Data Sheet
February 2001
JW100G and JW150G Power Modules; dc-dc Converters:
36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W
Applications
Distributed power architectures
Computer equipment
Communications equipment
Options
Heat sinks available for extended operation
Choice of remote on/off logic configuration
Short pins: 3.68 mm ± 0.25 mm
(0.145 in. ±0.010 in.)
Features
Small size: 61.0 mm x 57.9 mm x 12.7 mm
(2.40 in. x 2.28 in. x 0.50 in.)
High power density
High efficiency: 76% typical
Low output noise
Constant frequency
Industry-standard pinout
Metal baseplate and case ground pin
2:1 input voltage range
Overcurrent, overtemperature, and overvoltage pro-
tection
Remote sense and remote on/off
Adjustable output voltage
Manufacturing facilities registered against the
ISO*
9000 series standards
UL
60950
Recognized,
CSA
C22.2 No. 60950-00
Certified, and
VDE
§ 0805 (
IEC
**60950, 4th Edi-
tion) Licensed
CE mark meets 73/23/EEC and 93/68/EEC direc-
tives††
*
ISO
is a registered trademark of the International Organization
for Standardization.
UL
is a registered trademark of Underwriters Laboratories, Inc.
CSA
is a registered trademark of Canadian Standards Associa-
tion.
§
VDE
is a trademark of Verband Deutscher Elektrotechniker e.V.
**
IEC
is a trademark of International Elecktrotechniker Commis-
sion.
†† This product is intended for integration into end-use equipment.
All the required procedures for CE marking of end-use equip-
ment should be followed. (The CE mark is placed on selected
products.)
Description
The JW100G and JW150G Power Modules are dc-dc converter that operate over an input voltage range of
36 Vdc to 7 5Vdc and provide a precisely regulated dc output. The outputs are fully isolated from the inputs,
allowing versatile polarity configurations and grounding connections. The module has a maximum power rat-
ings of 50 W to 75 W at a typical full-load efficiency of 7 6%.
The sealed modules offer a metal baseplate for excellent thermal performance. Threaded-through holes are pro-
vided to allow easy mounting or addition of a heat sink for high-temperature applications. The standard feature set
includes remote sensing, output trim, and remote on/off for convenient flexibility in distributed power applications.
The JW100G and JW150G Power Modules use advanced, sur-
face-mount technology and delivers high-quality, efficient,
and compact dc-dc conversion.
2Tyco Electronics Corp.
Data Sheet
February 2001
36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W
JW100G and JW150G Power Modules; dc-dc Converters:
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions.
Table 1. Input Specifications
Fusing Considerations
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This encapsulated power module can be used in a wide variety of applications, ranging from simple stand-alone
operation to an integrated part of a sophisticated power architecture. To preserve maximum flexibility, internal fus-
ing is not included; however, to achieve maximum safety and system protection, always use an input line fuse. The
safety agencies require a normal-blow fuse with a maximum rating of 20 A (see Safety Considerations section).
Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same
type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data for further information.
Parameter Symbol Min Max Unit
Input Voltage:
Continuous
Transient (100 ms)
VI
VI, trans
80
100
Vdc
V
I/O Isolation Voltage 1500 Vdc
Operating Case Temperature
(See Thermal Considerations section.)
TC–40 100 °C
Storage Temperature Tstg –55 125 °C
Parameter Symbol Min Typ Max Unit
Operating Input Voltage VI36 48 75 Vdc
Maximum Input Current:
VI = 0 V to 75 V; IO = IO, max; see Figures 1—2:
JW100G
JW150G
VI = 36 V to 75 V; IO = IO, max:
JW100G
JW150G
II, max
II, max
II, max
II, max
2.3
3.7
2.4
3.7
A
A
A
A
Inrush Transient i2t—1.0A
2s
Input Reflected-ripple Current, Peak-to-peak
(5 Hz to 20 MHz, 12 µH source impedance;
see Figure 15.)
II—5—mAp-p
Input Ripple Rejection (120 Hz) 60 dB
Tyco Electronics Corp. 3
Data Sheet
February 2001 36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W
JW100G and JW150G Power Modules; dc-dc Converters:
Electrical Specifications (continued)
Table 2. Output Specifications
* Consult your sales representative or the factory.
† These are manufacturing test limits. In some situations, results may differ.
Table 3. Isolation Specifications
Parameter Device Symbol Min Typ Max Unit
Output Voltage Set Point
(VI = 48 V; IO = IO, max; TC = 25 °C)
All VO, set 2.46 2.5 2.55 Vdc
Output Voltage
(Over all operating input voltage, resistive load,
and temperature conditions until end of life. See
Figure 17.)
