Data Sheet February 2001 JW100G and JW150G Power Modules; dc-dc Converters: 36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W Features The JW100G and JW150G Power Modules use advanced, surface-mount technology and delivers high-quality, efficient, and compact dc-dc conversion. Applications Distributed power architectures Computer equipment Communications equipment Options Heat sinks available for extended operation Choice of remote on/off logic configuration Short pins: 3.68 mm 0.25 mm (0.145 in. 0.010 in.) Small size: 61.0 mm x 57.9 mm x 12.7 mm (2.40 in. x 2.28 in. x 0.50 in.) High power density High efficiency: 76% typical Low output noise Constant frequency Industry-standard pinout Metal baseplate and case ground pin 2:1 input voltage range Overcurrent, overtemperature, and overvoltage protection Remote sense and remote on/off Adjustable output voltage Manufacturing facilities registered against the ISO* 9000 series standards UL 60950 Recognized, CSA C22.2 No. 60950-00 Certified, and VDE 0805 (IEC **60950, 4th Edition) Licensed CE mark meets 73/23/EEC and 93/68/EEC directives * ISO is a registered trademark of the International Organization for Standardization. UL is a registered trademark of Underwriters Laboratories, Inc. CSA is a registered trademark of Canadian Standards Association. VDE is a trademark of Verband Deutscher Elektrotechniker e.V. ** IEC is a trademark of International Elecktrotechniker Commission. This product is intended for integration into end-use equipment. All the required procedures for CE marking of end-use equipment should be followed. (The CE mark is placed on selected products.) Description The JW100G and JW150G Power Modules are dc-dc converter that operate over an input voltage range of 36 Vdc to 7 5Vdc and provide a precisely regulated dc output. The outputs are fully isolated from the inputs, allowing versatile polarity configurations and grounding connections. The module has a maximum power ratings of 50 W to 75 W at a typical full-load efficiency of 7 6%. The sealed modules offer a metal baseplate for excellent thermal performance. Threaded-through holes are provided to allow easy mounting or addition of a heat sink for high-temperature applications. The standard feature set includes remote sensing, output trim, and remote on/off for convenient flexibility in distributed power applications. JW100G and JW150G Power Modules; dc-dc Converters: 36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W Data Sheet February 2001 Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect device reliability. Parameter Symbol Min Max Unit Input Voltage: Continuous Transient (100 ms) VI VI, trans -- -- 80 100 Vdc V I/O Isolation Voltage -- -- 1500 Vdc Operating Case Temperature (See Thermal Considerations section.) TC -40 100 C Storage Temperature Tstg -55 125 C Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. Table 1. Input Specifications Parameter Symbol Min Typ Max Unit VI 36 48 75 Vdc II, max II, max -- -- -- -- 2.3 3.7 A A II, max II, max -- -- -- -- 2.4 3.7 A A Inrush Transient i2t -- -- 1.0 A2s Input Reflected-ripple Current, Peak-to-peak (5 Hz to 20 MHz, 12 H source impedance; see Figure 15.) II -- 5 -- mAp-p Input Ripple Rejection (120 Hz) -- -- 60 -- dB Operating Input Voltage Maximum Input Current: VI = 0 V to 75 V; IO = IO, max; see Figures 1--2: JW100G JW150G VI = 36 V to 75 V; I O = IO, max: JW100G JW150G Fusing Considerations CAUTION: This power module is not internally fused. An input line fuse must always be used. This encapsulated power module can be used in a wide variety of applications, ranging from simple stand-alone operation to an integrated part of a sophisticated power architecture. To preserve maximum flexibility, internal fusing is not included; however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a normal-blow fuse with a maximum rating of 20 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer's data for further information. 