MIL SPECS WuE D O000125 0034325 441 MEMILS The documentation and process INCH POUND conversion measures necessary to comply with this revision shall be MIL-S-19500/144H icompleted by 22 February 1994 L 22 November 1993 SUPERSED ING MIL-S-19500/1446 26 April 1984 MILITARY SPECIFICATION SEMICONDUCTOR DEVICE, DIODE, SILICON, SWITCHING TYPES 1N3064, 1N4454, 1N4454-1, 1N4532, AND 1N4454UR-1 JAN, JANTX, AND JANTXV This specification is approved for use by all Departments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the detail requirements for silicon, switching diodes. Three levels of product assurance are provided for each device type as specified in MIL-S-19500 (see 6.3.2). 1.2 Physical dimensions. See figure 1 (D0-35) and figure 2 (D0-213AA) (see 3.3). 1.3 Maximum ratings. Type Vier Vawm I, Teom Tem Ty and Teste | Zoux Rou v_de V(pk) mA mA A C c/w | C/W 1N3064 if) 50 75 V/ 500 2.0 -55 to +175 50 250 1N4454 75 50 200 2/ 1,000 4.0 -55 to +175 50 250 1N4454-1 75 50 200 2/ 1,000 4.0 +55 to +175 50 250 1N46532 75 50 125 3/ 500 2.0 -55 to +175 50 250 1f Derate linearity 0.5 mA/C above T, = +25C. 2/ Derate linearly 1.33 mA/C above T, = +25C. 3/ Derate linearly 0.833 mA/C above 7, = +25C. 1.4 Primary electrical characteristics at T, = +25C, unless otherwise indicated. Limits Veq Tay c, t, t,, V, = 90 I, = I, = 10 mA de V, = 5.0 Vpk) I, = 10 mde {Vy = 50 V de f = 1 MHz [R, = 100 ohms I, = 100 mA de Min --- oe ++ --- --- Max 1.00 V de 0.1 pA de 2 pF 4.0 ns 30 ns Beneficial comments (recommendations, additions, deietions) and any pertinent data which may be of use in improving this document should be addressed to: Commander, Defense Electronics Supply Center, ATIN: DESC-ECT, 1507 Wilmington Pike, Dayton, OH 45444, by using the self-addressed Standardization | Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. AMSC N/A FSC 5961 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.MIL SPECS WUE D MM 0000125 00343eb 744 MBNILS S +F Ci) 1N4454 1N4454-1 1N4532 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. The maximum dimension of @0 shall apply for dimension G. 4. The minimum dimension of gD shall apply over at least .075 (1.91 mm) of dimension G. 5. Ferrule is optional for dimension G. 6. The specified lead diameter applies in the zone between .050 (1.27 mm) for 1N3064, 1N4454, and 1N4454-1 and .010 (.25 mm) for 1N4532 from the diode body to the end of the lead. Outside this zone, the lead diameter shall not exceed @D. FIGURE 1. Physical dimensions.MIL SPECS WOE D 0000125 0034327 614 MEMILS MIL-S~19500/144H Go J Dimensions R Ltr Inches Millimeters Min Max Min Max gd -063 067 1.60 1.70 FE .016 022 0.41 0.55 G 130 146 3.30 3.70 G, -100 ref 2.54 ref $s -901 min 0.03 min NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. FIGURE 2. Physical dimensions, 1N4454UR-14 (DO0-213AA).MIL SPECS WHE D MM 0000125 0034326 550 MMNILS MIL-S-19500/144H 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those tisted in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2). SPECIFICATION MILITARY MIL-S- 19500 - Semiconductor Devices, General Specification for. STANDARD MILITARY MIL-STD-750 - Test Metheds for Semiconductor Devices. (Unless otherwise indicated, copies of federal and military specifications, standards, and handbooks are available from the Standardization Document Order Desk, Building 4D, 700 Robbins Avenue, Philadelphia, PA 19120-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (except for related associated detail specifications, specification sheets, or MS standards), the text of this document shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Associated Detail specification. The individual item requirements shall be in accordance with MIL-S-19500, and as specified herein. 3.2 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in MIL-S-19500. 3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-S-19500, and figure 1 (D0-35) and figure 2 (D0-213AA) herein. 3.3.1 Lead finish. Lead finish shall be solderable in accordance with MIL-STD-750, MIL-S-19500. Where a choice of lead finish is desired, it shail be specified in the acquisition document. 3.3.2 Dash-one (-1) construction. See (see Mil-S-19500). The UR version devices shall be structurally identical to the leaded devices, except for lead termination. . 3.4 Marking. Marking shall be in accordance with MIL-S-19500. 