TOTX1350(F) - TOSHIBA - Product.Network

TOTX1350(F)

2013-12-13

FIBER OPTIC TRANSMITTING MODULE

TOTX1350(F)

GENERAL PURPOSE OPTICAL TRANSMITTING MODULE

 JIS F05 type fiber optic connector

 650nm LED

 Low current LED drive

1. Absolute Maximum Ratings (Ta = 25°C)

Characteristics Symbol Rating Unit

Storage Temperature Tstg −40 to 95 °C

Operating Temperature Topr −40 to 85 °C

Forward Current (DC) IFDC

30 mA

Reverse Voltage VR

MAX 5 V

Soldering Temperature Tsol

260 (Note 1) °C

Note 1: Soldering time ≤ 10 s (More than 1 mm apart from the package).

Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant

change in temperature , etc) may cause this product to decrease in the reliability significantly even if the

operating conditions (i.e.operating temperature/ current/ voltage, etc.) are within the absolute maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/ “Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and

estimated failure rate, etc).

2. Operating Ranges

Characteristics Symbol Min Typ. Max Unit

Forward Current (DC) IF

- 6 8 mA

Data Rate

DC - 10 Mb/s

TOTX1350(F)

2013-12-13

3. Electrical and Optical Characteristics (Ta = 25°C, VCC = 5 V)

Characteristics Symbol Test Condition Min Typ. Max Unit

Data Rate NRZ Code(Note 2) DC -

10 Mb / s

Transmission Distance (Note 2)

APF(Note 3), IF=6mA, Using TORX1350(F) 40 -

100 m

APF(Note 3), IF=1.5mA, Using TORX1350(F) 0.2 -

50 m

Pulse Width Distortion (Note 4) Δtw -30 -

30 ％

Fiber Output Power (Note 5) Pf

IF=6mA, Using APF (Note3), - 6 -

-2 dBm

IF=1.5mA, Using APF (Note3), -13 -

-8 dBm

Center Emission Wavelength λc -

650 - nm

Forward Voltage VF

IF=6mA -

2.0 2.1 V

IF=1.5mA -

1.8 2.0 V

Reverse Current IR

VR=5V -

- 10 μA

Note 2: Data rate and transmission distance differ from driver circuit.

Note 3: All Plastic Fiber (980μm core / 1000μm cladding, NA=0.5). Polished surface.

Transmission loss is less than 0.18dB/m. (100m@650nm).

Note 4: Between input of driver circuit of TOTX1350(F) and output of TORX1350(F).

A value changes with LED drive circuits.

Note 5: Measure with a standard optical fiber with fiber optic connectors. Valued by peak.

4. Application Circuit

(1) IF = 6mA operation

(2) IF = 1.5mA operation

5. Applicable Optical Fiber with Fiber Optic Connectors

All Plastic Fiber (980μm core / 1000μm cladding, NA=0.5) with F05 type optical connector. Polished surface.

Transmission loss is less than 0.18dB/m. (100m@650nm).

TOTX1350(F)

2013-12-13

6. Precautions during use

(1) Absolute maximum rating

The absolute maximum ratings are the limit values which must not be exceeded during operation of device.

None of these rating value must not be exceeded. If the absolute maximum rating value is exceeded, the

characteristics of devices may never be restored properly. In extreme cases, the device may be

permanently damages.

(2) Operating Range

The operating range is the range of conditions necessary for the device to operate as specified in

individual technical datasheets and databooks. Care must be exercised in the design of the equipment.

If a device is used under conditions that do not exceed absolute maximum ratings but exceed the

operating range, the specifications related to device operation and electrical characteristics may not be

met, resulting in a decrease in reliability.

If greater reliability is required, derate the device’s operating ranges for voltage, current, power and

temperature before use.

(3) Lifetime of light emitters

If an optical module is used for a long period of time, degeneration in the characteristics will mostly be due

to a lowering of the fiber output power (Pf). This is caused by the degradation of the optical output of the

LEDs used as the light source. The cause of degradation of the optical output of the LEDs may be defects

in wafer crystallization or mold resin stress. The detailed causes are, however, not clear.

The lifetime of light emitters is greatly influenced by the operating conditions and the environment in which

it is used as well as by the lifetime characteristics unique to the device type. Thus, when a light emitting

device and its operating conditions determined, Toshiba recommend that lifetime characteristics be

checked.

Depending on the environment conditions, Toshiba recommend that maintenance such as regular checks

of the amount of optical output in accordance with the condition of operating environment.

(4) Soldering

Optical modules are comprised of internal semiconductor devices. However, in principle, optical modules

are optical components. During soldering, ensure that flux does not contact with the emitting surface or the

detecting surface. Also ensure that proper flux removal is conducted after soldering.

Some optical modules come with a protective cap. The protective cap is used to avoid malfunction when

the optical module is not in use. Note that it is not dust or waterproof.

As mentioned before, optical modules are optical components. Thus, in principle, soldering where there

may be flux residue and flux removal after soldering is not recommended. Toshiba recommend that

soldering be performed without the optical module mounted on the board. Then, after the board has been

cleaned, the optical module should be soldered on to the board manually.

If the optical module cannot be soldered manually, use non−halogen (chlorine−free) flux and make sure,

without cleaning, there is no residue such as chlorine. This is one of the ways to eliminate the effects of

flux. In such a cases, be sure to check the devices’ reliability.

(5) Vibration and shock

This module is plastic sealed and has its wire fixed by resin. This structure is relatively resistant to vibration

and shock. In actual equipment, there are sometime cases in which vibration, shock, or stress is applied to

soldered parts or connected parts, resulting in lines cut. A care must be taken in the design of equipment

which will be subject to high levels of vibration.

TOTX1350(F)

2013-12-13

(6) Fixing fiber optical transmitting module

Solder the fixed pin (pins 4 and 5) of fiber optic transmitting module TOTX1350(F) to the printed circuit

board to fix the module to the board.

(7) Solvent

When using solvent for flux removal, do not use a high acid or high alkali solvent. Be careful not to pour

solvent in to the optical connector ports. If solvent is inadvertently poured in to them, clean it off using

cotton tips.

(8) Protective cap

When the TOTX1350(F) is not in use, attach the protective cap..

(9) An influence of flash or strong light

Do not emit a flash or a strong light to the optical module directly they may cause an error in data

transmission.

(10) Soldering condition

Solder at 260°C or less for no more than ten seconds.

(11) Precautions when disposing of devices and packing materials.

When disposing devices and packing materials, follow the procedures stipulated by local regulations in

order to protect the environment against contamination.

(12) Others

This product is an optical transmitting module for plastic optical fiber.

Use only for an optical transmitting module purpose.

TOTX1350(F)

2013-12-13

7. Package Outline drawing

Unit: mm

Pin connection

1. NC

2. Cathode

3. Anode

4. NC

5. NC

TOTX1350(F)

2013-12-13

RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information

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responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and

systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily

injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the

Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of

all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes

for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the

instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their

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