2Electrical characteristics
(TCASE = 25 °C unless otherwise specified)
Table 4. On/off states
Symbol Parameter Test conditions Min. Typ. Max. Unit
V(BR)DSS Drain-source breakdown
voltage ID = 1 mA, VGS = 0 V 600 V
IDSS Zero gate voltage drain
current
VGS = 0 V, VDS = 600 V 1 µA
VGS = 0 V, VDS = 600 V, TC = 125 °C (1) 50 µA
IGSS Gate body leakage
current VDS = 0 V, VGS = ±30 V ±100 nA
VGS(th) Gate threshold voltage VDS = VGS, ID = 250 µA 2.25 3 3.7 V
RDS(on) Static drain-source on
resistance VGS = 10 V, ID = 0.5 A 7.3 8.5 Ω
1. Defined by design, not subject to production test.
Table 5. Dynamic
Symbol Parameter Test conditions Min. Typ. Max. Unit
Ciss Input capacitance
VDS = 25 V, f = 1 MHz, VGS = 0 V -
156
pF
Coss Output capacitance 23.5
Crss Reverse transfer
capacitance 3.8
QgTotal gate charge VDD = 480 V, ID = 1 A, VGS = 0 to 10 V
(see Figure 16. Test circuit for gate charge
behavior)
-
7 10
nC
Qgs Gate-source charge 1.1
Qgd Gate-drain charge 3.7
Table 6. Switching times
Symbol Parameter Test conditions Min. Typ. Max. Unit
td(on) Turn-on delay time VDD = 300 V, ID = 0.5 A,
RG = 4.7 Ω, VGS = 10 V
(see Figure 15. Test circuit for resistive load
switching times and Figure 20. Switching
time waveform)
-
6.5
- ns
trRise time 5
td(off) Turn-off delay time 19
trFall time 25
STN1HNK60, STQ1HNK60R-AP
Electrical characteristics
DS12594 - Rev 1 page 3/16