DATASHEET ICS2309 3.3 VOLT ZERO DELAY LOW SKEW BUFFER Description Features The ICS2309 is a low phase noise, high-speed PLL based, low-skew zero delay buffer. Based on ICS' proprietary low jitter Phase Locked Loop (PLL) techniques, the device provides nine low skew outputs at speeds up to 133 MHz at 3.3 V. The outputs can be generated from the PLL (for zero delay), or directly from the input (for testing), and can be set to tri-state mode or to stop at a low level. The PLL feedback is on-chip and is obtained from the CLKOUT pad. * * * * * Clock outputs from 10 to 133 MHz * * * * * * 5 V tolerant CLKIN The ICS2309 is available in two different versions. The ICS2309-1 is the base part. The ICS2309-1H is a high drive version with faster rise and fall times. Zero input-output delay Nine low skew (<250 ps) outputs Device-to-device skew <700 ps Full CMOS outputs with 12 mA output drive capability at TTL levels Tri-state mode for board-level testing Advanced, low power, sub-micron CMOS process Operating voltage of 3.3 V Industrial temperature range available Packaged in 16-pin SOIC and TSSOP (-1H version only) * RoHS 5 (green) or RoHS 6 (green and lead free) complaint packaging Block Diagram VDD 2 CLKIN PLL 0 CLKOUT 1 CLKA1 CLKA2 CLKA3 CLKA4 S2, S1 2 Control Logic CLKB1 CLKB2 CLKB3 CLKB4 GND IDTTM / ICSTM 3.3 VOLT ZERO DELAY LOW SKEW BUFFER 2 1 ICS2309 REV F 041906 ICS2309 3.3 VOLT ZERO DELAY LOW SKEW BUFFER ZERO DELAY BUFFERS Pin Assignment CLKIN 1 16 CLKOUT CLKA1 2 15 CLKA4 CLKA2 3 14 CLKA3 VDD 4 13 VDD GND 5 12 GND CLKB1 6 11 CLKB4 CLKB2 7 10 CLKB3 S2 8 9 S1 16 pin narrow (150 mil) SOIC Output Clock Mode Select Table S2 S1 CLKA1:A4 CLKB1:B4 A & B Source CLKOUT PLL Status 0 0 Tri-state (note 1) Tri-state (note 1) PLL Driven OFF 0 1 Running Tri-state (note 1) PLL Driven ON 1 0 Running Running CLKIN (note 2) PLL Bypass Mode OFF 1 1 Running Running PLL Driven ON Note 1. Outputs are in high impedance state Note 2. Buffer mode only; not zero delay between input and output Pin Descriptions Pin Number Pin Name Pin Type 1 CLKIN Input 2-3 CLKA1:A4 Output Clock outputs A1:A4. See table above. 4 VDD Power Power supply. Connect to 3.3 V. 5 GND Power Connect to ground. 6-7 CLKB1:B4 Output Clock outputs B1:B4. See table above. 8 S2 Input Select input 2. See table above. Internal pull-up. 9 S1 Input Select input 1. See table above. Internal pull-up. 10 - 11 CLKB1:B4 Output Clock outputs B1:B4. See table above. 12 GND Power Connect to ground. 13 VDD Power Power supply. Connect to 3.3 V. 14 - 15 CLKA1:A4 Output Clock outputs A1:A4. See table above. 