All VO2.42 2.58 Vdc
Output Regulation:
Line (VI = 36 V to 75 V)
Load (IO = IO, min to IO, max)
Temperature (TC = –40 °C to +100 °C)
All
All
All
0.01
0.05
15
0.1
0.2
50
%VO
%VO
mV
Output Ripple and Noise Voltage (See Figure 16.):
RMS
Peak-to-peak (5 Hz to 20 MHz)
All
All
40
150
mVrms
mVp-p
External Load Capacitance All 0 * µF
Output Current
(At IO < IO, min, the modules may exceed output
ripple specifications.)
JW100G
JW150G
IO
IO
0.5
0.5
20
30
A
A
Output Current-limit Inception
(VO = 90% of VO, nom)
JW100G
JW150G
IO, cli
IO, cli
23
34
26
39
A
A
Output Short-circuit Current (VO = 250 mV) All 170 %IO, max
Efficiency (VI = 48 V; IO = IO, max; TC = 70 °C;
see Figure 17.)
JW100G
JW150G
η
η
76
76
%
%
Switching Frequency All 500 kHz
Dynamic Response
(IO/t = 1 A/10 µs, VI = 48 V, TC = 25 °C; tested
with a 10 µF aluminum and a 1.0 µF ceramic
capacitor across the load):
Load Change from IO = 50% to 75% of IO, max:
Peak Deviation
Settling Time (VO < 10% of peak deviation)
Load Change from IO = 50% to 25% of IO, max:
Peak Deviation
Settling Time (VO < 10% of peak deviation)
All
All
All
All
150
300
150
300
mV
µs
mV
µs
Parameter Min Typ Max Unit
Isolation Capacitance 2500 pF
Isolation Resistance 10 M
4Tyco Electronics Corp.
Data Sheet
February 2001
36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W
JW100G and JW150G Power Modules; dc-dc Converters:
General Specifications
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions. See the Feature Descriptions section for additional information.
* These are manufacturing test limits. In some situations, results may differ.
Solder, Cleaning, and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly process prior to electrical testing. The result of inad-
equate circuit-board cleaning and drying can affect both the reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on appropriate soldering, cleaning, and drying procedures, refer to
the
Board-Mounted Power Modules Soldering and Cleaning
Application Note (AP97-021EPS).
Parameter Min Typ Max Unit
Calculated MTBF (IO = 80% of IO, max; TC = 40 °C) 2,600,000 hours
Weight 100 (3.5) g (oz.)
Parameter Symbol Min Typ Max Unit
Remote On/Off Signal Interface
(VI = 0 V to 75 V; open collector or equivalent compatible;
signal referenced to VI(–) terminal):
JWxxxG1 Preferred Logic:
Logic Low—Module On
Logic High—Module Off
JWxxxG Optional Logic:
Logic Low—Module Off
Logic High—Module On
Logic Low:
At Ion/off = 1.0 mA
At Von/off = 0.0 V
Logic High:
At Ion/off = 0.0 µA
Leakage Current
Tu r n - o n T i m e
(IO = 80% of IO, max; VO within ±1% of steady state)
Von/off
Ion/off
Von/off
Ion/off
0
20
1.2
1.0
15
50
35
V
mA
V
µA
ms
Output Voltage Adjustment:
Output Voltage Remote-sense Range
Output Voltage Set-point Adjustment Range (trim)
60
0.5
110
V
%VO, nom
Output Overvoltage Protection VO, clamp 3.0* 4.0* V
Overtemperature Protection TC 105 °C
Data Sheet
February 2001
Tyco Electronics Corp. 5
36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W
JW100G and JW150G Power Modules; dc-dc Converters:
Characteristic Curves
The following figures provide typical characteristics for the power module. The figures are identical for both on/off
configurations.
1-0054
Figure 1. Typical JW100G Input Characteristics at
Room Temperature
8-1937 (F)
Figure 2. Typical JW150G Input Characteristics at
Room Temperature
1-0055
Figure 3. Typical JW100G Output Characteristics
at Room Temperature
8-1938 (F)
Figure 4. Typical JW150G Output Characteristics
at Room Temperature
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0 0 1020304050607080
INPUT VOLTAGE, VI (V)
INPUT CURRENT, II (A)
IO = 20.0 A
IO = 1.0 A
IO = 10.5 A
5 101520 55 65
0.0
2.0
INPUT VOLTAGE, VI (V)
1.0
0.5
1.5
INPUT CURRENT, II (A)
3.0
750
2.5
25 30 35 40 45 50 60 70
IO = 30 A
IO = 15 A
IO = 3 A
2.5
2.0
1.5
1.0
0.5
0.0
0 5 10 15 20 25 30
OUTPUT VOLTAGE, VO (V)
OUTPUT CURRENT, IO (A)
VI = 75 V
VI = 48 V
VI = 36 V
5101520
0.0
2.0
OUTPUT CURRENT, IO (A)
1.6
1.4
1.8
OUTPUT VOLTAGE, VO (V)