3.4.1 Marking for UR version devices. For UR version devices only, all marking may be omitted from the body (except 3.5), but shall be retained on the initial container. 3.5 Polarity. The polarity of all types shall be indicated with a contrasting color band to denote the cathode end. For UR suffix devices, a minimum of three contrasting color dots spaced around the cathode end May be used. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection shall be in accordance with MIL-S-19500, and as specified herein.MIL SPECS WUE D MM 9000325 0034329 457 MMNILS MIL-S-19500/144H 4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-S-19500, and as specified herein. 4.3 Screening (JAN, JANTX, and JANTXV levels only). Screening shall be in accordance with table I! of MIL-S-19500 and as specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits of table I herein shalt not be acceptable. Screen (see table II of Measurement MIL-S-19500) JANTX_and JANTXV levels JAN Levelt 3a Temperature cycling Temperature cycling (per MIL-S-19500_ JANTX Level) 3c V/ Thermal impedance (see 4.5.4) Thermal impedance (see 4.5.4) 9 Not applicable Not applicable 11 lap and Vp, 12 See 4.3.1, t = 48 hours Subgroup 2 of table I herein. 13, 2/ Al, 100% of initial reading or 3/ 25 nA dc, whichever is greater; AV, $ +.03 V de change from initial reading. subgroup 2 of table I herein. 1/ Thermal impedance may be performed any time after sealing provided temperature cycling is performed in accordance with MIL-S-19500, screen 3 prior to this thermal test. 2/ PDA = 5 percent for screen 13, applies to Alg,, AV, and subgroup 2 of table I herein. 3/ Thermal impedance (Zo,,) need not be repeated in screen 13. 4.3.1 Power burn-in conditions. Power burn-in conditions are as follows: 1, = Room ambient as defined in the general requirements of MIL-STO-750 (see 4.5). AC option DC option Type Va = 50 Vipk) f_ = 50-60 Hz (see 4.5.2) 1N3064 I, = 75 mA de I, = 75 mA de 1N4532 1, = 125 mA de I, = 125 mA de 1N4454 and 1N4454-1 |I, = 200 mA de I, = 175 m de 4.4 Quality conformance inspection. Quality conformance inspection shall be in accordance with MIL-S-19500, and as specified herein.MIL SPECS HOE D MM 0000125 0034330 109 M@BNILS MIL-S-19500/144H 4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-S-19500, and table I herein. The following test conditions shall be used for Z9,,, group A inspection: a. Iy measurement current -- - + -- s+ ee et ete 1 mA - 10 mA. b. I, forward heating current ----------7+-- 5 A- 1.0 A. c. t, heating time ----+--+------- te eee 10 ms. d. ty, measurement delay time ------+----- 70 us maximum. 4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for subgroup testing in table IVb (JAN, JANTX and JANTXV) of MIL-S-19500, and as follows. Electrical measurements (end points) and delta requirements shall be in accordance with footnote 2/ and the applicable steps of table II herein. Subgroup Method Condition B2 4066 (This test shall be performed on each sublot) I, = 50 mA de; 10 surges; tp = 1 ws; 1 surge per minute; i,(surge) s 2.0 ACpk) for 1N3064 and 1N4532; i,(surge) s 4.0 A(pk) for 1N4454, 1N4454-1, and 1N4454UR-1. 83 1027 See 4.5.2; V, = 50 V(pk); f = 50-60 Hz; 1, = 75 mA de for 1N3064, 125 mA de for 1N4532, and 200 mA de for 1N4454, 1N4454-1, and 1N4454UR-1. 4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in table V of MIL-S-19500, and as follows. Electrical measurements (end points) and delta requirements shall be in accordance with footnote 3/ and the applicable steps of table II herein. Subgroup Method Condition c2 2036 Test condition A, weight = 4 lbs.; t = 15 +3 seconds. Test condition E.(Note: Terminal strength not applicable to UR suffix devices.) c 1026 V, = 50 Vipk); f = 50-60 Hz; See 4.5.2; I, = 75 mA de for 1N3064, 125 mA de for 1N4532, and 200 mA de for 1N4454, 1N4454-1, and 1N4454UR-1. 4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows: 4.5.1 Pulse measurements. Conditions of pulse measurements shall be specified in section 4 of MIL-STD-750. 4.5.2 Burn-in and Life tests. These tests shall be conducted with a half-sine wave of the peak voltage specified herein impressed across the diode in the reverse direction, followed by a half-sine waveform of the average rectified current specified herein. The forward conduction angle of the rectified current shail not be greater than 180 nor less than 150. 4.5.3 Forward recovery voltage and time. Forward recovery time shall be measured as the time interval between zero time and the point where the pulse has decreased to 110 percent of the steady-state value of V, when I, = 100 mA de. The maximum rise time of the response detector shall be 1 ns. 4.5.4 Thermal impedance 7,,, measurements for screening. The Z,,, measurements shall be performed in accordance with MIL-ST0-750, method 3101. The maximum Limit (mot to exceed the group A, subgroup 2 limit) for Z5,, im screening (table II of MIL-S-19500) shall be derived by each vendor by means of statistical process control. When the process has exhibited control and capability, the capability data shall be used to establish the fixed screening limit. In addition to screening, once a fixed limit has been established, monitor all_future sealing lots using a random five piece sample from each lot to be plotted on the applicable X, R chart. If a lot exhibits an out of control condition, the entire lot shall be removed from the line and held for Engineering evaluation and disposition.MTL SPECS GUE D @@ 00001325 0034331 O45 MBMILS MIL-S-19500/144H TABLE I. Group A_ inspection. MIL-STD-750 Limits Inspection 1/ Symbol Unit Method Conditions Min | Max Subgroup 1 Visual and mechanical 2071 inspection Subgroup 2 Thermal impedance 3101 | See 4.5.4 Zoux --- | 50 C/W Forward voltage 4011 | I, = 10 mA de Vey vee (1.00 | V de Reverse current 4016 | DC method; V, = 50 V de Tey --- {0.1 RA de Breakdown voltage 4021 | I, = 5.0 wa de Visrn re) V de Subgroup 3 High temperature T, = +150C operation: Reverse current 4016 | OC method Ine --- |100 BA de Vz, = 50 V de Forward voltage 4011 | I, = 10 mA de Veo --- |? Vv de Low temperature T, = 755C operation: Breakdown voltage 4021 I, = 10 wA de Vem 75 --- | Vde Subgroup 4 Capacitance 4001 | Vv, = OV de, f = 1 MHz Cc, s-> | 2.0 | pF AC signal = 50 mV(p-p) max Reverse recovery time 4031 | Test condition A; t, 4.0 | ns I, = I, = 10 mA de; R, = 100 Q; C < 3 pF Subgroup 5 and 6 Not applicable Subgroup 7 Forward recovery 4026 {1, = 100 mA de; Vi | 5.0 | Vpk> voltage and time t, 0.4 ns; see 4.5.3 ty to 30 | ns i/ For sampling plan, see MIL-S-19500.MIL SPECS GUE D MM 0000125 0034332 781 MHMILS MIL-S-19500/144H TABLE If. Groups B and C electrical measurements. Step Inspection MIL-STD-750 Symbol Limits Unit Method Conditions Min Max 1. Forward voltage 4011 Jf, = 10 m de Veq --- 1.0 V de 2. Reverse current 4016 |DC method; V, = 50 V de In toe 0.1 KA de 3. Capacitance 4001 |V,p = 0 V de: f = 1 MHz c, ss 2.0 pF ac-signal = 50 mV(p-p) max 4. Forward voltage 4011 {I, = 10 mA de AV,, 1/ |[ 60 mV de change from pista reading 5. Reverse current 4016 |DC method, V, = 50 V de Ala, 1/ | 100% of initial value or 45 nA dc, whichever is greater i/ Devices which exceed the group A limits for this test shall not be acceptable. 2/ The electrical measurements for table a. b. Cc. 3/ The electrical measurements for table a. b. Cc. Subgroup 2, see table II herein, steps 1 and 2. Subgroup 3, see table II herein, steps 1, 2, 3, 4, and 5S. Subgroup 6, see table II herein, steps 1, 2, 3, 4, and 5. Subgroup 2, see table II herein, steps 1 and 2. Subgroup 3, see table II herein, steps 1 and 2. Subgroup 6, see table II herein, steps 1, 2, 3, 4, and 5. V of MIL-S-19500 are as follows: IVb (JAN, JANTX, and JANTXV) of MIL-S-19500 are as follows:MIL SPECS WHE D MB 0000125 0034333 918 MENILS MIL-S-19500/144H 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shal! be in accordance with MIL-S-19500. &. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Notes. The notes specified in MIL-S-19500 are applicable to this specification. 6.2 Acquisition requirements. Acquisition documents should specify the following: a. Title, number, and date of the specification. b. Issue of DODISS to be cited in the solicitation, and if required, the specific issue of individual documents referenced (see 2.1). c. Lead finish (see 3.3.1). d. Product assurance level and type designation. 6.3 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect to the previous issue due to the extensiveness of the changes. CONCLUDING MATERIAL Custodians: Preparing activity: Arty - ER Navy - EC Navy - EC Air Force - 17 Agent: DLA - ES Review activities: Army - AR, MI, SM (Project 5961-1444) Navy - AS, CG, MC Air Force - 19, 85, 99 DLA - ES