16 CLKOUT Input IDTTM / ICSTM 3.3 VOLT ZERO DELAY LOW SKEW BUFFER Pin Description Clock input (5 V tolerant). Buffered output. Internal feedback on this pin. 2 ICS2309 REV F 041906 ICS2309 3.3 VOLT ZERO DELAY LOW SKEW BUFFER ZERO DELAY BUFFERS External Components The ICS2309 requires a minimum number of external components for proper operation. Decoupling capacitors of 0.01 mF should be connected between VDD and GND on pins 4 and 5, and VDD and GND on pins 13 and 12, as close to the device as possible. A series termination resistor of 33 may be used to each clock output pin to reduce reflections. Absolute Maximum Ratings Stresses above the ratings listed below can cause permanent damage to the ICS2309. These ratings, which are standard values for ICS commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Item Rating Supply Voltage, VDD 7V All Inputs and Outputs -0.5 V to VDD+0.5 V CLKIN and FBIN inputs -0.5 V to 5.5 V Electrostatic Discharge (HBM) 2000 V Ambient Operating Temperature (Commercial) 0 to +70 C Ambient Operating Temperature (Industrial) -40 to +85 C Storage Temperature -65 to +150 C Junction Temperature 150 C Soldering Temperature 260 C Recommended Operation Conditions Parameter Min. Ambient Operating Temperature (Industrial) Ambient Operating Temperature (Commercial) Power Supply Voltage (measured in respect to GND) IDTTM / ICSTM 3.3 VOLT ZERO DELAY LOW SKEW BUFFER 3 Typ. Max. Units -40 +85 C 0 +70 C +3.0 +3.6 V ICS2309 REV F 041906 ICS2309 3.3 VOLT ZERO DELAY LOW SKEW BUFFER ZERO DELAY BUFFERS DC Electrical Characteristics ICS2309M-1, VDD = 3.3 V 0.3 V, Ambient Temperature -40 to +85 C (Industrial), (0-70 C Commercial) Parameter Symbol Conditions Min. Operating Voltage VDD 3.0 Input High Voltage VIH 2 Input Low Voltage VIL Input Low Current IIL Input High Current Typ. Max. Units 3.6 V V 0.8 V VIN = 0V 50 A IIH VIN = VDD 100 A Output High Voltage VOH IOH = -8 mA Output Low Voltage VOL IOL = 8 mA 0.4 V Operating Supply Current IDD No Load 32 mA CLKIN = 0, Note 1 12 A Power Down Supply Current Short Circuit Current IOS Each output Input Capacitance CIN S2, S1, CLKIN 2.4 V 50 mA 5 pF Note 1: When there is no clock signal present at CLKIN, the ICS2309 will enter power down mode. The PLL is stopped and the outputs are tri-state. ICS2309M-1, VDD = 3.3 V 0.3 V, Ambient Temperature -40 to +85 C (Industrial), (0-70 C Commercial) Parameter Symbol Conditions Min. Operating Voltage VDD 3.0 Input High Voltage VIH 2 Input Low Voltage VIL Input Low Current IIL Input High Current IIH Typ. Max. Units 3.6 V V 0.8 V VIN = 0V 50 A VIN = VDD 100 A Output High Voltage VOH IOH = -12 mA Output Low Voltage VOL IOL = 12 mA 0.4 V Operating Supply Current IDD No Load 32 mA CLKIN = 0, Note 1 12 A Power Down Supply Current Short Circuit Current IOS Each output Input Capacitance CIN S2, S1, CLKIN 2.4 V 50 mA 5 pF Note 1: When there is no clock signal present at CLKIN, the ICS2309 will enter power down mode. The PLL is stopped and the outputs are tri-state. IDTTM / ICSTM 3.3 VOLT ZERO DELAY LOW SKEW BUFFER 4 ICS2309 REV F 041906 ICS2309 3.3 VOLT ZERO DELAY LOW SKEW BUFFER ZERO DELAY BUFFERS AC Electrical Characteristics ICS2309M-1, VDD=3.3 V 0.3 V, Ambient temperature -40 to +85 C (Industrial), (0-70 C Commercial) Parameter Symbol