BGA925L6E6327XTSA1 - INFINEON TECHNOLOGIES AG

RF & Protection Devices

Data Sheet

Revision 3.0, 2012-01-13

BGA925L6

Silicon Germanium GNSS Low Noise Amplifier

in ultra small package with 0.77mm² footprint

Edition 2012-01-13

Published by

Infineon Technologies AG

81726 Munich, Germany

Legal Disclaimer

The information given in this document shall in no event be regarded as a guarantee of conditions or

characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any

information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties

and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights

of any third party.

Information

For further information on technology, delivery terms and conditions and prices, please contact the nearest

Infineon Technologies Office (www.infineon.com).

Warnings

Due to technical requirements, components may contain dangerous substances. For information on the types in

question, please contact the nearest Infineon Technologies Office.

Infineon Technologies components may be used in life-support devices or systems only with the express written

approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure

of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support

devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain

and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may

be endangered.

BGA925L6

Data Sheet 3 Revision 3.0, 2012-01-13

Trademarks of Infineon Technologies AG

AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, EconoPACK™, CoolMOS™, CoolSET™,

CORECONTROL™, CROSSAVE™, DAVE™, DI-POL™, EasyPIM™, EconoBRIDGE™, EconoDUAL™,

EconoPIM™, EconoPACK™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™,

ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OptiMOS™, ORIGA™,

POWERCODE™; PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™,

ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, TEMPFET™,

thinQ!™, TRENCHSTOP™, TriCore™.

Other Trademarks

Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,

PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR

development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™,

FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.

FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of

Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data

Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of

MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics

Corporation. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA

MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of

OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF

Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™

of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co.

TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™

of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas

Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes

Zetex Limited.

Last Trademarks Update 2011-11-11

Revision History

Page or Item Subjects (major changes since previous revision)

Revision 3.0, 2012-01-13

all “Preliminary” status removed

14 Tolerance for package height tightened

Revision 2.1, 2011-12-02

12 More detailed application information provided

15 Number of pieces/reel modified: 15000

BGA925L6

Table of Contents

Data Sheet 4 Revision 3.0, 2012-01-13

Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

4 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Table of Contents

BGA925L6

List of Figures

Data Sheet 5 Revision 3.0, 2012-01-13

Figure 1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Figure 2 Application Schematic BGA925L6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Figure 3 Drawing of Application Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Figure 4 Application Board Cross-Section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Figure 5 TSLP-6-2 Package Outline (top, side and bottom views) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 6 Footprint TSLP-6-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 7 Marking Layout (top view). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 8 Tape & Reel Dimensions (reel diameter 180 mm, pieces/reel 15000) . . . . . . . . . . . . . . . . . . . . . . 15

List of Figures

BGA925L6

List of Tables

Data Sheet 6 Revision 3.0, 2012-01-13

Table 1 Pin Definition and Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Table 2 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Table 3 Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Table 4 Electrical Characteristics: TA = 25 °C, VCC = 1.8 V, VPON,ON = 1.8 V, VPON,OFF = 0 V,

f= 1550 - 1615 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Table 5 Electrical Characteristics: TA = 25 °C, VCC = 2.8 V, VPON,ON = 2.8 V, VPON,OFF = 0 V,

f= 1550 - 1615 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Table 6 Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

List of Tables

Product Name Marking Package

BGA925L6 CTSLP-6-2

Silicon Germanium GNSS Low Noise Amplifier

in ultra small package with 0.77mm² footprint

BGA925L6

Data Sheet 7 Revision 3.0, 2012-01-13

Features

• Insertion power gain: 15.8 dB

• High out-of-band 3rd-order intercept point at input: +7 dBm

• High 1dB-compression point: -5 dBm

• Low noise figure: 0.65 dB

• Low current consumption: 4.8 mA

• Operating frequencies: 1550 - 1615 MHz

• Supply voltage: 1.5 V to 3.6 V

• Digital on/off switch (1V logic high level)

• Ultra small TSLP-6-2 leadless package (footprint: 0.7 x 1.1 mm2)

• B7HF Silicon Germanium technology

• RF output internally matched to 50 Ω

• Only 1 external SMD component necessary

• 2kV HBM ESD protection (including AI-pin)

• Pb-free (RoHS compliant) package

Application

• Ideal for all Global Navigation Satellite Systems (GNSS) like GPS, Galileo, GLONASS, COMPASS

Figure 1 Block Diagram

BGA925L6_Blockdiagram .vsd

AI AO

GNDRF

PONVCC

ESD

GND

BGA925L6

Features

Data Sheet 8 Revision 3.0, 2012-01-13

Description

The BGA925L6 is a front-end low noise amplifier for Global Navigation Satellite Systems (GNSS) from 1550 MHz

to 1615 MHz like GPS, Galileo, GLONASS and COMPASS and others. The LNA provides 15.8 dB gain and

0.65 dB noise figure at a current consumption of 4.8 mA in the application configuration described in Chapter 3.

The BGA925L6 is based upon Infineon Technologies‘ B7HF Silicon Germanium technology. It operates from 1.5 V

to 3.6 V supply voltage.

Pin Definition and Function

Table 1 Pin Definition and Function

Pin No. Name Function

1 GND General ground

2 VCC DC supply

3 AO LNA output

4 GNDRF LNA RF ground

5 AI LNA input

6 PON Power on control

BGA925L6

Maximum Ratings

Data Sheet 9 Revision 3.0, 2012-01-13

1 Maximum Ratings

Attention: Stresses above the max. values listed here may cause permanent damage to the device.

Exposure to absolute maximum rating conditions for extended periods may affect device

reliability. Maximum ratings are absolute ratings; exceeding only one of these values may

cause irreversible damage to the integrated circuit.

Thermal Resistance

Table 2 Maximum Ratings

Parameter Symbol Values Unit Note /

Test Condition

Min. Typ. Max.

Voltage at pin VCC VCC -0.3 – 3.6 V 1)

1) All voltages refer to GND-Node unless otherwise noted

Voltage at pin AI VAI -0.3 – 0.9 V –

Voltage at pin AO VAO -0.3 – VCC + 0.3 V –

Voltage at pin PON VPON -0.3 – VCC + 0.3 V –

Voltage at pin GNDRF VGNDRF -0.3 – 0.3 V –

Current into pin VCC ICC ––20mA–

RF input power PIN ––0dBm–

Total power dissipation,

TS< 123 °C2)

2) TS is measured on the ground lead at the soldering point

Ptot ––72mW–

Junction temperature TJ––150°C–

Ambient temperature range TA-40 – 85 °C –

Storage temperature range TSTG -65 – 150 °C –

ESD capability all pins VESD_HBM – – 2000 V according to

JESD22A-114

Table 3 Thermal Resistance

Parameter Symbol Value Unit

Junction - soldering point1)

1) For calculation of RthJA please refer to Application Note Thermal Resistance

RthJS 380 K/W

BGA925L6

Electrical Characteristics

Data Sheet 10 Revision 3.0, 2012-01-13

2 Electrical Characteristics

Table 4 Electrical Characteristics:1) TA = 25 °C, VCC = 1.8 V, VPON,ON = 1.8 V, VPON,OFF = 0 V,

f= 1550 - 1615 MHz

1) Based on the application described in chapter 3

Parameter Symbol Values Unit Note / Test Condition

Min. Typ. Max.

Supply voltage VCC 1.5 – 3.6 V –

Supply current ICC –4.8–mAON-mode

–0.23μA OFF-mode

Power On voltage Vpon 1.0 – Vcc V ON-mode

0 – 0.4 V OFF-mode

Power On current Ipon –5–μA ON-mode

––1μA OFF-mode

Insertion power gain |S21|2– 15.8 – dB –

Noise figure2)

2) PCB losses are subtracted

NF –0.65–dBZS=50Ω

Input return loss RLin –12–dB–

Output return loss RLout –18–dB–

Reverse isolation 1/|S12|2–20–dB–

Power gain settling time3)

3) To be within 1 dB of the final gain OFF- to ON-mode; to be within 3 dB of the final gain ON- to OFF-mode

tS–5–μs OFF- to ON-mode

–5–μs ON- to OFF-mode

Inband input 1dB-compression

point

IP1dB –-8–dBm–

Inband input 3rd-order intercept

point4)

4) Input power = -30 dBm for each tone

IIP3–+2–dBmf1= 1575 MHz

f2=f1+/-1 MHz

Out-of-band input 3rd-order

intercept point5)

5) Input power = -20 dBm for each tone

IIP3oob –+7–dBmf1= 1712.7 MHz

f2= 1850 MHz

Stability k–> 1– f= 20 MHz ... 10 GHz

BGA925L6

Electrical Characteristics

Data Sheet 11 Revision 3.0, 2012-01-13

Table 5 Electrical Characteristics:1) TA = 25 °C, VCC = 2.8 V, VPON,ON = 2.8 V, VPON,OFF = 0 V,

f= 1550 - 1615 MHz

1) Based on the application described in chapter 3

Parameter Symbol Values Unit Note / Test Condition

Min. Typ. Max.