2.8
400
2.6
25 30 35
2.4
2.2
1.2
1.0
0.8
0.6
0.4
0.2
VI = 75 V
VI = 55 V
VI = 36 V
66 Tyco Electronics Corp.
Data Sheet
February 2001
36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W
JW100G and JW150G Power Modules; dc-dc Converters:
Characteristic Curves (continued)
1-0056
Figure 5. Typical JW100G Efficiency vs. Output
Current at Room Temperature
8-1939 (F)
Figure 6. Typical JW150G Efficiency vs. Output
Current at Room Temperature
1-0057
Note: See Figure 16 for test conditions.
Figure 7. Typical JW100G Output Ripple Voltage at
Room Temperature, 36 Vdc to 75 Vdc
Input, and 20 A Output
8-2630 (F)
Note: See Figure 16 for test conditions.
Figure 8. Typical JW150G Output Ripple Voltage at
Room Temperature, 36 Vdc to 75 Vdc
Input, and 30 A Output
78
77
76
75
74
73
72
71
70
69
68
67 2 4 6 8 10 12 14 16 18 20
OUTPUT CURRENT, IO (A)
EFFICIENCY, η (%)
VI = 36 V
VI = 48 V
VI = 75 V
691215
69
75
OUTPUT CURRENT, IO (A)
73
72
74
EFFICIENCY, η (%)
79
303
78
18 21 24
77
76
71
70
27
VI = 75 V
VI = 48 V
VI = 36 V
TIME, t (500 ns/div)
OUTPUT VOLTAGE, VO (V)
(50 mV/div)
VI = 75 V
VI = 48 V
VI = 36 V
TIME, t (500 ns/div)
OUTPUT VOLTAGE, V
O
(V)
(50 mV/div)
V
I
= 36 V
V
I
= 48 V
V
I
= 75 V
Tyco Electronics Corp. 7
Data Sheet
February 2001 36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W
JW100G and JW150G Power Modules; dc-dc Converters:
Characteristic Curves (continued)
1-0058
Note: Tested with a 10 µF aluminum and a 1.0 µF ceramic capacitor
across the load.
Figure 9. Typical JW100G Transient Response to
Step Decrease in Load from 50% to 25%
of Full Load at Room Temperature and
48 Vdc Input (Waveform Averaged to
Eliminate Ripple Component.)
8-2631 (F)
Note: Tested with a 10 µF aluminum and a 1.0 µF ceramic capacitor
across the load.
Figure 10. Typical JW150G Transient Response to
Step Increase in Load from 25% to 50%
of Full Load at Room Temperature and
48 Vdc Input (Waveform Averaged to
Eliminate Ripple Component.)
1-0059
Note: Tested with a 10 µF aluminum and a 1.0 µF ceramic capacitor
across the load.
Figure 11. Typical JW100G Transient Response to
Step Increase in Load from 25% to 50%
of Full Load at Room Temperature and
48 Vdc Input (Waveform Averaged to
Eliminate Ripple Component.)
8-2632 (F)
Note: Tested with a 10 µF aluminum and a 1.0 µF ceramic capacitor
across the load.
Figure 12. Typical JW150G Transient Response to
Step Decrease in Load from 50% to 25%
of Full Load at Room Temperature and
48 Vdc Input (Waveform Averaged to
Eliminate Ripple Component.)
TIME, t (50 µs/div)
OUTPUT CURRENT, IO (A)
(5 A/div)
OUTPUT VOLTAGE, VO (V)
(100 mV/div)
TIME, t (100
µ
s/div)
OUTPUT VOLTAGE, VO (V)
7.5 A
OUTPUT CURRENT, IO (A)
15 A
(50 mV/div)(5 A/div)
TIME, t (50 µs/div)
OUTPUT CURRENT, IO (A)
(5 A/div)
OUTPUT VOLTAGE, VO (V)
(100 mV/div)
TIME, t (100
µ
s/div)
OUTPUT VOLTAGE, VO (V)
7.5 A
OUTPUT CURRENT, IO (A)
15 A
(50 mV/div)(5 A/div)
88 Tyco Electronics Corp.
Data Sheet
February 2001
36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W
JW100G and JW150G Power Modules; dc-dc Converters:
Characteristic Curves (continued)
1-0060
Note: Tested with a 10 µF aluminum and a 1.0 µF ceramic capacitor
across the load.
