Nom.)
nanoASMD device 1.60 (0.063) 1.00 (0.039) 2.00 (0.079)
microASMD device 2.50 (0.098) 1.00 (0.039) 2.00 (0.079)
miniASMD device 2.95 (0.114) 1.68 (0.066) 3.10 (0.122)
AHS080-2018 device 4.60 (0.180) 1.50 (0.059) 3.40 (0.134)
AHS160~AHS300 devices 4.60 (0.180) 2.30 (0.090) 6.10 (0.240)
ASMD030F~ASMD125F devices 3.10 (0.120) 2.30 (0.090) 5.10 (0.201)
ASMD150F~ASMD250F devices 4.60 (0.180) 2.30 (0.090) 6.10 (0.240)
B B
A
C
8
PS400 Test Items and Results (Based on AEC-Q200 Specifi cation)
Item Test Test condition Details Test Results
1Pre & post stress
electrical test Passive resistance, TtT, IHOLD, Pd Pass
4 Temperature cycling -40°C to 85°C
1000 cycles
Ramp rate 10°C/min
Soak time 5 minutes Pass
6 Moisture resistance t = 24 hours/cycle; 10 continuous cycles
Un-powered Pass
7 Biased humidity
1000 hours
85°C ± 5°C/85%RH±5%
Test current: 10% of IHOLD
In-test measurement: None Pass
8 Operational life
1000 hours
Rated Temp. and tol: 85°C ±2°C
Still air requirement: None
Dist of temp measurement: 4”min
Operation condition: Rated Voltage/IHOLD
ON-OFF frequency: 15 sec ON 15 sec OFF Pass
12 Resistance to
solvents
Three solvents.
Immersion brush, 3 cycles, inspection for marking
and part damage
Per MIL-STD-202G
METHOD 215K Pass
13 Mechanical shock Condition: F
Mounting cfg.: per general spec.
Peak value 1500g’s half-sine
0.5msec for each duration
Repeat 3 times per direction
Pass
14 Vibration
5 g’s for 20 min.
12 cycles each of 3 orientations
Test from 10-2000 Hz
Frequency 1: 10 - 40 Hz
Amplitude: ± 0.75 mm
Frequency 2: 40 – 2KHz
Amplitude: 5 g’s peak
Pass
15 Resistance to
soldering heat
Per MIL-STD-202G
Test conditions I, J, K
Repeat 3 times
24hrs cooling time prior to fi nal measurement Pass
16 Thermal shock
-40°C to 85°C
Transfer time: 20 sec;
Dwell time: 15 minutes
Medium: Air - Air
No. of cycles: 300 Pass
17 ESD 15KV air discharge level Pass
18 Solderability
260(+0/-5)°C 10 seconds max
(Pb free solder paste)
220(+0/-5)°C 10 seconds max
(Pb contained solder paste)
Test with devices after 8 hours steam aging Pass
21 Board fl ex Total defl ection: 2.0mm minimum
Defl ection time: 60 (-0/+5) sec. Pass
22 Terminal strength 17.7 N (1.8 Kg) force to the side of a device being
tested for 60sec Pass
31 Short circuit fault
current durability
Room temperature
VDC/200A, (16V for miniASMDC014F)
5 sec ON, 2 minutes OFF
25 cycles Pass
32 Fault current
durability
Room temperature
16V/6 x IHOLD
Min. 5 minutes ON
Min. 10 minutes OFF Pass
33 End-of-life-mode
verifi cation
Room temperature
16V/6 x IHOLD
5 sec ON, 1 minute OFF
1000 cycles Pass
34 Jump start
endurance
Test voltage: 26V
Duty cycle: 1min ±3sec ON, 2 min OFF
3 pulses
Pass
35 Load dump
endurance Test per ISO7637-2, pulse 5a, 10 times
Test voltage: Us=86.5V/66.5V/46.5V (the two lower
Us values correspond to truncated surge profi les)*
Devices tested under un-tripped status, Ua=13.5V
Pass*
* Most tested devices meet the load dump test with a peak voltage of 86.5V. However some only meet a reduced peak voltage surge. Contact us if you need more details.
PolySwitch, TE (logo) and Tyco Electronics are trademarks of the Tyco Electronics group of companies and its
licensors. Other logos, product and Company names mentioned herein may be trademarks of their respective owners.
All information, including illustrations, is believed to be reliable. Users, however, should independently evaluate the
suitability of each product for their application. Tyco Electronics Corporation makes no warranties as to the accuracy
or completeness of the information, and disclaims any liability regarding its use. Tyco Electronics’ only obligations
are those in the Tyco Electronics Standard Terms and Conditions of Sale for this product, and in no case will Tyco
Electronics be liable for any incidental, indirect, or consequential damages arising from the sale, resale, use, or misuse
of the product. Specifi cations are subject to change without notice. In addition, Tyco Electronics reserves the right
to make changes without notifi cation to Buyer—to materials or processing that do not affect compliance with any
applicable specifi cation.
© 2010 Tyco Electronics Corporation. All rights reserved. RCP0093E.1110
Circuit Protection Products
308 Constitution Drive
Menlo Park, CA USA 94025-1164
Tel : (800) 227-7040, (650) 361-6900
Fax : (650) 361-4600
www.circuitprotection.com
www.circuitprotection.com.hk (Chinese)
www.tycoelectronics.com/japan/bu/circuitprotection (Japanese)