Supply voltage VCC 1.5 – 3.6 V –

Supply current ICC –4.9–mAON-mode

–0.23μA OFF-mode

Power On voltage Vpon 1.0 – Vcc V ON-mode

0 – 0.4 V OFF-mode

Power On current Ipon –5–μA ON-mode

––1μA OFF-mode

Insertion power gain |S21|2– 15.8 – dB –

Noise figure2)

2) PCB losses are subtracted

NF –0.65–dBZS=50Ω

Input return loss RLin –12–dB–

Output return loss RLout –18–dB–

Reverse isolation 1/|S12|2–20–dB–

Power gain settling time3)

3) To be within 1 dB of the final gain OFF- to ON-mode; to be within 3 dB of the final gain ON- to OFF-mode

tS–5–μs OFF- to ON-mode

–5–μs ON- to OFF-mode

Inband input 1dB-compression

point

IP1dB –-5–dBm–

Inband input 3rd-order intercept

point4)

4) Input power = -30 dBm for each tone

IIP3–+2–dBmf1= 1575 MHz

f2=f1+/-1 MHz

Out-of-band input 3rd-order

intercept point5)

5) Input power = -20 dBm for each tone

IIP3oob –+7–dBmf1= 1712.7 MHz

f2= 1850 MHz

Stability k–> 1– f= 20 MHz ... 10 GHz

BGA925L6

Application Information

Data Sheet 12 Revision 3.0, 2012-01-13

3 Application Information

Application Board Configuration

Figure 2 Application Schematic BGA925L6

A list of all application notes is available at http://www.infineon.com/gpslna.appnotes.

Table 6 Bill of Materials

Name Value Package Manufacturer Function

C1 (optional) 1nF 0402 Various DC block 1)

1) DC block might be realized with pre-filter in GNSS applications

C2 (optional) > 10nF 2)

2) For data sheet characteristics 1μF used

0402 Various RF bypass 3)

3) RF bypass recommended to mitigate power supply noise

L1 6.8nH 0402 Murata LQW type Input matching

N1 BGA925L6 TSLP-6-2 Infineon SiGe LNA

BGA925L6_Schematic.vsd

N1 BGA925L6

AI, 5

PON, 6

GNDRF, 4

GND, 1

AO, 3

VCC, 2

(optional)

RFin

PON

VCC

(optional)

RFout

BGA925L6

Application Information

Data Sheet 13 Revision 3.0, 2012-01-13

Figure 3 Drawing of Application Board

Figure 4 Application Board Cross-Section

BGA 925 L6_Application _Board .vsd

Copper

35µm

Vias Vias

Ro4003, 0.2mm

FR4,0.8mm

BGA 925L6_application _board _ sideview.vsd

BGA925L6

Package Information

Data Sheet 14 Revision 3.0, 2012-01-13

4 Package Information

Figure 5 TSLP-6-2 Package Outline (top, side and bottom views)

Figure 6 Footprint TSLP-6-2

Figure 7 Marking Layout (top view)

0.05 MAX.

±0.05

0.7

±0.035

0.2

±0.05

±0.035

0.2

1.1±0.05

1) Dimension applies to plated terminals

Top view Bottom view

Pin 1 marking

TSLP-6-2-PO V01

0.2±0.05

(0.05) (0.05)

(0.05)(0.05)

+0.01

0.39 -0.03

0.25

0.4

0.25

0.4

0.25

0.4

0.25

0.4

TSLP-6-2-FP V01

Stencil apertures

Copper Solder mask

(stencil thickness 100 µm)

NSMD

TS LP-6-2-MK BGA 925

Type code

Pin 1 marking

BGA925L6

Package Information

Data Sheet 15 Revision 3.0, 2012-01-13

Figure 8 Tape & Reel Dimensions (reel diameter 180 mm, pieces/reel 15000)

0.5

Pin 1

marking

TSLP-6-2-TP V01

0.85

1.25

Published by Infineon Technologies AG