Figure 13. Typical Start-Up from Remote On/Off
JW100G1; IO = IO, max
8-2633 (F)
Note: Tested with a 10 µF aluminum and a 1.0 µF ceramic capacitor
across the load.
Figure 14. Typical Start-Up from Remote On/Off
JW150G1; IO = IO, max
Test Configurations
8-203 (F).l
Note: Measure input reflected-ripple current with a simulated source
inductance (LTEST) of 12 µH. Capacitor CS offsets possible bat-
tery impedance. Measure current as shown above.
Figure 15. Input Reflected-Ripple Test Setup
8-1935 (F)
Note: Use a 1 µF ceramic capacitor and a 10 µF aluminum or tanta-
lum capacitor. Scope measurement should be made using a
BNC socket. Position the load between 51 mmand 76mm
(2 in. and 3 in.) from the module.
Figure 16. Peak-to-Peak Output Noise
Measurement Test Setup
8-749 (F)
Note: All measurements are taken at the module terminals. When
socketing, place Kelvin connections at module terminals to
avoid measurement errors due to socket contact resistance.
Figure 17. Output Voltage and Efficiency
Measurement Test Setup
TIME, t (20 ms/div)
OUTPUT VOLTAGE, VO (V)
(0.5 V/div)
REMOTE ON/OFF,
VON/OFF, (V)
TIME, t (5 ms/div)
OUTPUT VOLTAGE, V
O
(V) REMOTE ON/OFF,
2.5 V
(1 V/div) V
ON/OFF
(V)
TO OSCILLOSCOPE
CURRENT
PROBE
BATTERY
L
TEST
12
µ
H
C
S
220
µ
F
ESR < 0.1
@ 20
°
C, 100 kHz 33
µ
F
ESR < 0.7
@ 100 kHz
V
I
(+)
V
I
()
1 µFRESISTIVE
LOAD
SCOPE
COPPER STRIP
10 µF
VO(+)
VO()
VI(+)
IIIO
SUPPLY
CONTACT
CONTACT AND
LOAD
SENSE(+)
VI()
VO(+)
VO()
SENSE()
RESISTANCE
DISTRIBUTION LOSSES
ηVO(+) VO()[]IO
VI(+) VI()[]II
------------------------------------------------


x 100 %=
Tyco Electronics Corp. 9
Data Sheet
February 2001 36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W
JW100G and JW150G Power Modules; dc-dc Converters:
Design Considerations
Input Source Impedance
The power module should be connected to a low
ac-impedance input source. Highly inductive source
impedances can affect the stability of the power mod-
ule. For the test configuration in Figure 15, a 33 µF
electrolytic capacitor (ESR < 0.7 at 100 kHz)
mounted close to the power module helps ensure sta-
bility of the unit. For other highly inductive source
impedances, consult the factory for further application
guidelines.
Safety Considerations
For safety-agency approval of the system in which the
power module is used, the power module must be
installed in compliance with the spacing and separation
requirements of the end-use safety agency standard,
i.e.,
UL
1950,
CSA
C22.2 No. 950-95, and
VDE
0805
(EN60950, IEC950).
If the input source is non-SELV (ELV or a hazardous
voltage greater than 60 Vdc and less than or equal to
75 Vdc), for the modules output to be considered
meeting the requirements of safety extra-low voltage
(SELV), all of the following must be true:
The input source is to be provided with reinforced
insulation from any hazardous voltages, including the
ac mains.
One VI pin and one VO pin are to be grounded, or
both the input and output pins are to be kept floating.
The input pins of the module are not operator acces-
sible.
Another SELV reliability test is conducted on the
whole system, as required by the safety agencies, on
the combination of supply source and the subject
module to verify that under a single fault, hazardous
voltages do not appear at the modules output.
Note: Do not ground either of the input pins of the
module without grounding one of the output pins.
This may allow a non-SELV voltage to appear
between the output pin and ground.
The power module has extra-low voltage (ELV) outputs
when all inputs are ELV.
The input to these units is to be provided with a maxi-
mum 20 A normal-blow fuse in the ungrounded lead.
Feature Descriptions
Overcurrent Protection
To provide protection in a fault (output overload) condi-
tion, the unit is equipped with internal current-limiting
circuitry and can endure current limiting for an unlim-
ited duration. At the point of current-limit inception, the
unit shifts from voltage control to current control. If the
output voltage is pulled very low during a severe fault,
the current-limit circuit can exhibit either foldback or tai-
lout characteristics (output current decrease or
increase). The unit operates normally once the output
current is brought back into its specified range.
Remote On/Off
Two remote on/off options are available. Positive logic
remote on/off turns the module on during a logic-high
voltage on the ON/OFF pin, and off during a logic low.