2 Tyco Electronics Corp. JW100G and JW150G Power Modules; dc-dc Converters: 36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W Data Sheet February 2001 Electrical Specifications (continued) Table 2. Output Specifications Device Symbol Min Typ Max Unit Output Voltage Set Point (VI = 48 V; IO = IO, max; TC = 25 C) Parameter All VO, set 2.46 2.5 2.55 Vdc Output Voltage (Over all operating input voltage, resistive load, and temperature conditions until end of life. See Figure 17.) All VO 2.42 -- 2.58 Vdc Output Regulation: Line (VI = 36 V to 75 V) Load (IO = IO, min to IO, max) Temperature (TC = -40 C to +100 C) All All All -- -- -- -- -- -- 0.01 0.05 15 0.1 0.2 50 %VO %VO mV Output Ripple and Noise Voltage (See Figure 16.): RMS Peak-to-peak (5 Hz to 20 MHz) All All -- -- -- -- -- -- 40 150 mVrms mVp-p External Load Capacitance All -- 0 -- * F Output Current (At I O < IO, min, the modules may exceed output ripple specifications.) JW100G JW150G IO IO 0.5 0.5 -- -- 20 30 A A Output Current-limit Inception (VO = 90% of V O, nom) JW100G JW150G IO, cli IO, cli -- -- 23 34 26 39 A A Output Short-circuit Current (VO = 250 mV) Efficiency (VI = 48 V; I O = IO, max; TC = 70 C; see Figure 17.) Switching Frequency Dynamic Response (IO/t = 1 A/10 s, V I = 48 V, TC = 25 C; tested with a 10 F aluminum and a 1.0 F ceramic capacitor across the load): Load Change from IO = 50% to 75% of I O, max: Peak Deviation Settling Time (VO < 10% of peak deviation) Load Change from IO = 50% to 25% of I O, max: Peak Deviation Settling Time (VO < 10% of peak deviation) All -- -- 170 -- %IO, max JW100G JW150G -- -- 76 76 -- -- % % All -- -- 500 -- kHz All All -- -- -- -- 150 300 -- -- mV s All All -- -- -- -- 150 300 -- -- mV s * Consult your sales representative or the factory. These are manufacturing test limits. In some situations, results may differ. Table 3. Isolation Specifications Parameter Min Typ Max Isolation Capacitance -- 2500 -- pF Isolation Resistance 10 -- -- M Tyco Electronics Corp. Unit 3 JW100G and JW150G Power Modules; dc-dc Converters: 36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W Data Sheet February 2001 General Specifications Parameter Min Calculated MTBF (I O = 80% of I O, max; TC = 40 C) Weight Typ Max Unit 100 (3.5) g (oz.) 2,600,000 -- hours -- Feature Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See the Feature Descriptions section for additional information. Parameter Remote On/Off Signal Interface (VI = 0 V to 75 V; open collector or equivalent compatible; signal referenced to VI(-) terminal): JWxxxG1 Preferred Logic: Logic Low--Module On Logic High--Module Off JWxxxG Optional Logic: Logic Low--Module Off Logic High--Module On Logic Low: At Ion/off = 1.0 mA At Von/off = 0.0 V Logic High: At Ion/off = 0.0 A Leakage Current Turn-on Time (IO = 80% of I O, max; VO within 1% of steady state) Output Voltage Adjustment: Output Voltage Remote-sense Range Output Voltage Set-point Adjustment Range (trim) Output Overvoltage Protection Overtemperature Protection Symbol Min Typ Max Unit Von/off Ion/off 0 -- -- -- 1.2 1.0 V mA Von/off Ion/off -- -- -- -- -- -- 20 15 50 35 V A ms -- -- -- 60 -- -- 0.5 110 V %VO, nom VO, clamp 3.0* -- 4.0* V TC -- 105 -- C * These are manufacturing test limits. In some situations, results may differ. Solder, Cleaning, and Drying Considerations Post solder cleaning is usually the final circuit-board assembly process prior to electrical testing. The result of inadequate circuit-board cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning, and drying procedures, refer to the Board-Mounted Power Modules Soldering and Cleaning Application Note (AP97-021EPS). 