RJ(ARJ2)
2
RJ-RELAYS
SMD RELAYS
WITH 8GHz CAPABILITIES
14.0
.551
9.00
.354
8.20
.323
14.0
.551
9.00
.354
8.20
.323
FEATURES
• Excellent high frequency characteris-
tics (50
Ω
, at 5GHz)
V.S.W.R.: Max. 1.25
Insertion loss: Max. 0.5dB
Isolation: Min. 35dB
(Between open contacts)
Min. 30dB
(Between contact sets)
• Surface mount terminal
Surface mount terminals are now stan-
dard so there is much less work in design-
ing PC boards.
• Small size
Size: 14.00 (L)
×
9.00 (W)
×
8.20 (H) mm
.551 (L)
×
.354 (W)
×
.323 (H) inch
TYPICAL
APPLICATIONS
Measurement equipment market
Attenuator circuits, spectrum analyzer,
oscilloscope, mobile equipment, tester
Mobile telecommunication market
IMT2000, microwave communication
Medical instruments market
SPECIFICATIONS
Contact
Coil (at 20
°
C, 68
°
F)
Characteristics
Remarks
* Specifications will vary with foreign standards certification ratings.
*
1
Measurement at same location as "Initial breakdown voltage" section.
*
2
Detection current: 10mA
*
3
Nominal operating voltage applied to the coil, excluding contact bounce time.
*
4
By resistive method, nominal voltage applied to the coil, 5GHz, V.S.W.R.
&
1.25
*
5
Half-wave pulse of sine wave: 6ms, detection time: 10
µ
s.
*
6
Pulse of sine wave: 11ms.
*
7
Detection time: 10
µ
s
*
8
Refer to 6. Conditions for operation, transport and storage mentioned in NOTES
Arrangement 2 Form C
Contact material Gold alloy
Initial contact resistance Max. 150m
Ω
Rating
Contact rating
1W (at 5 GHz, Impedance
50
Ω
, V.S .W .R.
&
1.25)
10mA 10V DC (resistive load)
Contact carrying power 1W (at 5 GHz, Impedance
50
Ω
, V.S .W .R.
&
1.25)
Max. switching voltage 30 V DC
Max. switching current 0.3 A DC
High frequency
characteristics
(Initial)
(~5GHz,
Impedance
50
Ω
)
V.S.W.R. Max. 1.25
Insertion loss
(without D.U.T. board’s loss)
Max. 0.5dB
Isolation
Between
open contacts Min. 35dB
Between
contact sets Min. 30dB
Input power
1W (at 5GHz, impedance 50
Ω
,
V.S.W.R.
&
1.25, at 20
°
C)
Expected life
(min. opera-
tions)
Mechanical (at 180 cpm) 10
7
Electrical
(at
20cpm)
1W, at 5GHz,
V.S.W.R.
&
1.25
10
5
10mA 10V DC
(resistive load) 10
6
Nominal operating power
Single side stable 200 mW
2 coil latching 150 mW
Initial insulation resistance*
1
Min. 500 M
Ω
(at 500 V DC)
Initial breakdown
voltage*
2
Between open contacts
500 Vrms
Between contact sets 500 Vrms
Between contact and coil
500 Vrms
Operate time [Set time]*
3
(at 20
°
C) Max. 5ms
Release time (without diode)[Reset time]*
3
(at 20
°
C) Max. 5ms
Temperature rise (at 20
°
C)*
4
Max. 50
°
C
Shock resistance Functional*
5
Min. 500 m/s
2
Destructive*
6
Min. 1,000 m/s
2
Vibration resistance Functional*
7
10 to 55 Hz at double
amplitude of 3 mm
Destructive 10 to 55 Hz at double
amplitude of 5 mm
Conditions for operation,
transport and storage*
8
(Not freezing and condens-
ing at low temperature)
Ambient temp. –30
°
C to 70
°
C
–22
°
F to 158
°
F
Humidity 5 to 85% R.H.
