BGA925L6 Silicon Germanium GNSS Low Noise Amplifier in ultra small package with 0.77mm footprint Data Sheet Revision 3.0, 2012-01-13 RF & Protection Devices Edition 2012-01-13 Published by Infineon Technologies AG 81726 Munich, Germany (c) 2012 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGA925L6 Revision History Page or Item Subjects (major changes since previous revision) Revision 3.0, 2012-01-13 all "Preliminary" status removed 14 Tolerance for package height tightened Revision 2.1, 2011-12-02 12 More detailed application information provided 15 Number of pieces/reel modified: 15000 Trademarks of Infineon Technologies AG AURIXTM, C166TM, CanPAKTM, CIPOSTM, CIPURSETM, EconoPACKTM, CoolMOSTM, CoolSETTM, CORECONTROLTM, CROSSAVETM, DAVETM, DI-POLTM, EasyPIMTM, EconoBRIDGETM, EconoDUALTM, EconoPIMTM, EconoPACKTM, EiceDRIVERTM, eupecTM, FCOSTM, HITFETTM, HybridPACKTM, IRFTM, ISOFACETM, IsoPACKTM, MIPAQTM, ModSTACKTM, my-dTM, NovalithICTM, OptiMOSTM, ORIGATM, POWERCODETM; PRIMARIONTM, PrimePACKTM, PrimeSTACKTM, PRO-SILTM, PROFETTM, RASICTM, ReverSaveTM, SatRICTM, SIEGETTM, SINDRIONTM, SIPMOSTM, SmartLEWISTM, SOLID FLASHTM, TEMPFETTM, thinQ!TM, TRENCHSTOPTM, TriCoreTM. Other Trademarks Advance Design SystemTM (ADS) of Agilent Technologies, AMBATM, ARMTM, MULTI-ICETM, KEILTM, PRIMECELLTM, REALVIEWTM, THUMBTM, VisionTM of ARM Limited, UK. AUTOSARTM is licensed by AUTOSAR development partnership. BluetoothTM of Bluetooth SIG Inc. CAT-iqTM of DECT Forum. COLOSSUSTM, FirstGPSTM of Trimble Navigation Ltd. EMVTM of EMVCo, LLC (Visa Holdings Inc.). EPCOSTM of Epcos AG. FLEXGOTM of Microsoft Corporation. FlexRayTM is licensed by FlexRay Consortium. HYPERTERMINALTM of Hilgraeve Incorporated. IECTM of Commission Electrotechnique Internationale. IrDATM of Infrared Data Association Corporation. ISOTM of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLABTM of MathWorks, Inc. MAXIMTM of Maxim Integrated Products, Inc. MICROTECTM, NUCLEUSTM of Mentor Graphics Corporation. MIPITM of MIPI Alliance, Inc. MIPSTM of MIPS Technologies, Inc., USA. muRataTM of MURATA MANUFACTURING CO., MICROWAVE OFFICETM (MWO) of Applied Wave Research Inc., OmniVisionTM of OmniVision Technologies, Inc. OpenwaveTM Openwave Systems Inc. RED HATTM Red Hat, Inc. RFMDTM RF Micro Devices, Inc. SIRIUSTM of Sirius Satellite Radio Inc. SOLARISTM of Sun Microsystems, Inc. SPANSIONTM of Spansion LLC Ltd. SymbianTM of Symbian Software Limited. TAIYO YUDENTM of Taiyo Yuden Co. TEAKLITETM of CEVA, Inc. TEKTRONIXTM of Tektronix Inc. TOKOTM of TOKO KABUSHIKI KAISHA TA. UNIXTM of X/Open Company Limited. VERILOGTM, PALLADIUMTM of Cadence Design Systems, Inc. VLYNQTM of Texas Instruments Incorporated. VXWORKSTM, WIND RIVERTM of WIND RIVER SYSTEMS, INC. ZETEXTM of Diodes Zetex Limited. Last Trademarks Update 2011-11-11 Data Sheet 3 Revision 3.0, 2012-01-13 BGA925L6 Table of Contents Table of Contents Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Data Sheet 4 Revision 3.0, 2012-01-13 BGA925L6 List of Figures List of Figures Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Data Sheet Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Application Schematic BGA925L6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Drawing of Application Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Application Board Cross-Section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 TSLP-6-2 Package Outline (top, side and bottom views) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Footprint TSLP-6-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Marking Layout (top view). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Tape & Reel Dimensions (reel diameter 180 mm, pieces/reel 15000) . . . . . . . . . . . . . . . . . . . . . . 