Negative logic remote on/off turns the module off dur-
ing a logic high and on during a logic low. Negative
logic (code suffix 1) is the factory-preferred configura-
tion.
To turn the power module on and off, the user must
supply a switch to control the voltage between the
on/off terminal and the VI() terminal (Von/off). The
switch can be an open collector or equivalent (see
Figure 18). A logic low is Von/off = 0 V to 1.2 V. The
maximum Ion/off during a logic low is 1mA. The switch
should maintain a logic-low voltage while sinking 1 mA.
During a logic high, the maximum Von/off generated by
the power module is 15 V. The maximum allowable
leakage current of the switch at V on/off = 15 V is 50 µA.
If not using the remote on/off feature, do one of the
following:
For negative logic, short the ON/OFF pin to VI().
For positive logic, leave the ON/OFF pin open.
8-720 (F).c
Figure 18. Remote On/Off Implementation
SENSE(+)
VO(+)
SENSE()
VO()
VI()
+
Ion/off
ON/OFF
VI(+)
LOAD
Von/off
1010 Tyco Electronics Corp.
Data Sheet
February 2001
36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W
JW100G and JW150G Power Modules; dc-dc Converters:
Feature Descriptions (continued)
Remote Sense
Remote sense minimizes the effects of distribution
losses by regulating the voltage at the remote-sense
connections. The voltage between the remote-sense
pins and the output terminals must not exceed the out-
put voltage sense range given in the Feature Specifica-
tions table, i.e.:
[VO(+) VO()] [SENSE(+) SENSE()] 0.5 V
The voltage between the VO(+) and VO() terminals
must not exceed 3.0 V. This limit includes any increase
in voltage due to remote-sense compensation and out-
put voltage set-point adjustment (trim). See Figure 19.
If not using the remote-sense feature to regulate the
output at the point of load, then connect SENSE(+) to
VO(+) and SENSE() to VO() at the module.
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim. Consult the factory if you
need to increase the output voltage more than the
above limitation.
The amount of power delivered by the module is defined
as the voltage at the output terminals multiplied by the
output current. When using remote sense and trim, the
output voltage of the module can be increased, which at
the same output current would increase the power output
of the module. Care should be taken to ensure that the
maximum output power of the module remains at or
below the maximum rated power.
8-651 (F).m
Figure 19. Effective Circuit Configuration for
Single-Module Remote-Sense Operation
Output Voltage Set-Point Adjustment
(Trim)
Output voltage trim allows the user to increase or
decrease the output voltage set point of a module. This
is accomplished by connecting an external resistor
between the TRIM pin and either the SENSE(+) or
SENSE() pins. The trim resistor should be positioned
close to the module.
If not using the trim feature, leave the TRIM pin open.
With an external resistor between the TRIM and
SENSE() pins (Radj-down), the output voltage set point
(VO, adj) decreases (see Figure 20). The following equa-
tion determines the required external-resistor value to
obtain a percentage output voltage change of %.
With an external resistor connected between the TRIM
and SENSE(+) pins (Radj-up), the output voltage set
point (VO, adj) increases (see Figure 21).
The following equation determines the required exter-
nal-resistor value to obtain a percentage output voltage
change of %.
The voltage between the VO(+) and VO() terminals
must not exceed 3.8 V. This limit includes any increase
in voltage due to remote-sense compensation and out-
put voltage set-point adjustment (trim). See Figure 19.
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim. Consult the factory if you
need to increase the output voltage more than the
above limitation.
The amount of power delivered by the module is defined
as the voltage at the output terminals multiplied by the
output current. When using remote sense and trim, the
output voltage of the module can be increased, which at
the same output current would increase the power output
of the module. Care should be taken to ensure that the
maximum output power of the module remains at or
below the maximum rated power.
SENSE(+)
SENSE()
VI(+)
VI()
IOLOAD
CONTACT AND
SUPPLY II
CONTACT
VO(+)
VO()
DISTRIBUTION LOSSESRESISTANCE
Radj-down 100
%
----------2


k=
Radj-up VO100 %+()
1.225%
-------------------------------------- 100 2%+()
%
----------------------------------


k=
Tyco Electronics Corp. 11
Data Sheet
February 2001 36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W
JW100G and JW150G Power Modules; dc-dc Converters:
Feature Descriptions (continued)
Output Voltage Set-Point Adjustment
(Trim) (continued)
8-748 (F).b
Figure 20. Circuit Configuration to Decrease
Output Voltage
8-715 (F).b
Figure 21. Circuit Configuration to Increase
Output Voltage
Output Overvoltage Protection
The output overvoltage clamp consists of control cir-
cuitry, independent of the primary regulation loop, that
monitors the voltage on the output terminals. The con-
trol loop of the clamp has a higher voltage set point
than the primary loop (see Feature Specifications
table). This provides a redundant voltage control that
reduces the risk of output overvoltage.
Thermal Considerations
Introduction
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation of the unit.
Heat-dissipating components inside the unit are ther-
mally coupled to the case. Heat is removed by conduc-
tion, convection, and radiation to the surrounding
environment. Proper cooling can be verified by mea-
suring the case temperature. Peak temperature (TC)
occurs at the position indicated in Figure 22.
8-716 (F).f
Note: Top view, pin locations are for reference only.
Measurements shown in millimeters and (inches).
Figure 22. Case Temperature Measurement
Location
The temperature at this location should not exceed
100 °C. The output power of the module should not
exceed the rated power for the module as listed in the
Ordering Information table.
Although the maximum case temperature of the power
module is 100 °C, you can limit this temperature to a
lower value for extremely high reliability.
For additional information on these modules, refer to
the
Thermal Management JC-, JFC-, JW-, and JFW-
Series 50 W to 150 W Board-Mounted Power Modules
Technical Note (TN97-008EPS).
VI
(+)
VI()
ON/OFF
CASE
VO(+)
VO()
SENSE(+)
TRIM
SENSE()
Radj-down
RLOAD
VI
(+)
VI()
ON/OFF
CASE
VO(+)
VO()
SENSE(+)
TRIM
SENSE()
Radj-up
RLOAD
38.0 (1.50) MEASURE CASE
VI()
ON/OFF
CASE
+ SEN
TRIM
SEN
VI(+)
VO()
VO(+)
7.6 (0.30)
TEMPERATURE HERE
1212 Tyco Electronics Corp.
Data Sheet
February 2001
36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W
JW100G and JW150G Power Modules; dc-dc Converters:
Thermal Considerations (continued)
Heat Transfer Without Heat Sinks
Increasing airflow over the module enhances the heat
transfer via convection. Figure 23 shows the maximum
power that can be dissipated by the module without
exceeding the maximum case temperature versus local
ambient temperature (TA) for natural convection
through 4 m/s (800 ft./min.).
Note that the natural convection condition was mea-
sured at 0.05 m/s to 0.1 m/s (10 ft./min. to 20 ft./min.);
however, systems in which these power modules may
be used typically generate natural convection airflow
rates of 0.3 m/s (60 ft./min.) due to other heat dissipat-
ing components in the system. The use of Figure 23 is
shown in the following example.
Example
What is the minimum airflow necessary for a JW150G
operating at VI = 55 V, an output current of 30 A, and a
maximum ambient temperature of 4 0°C?
Solution
Given: VI = 55 V
IO = 30 A
TA = 40 °C
Determine PD (Use Figure 25.):
PD = 23.5 W
Determine airflow (v) (Use Figure 23.):
v = 3.0 m/s (600 ft./min.)
8-1150 (F).a
Figure 23. Forced Convection Power Derating with
No Heat Sink; Either Orientation
1-0061
Figure 24. JW100G Power Dissipation vs.
Output Current
8-1944 (F)
Figure 25. JW150G Power Dissipation vs.
Output Current
Heat Transfer with Heat Sinks
The power modules have through-threaded, M3 x 0.5
mounting holes, which enable heat sinks or cold plates
to attach to the module. The mounting torque must not
exceed 0.56 N-m ( 5in.-lb.).
For a screw attachment from the pin side, the recom-
mended hole size on the customers PWB around the
mounting holes is 0.130 ± 0.005 inches. If a larger hole
is used, the mounting torque from the pin side must not
exceed 0.2 5N-m (2. 2in.-lb.).
010203040 100
0
35
25
20
10
9080706050
5
15
30
LOCAL AMBIENT TEMPERATURE, TA(°C)
POWER DISSIPATION, PD (W)
4.0 m/s (800 ft./min.)
3.5 m/s (700 ft./min.)
3.0 m/s (600 ft./min.)
2.5 m/s (500 ft./min.)
2.0 m/s (400 ft./min.)
1.5 m/s (300 ft./min.)
1.0 m/s (200 ft./min.)
0.5 m/s (100 ft./min.)
0.1 m/s (NAT. CONV.)
(20 ft./min.)