Unit weight Approx. 3 g .11 oz
ORDERING INFORMATION 2Ex. ARJ
Contact arrangement
Terminal shapeOperating function Packing style
Coil voltage (DC)
Nil: Standard PC board terminal
A: Surface-mount terminal
2: 2 Form C 0: Single side stable
2: 2 coil latching Nil: Carton packing
X: Tape end reel packing
(picked from 1/2/3-pin side)
Z: Tape and reel packing (picked
from 6/7/8-pin side)
03
: 3V
4H: 4.5V
12
: 12V
24
: 24V
Note: Tape and reel packing symbol “-Z” is not marked on the relay. “X” type tape and reel packing (picked from 1/2/3-pin side) is
also available. Suffix “X” instead of “Z”.
rj.fm 2 y [ W QOOPNX PPœ@˛jœ@ OPP SS“
RJ(ARJ2)
3
TYPES AND COIL DATA (at 20
°
C 68
°
F)
1. Standard PC board terminal
• Packing of standard PC board terminal: 50 pcs. in an inner package (carton); 500 pcs. in an outer package
2. Surface-mount terminal
• Packing of surface-mount terminal: 50 pcs. in an inner package (carton); 500 pcs. in an outer package
• Packing of surface-mount terminal: 500 pcs. in an inner package (tape and reel); 500 pcs. in an outer package
Operating
function Coil Rating,
V DC
Part No. Pick-up voltage,
V DC (max.)
(initial)
Drop-out voltage ,
V DC (min.)
(initial)
Nominal operating
current, mA
(
±
10%) Coil resistance,
Ω
(
±
10%) Nominal
operating
power, mW Max. allowable
voltage , V DC
Standard PC
board terminal
Single side
stable
3 ARJ2003 2.25 0.3 66.6 45 200 3.3
4.5 ARJ204H 3.375 0.45 44.4 101.2 200 4.95
12 ARJ2012 9 1.2 16.6 720 200 13.2
24 ARJ2024 18 2.4 8.3 2,880 200 26.4
Operating
function Coil Rating,
V DC
Part No. Set voltage,
V DC (max.)
(initial)
Reset voltage,
V DC (min.)
(initial)
Nominal operating
current, mA
(
±
10%) Coil resistance,
Ω
(
±
10%) Nominal
operating
power, mW Max. allowable
voltage , V DC
Standard PC
board terminal
2 coil
latching
3 ARJ2203 2.25 2.25 50 60 150 3.3
4.5 ARJ224H 3.375 3.375 33.3 135 150 4.95
12 ARJ2212 9 9 12.5 960 150 13.2
24 ARJ2224 18 18 6.3 3,840 150 26.4
Operating
function Coil Rating,
V DC
Part No. Pick-up
voltage, V DC
(max.) (initial)
Drop-out
voltage, V DC
(min.) (initial)
Nominal operating
current, mA
(
±
10%)
Coil
resistance,
Ω
(
±
10%)
Nominal
operating
power, mW Max. allowable
voltage , V DC
Carton
packing T ape and reel
packing
Single side
stable
3 ARJ20A03 ARJ20A03Z 2.25 0.3 66.6 45 200 3.3
4.5 ARJ20A4H ARJ20A4HZ 3.375 0.45 44.4 101.2 200 4.95
12 ARJ20A12 ARJ20A12Z 9 1.2 16.6 720 200 13.2
24 ARJ20A24 ARJ20A24Z 18 2.4 8.3 2,880 200 26.4
Operating
function Coil Rating,
V DC
Part No. Set voltage,
V DC (max.)
(initial)
Reset voltage,
V DC (min.)
(initial)
Nominal operating
current, mA
(
±
10%)
Coil
resistance,
Ω
(
±
10%)
Nominal
operating
power, mW Max. allowable
voltage , V DC
Carton
packing T ape and reel
packing
2 coil
latching
3 ARJ22A03 ARJ22A03Z 2.25 2.25 50 60 150 3.3
4.5 ARJ22A4H ARJ22A4HZ 3.375 3.375 33.3 135 150 4.95
12 ARJ22A12 ARJ22A12Z 9 9 12.5 960 150 13.2
24 ARJ22A24 ARJ22A24Z 18 18 6.3 3,840 150 26.4
REFERENCE DATA
1. High frequency characteristics
Sample: ARJ20A12
Measuring method: Measured with MEW PC board by HP network analyzer (HP8510C).
• V.S.W.R. characteristics • Insertion loss characteristics
(without D.U.T. board’s loss) • Isolation characteristics
2.0
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
Frequency
V.S.W.R.
45MHz 5GHz 8GHz 3.0
0.5
0
1.0
1.5
2.0
2.5
8GHz5GHz45MHz Frequency
Insertion loss, dB
10
0
20
30
40
50
60
70
8045MHz 8GHz5GHz
Frequency
Isolation, dB
Between contact sets
Between open contact
rj.fm 3 y [ W QOOPNX PPœ@˛jœ@ OPP SS“
RJ(ARJ2)
4
DIMENSIONS
mm inch
1. Standard PC board terminal
General tolerance:
±
0.3
±
.012
3Better HF characteristics
may be obtained when this
portion is soldered with
PC board ground.
1All bottom surface of the base should be
touched closely or soldered with PC board
ground.
24 ribs should be soldered with PC board ground.
10.6
.417
12.2
.480
14.0
.551
0.50
.020 8.89
.350
12.70
.500
0.40
.016
7.62
.300
3.81
.150
0.50
.020
9.00
.354
11.40
.449
0.20
.008
A
10.4
.409
3.50
.138 8.20
.323
6.36
.250
0.15
.006
0.20
.008
0.50
.020
Expansion of A
0 to 0.2
0 to .008
(Typical: 0.1)
(Typical: .004)
Schematic (Bottom view)
Single side stable
(Deenergized condition)
2 coil latching
(Reset condition)
NONC
Com
Com
59
2
87
10
6
3
4
1
+–
Direction
indication
Com
Com
NONC
6
1
10
3
4
7
2
5
8
9
–
+
+
–
2. Surface mount terminal
General tolerance:
±
0.3
±
.012
10.6
.417
0.50
.020
8.89
.350
12.2
.480
14.0
.551
15.0
.591
9.00
.354
10.0
.394
11.40
.449
3Better HF characteristics
may be obtained when this
portion is soldered with
PC board ground.
1All bottom surface of the base should be
touched closely or soldered with PC board
ground.
24 ribs should be soldered with PC board ground.
A
8.20
.323
0.50
.020
0.50
.020
10.4
.409 3.81
.150
0.40
.016
0.20
.008
6.36
.250
Expansion of A
0 to 0.2
0 to .008
(Typical: 0.1)
(Typical: .004)
Schematic (Top view)
Single side stable
(Deenergized condition)
2 coil latching
(Reset condition)
Direction
indication
NONC
Com
Com
59
2
87
10
6
3
4
1
+–Com
Com
NONC
6
1
10
3
4
7
2
5
8
9
–
+
+
–
rj.fm 4 y [ W QOOPNX PPœ@˛jœ@ OPP SS“
RJ(ARJ2)
5
NOTES
1. Coil operating power
Pure DC current should be applied to the
coil. The wave form should be rectangular.
If it includes ripple, the ripple factor should
be less than 5%.
However, check it with the actual circuit
since the characteristics may be slightly
different. The nominal operating voltage
should be applied to the coil for more than
20 ms to set/reset the latching type relay.
2. Coil connection
When connecting coils, ref er to the wiring
diagram to prevent mis-operation or mal-
function.
3. External magnetic field
Since RJ rela ys are highly sensitive polar-
ized rela ys , their char acteristics will be af-
f ected by a strong external magnetic field.
A void using the rela y under that condition.
4. Cleaning
For automatic cleaning, the boiling meth-
od is recommended. Avoid ultrasonic
cleaning which subjects the rela ys to high
frequency vibrations, which may cause
the contacts to stick.
It is recommended that alcoholic solvents
be used.
5. Tape and reel packing
1) Tape dimensions
2) Dimensions of plastic reel
6. Conditions for operation, transport
and storage conditions
1) Ambient temperature, humidity, and at-
mospheric pressure during usage, trans-
port, and storage of the relay:
(1) Temperature:
–30 to +70
°
C –22 to +158
°
F
(However, tolerance range is –30 to
+60
°
C –22 to +140
°
F if package is carried
as is.)
(2) Humidity: 5 to 85% RH
(Avoid freezing and condensation.)
The humidity range varies with the tem-
perature. Use within the range indicated
in the graph below.
(3) Atmospheric pressure: 86 to 106 kPa
Temperature and humidity range for us-
age, transport, and storage:
2) Condensation
Condensation forms when there is a sud-
den change in temperature under high
temperature and high humidity conditions.
Condensation will cause deterioration of
the relay insulation.
3) Freezing
Condensation or other moisture may
freeze on the rela y when the temperature
is lower than 0
°
C 32
°
F. This causes prob-
lems such as sticking of mo v able parts or
operational time lags.