4 Tyco Electronics Corp. JW100G and JW150G Power Modules; dc-dc Converters: 36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W Data Sheet February 2001 Characteristic Curves 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 2.5 OUTPUT VOLTAGE, VO (V) INPUT CURRENT, II (A) The following figures provide typical characteristics for the power module. The figures are identical for both on/off configurations. IO = 20.0 A IO = 10.5 A IO = 1.0 A 2.0 1.5 VI = 75 V VI = 48 V VI = 36 V 1.0 0.5 0.0 0 10 20 30 40 50 60 70 0 80 5 10 15 20 25 30 OUTPUT CURRENT, IO (A) INPUT VOLTAGE, VI (V) 1-0055 1-0054 Figure 1. Typical JW100G Input Characteristics at Room Temperature Figure 3. Typical JW100G Output Characteristics at Room Temperature 3.0 OUTPUT VOLTAGE, VO (V) INPUT CURRENT, II (A) 2.5 IO = 30 A 2.0 1.5 IO = 15 A 1.0 IO = 3 A 0.5 0.0 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 INPUT VOLTAGE, VI (V) VI = 75 V VI = 55 V VI = 36 V 0 5 10 15 20 25 30 35 40 OUTPUT CURRENT, IO (A) 8-1937 (F) Figure 2. Typical JW150G Input Characteristics at Room Temperature Tyco Electronics Corp. 2.8 2.6 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 8-1938 (F) Figure 4. Typical JW150G Output Characteristics at Room Temperature 5 JW100G and JW150G Power Modules; dc-dc Converters: 36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W Data Sheet February 2001 78 77 76 75 74 73 72 71 70 69 68 67 OUTPUT VOLTAGE, VO (V) (50 mV/div) EFFICIENCY, (%) Characteristic Curves (continued) VI = 36 V VI = 48 V VI = 75 V VI = 36 V VI = 48 V VI = 75 V 2 4 6 8 10 12 14 16 18 20 OUTPUT CURRENT, IO (A) 1-0056 Figure 5. Typical JW100G Efficiency vs. Output Current at Room Temperature TIME, t (500 ns/div) 1-0057 Note: See Figure 16 for test conditions. Figure 7. Typical JW100G Output Ripple Voltage at Room Temperature, 36 Vdc to 75 Vdc Input, and 20 A Output 79 78 76 75 VI = 75 V VI = 48 V VI = 36 V 74 73 VI = 36 V 72 71 70 69 3 6 9 12 15 18 21 24 27 30 OUTPUT CURRENT, IO (A) 8-1939 (F) Figure 6. Typical JW150G Efficiency vs. Output Current at Room Temperature OUTPUT VOLTAGE, VO (V) (50 mV/div) EFFICIENCY, (%) 77 VI = 48 V VI = 75 V TIME, t (500 ns/div) 8-2630 (F) Note: See Figure 16 for test conditions. Figure 8. Typical JW150G Output Ripple Voltage at Room Temperature, 36 Vdc to 75 Vdc Input, and 30 A Output 6 Tyco Electronics Corp. JW100G and JW150G Power Modules; dc-dc Converters: 36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W Data Sheet February 2001 OUTPUT CURRENT, IO (A) OUTPUT VOLTAGE, VO (V) (5 A/div) (100 mV/div) OUTPUT CURRENT, IO (A) OUTPUT VOLTAGE, VO (V) (5 A/div) (100 mV/div) Characteristic Curves (continued) TIME, t (50 s/div) 1-0059 TIME, t (50 s/div) 1-0058 Note: Tested with a 10 F aluminum and a 1.0 F ceramic capacitor across the load. Figure 11. Typical JW100G Transient Response to Step Increase in Load from 25% to 50% of Full Load at Room Temperature and 48 Vdc Input (Waveform Averaged to Eliminate Ripple Component.) OUTPUT CURRENT, IO (A) OUTPUT VOLTAGE, VO (V) (5 A/div) (50 mV/div) OUTPUT CURRENT, IO (A) OUTPUT VOLTAGE, VO (V) (5 A/div) (50 mV/div) Figure 9. Typical JW100G Transient Response to Step Decrease in Load from 50% to 25% of Full Load at Room Temperature and 48 Vdc Input (Waveform Averaged to Eliminate Ripple Component.) Note: Tested with a 10 F aluminum and a 1.0 F ceramic capacitor across the load. 15 A 7.5 A 15 A 7.5 A TIME, t (100 s/div) TIME, t (100 s/div) 8-2632 (F) 8-2631 (F) Note: Tested with a 10 F aluminum and a 1.0 F ceramic capacitor across the load. Figure 10. Typical JW150G Transient Response to Step Increase in Load from 25% to 50% of Full Load at Room Temperature and 48 Vdc Input (Waveform Averaged to Eliminate Ripple Component.) Tyco Electronics Corp. Note: Tested with a 10 F aluminum and a 1.0 F ceramic capacitor across the load. Figure 12. Typical JW150G Transient Response to Step Decrease in Load from 50% to 25% of Full Load at Room Temperature and 48 Vdc Input (Waveform Averaged to Eliminate Ripple Component.) 