18
16
14
12
10
8
6
4
2
0135791113 191715 21
OUTPUT CURRENT, IO (A)
POWER DISSIPATION, PD (W)
VI = 75 V
VI = 48 V
VI = 36 V
5 101520
0
OUTPUT CURRENT, IO (A)
20
15
POWER DISSIPATION, PD (W)
25
30025
10
5
VI = 36 V
VI = 75 V
VI = 55 V
Tyco Electronics Corp. 13
Data Sheet
February 2001 36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W
JW100G and JW150G Power Modules; dc-dc Converters:
Thermal Considerations (continued)
Heat Transfer with Heat Sinks (continued)
Thermal derating with heat sinks is expressed by using
the overall thermal resistance of the module. Total
module thermal resistance (θca) is defined as the max-
imum case temperature rise (TC, max) divided by the
module power dissipation (PD):
The location to measure case temperature (TC) is
shown in Figure 22. Case-to-ambient thermal resis-
tance vs. airflow is shown, for various heat sink config-
urations and heights, in Figure 26. These curves were
obtained by experimental testing of heat sinks, which
are offered in the product catalog.
8-1153 (F)
Figure 26. Case-to-Ambient Thermal Resistance
Curves; Either Orientation
These measured resistances are from heat transfer
from the sides and bottom of the module as well as the
top side with the attached heat sink; therefore, the
case-to-ambient thermal resistances shown are gener-
ally lower than the resistance of the heat sink by itself.
The module used to collect the data in Figure 26 had a
thermal-conductive dry pad between the case and the
heat sink to minimize contact resistance. The use of
Figure 26 is shown in the following example.
Example
If an 85 °C case temperature is desired, what is the
minimum airflow necessary? Assume the JW150G
module is operating at VI = 55 V and an output current
of 30 A, maximum ambient air temperature of 4 0°C,
and the heat sink is 1/2 inch.
Solution
Given: VI = 55 V
IO = 30 A
TA = 40 °C
TC = 85 °C
Heat sink = 1/2 inch
Determine PD by using Figure 25:
PD = 23.5 W
Then solve the following equation:
Use Figure 26 to determine air velocity for the 1/2 inch
heat sink.
The minimum airflow necessary for the JW150G
module is 2.1 m/s (420 ft./min.).
θca TCmax,
PD
---------------------TCTA
()
PD
------------------------
==
00.5
(100)
1.0
(200)
1.5
(300)
2.0
(400)
2.5
(500)
3.0
(600)
0
1
5
6
7
8
AIR VELOCITY MEASURED IN m/s (ft./min.)
4
3
2
CASE-TO-AMBIENT THERMAL
RESISTANCE, θCA (°C/W)
1 1/2 IN HEAT SINK
1 IN HEAT SINK
1/2 IN HEAT SINK
1/4 IN HEAT SINK
NO HEAT SINK
0
θca TCTA
()
PD
------------------------
=
θca 85 40()
23.5
------------------------
=
θca 1.9 °C/W=
1414 Tyco Electronics Corp.
Data Sheet
February 2001
36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W
JW100G and JW150G Power Modules; dc-dc Converters:
Thermal Considerations (continued)
Custom Heat Sinks
A more detailed model can be used to determine the
required thermal resistance of a heat sink to provide
necessary cooling. The total module resistance can be
separated into a resistance from case-to-sink (θcs) and
sink-to-ambient (θsa) shown below (Figure 27).
8-1304 (F).e
Figure 27. Resistance from Case-to-Sink and
Sink-to-Ambient
For a managed interface using thermal grease or foils,
a value of θcs = 0.1 °C/W to 0.3 °C/W is typical. The
solution for heat sink resistance is:
This equation assumes that all dissipated power must
be shed by the heat sink. Depending on the user-
defined application environment, a more accurate
model, including heat transfer from the sides and bot-
tom of the module, can be used. This equation pro-
vides a conservative estimate for such instances.
EMC Considerations
For assistance with designing for EMC compliance,
please refer to the
FLTR100V10 Filter Module
Data
Sheet (DS99-294EPS).
Layout Considerations
Copper paths must not be routed beneath the power
module mounting inserts. For additional layout guide-
lines, refer to the
FLTR100V10
Filter Module
Data
Sheet (DS99-294EPS).
PDTCTSTA
θcs θsa
θsa TCTA
()
PD
-------------------------θcs=
Tyco Electronics Corp. 15
Data Sheet
February 2001 36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W
JW100G and JW150G Power Modules; dc-dc Converters:
Outline Diagram
Dimensions are in millimeters and (inches).
Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.)
x.xx mm ± 0.25 mm (x.xxx in. ± 0.010 in.)
Top View
Side View
Bottom View
8-1936 (F)
* Side label includes Tyco name, product designation, safety agency markings, input/output voltage and current ratings, and bar code.