4) Low temperature , low humidity environ-
ments
The plastic becomes brittle if the relay is
e xposed to a low temperature , low humid-
ity environment for long periods of time.
5) Storage procedures for surface-mount
terminal types
Since the rela y is very sensitive to humid-
ity, it is packed in humidity-free, hermeti-
cally sealed packaging. When storing the
relay, be careful of the following points:
(1) Be sure to use the relay immediately
after removing it from its sealed package.
(2) When storing the relay for long periods
of time after removing it from its sealed
package, we recommend using a humidi-
ty-free bag with silica gel to prevent sub-
jecting the relay to humidity.
Furthermore, if the relay is solder mount-
ed when it has been subjected to exces-
sive humidity, cracks and leaks can occur .
Be sure to mount the relay under the re-
quired mounting conditions.
7. Soldering
1) Surface-mount terminal
In case of automatic soldering, the follo w-
ing conditions should be observed
(1) Position of measuring temperature
(2) IR (infrared reflow) soldering method
Temperature rise of relay itself may vary
according to the mounting level or the
heating method of reflow equipment.
Therefore, please set the temperature of
soldering portion of relay terminal and the
top surface of the relay case not to exceed
the above mentioned soldering condition.
It is recommended to check the tempera-
ture rise of each portion under actual
mounting condition before use.
2) Standard PC board terminal
Please meet the following conditions if
this relay is to be automatically soldered.
(1) Preheating: Max. 100
°
C 212
°
F (termi-
nal solder surface) for max. 60 seconds
(2) Soldering: Max. 250
°
C 482
°
F f or max.
5 seconds
The eff ect on the relay depends on the ac-
tual substrate used. Please v erify the sub-
strate to be used.
3) Hand soldering
Please meet the following conditions if
this relay is to be soldered by hand.
(1) Wattage: 30 to 60 W
(2) Tip temperature/time: 280 to 300
°
C
536 to 572
°
F for max. 5 seconds
The eff ect on the relay depends on the ac-
tual substrate used. Please v erify the sub-
strate to be used.
4) Avoid high frequency cleaning since
this may adversely affect relay character-
istics. Use alcohol-based cleaning solu-
tions when cleaning relays.
3 to 5°
3 to 5°
11.40
.449
9.40
.370
1.33
.052
2.57
.101
6.20
.244
4.00 .157
(Accumulation 10 pitch:
40±0.1 1.575±.004)
16.00
.630
2.0
.079 8.50
.337
8.80
.346
.059 dia.
+.004
0
1.50 dia.
+0.1
0
0.40±0.05
.016±.002
1
1.20
.441
1.50
.059
7.40
.291
1.75
.069
14.40
.570
16.00
.630
11.50
.453
(10.75)
(.423)
24.00
.945
21±0.8 dia.
.827±.031 dia.
13±0.2 dia.
.512±.008 dia.
24.4
.961+2
0
+.079
0
100±1 dia.
3.937±.039 dia.
2.0±0.2
.079±.008
370±2 dia.
14.567±.079 dia.
2.0±0.5
.079±.020
Temperature, °C °F
85
5
0
32 70
158
–30
–22
(Avoid
condensation
when used at
temperatures
higher than
0°C 32°F)
Humidity, %R.H.
Tolerance range
(Avoid freezing
when used at
temperatures
lower than
0°C 32°F)
B
1.0mm .039inch
A: Surface of PC board where relay is mounted.
B: Above the PC board surface.
A
T1
T2
T3
T4
T5
t1t3t4t5t2
A: B:
t2 - t1 = 80 to 120 s
t5 - t3 = 30 to 40 s
t4 = 170 to 190 s
T1=150°C 302°F
T2=160°C 320°F
T3=183°C 361°F
T4=245°C 473°F
T5=270°C 518°F
rj.fm 5 y [ W QOOPNX PPœ@˛jœ@ OPP SS“
RJ(ARJ2)
16
Measuring method (Impedance 50
Ω
)
Connector
(Step 1) Calibrate the test system with HP
calibration kit [HP85052B]
(Step 2) After calibration, connect the
D.U.T. board and measure. Con-
nect 50
Ω
terminals on connec-
tors other than those for
measurement.
Notes)
1. All bottom surface of the base should be
touched closely or soldered with PC board
ground.
2. 4 ribs should be soldered with PC board
ground.
Measuring board
1) Dimensions
<Surface mount terminal>
<Standard PC board terminal>
<Calibration board>
2) Material: Glass PTFE double-sided
through hole PC board R-4737 (Matsush-
ita Electric Works)
3) Board thickness: t = 0.8 mm
4) Copper plating: 18
µ
m
• Connector (SMA type receptacle)
Product name: R125 510 (RADIALL)
Insertion loss compensation
The insertion loss of relay itself is given by
subtracting the insertion loss of short-
circuit the Com and the NC (or NO). (sig-
nal path and two connectors)
9. Others
1) The switching lifetime is defined under
the standard test condition specified in the
JIS* C 5442-1996 standard (temperature
15 to 35
°
C 59 to 95
°
F, humidity 25 to
75%). Chec k this with the real device as it
is affected by coil driving circuit, load type,
activation frequency, activation phase,
ambient conditions and other factors.
Also, be especially careful of loads such
as those listed below.
• When used for AC load-operating and
the operating phase is synchronous.
Rocking and fusing can easily occur due
to contact shifting.
• High-frequency load-operating
When high-frequency opening and clos-
ing of the relay is performed with a load
that causes arcs at the contacts, nitrogen
and oxygen in the air is fused by the arc
energy and HNO
3
is f ormed. This can cor-
rode metal materials.
Three countermeasures for these are listed
here.
(1) Incorporate an arc-extinguishing circuit.
(2) Lower the operating frequency
(3) Lower the ambient humidity
2) Use the relay within specifications such
as coil rating, contact rating and on/off
service life. If used beyond limits, the relay
may overheat, generate smoke or catch
fire.
3) Be careful not to drop the relay. If acci-
dentally dropped, carefully check its ap-
pearance and characteristics before use.
4) Be careful to wire the relay correctly.
Otherwise, malfunction, overheat, fire or
other trouble may occur.
5) If a relay stays on in a circuit for many
months or years at a time without being
activated, circuit design should be re-
viewed so that the relay can remain non-
e xcited. A coil that receiv es current all the
time heats, which degrades insulation
earlier than expected. A latching type re-
lay is recommended for such circuits.
6) The latching type relay is shipped in the
reset position. But jolts during transport or
impacts during installation can change
the reset position. It is, therefore, advis-
able to build a circuit in which the relay
can be initialized (set and reset) just after
turning on the power.
7) If silicone materials (e.g., silicone rub-
bers, silicone oils, silicone coating agents,
silicone sealers) are used in the vicinity of
the relay , the gas emitted from the silicone
may adhere to the contacts of the relay
during opening and closing and lead to
improper contact. If this is the case , use a
material other than silicone.
8) We recommend latching type when us-
ing in applications which involve lengthy
duty cycles.
* Japanese Industrial Standards
No. Product name Contents
1 HP 85131-60013 3.5 mm testport,
Extension cable
2 HP 83059 3.5 mm coaxial
adaptor
Network
analyzer
S parameter
test set
PORT2
PORT1
HP 8510C HP 8515A 1
B
A
R
RF
OUT RF
IN
B
A
R2
1 2
45°
Through hole
86-0.40 dia.
86-.016 dia.
17.00
.669
0.40
.016
6-1.76
6-.069
0.80
.031
0.40
.016
8.89
.350
12.04
.474
8.35
.329
30.00
1.181
0.40
.016
0.40
.016
2.81
.111
7.07
.278 7.22
.284
20.00
.787
1.00
.039
6-1.70 dia.
6-.067 dia.
4-1.60 dia.
4-.063 dia.
6-0.70 dia.
6-.028 dia.
4-0.60 dia.
4-.024 dia.
45°
78-0.40 dia.
78-.016 dia.
8.35
.329
12.70
.500
17.00
.669 0.40
.016
0.40
.016
6-1.86
6-.073
0.90
.035
8.89
.350
11.70
.461
30.00
1.181
0.50
.020
0.50
.020
7.62
.300
3.81
.150
1.00
.039
6.72
.265
6.62
.261
20.00
.787
14.5
.571
10.0
.394
0.40 or 0.50
.016 or .020
1.76 or 1.86
.069 or .073
12/2/2002 All Rights Reserved, © Copyright Matsushita Electric Works, Ltd.
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rj.fm 6 y [ W QOOPNX PPœ@˛jœ@ OPP SS“