7 JW100G and JW150G Power Modules; dc-dc Converters: 36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W Characteristic Curves (continued) Data Sheet February 2001 Test Configurations REMOTE ON/OFF, VON/OFF, (V) TO OSCILLOSCOPE CURRENT PROBE LTEST VI(+) 12 H CS 220 F ESR < 0.1 @ 20 C, 100 kHz OUTPUT VOLTAGE, VO (V) (0.5 V/div) BATTERY 33 F ESR < 0.7 @ 100 kHz VI(-) 8-203 (F).l Note: Measure input reflected-ripple current with a simulated source inductance (LTEST) of 12 H. Capacitor CS offsets possible battery impedance. Measure current as shown above. Figure 15. Input Reflected-Ripple Test Setup TIME, t (20 ms/div) 1-0060 Note: Tested with a 10 F aluminum and a 1.0 F ceramic capacitor across the load. COPPER STRIP VO(+) Figure 13. Typical Start-Up from Remote On/Off JW100G1; IO = IO, max 1 F 10 F SCOPE RESISTIVE LOAD VO(-) 8-1935 (F) REMOTE ON/OFF, VON/OFF (V) Note: Use a 1 F ceramic capacitor and a 10 F aluminum or tantalum capacitor. Scope measurement should be made using a BNC socket. Position the load between 51 mmand 76mm (2 in. and 3 in.) from the module. OUTPUT VOLTAGE, VO (V) (1 V/div) Figure 16. Peak-to-Peak Output Noise Measurement Test Setup SENSE(+) 2.5 V VI(+) CONTACT AND DISTRIBUTION LOSSES VO(+) II IO LOAD SUPPLY VI(-) VO(-) CONTACT RESISTANCE SENSE(-) TIME, t (5 ms/div) 8-749 (F) 8-2633 (F) Note: Tested with a 10 F aluminum and a 1.0 F ceramic capacitor across the load. Figure 14. Typical Start-Up from Remote On/Off JW150G1; IO = IO, max Note: All measurements are taken at the module terminals. When socketing, place Kelvin connections at module terminals to avoid measurement errors due to socket contact resistance. [ V O (+) - V O (-) ]I O = ------------------------------------------------ x 100 [ V I (+) - V I (-) ]I I % Figure 17. Output Voltage and Efficiency Measurement Test Setup 8 Tyco Electronics Corp. Data Sheet February 2001 JW100G and JW150G Power Modules; dc-dc Converters: 36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W Design Considerations Feature Descriptions Input Source Impedance Overcurrent Protection The power module should be connected to a low ac-impedance input source. Highly inductive source impedances can affect the stability of the power module. For the test configuration in Figure 15, a 33 F electrolytic capacitor (ESR < 0.7 at 100 kHz) mounted close to the power module helps ensure stability of the unit. For other highly inductive source impedances, consult the factory for further application guidelines. To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting for an unlimited duration. At the point of current-limit inception, the unit shifts from voltage control to current control. If the output voltage is pulled very low during a severe fault, the current-limit circuit can exhibit either foldback or tailout characteristics (output current decrease or increase). The unit operates normally once the output current is brought back into its specified range. Safety Considerations Remote On/Off For safety-agency approval of the system in which the power module is used, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e., UL1950, CSA C22.2 No. 950-95, and VDE 0805 (EN60950, IEC950). If the input source is non-SELV (ELV or a hazardous voltage greater than 60 Vdc and less than or equal to 75 Vdc), for the module's output to be considered meeting the requirements of safety extra-low voltage (SELV), all of the following must be true: The input source is to be provided with reinforced insulation from any hazardous voltages, including the ac mains. One VI pin and one VO pin are to be grounded, or both the input and output pins are to be kept floating. The input pins of the module are not operator accessible. Another SELV reliability test is conducted on the whole system, as required by the safety agencies, on the combination of supply source and the subject module to verify that under a single fault, hazardous voltages do not appear at the module's output. Note: Do not ground either of the input pins of the module without grounding one of the output pins. This may allow a non-SELV voltage to appear between the output pin and ground. The power module has extra-low voltage (ELV) outputs when all inputs are ELV. The input to these units is to be provided with a maximum 20 A normal-blow fuse in the ungrounded lead. Two remote on/off options are available. Positive logic remote on/off turns the module on during a logic-high voltage on the ON/OFF pin, and off during a logic low. Negative logic remote on/off turns the module off during a logic high and on during a logic low. Negative logic (code