61.0
(2.40)
MAX
57.9 (2.28) MAX
5.01 (0.20) MIN
12.70 ± 0.5
2.06 (0.081) DIA
1.02 (0.040) DIA
SIDE LABEL*
(0.500 ± 0.020)
SOLDER-PLATED
BRASS, 7 PLACES
SOLDER-PLATED BRASS,
2 PLACES (OUTPUT
AND +OUTPUT)
10.16
VO()
SEN
TRIM
+SEN
CASE
ON/OFF
VI(+)
VI()
VO(+)
MOUNTING INSERTS
10.16
(0.400)
5.1 (0.20)
12.7 (0.50)
4.8
(0.19)
25.4
50.8
35.56
48.3 (1.90)
48.26
17.78
25.40
35.56
M3 x 0.5 THROUGH,
4 PLACES
(2.00)
(1.400)
(1.00)
(1.900)
(0.400)
(0.700)
(1.000)
(1.400)
16 Tyco Electronics Corp.
Data Sheet
February 2001
36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W
JW100G and JW150G Power Modules; dc-dc Converters:
Recommended Hole Pattern
Component-side footprint.
Dimensions are in millimeters and (inches).
8-1936 (F)
Ordering Information
Please contact your Tyco Electronics Account Manager or Field Application Engineer for pricing and availability.
Table 4. Device Codes
Optional features can be ordered using the suffixes shown in Table 5. The suffixes follow the last letter of the device
code and are placed in descending order. For example, the device code for a JW100G1 module with the following
option is shown below:
Short pins JW100G61
Table 5. Device Options
Input
Voltage
Output
Voltag e
Output
Power
Output
Current
Remote On/Off
Logic
Device
Code Comcode
48 V 2.5 V 50 W 20 A Negative JW100G1 108553256
48 V 2.5 V 50 W 20 A Positive JW100G TBD
48 V 2.5 V 75 W 30 A Negative JW150G1 108457706
48 V 2.5 V 75 W 30 A Positive JW150G TBD
Option Suffix
Short pins: 3.68 mm ± 0.25 mm
(0.145 in. ± 0.010 in.)
6
10.16
VO()
SEN
TRIM
+SEN
CASE
ON/OFF
VI(+)
VI()
VO(+)
MOUNTING INSERTS
10.16
(0.400)
5.1 (0.20)
12.70 (0.500)
4.8
(0.19)
25.4
50.8
35.56
48.3 (1.90)
48.26
17.78
25.40
(2.00)
(1.400)
(1.000)
(1.900)
(0.400)
(0.700)
(1.00)
57.9 (2.28) MAX
MODULE OUTLINE
61.0
(2.40)
MAX
35.56
(1.400)
Tyco Electronics Corp. 17
Data Sheet
February 2001 36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W
JW100G and JW150G Power Modules; dc-dc Converters:
Ordering Information (continued)
Table 6. Device Accessories
Dimensions are in millimeters and (inches).
8-2832 (F).a
Figure 28. Longitudinal Heat Sink
8-2833 (F)
Figure 29. Transverse Heat Sink
Accessory Comcode
1/4 in. transverse kit (heat sink, thermal pad, and screws) 407243989
1/4 in. longitudinal kit (heat sink, thermal pad, and screws) 407243997
1/2 in. transverse kit (heat sink, thermal pad, and screws) 407244706
1/2 in. longitudinal kit (heat sink, thermal pad, and screws) 407244714
1 in. transverse kit (heat sink, thermal pad, and screws) 407244722
1 in. longitudinal kit (heat sink, thermal pad, and screws) 407244730
1 1/2 in. transverse kit (heat sink, thermal pad, and screws) 407244748
1 1/2 in. longitudinal kit (heat sink, thermal pad, and screws) 407244755
1/4 IN.
1/2 IN.
1 IN.
1 1/2 IN.
61
57.9
(2.4)
(2.28)
1/4 IN.
1/2 IN.
1 IN.
1 1/2 IN.
57.9
(2.28)
61
(2.4)
1818 Tyco Electronics Corp.
Data Sheet
February 2001
36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W
JW100G and JW150G Power Modules; dc-dc Converters:
Notes
Tyco Electronics Corp. 19
Data Sheet
February 2001 36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W
JW100G and JW150G Power Modules; dc-dc Converters:
Notes
Data Sheet
February 2001
36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W
JW100G and JW150G Power Modules; dc-dc Converters:
Printed on
Recycled Paper
Tyco Electronics Power Systems, Inc.
3000 Skyline Drive, Mesquite, TX 75149, USA
+1-800-526-7819 FAX: +1-888-315-5182
(Outside U.S.A.: +1-972-284-2626, FAX: +1-972-284-2900)
http://power.tycoelectronics.com
Tyco Electronics Corporation reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application.
No rights under any patent accompany the sale of any such product(s) or information.
© 2001 Tyco Electronics Corporation, Harrisburg, PA. All International Rights Reserved.
Printed in U.S.A.
February 2001
DS00-076EPS (Replaces DS99-132EPS)