15 5 Revision 3.0, 2012-01-13 BGA925L6 List of Tables List of Tables Table 1 Table 2 Table 3 Table 4 Table 5 Table 6 Data Sheet Pin Definition and Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Electrical Characteristics: TA = 25 C, VCC = 1.8 V, VPON,ON = 1.8 V, VPON,OFF = 0 V, f = 1550 - 1615 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Electrical Characteristics: TA = 25 C, VCC = 2.8 V, VPON,ON = 2.8 V, VPON,OFF = 0 V, f = 1550 - 1615 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6 Revision 3.0, 2012-01-13 Silicon Germanium GNSS Low Noise Amplifier in ultra small package with 0.77mm footprint BGA925L6 Features * * * * * * * * * * * * * * Insertion power gain: 15.8 dB High out-of-band 3rd-order intercept point at input: +7 dBm High 1dB-compression point: -5 dBm Low noise figure: 0.65 dB Low current consumption: 4.8 mA Operating frequencies: 1550 - 1615 MHz Supply voltage: 1.5 V to 3.6 V Digital on/off switch (1V logic high level) Ultra small TSLP-6-2 leadless package (footprint: 0.7 x 1.1 mm2) B7HF Silicon Germanium technology RF output internally matched to 50 Only 1 external SMD component necessary 2kV HBM ESD protection (including AI-pin) Pb-free (RoHS compliant) package Application * Ideal for all Global Navigation Satellite Systems (GNSS) like GPS, Galileo, GLONASS, COMPASS VCC PON AI AO ESD GND GNDRF BGA 925L 6_Blockdiagram .vsd Figure 1 Block Diagram Product Name Marking Package BGA925L6 C TSLP-6-2 Data Sheet 7 Revision 3.0, 2012-01-13 BGA925L6 Features Description The BGA925L6 is a front-end low noise amplifier for Global Navigation Satellite Systems (GNSS) from 1550 MHz to 1615 MHz like GPS, Galileo, GLONASS and COMPASS and others. The LNA provides 15.8 dB gain and 0.65 dB noise figure at a current consumption of 4.8 mA in the application configuration described in Chapter 3. The BGA925L6 is based upon Infineon Technologies` B7HF Silicon Germanium technology. It operates from 1.5 V to 3.6 V supply voltage. Pin Definition and Function Table 1 Pin Definition and Function Pin No. Name Function 1 GND General ground 2 VCC DC supply 3 AO LNA output 4 GNDRF LNA RF ground 5 AI LNA input 6 PON Power on control Data Sheet 8 Revision 3.0, 2012-01-13 BGA925L6 Maximum Ratings 1 Maximum Ratings Table 2 Maximum Ratings Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition Voltage at pin VCC VCC -0.3 - 3.6 V 1) Voltage at pin AI VAI -0.3 - 0.9 V - Voltage at pin AO VAO -0.3 - VCC + 0.3 V - Voltage at pin PON VPON -0.3 - VCC + 0.3 V - Voltage at pin GNDRF VGNDRF -0.3 - 0.3 V - Current into pin VCC ICC - - 20 mA - RF input power PIN - - 0 dBm - Total power dissipation, Ptot - - 72 mW - Junction temperature TJ - - 150 C - Ambient temperature range TA -40 - 85 C - Storage temperature range TSTG -65 - 150 C - ESD capability all pins VESD_HBM - - 2000 V according to JESD22A-114 TS < 123 C2) 1) All voltages refer to GND-Node unless otherwise noted 2) TS is measured on the ground lead at the soldering point Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. Thermal Resistance Table 3 Thermal Resistance Parameter Symbol Value Unit Junction - soldering point RthJS 380 1) For calculation of RthJA please refer to Application Note Thermal Resistance K/W 1) Data Sheet 9 Revision 3.0, 2012-01-13 BGA925L6 Electrical Characteristics 2 Electrical Characteristics Table 4 Electrical Characteristics:1) TA = 25 C, VCC = 1.8 V, VPON,ON = 1.8 V, VPON,OFF = 0 V, f = 1550 - 1615 MHz Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition Supply voltage VCC 1.5 - 3.6 V - Supply current ICC - 4.8 - mA ON-mode - 0.2 3 A OFF-mode 1.0 - Vcc V ON-mode 0 - 0.4 V OFF-mode - 5 - A ON-mode - - 1 A OFF-mode |S21| - 15.8 - dB - NF - 0.65 - dB ZS = 50 Input return loss RLin - 12 - dB - Output return loss RLout - 18 - dB - 1/|S12| - 20 - dB - tS - 5 - s OFF- to ON-mode - 5 - s ON- to OFF-mode Inband input 1dB-compression IP1dB point - -8 - dBm - Inband input 3rd-order intercept IIP3 point4) - +2 - dBm f1 = 1575 MHz f2 = f1 +/-1 MHz Out-of-band input 3rd-order intercept point5) IIP3oob - +7 - dBm f1 = 1712.7 MHz f2 = 1850 MHz Stability k - >1 - Vpon Power On voltage Ipon Power On current 2 Insertion power gain Noise figure 2) 2 Reverse isolation 3) Power gain settling time 1) 2) 3) 4) 5) f = 20 MHz ... 