Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge
5 V AGC AMPLIFIER + VIDEO AMPLIFIER
BIPOLAR ANALOG INTEGRATED CIRCUIT
PC3221GV
Document No. PU10171EJ03V0DS (3rd edition)
The mark shows major revised points.
DESCRIPTION
The
PC3221GV is a silicon monolithic IC designed for use as AGC amplifier for digital CATV, cable modem
systems. This IC consists of gain control amplifier and video amplifier.
The package is 8-pin SSOP suitable for surface mount.
This IC is manufactured using our 10 GHz fT NESAT II AL silicon bipolar process. This process uses silicon
nitride passivation film. This material can protect chip surface from external pollution and prevent
corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
• Low distortion : IM3 = 56 dBc TYP. @ single-ended output, Vout = 0.7 Vp-p/tone
• Low noise figure : NF = 4.2 dB TYP.
• Wide AGC dynamic range : GCR = 50 dB TYP. @ input prescribe
• On-chip video amplifier : Vout = 1.0 Vp-p TYP. @ single-ended output
• Supply voltage : VCC = 5.0 V TYP.
• Packaged in 8-pin SSOP suitable for surface mounting
APPLICATION
• Digital CATV/Cable modem receivers
ORDERING INFORMATION
Part Number
Package
Supplying Form
PC3221GV-E1-A
8-pin plastic SSOP (4.45 mm (175))
Embossed tape 8 mm wide
Pin 1 indicates pull-out direction of tape
Qty 1 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order:
PC3221GV-A
Data Sheet PU10171EJ03V0DS
2
PC3221GV
INTERNAL BLOCK DIAGRAM AND PIN CONNECTIONS
PRODUCT LINE-UP OF 5 V AGC AMPLIFIER
ICC
(mA)
GMAX
(dB)
GMIN
(dB)
GCR
(dB)
NF
(dB)
IM3
(dBc) Note
Package
23
53
0
53
6.5
50
8-pin SSOP (4.45 mm (175))
23
63
10
53
3.5
50
36.5
42.5
0
42.5
9.0
58
33
60
10
50
4.2
56
Note f1 = 44 MHz, f2 = 45 MHz, Vout = 0.7 Vp-p/tone, single-ended output
Data Sheet PU10171EJ03V0DS
3
PC3221GV
PIN EXPLANATIONS
Pin
No.
Pin Name
Applied
Voltage
(V)
Pin
Voltage
(V) Note
Function and Application
Internal Equivalent Circuit
1
VCC
4.5 to 5.5
Power supply pin.
This pin should be externally equipped
with bypass capacitor to minimize ground
impedance.

2
INPUT1
1.29
Signal input pins to AGC amplifier.
This pin should be coupled with capacitor
for DC cut.
3
INPUT2
1.29
4
VAGC
0 to VCC
Gain control pin.
This pin’s bias govern the AGC output
level.
Minimum Gain at VAGC : 0 to 0.5 V
Maximum Gain at VAGC : 3 to 3.5 V
Recommended to use AGC voltage with
externally resister (example: 1 k).
5
GND2
0
Ground pin.
This pin should be connected to system
ground with minimum inductance.
Ground pattern on the board should be
formed as wide as possible.

6
OUTPUT2
2.28
Signal output pins of video amplifier.
This pin should be coupled with capacitor
for DC cut.
7
OUTPUT1
2.28
8
GND1
0
Ground pin.
This pin should be connected to system
ground with minimum inductance.
Ground pattern on the board should be
formed as wide as possible.
All ground pins must be connected
together with wide ground pattern to
decrease impedance difference.

Note Pin voltage is measured at VCC = 5.0 V.
Data Sheet PU10171EJ03V0DS
4
PC3221GV
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Test Conditions
Ratings
Unit
Supply Voltage
VCC
TA = +25C
6.0
V
Gain Control Voltage Range
VAGC
TA = +25C
0 to VCC
V
Power Dissipation
PD
TA = +85C Note
250
mW
Operating Ambient Temperature
TA
40 to +85
C
Storage Temperature
Tstg
55 to +150
C
Note Mounted on double-sided copper-clad 50 50 1.6 mm epoxy glass PWB
RECOMMENDED OPERATING RANGE
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Supply Voltage
VCC
4.5
5.0
5.5
V
Operating Ambient Temperature
TA
VCC = 4.5 to 5.5 V
40
+25
+85
C
Gain Control Voltage Range
VAGC
0
3.5
V
Operating Frequency Range
fBW
10
45
100
MHz
Data Sheet PU10171EJ03V0DS
5
PC3221GV
ELECTRICAL CHARACTERISTICS
(TA = +25C, VCC = 5 V, f = 45 MHz, ZS = 50 , ZL = 250 , single-ended output)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
DC Characteristics
Circuit Current
ICC
No input signal Note 1
26
33
41
mA
AGC Pin Current
IAGC
No input signal, VAGC = 3.5 V Note 1
16
50
A
AGC Voltage High Level
VAGC (H)
@ Maximum gain Note 1
3.0
3.5
V
AGC Voltage Low Level
VAGC (L)
@ Minimum gain Note 1
0
0.5
V
RF Characteristics
Maximum Voltage Gain
GMAX
VAGC = 3.0 V, Pin = 60 dBm Note 1
57
60
63
dB
Middle Voltage Gain 1
GMID1
VAGC = 2.2 V, Pin = 60 dBm Note 1
47.5
50.5
53.5
dB
Middle Voltage Gain 2
GMID2
VAGC = 1.2 V, Pin = 30 dBm Note 1
18
21
24
dB
Minimum Voltage Gain
GMIN
VAGC = 0.5 V, Pin = 30 dBm Note 1
6
10
14
dB
Gain Control Range (input prescribe)
GCRin
VAGC = 0.5 to 3.0 V Note 1
43
50
dB
Gain Control Range (output prescribe)
GCRout
Vout = 1.0 Vp-p Note 1
36
40
dB
Gain Slope
Gslope
Gain (@ VAGC = 2.2 V) Gain (@ VAGC
= 1.2 V) Note 1
26.5
29.5
32.5
dB/V
Maximum Output Voltage
Voclip
VAGC = 3.0 V (@ Maximum gain) Note 1
2.0
2.8
Vp-p
Noise Figure
NF
VAGC = 3.0 V (@ Maximum gain) Note 3
4.2
5.7
dB
3rd Order Intermodulation Distortion 1
IM31
f1 = 44 MHz, f2 = 45 MHz, ZL = 250 ,
Pin = 30 dBm/tone,
Vout = 0.7 Vp-p/tone (@ single-ended
output) Note 1
43
47
dBc
3rd Order Intermodulation Distortion 2
IM32
f1 = 44 MHz, f2 = 45 MHz, ZL = 250 ,
VAGC = 3.0 V (@ Maximum gain),
Vout = 0.7 Vp-p/tone (@ single-ended
output) Note 1
50
56
dBc
Gain Difference of
OUTPUT1 and OUTPUT2
G
VAGC = 3.0 V, Pin = 60 dBm,
G = G (@ Pout1) G (@ Pout2)
Note 1, 2
0.5
0
+0.5
dB
Notes 1. By measurement circuit 1
2. By measurement circuit 2
3. By measurement circuit 3
Data Sheet PU10171EJ03V0DS
6
PC3221GV
STANDARD CHARACTERISTICS (TA = +25C, VCC = 5 V, ZS = 50 )
Parameter
Symbol
Test Conditions
Reference Value
Unit
Noise Figure 2
NF2
Gain reduction = 10 dBm Note 2
6.0
dB
Noise Figure 3
NF3
Gain reduction = 20 dBm Note 2
9.5
dB
Output Voltage
Vout
Pin = 56 to 16 dBm Note 1
1.0
Vp-p
Input Impedance
Zin
VAGC = 0.5 V, f = 45 MHz Note 3
0.9 k j1.4 k
Output Impedance
Zout
VAGC = 0.5 V, f = 45 MHz Note 3
9.0 + j1.9
Input 3rd Order Distortion
Intercept Point
IIP3
VAGC = 0.5 V (@ Minimum gain),
f1 = 44 MHz, f2 = 45 MHz,
ZL = 250 (@ single-ended output)
Note 1
+2.5
dBm
Notes 1. By measurement circuit 1
2. By measurement circuit 3
3. By measurement circuit 4
Data Sheet PU10171EJ03V0DS
7
PC3221GV
MEASUREMENT CIRCUIT 1
Note Balun Transformer: TOKO 617DB-1010 B4F (Double balanced type)
MEASUREMENT CIRCUIT 2
Note Balun Transformer: TOKO 617DB-1010 B4F (Double balanced type)
Data Sheet PU10171EJ03V0DS
8
PC3221GV
MEASUREMENT CIRCUIT 3
Note Balun Transformer: TOKO 617DB-1010 B4F (Double balanced type)
MEASUREMENT CIRCUIT 4
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
Data Sheet PU10171EJ03V0DS
9
PC3221GV
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
(MEASUREMENT CIRCUIT 1)
Note Balun Transformer
Remarks
1. Back side: GND pattern
2. Solder plated on pattern
3. : Through hole
Data Sheet PU10171EJ03V0DS
10
PC3221GV
TYPICAL CHARACTERISTICS (TA = +25C , unless otherwise specified)
Remark The graphs indicate nominal characteristics.
Data Sheet PU10171EJ03V0DS
11
PC3221GV
Remark The graphs indicate nominal characteristics.
Data Sheet PU10171EJ03V0DS
12
PC3221GV
Remark The graphs indicate nominal characteristics.
Data Sheet PU10171EJ03V0DS
13
PC3221GV
Remark The graphs indicate nominal characteristics.
Data Sheet PU10171EJ03V0DS
14
PC3221GV
S-PARAMETERS (TA = +25C, VCC = VAGC = 5.0 V)
S11FREQUENCY
S22FREQUENCY
Data Sheet PU10171EJ03V0DS
15
PC3221GV
PACKAGE DIMENSIONS
8-PIN PLASTIC SSOP (4.45 mm (175)) (UNIT: mm)
14 Data Sheet PU10171EJ03V0DS
PC3221GV
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired
oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to VCC line.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Conditions
Condition Symbol
Peak temperature (package surface temperature) : 260C or below
Time at peak temperature : 10 seconds or less
Time at temperature of 220C or higher : 60 seconds or less
Preheating time at 120 to 180C : 12030 seconds
Maximum number of reflow processes : 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
IR260
Peak temperature (package surface temperature) : 215C or below
Time at temperature of 200C or higher : 25 to 40 seconds
Preheating time at 120 to 150C : 30 to 60 seconds
Maximum number of reflow processes : 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
VP215
Peak temperature (molten solder temperature) : 260C or below
Time at peak temperature : 10 seconds or less
Preheating temperature (package surface temperature) : 120C or below
Maximum number of flow processes : 1 time
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
WS260
Peak temperature (pin temperature) : 350C or below
Soldering time (per side of device) : 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).