suffix "1") is the factory-preferred configuration. To turn the power module on and off, the user must supply a switch to control the voltage between the on/off terminal and the VI(-) terminal (Von/off). The switch can be an open collector or equivalent (see Figure 18). A logic low is V on/off = 0 V to 1.2V. The maximum Ion/off during a logic low is 1mA. The switch should maintain a logic-low voltage while sinking 1 mA. During a logic high, the maximum Von/off generated by the power module is 15 V. The maximum allowable leakage current of the switch at V on/off = 15 V is 50 A. If not using the remote on/off feature, do one of the following: For negative logic, short the ON/OFF pin to VI(-). For positive logic, leave the ON/OFF pin open. Ion/off + ON/OFF Von/off - SENSE(+) VO(+) LOAD VI(+) VI(-) VO(-) SENSE(-) 8-720 (F).c Figure 18. Remote On/Off Implementation Tyco Electronics Corp. 9 JW100G and JW150G Power Modules; dc-dc Converters: 36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W Data Sheet February 2001 Output Voltage Set-Point Adjustment (Trim) Feature Descriptions (continued) Remote Sense Remote sense minimizes the effects of distribution losses by regulating the voltage at the remote-sense connections. The voltage between the remote-sense pins and the output terminals must not exceed the output voltage sense range given in the Feature Specifications table, i.e.: [VO(+) - VO(-)] - [SENSE(+) - SENSE(-)] 0.5 V The voltage between the V O(+) and VO(-) terminals must not exceed 3.0 V. This limit includes any increase in voltage due to remote-sense compensation and output voltage set-point adjustment (trim). See Figure 19. If not using the remote-sense feature to regulate the output at the point of load, then connect SENSE(+) to VO(+) and SENSE(-) to VO(-) at the module. Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. Consult the factory if you need to increase the output voltage more than the above limitation. The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power. SENSE(+) SENSE(-) VI(+) SUPPLY VO (+) IO II VI(-) CONTACT RESISTANCE LOAD VO(-) CONTACT AND DISTRIBUTION LOSSES 8-651 (F).m Figure 19. Effective Circuit Configuration for Single-Module Remote-Sense Operation 10 Output voltage trim allows the user to increase or decrease the output voltage set point of a module. This is accomplished by connecting an external resistor between the TRIM pin and either the SENSE(+) or SENSE(-) pins. The trim resistor should be positioned close to the module. If not using the trim feature, leave the TRIM pin open. With an external resistor between the TRIM and SENSE(-) pins (Radj-down), the output voltage set point (VO, adj) decreases (see Figure 20). The following equation determines the required external-resistor value to obtain a percentage output voltage change of %. 100 R adj-down = ---------- - 2 k % With an external resistor connected between the TRIM and SENSE(+) pins (Radj-up), the output voltage set point (VO, adj) increases (see Figure 21). The following equation determines the required external-resistor value to obtain a percentage output voltage change of %. O ( 100 + % ) ( 100 + 2% ) ------------------------------------- - ---------------------------------- k R adj-up = V 1.225% % The voltage between the VO(+) and VO(-) terminals must not exceed 3.8 V. This limit includes any increase in voltage due to remote-sense compensation and output voltage set-point adjustment (trim). See Figure 19. Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. Consult the factory if you need to increase the output voltage more than the above limitation. The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power. Tyco Electronics Corp. JW100G and JW150G Power Modules; dc-dc Converters: 36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W Data Sheet February 2001 Feature Descriptions (continued) Thermal Considerations Output Voltage Set-Point Adjustment (Trim) (continued) Introduction VI(+) ON/OFF CASE VO(+) SENSE(+) TRIM RLOAD Radj-down VI(-) SENSE(-) The power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation of the unit. Heat-dissipating components inside the unit are thermally coupled to the case. Heat is removed by conduction, convection, and radiation to the surrounding environment. Proper cooling can be verified by measuring the case temperature. Peak temperature (TC) occurs at the position indicated in Figure 22. VO(-) 38.0 (1.50) MEASURE CASE TEMPERATURE HERE 8-748 (F).b Figure 20. Circuit Configuration to Decrease Output Voltage 7.6 (0.30) VI(+) ON/OFF VO(+) + SEN TRIM VI(+) VO(+) CASE ON/OFF VI(-) Radj-up CASE VI(-) - SEN SENSE(+) TRIM VO(-) RLOAD 8-716 (F).f SENSE(-) Note: Top view, pin locations are for reference only. Measurements shown in millimeters and (inches). VO(-) 8-715 (F).b Figure 21. Circuit Configuration to Increase Output Voltage Output Overvoltage Protection The output overvoltage clamp consists of control circuitry, independent of the primary regulation loop, that monitors the voltage on the output terminals. The control loop of the clamp has a higher voltage set point than the primary loop (see Feature Specifications table). This provides a redundant voltage control that reduces the risk of output overvoltage. Tyco Electronics Corp. Figure 22. Case Temperature Measurement Location The temperature at this location should not exceed 100 C. The output power of the module should not exceed the rated power for the module as listed in the Ordering Information table. Although the maximum case temperature of the power module is 100 C, you can limit this temperature to a lower value for extremely high reliability. For additional information on these modules, refer to the Thermal Management JC-, JFC-, JW-, and JFWSeries 50 W to 150 W Board-Mounted Power Modules Technical Note (TN97-008EPS). 11 JW100G and JW150G Power Modules; dc-dc Converters: 36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W Data Sheet February 2001 POWER DISSIPATION, PD (W) Thermal Considerations (continued) Heat Transfer Without Heat Sinks Increasing airflow over the module enhances the heat transfer via convection. Figure 23 shows the maximum power that can be dissipated by the module without exceeding the maximum case temperature versus local ambient temperature (TA) for natural convection through 4 m/s (800 ft./min.). Note that the natural convection condition was measured at 0.05 m/s to 0.1 m/s (10 ft./min. to 20 ft./min.); however, systems in which these power modules may be used typically generate natural convection airflow rates of 0.3 m/s (60 ft./min.) due to other heat dissipating components in the system. The use of Figure 23 is shown in the following example. 18 16 14 VI = 75 V VI = 48 V VI = 36 V 12 10 8 6 4 2 0 1 3 5 7 9 11 13 15 17 1-0061 Figure 24. JW100G Power Dissipation vs. Output Current Example Solution Given: VI = 55 V IO = 30 A TA = 40 C Determine PD (Use Figure 25.): PD = 23.5 W POWER DISSIPATION, P D (W) 25 What is the minimum airflow necessary for a JW150G operating at VI = 55 V, an output current of 30 A, and a maximum ambient temperature of 4 0C? 20 15 10 VI = 36 V VI = 55 V VI = 75 V 5 0 Determine airflow (v) (Use Figure 23.): 0 5 10 15 20 25 30 OUTPUT CURRENT, IO (A) v = 3.0 m/s (600 ft./min.) 8-1944 (F) Figure 25. JW150G Power Dissipation vs. Output Current 35 POWER DISSIPATION, PD (W) 19 21 OUTPUT CURRENT, IO (A) 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 30 25 20 m/s m/s m/s m/s m/s m/s m/s m/s (800 (700 (600 (500 (400 (300 (200 (100 ft./min.) ft./min.) ft./min.) ft./min.) ft./min.) ft./min.) ft./min.) ft./min.) 15 10 5 0.1 m/s (NAT. CONV.) (20 ft./min.) 0 0 10 20 30 40 50 60 70 80 90 100 Heat Transfer with Heat Sinks The power modules have through-threaded, M3 x 0.5 mounting holes, which enable heat sinks or cold plates to attach to the module. The mounting torque must not exceed 0.56 N-m ( 5in.-lb.). For a screw attachment from the pin side, the recommended hole size on the customer's PWB around the mounting holes is 0.130 0.005 inches. If a larger hole is used, the mounting torque from the pin side must not exceed 0.2 5N-m (2. 