10 GHz Based on the application described in chapter 3 PCB losses are subtracted To be within 1 dB of the final gain OFF- to ON-mode; to be within 3 dB of the final gain ON- to OFF-mode Input power = -30 dBm for each tone Input power = -20 dBm for each tone Data Sheet 10 Revision 3.0, 2012-01-13 BGA925L6 Electrical Characteristics Table 5 Electrical Characteristics:1) TA = 25 C, VCC = 2.8 V, VPON,ON = 2.8 V, VPON,OFF = 0 V, f = 1550 - 1615 MHz Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition Supply voltage VCC 1.5 - 3.6 V - Supply current ICC - 4.9 - mA ON-mode - 0.2 3 A OFF-mode 1.0 - Vcc V ON-mode 0 - 0.4 V OFF-mode - 5 - A ON-mode - - 1 A OFF-mode |S21| - 15.8 - dB - NF - 0.65 - dB ZS = 50 Input return loss RLin - 12 - dB - Output return loss RLout - 18 - dB - Reverse isolation 1/|S12|2 - 20 - dB - tS - 5 - s OFF- to ON-mode - 5 - s ON- to OFF-mode Inband input 1dB-compression IP1dB point - -5 - dBm - Inband input 3rd-order intercept IIP3 point4) - +2 - dBm f1 = 1575 MHz f2 = f1 +/-1 MHz Out-of-band input 3rd-order intercept point5) IIP3oob - +7 - dBm f1 = 1712.7 MHz f2 = 1850 MHz Stability k - >1 - Vpon Power On voltage Ipon Power On current 2 Insertion power gain Noise figure 2) 3) Power gain settling time 1) 2) 3) 4) 5) f = 20 MHz ... 10 GHz Based on the application described in chapter 3 PCB losses are subtracted To be within 1 dB of the final gain OFF- to ON-mode; to be within 3 dB of the final gain ON- to OFF-mode Input power = -30 dBm for each tone Input power = -20 dBm for each tone Data Sheet 11 Revision 3.0, 2012-01-13 BGA925L6 Application Information 3 Application Information Application Board Configuration N1 BGA925L6 GNDRF, 4 C1 (optional) AO, 3 RFout L1 RFin VCC VCC, 2 AI, 5 C2 (optional) PON PON, 6 GND, 1 BGA 925L 6_Schematic.vsd Figure 2 Application Schematic BGA925L6 Table 6 Bill of Materials Name Value Package Manufacturer Function C1 (optional) 1nF 0402 Various DC block 1) C2 (optional) > 10nF 2) 0402 Various RF bypass 3) L1 6.8nH 0402 Murata LQW type Input matching N1 BGA925L6 TSLP-6-2 Infineon SiGe LNA 1) DC block might be realized with pre-filter in GNSS applications 2) For data sheet characteristics 1F used 3) RF bypass recommended to mitigate power supply noise A list of all application notes is available at http://www.infineon.com/gpslna.appnotes. Data Sheet 12 Revision 3.0, 2012-01-13 BGA925L6 Application Information BGA 925 L6_Application _Board .vsd Figure 3 Drawing of Application Board Vias Vias Ro4003, 0.2mm Copper 35m FR4,0.8mm BGA 925L6_application _board _sideview.vsd Figure 4 Data Sheet Application Board Cross-Section 13 Revision 3.0, 2012-01-13 BGA925L6 Package Information Package Information Top view Bottom view 0.2 0.05 (0.05) 3 4 2 5 1 6 1.1 0.05 (0.05) 0.05 MAX. 0.2 0.05 Pin 1 marking 1) Dimension applies to plated terminals Figure 5 (0.05) 0.2 0.035 1) 0.2 0.035 1) 0.7 0.05 +0.01 0.39 -0.03 (0.05) 4 TSLP-6-2-PO V01 TSLP-6-2 Package Outline (top, side and bottom views) N SMD 0.4 0.4 0.25 0.25 0.4 0.4 0.25 0.25 (stencil thickness 100 m) Copper Stencil apertures Solder mask TSLP-6-2-FP V01 Figure 6 Footprint TSLP-6-2 C Type code Pin 1 marking TS LP-6-2-MK B GA 925 Figure 7 Data Sheet Marking Layout (top view) 14 Revision 3.0, 2012-01-13 BGA925L6 Package Information Pin 1 marking 8 1.25 0.5 2 0.85 TSLP-6-2-TP V01 Figure 8 Data Sheet Tape & Reel Dimensions (reel diameter 180 mm, pieces/reel 15000) 15 Revision 3.0, 2012-01-13 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG