201207
FEATURES
APPLICATION
Mobile communication systems, noise suppression
at high frequency and Impedance matching.
DIMENSION
Type
Dimension [mm]
L W t d
03 0.6±0.03 0.3±0.03 0.3±0.03 0.15±0.05
DESCRIPTION
Multilayer High Frequency inductor
RECOMMENDED LAND PATTERN
CIH03T Series (0603/ EIA 0201)
Lowest value of specific resistance, good property of
Qand high SRF.
Possible to use at range above 100MHz
Monolithic structure for high reliability.
Do not contain lead and support lead-free soldering.
RoHS compliant
0.20~
0.30mm
0.60~1.0mm
0.20~0.35mm
Part No. Inductance
(nH)@100MHz
Q
(Min.)
100 MHz
Q(
typical.) SRF
(MHz)
Min
DC
resistance
(Ω)Max.
Rated
current
(mA) Max.
500MHz 800MHz 1.8GHz 2.0GHz 2.4GHz
CIH03T1N0□1.0±0.2nH,0.3nH 4 17 20 28 30 33 13000 0.14 300
CIH03T1N2□1.2±0.2nH,0.3nH 4 16 20 28 30 33 10000 0.14 250
CIH03T1N3□1.3±0.2nH,0.3nH 4 16 20 28 30 33 10000 0.14 250
CIH03T1N5□1.5±0.2nH,0.3nH 4 15 20 27 29 32 10000 0.18 230
CIH03T1N8□1.8±0.2nH,0.3nH 4 15 20 27 29 31 10000 0.19 200
CIH03T2N0□2.0±0.2nH,0.3nH 4 15 20 26 28 30 8800 0.22 200
CIH03T2N2□2.2±0.2nH,0.3nH 4 15 20 26 28 30 8800 0.22 200
CIH03T2N4□2.4±0.2nH,0.3nH 5 15 20 26 28 30 7500 0.25 200
CIH03T2N7□2.7±0.2nH,0.3nH 5 15 20 26 28 30 7700 0.25 200
CIH03T3N0□3.0±0.2nH,0.3nH 5 15 20 26 28 30 7200 0.27 200
CIH03T3N3□3.3±0.2nH,0.3nH 5 15 20 26 28 30 6700 0.3 200
CIH03T3N6□3.6±0.2nH,0.3nH 5 15 20 27 29 31 6000 0.3 200
CIH03T3N9□3.9±0.2nH,0.3nH 5 15 20 27 29 31 6000 0.3 200
CIH03T4N3□4.3±0.2nH,0.3nH 5 15 19 26 28 30 5600 0.35 200
CIH03T4N7□4.7±0.2nH,0.3nH 5 15 19 26 28 30 5300 0.4 200
CIH03T5N6□5.6±0.2nH,0.3nH 5 15 19 26 27 28 4600 0.4 200
CIH03T6N2□6.2±0.2nH,0.3nH 5 17 18 23 24 25 4100 0.48 150
CIH03T6N8□6.8±5% 5.5 14 18 23 24 25 4100 0.48 150
CIH03T7N5□7.5±5% 5 14 18 22 23 23 3700 0.51 150
CIH03T8N2□8.2±5% 5 14 18 22 23 23 3400 0.55 150
CIH03T10N□10.0±5% 5 14 17 22 22 21 3300 0.63 150
CIH03T12N□12.0±5% 6 14 17 21 21 19 3000 0.7 150
CIH03T15N□15.0±5% 6 13 16 19 18 14 2700 0.8 100
CIH03T18N□18.0±5% 6 13 17 16 14 9 2100 0.9 100
CIH03T22N□22.0±5% 5 13 15 14 11 5 1800 1.2 100
CIH03T24N□24.0±5% 5 13 15 12 9 3 1800 1.6 100
CIH03T27N□27.0±5% 4 12 14 10 7 2 1800 1.8 50
Ver. 201207
※Tolerance (B :±0.1nH, C:±0.2
nH, S:±0.3
nH, H :±3%, J :±5%)
※Measurement equipment &Jig :Agilent E4991A+16196C or Equivalent
※The Rated Current is either the DC value at witch the internal Ls value is decreased within 5% with the application
of DC_Current, or the value of current at which the temperature of the element is increased within 20℃
(Reference ambient temperature:20℃)
※Residual Inductance of short chip: 0.30nH
CI H03T10NJNC
(1) (2) (3) (4) (5) (6) (7) (8)
(1) Chip Inductor (2) H:High frequency type
(3) Dimension (4) Material code(T:Dielectric material)
(5) Inductance(4N7:4.7nH, 10N:10nH, R10:100nH) (6) Tolerance(B:±0.1nHC:±0.2nH, S:±0.3nH, J:±5%)
(7) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
(8) Packaging(C:paper tape, E:embossed tape)
PACKAGING
Packaging Style Quantity(pcs/reel)
Card Board Taping 10,000
RECOMMENDED SOLDERING CONDITION
PRODUCT IDENTIFICATION
*Operating temperature range –55 to +125°C
Part No. Inductance
(nH)@100MHz
Q
(Min.)
100 MHz
Q(
typical.) SRF
(MHz)
Min
DC
resistance
(Ω)Max.
Rated
current
(mA) Max.
500MHz 800MHz 1.8GHz 2.0GHz 2.4GHz
CIH03T33N□33.0±5% 4 12 14 8 5 1 1700 2.1 50
CIH03T39N□39.0±5% 4 12 13 4 1 - 1500 2.4 50
CIH03T47N□47.0±5% 4 11 12 2 - - 1300 2.8 50
CIH03T56N□56.0±5% 4 11 11 - - - 1100 3.0 50
CIH03T68N□68.0±5% 5 13 11 - - - 1050 3.0 50
CIH03T82N□82.0±5% 5 12 8 - - - 900 4.0 50
CIH03TR10□100.0±5% 5 11 - - - - 770 4.5 50
■NOTICE :All specifications are subject to change without previous notice. Please contact with
product representatives or engineers to check specifications.
REFLOW SOLDERING FLOW SOLDERING