2in.-lb.). LOCAL AMBIENT TEMPERATURE, TA(C) 8-1150 (F).a Figure 23. Forced Convection Power Derating with No Heat Sink; Either Orientation 12 Tyco Electronics Corp. JW100G and JW150G Power Modules; dc-dc Converters: 36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W Data Sheet February 2001 Thermal Considerations (continued) Heat Transfer with Heat Sinks (continued) Thermal derating with heat sinks is expressed by using the overall thermal resistance of the module. Total module thermal resistance (ca) is defined as the maximum case temperature rise (TC, max) divided by the module power dissipation (P D): Example (TC - TA ) C, max -------------------- = ----------------------- ca = T PD PD The location to measure case temperature (TC) is shown in Figure 22. Case-to-ambient thermal resistance vs. airflow is shown, for various heat sink configurations and heights, in Figure 26. These curves were obtained by experimental testing of heat sinks, which are offered in the product catalog. CASE-TO-AMBIENT THERMAL RESISTANCE, CA (C/W) 8 7 1 1/2 IN HEAT SINK 1 IN HEAT SINK 1/2 IN HEAT SINK 1/4 IN HEAT SINK NO HEAT SINK 6 5 These measured resistances are from heat transfer from the sides and bottom of the module as well as the top side with the attached heat sink; therefore, the case-to-ambient thermal resistances shown are generally lower than the resistance of the heat sink by itself. The module used to collect the data in Figure 26 had a thermal-conductive dry pad between the case and the heat sink to minimize contact resistance. The use of Figure 26 is shown in the following example. If an 85 C case temperature is desired, what is the minimum airflow necessary? Assume the JW150G module is operating at VI = 55 V and an output current of 30 A, maximum ambient air temperature of 4 0C, and the heat sink is 1/2 inch. Solution Given: VI = 55 V IO = 30 A TA = 40 C TC = 85 C Heat sink = 1/2 inch Determine PD by using Figure 25: PD = 23.5 W 4 Then solve the following equation: 3 ( T C - T A) ca = ----------------------- 2 PD 1 0 0 0.5 (100) 1.0 (200) 1.5 (300) 2.0 (400) 2.5 3.0 (500) (600) AIR VELOCITY MEASURED IN m/s (ft./min.) 8-1153 (F) Figure 26. Case-to-Ambient Thermal Resistance Curves; Either Orientation 85 - 40 ) ca = (----------------------23.5 ca = 1.9 C/W Use Figure 26 to determine air velocity for the 1/2 inch heat sink. The minimum airflow necessary for the JW150G module is 2.1 m/s (420 ft./min.). Tyco Electronics Corp. 13 JW100G and JW150G Power Modules; dc-dc Converters: 36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W Thermal Considerations (continued) Custom Heat Sinks A more detailed model can be used to determine the required thermal resistance of a heat sink to provide necessary cooling. The total module resistance can be separated into a resistance from case-to-sink (cs) and sink-to-ambient (sa) shown below (Figure 27). PD TC TS cs Data Sheet February 2001 This equation assumes that all dissipated power must be shed by the heat sink. Depending on the userdefined application environment, a more accurate model, including heat transfer from the sides and bottom of the module, can be used. This equation provides a conservative estimate for such instances. EMC Considerations For assistance with designing for EMC compliance, please refer to the FLTR100V10 Filter Module Data Sheet (DS99-294EPS). TA sa 8-1304 (F).e Figure 27. Resistance from Case-to-Sink and Sink-to-Ambient For a managed interface using thermal grease or foils, a value of cs = 0.1 C/W to 0.3 C/W is typical. The solution for heat sink resistance is: Layout Considerations Copper paths must not be routed beneath the power module mounting inserts. For additional layout guidelines, refer to the FLTR100V10 Filter Module Data Sheet (DS99-294EPS). (TC - TA) sa = ------------------------- - cs PD 14 Tyco Electronics Corp. JW100G and JW150G Power Modules; dc-dc Converters: 36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W Data Sheet February 2001 Outline Diagram Dimensions are in millimeters and (inches). Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.) x.xx mm 0.25 mm (x.xxx in. 0.010 in.) Top View 57.9 (2.28) MAX 61.0 (2.40) MAX Side View SIDE LABEL* 12.70 0.5 (0.500 0.020) 5.01 (0.20) MIN 1.02 (0.040) DIA SOLDER-PLATED BRASS, 7 PLACES 2.06 (0.081) DIA SOLDER-PLATED BRASS, 2 PLACES (-OUTPUT AND +OUTPUT) Bottom View MOUNTING INSERTS M3 x 0.5 THROUGH, 4 PLACES 12.7 (0.50) 5.1 (0.20) 50.8 (2.00) 10.16 (0.400) 25.4 (1.00) 35.56 (1.400) VI(-) VO(-) CASE -SEN TRIM ON/OFF VI(+) 4.8 (0.19) +SEN 48.26 (1.900) 10.16 (0.400) 17.78 (0.700) 25.40 (1.000) 35.56 (1.400) VO (+) 48.3 (1.90) 8-1936 (F) * Side label includes Tyco name, product designation, safety agency markings, input/output voltage and current ratings, and bar code. Tyco Electronics Corp. 15 JW100G and JW150G Power Modules; dc-dc Converters: 36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W Data Sheet February 2001 Recommended Hole Pattern Component-side footprint. Dimensions are in millimeters and (inches). 57.9 (2.28) MAX 48.3 (1.90) 4.8 (0.19) 48.26 (1.900) VI(+) 35.56 (1.400) ON/OFF VO(+) 35.56 (1.400) +SEN 25.4 (1.000) 10.16 (0.400) CASE -SEN VI(-) VO (-) 61.0 (2.40) MAX 25.40 (1.00) TRIM 50.8 (2.00) 17.78 10.16 (0.700) (0.400) 5.1 (0.20) 12.70 (0.500) MODULE OUTLINE MOUNTING INSERTS 8-1936 (F) Ordering Information Please contact your Tyco Electronics' Account Manager or Field Application Engineer for pricing and availability. Table 4. Device Codes Input Voltage Output Voltage Output Power Output Current Remote On/Off Logic Device Code Comcode 48 V 2.5 V 50 W 20 A Negative JW100G1 108553256 48 V 2.5 V 50 W 20 A Positive JW100G TBD 48 V 2.5 V 75 W 30 A Negative JW150G1 108457706 48 V 2.5 V 75 W 30 A Positive JW150G TBD Optional features can be ordered using the suffixes shown in Table 5. The suffixes follow the last letter of the device code and are placed in descending order. For example, the device code for a JW100G1 module with the following option is shown below: Short pins JW100G61 Table 5. Device Options Option Short pins: 3.68 mm 0.25 mm (0.145 in. 0.010 in.) 16 Suffix 6 Tyco Electronics Corp. JW100G and JW150G Power Modules; dc-dc Converters: 36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W Data Sheet February 2001 Ordering Information (continued) Table 6. Device Accessories Accessory Comcode 1/4 in. transverse kit (heat sink, thermal pad, and screws) 1/4 in. longitudinal kit (heat sink, thermal pad, and screws) 1/2 in. transverse kit (heat sink, thermal pad, and screws) 1/2 in. longitudinal kit (heat sink, thermal pad, and screws) 1 in. transverse kit (heat sink, thermal pad, and screws) 1 in. longitudinal kit (heat sink, thermal pad, and screws) 1 1/2 in. transverse kit (heat sink, thermal pad, and screws) 1 1/2 in. longitudinal kit (heat sink, thermal pad, and screws) 407243989 407243997 407244706 407244714 407244722 407244730 407244748 407244755 Dimensions are in millimeters and (inches). 1/4 IN. 1/4 IN. 1/2 IN. 1/2 IN. 1 IN. 1 IN. 61 (2.4) 57.9 (2.28) 1 1/2 IN. 1 1/2 IN. 61 (2.4) 57.9 (2.28) 8-2832 (F).a Figure 28. Longitudinal Heat Sink Tyco Electronics Corp. 8-2833 (F) Figure 29. Transverse Heat Sink 17 JW100G and JW150G Power Modules; dc-dc Converters: 36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W Data Sheet February 2001 Notes 18 Tyco Electronics Corp. Data Sheet February 2001 JW100G and JW150G Power Modules; dc-dc Converters: 36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W Notes Tyco Electronics Corp. 19 JW100G and JW150G Power Modules; dc-dc Converters: 36 Vdc to 75 Vdc Input, 2.5 Vdc Output; 50 W to 75 W Data Sheet February 2001 Tyco Electronics Power Systems, Inc. 3000 Skyline Drive, Mesquite, TX 75149, USA +1-800-526-7819 FAX: +1-888-315-5182 (Outside U.S.A.: +1-972-284-2626, FAX: +1-972-284-2900) http://power.tycoelectronics.com Tyco Electronics Corporation reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. (c) 2001 Tyco Electronics Corporation, Harrisburg, PA. All International Rights Reserved. Printed in U.S.A. February 2001 DS00-076EPS (Replaces DS99-132EPS) Printed on Recycled Paper