Conditions Min. Output Clock Frequency fIN 10 pF load, see table on page 2 10 133 MHz 30 pF load, see table on page 2 10 100 MHz Output Clock Frequency Typ. Max. Units Output Rise Time tOR 0.8 to 2.0 V, outputs loaded 2.5 ns Output Fall Time tOF 2.0 to 0.8 V, outputs loaded 2.5 ns Output Clock Duty Cycle tDC Measured at 1.4 V, Fout=66.67 MHz 40 50 60 % Output Clock Duty Cycle tDC Measured at 1.4 V, Fout=50 MHz 45 50 55 % Device to Device Skew Rising edges at VDD/2 700 ps Output to Output Skew Rising edges at VDD/2 250 ps Input to Output Skew Rising edges at VDD/2 350 ps Input to Output Skew (PLL bypass mode) Rising edges at VDD/2, S2= 1, S1 = 0 8.7 ns Cycle to Cycle Jitter Measured at 66.67M, outputs loaded 200 ps PLL Lock Time Note 2 1.0 ms 1 5 Note 2: With VDD at a steady rate and valid input at CLKIN. ICS2309M-1H, VDD=3.3 V 0.3 V, Ambient temperature -40 to +85 C (Industrial), (0-70 C Commercial) Parameter Symbol Conditions Min. Output Clock Frequency fIN 10 pF load, see table on page 2 10 133 MHz 30 pF load, see table on page 2 10 100 MHz Output Clock Frequency Typ. Max. Units Output Rise Time tOR 0.8 to 2.0 V, outputs loaded 1.5 ns Output Fall Time tOF 2.0 to 0.8 V, outputs loaded 1.5 ns Output Clock Duty Cycle tDC Measured at 1.4 V, Fout=66.67 MHz 40 50 60 % Output Clock Duty Cycle tDC Measured at 1.4 V, Fout=50 MHz 45 50 55 % Device to Device Skew Rising edges at VDD/2 700 ps Output to Output Skew Rising edges at VDD/2 250 ps Input to Output Skew Rising edges at VDD/2 350 ps Input to Output Skew (PLL bypass mode) Rising edges at VDD/2, S2= 1, S1 = 0 8.7 ns Cycle to Cycle Jitter Measured at 66.67M, outputs loaded 200 ps PLL Lock Time Note 3 1.0 ms 1 5 Note 3: With VDD at a steady rate and valid input at CLKIN. IDTTM / ICSTM 3.3 VOLT ZERO DELAY LOW SKEW BUFFER 5 ICS2309 REV F 041906 ICS2309 3.3 VOLT ZERO DELAY LOW SKEW BUFFER ZERO DELAY BUFFERS Package Outline and Package Dimensions (16-pin TSSOP, 4.40 mm Body, 0.65 mm Pitch) Package dimensions are kept current with JEDEC Publication No. 95 Millimeters 16 Symbol E1 A A1 A2 b C D E E1 e L E INDEX AREA 1 2 D Min Inches* Max -1.20 0.05 0.15 0.80 1.05 0.19 0.30 0.09 0.20 4.90 5.1 6.40 BASIC 4.30 4.50 0.65 Basic 0.45 0.75 0 8 Min Max -0.047 0.002 0.006 0.032 0.041 0.007 0.012 0.0035 0.008 0.193 0.201 0.252 BASIC 0.169 0.177 0.0256 Basic 0.018 0.030 0 8 *For reference only. Controlling dimensions in mm. A 2 A A 1 c -Ce b SEATING PLANE L .10 (.004) IDTTM / ICSTM 3.3 VOLT ZERO DELAY LOW SKEW BUFFER C 6 ICS2309 REV F 041906 ICS2309 3.3 VOLT ZERO DELAY LOW SKEW BUFFER ZERO DELAY BUFFERS Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body) Package dimensions are kept current with JEDEC Publication No. 95 Millimeters 16 Symbol E A A1 B C D E e H h L H INDEX AREA 1 2 D A Min Inches Max Min 1.35 1.75 0.10 0.25 0.33 0.51 0.19 0.25 9.80 10.00 3.80 4.00 1.27 BASIC 5.80 6.20 0.25 0.50 0.40 1.27 0 8 Max .0532 .0688 .0040 .0098 .013 .020 .0075 .0098 .3859 .3937 .1497 .1574 0.050 BASIC .2284 .2440 .010 .020 .016 .050 0 8 h x 45 A1 C -Ce B SEATING PLANE L .10 (.004) IDTTM / ICSTM 3.3 VOLT ZERO DELAY LOW SKEW BUFFER C 7 ICS2309 REV F 041906 ICS2309 3.3 VOLT ZERO DELAY LOW SKEW BUFFER ZERO DELAY BUFFERS Ordering Information Part / Order Number Marking Shipping Packaging Package Temperature 2309MI-1 2309MI-1T 2309MI-1LF 2309MI-1LFT 2309M-1 2309M-1T 2309M-1LF 2309M-1LFT 2309MI-1H 2309MI-1HT 2309MI-1HLF 2309MI-1HLFT 2309M-1H 2309M-1HT 2309M-1HLF 2309M-1HLFT 2309GI-1H 2309GI-1HT 2309GI-1HLF 2309GI-1HLFT 2309G-1H 2309G-1HT 2309G-1HLF 2309G-1HLFT ICS2309MI-1 ICS2309MI-1 2309MI-1LF 2309MI-1LF ICS2309M-1 ICS2309M-1 ICS2309M1LF ICS2309M1LF ICS2309MI-1H ICS2309MI-1H 2309MI-1HLF 2309MI-1HLF ICS2309M-1H ICS2309M-1H 2309M-1HLF 2309M-1HLF 2309GI1H 2309GI1H 309GI1HL 309GI1HL 2309G-1H 2309G-1H 2309G1HL 2309G1HL Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel 16-pin SOIC 16-pin SOIC 16-pin SOIC 16-pin SOIC 16-pin SOIC 16-pin SOIC 16-pin SOIC 16-pin SOIC 16-pin SOIC 16-pin SOIC 16-pin SOIC 16-pin SOIC 16-pin SOIC 16-pin SOIC 16-pin SOIC 16-pin SOIC 16-pin TSSOP 16-pin TSSOP 16-pin TSSOP 16-pin TSSOP 16-pin TSSOP 16-pin TSSOP 16-pin TSSOP 16-pin TSSOP -40 to +85 C -40 to +85 C -40 to +85 C -40 to +85 C 0 to +70 C 0 to +70 C 0 to +70 C 0 to +70 C -40 to +85 C -40 to +85 C -40 to +85 C -40 to +85 C 0 to +70 C 0 to +70 C 0 to +70 C 0 to +70 C -40 to +85 C -40 to +85 C -40 to +85 C -40 to +85 C 0 to +70 C 0 to +70 C 0 to +70 C 0 to +70 C Parts that are ordered with a "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant. While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems (ICS) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices or critical medical instruments. IDTTM / ICSTM 3.3 VOLT ZERO DELAY LOW SKEW BUFFER 8 ICS2309 REV F 041906 ICS2309 3.3 VOLT ZERO DELAY LOW SKEW BUFFER ZERO DELAY BUFFERS Revision History Rev. Originator Date Description of Change A P. Griffith 12/01/04 New device/datasheet; Preliminary. B P. Griffith 12/27/04 Add TSSOP package. Made corrections to IDD, IDDP, input capacitance and duty cycle specs/test conditions. Removed jitter specs for CL=15 pF. Added I/O skew spec for bypass mode and duty cycle spec for Fout=50 MHz. C P. Griffith 1/25/05 Made corrections to test conditions for output rise time, fall time, duty cycle and cycle-to-cycle jitter. Moved from Preliminary to Final. D P. Griffith 5/24/05 Added LF ordering info to 16-pin TSSOP (-1H version only); added Thermal Chars for 16-pin TSSOP package E A.Ilkbahar 09/01/05 Added LF to all versions. F R. Willner 04/19/06 Corrected Output Clock Mode Select Table to include CLKOUT functionality. IDTTM / ICSTM 3.3 VOLT ZERO DELAY LOW SKEW BUFFER 9 ICS2309 REV F 041906 ICS2309 3.3 VOLT ZERO DELAY LOW SKEW BUFFER ZERO DELAY BUFFERS Innovate with IDT and accelerate your future networks. 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